KR20090069209A - Manufacturing method of ceramic slurry, ceramic slurry manufactured thereby, greensheet, sintered body and multi layered ceramic condenser comprising ceramic slurry - Google Patents

Abstract

Ceramic slurry and a manufacture method thereof are provided to secure high dispersibility of main component powder as well as minor component powder, thereby lowering the roughness of surfaces. A method for manufacturing ceramic slurry comprises the following steps of: performing a first dispersing process to a mixture including at least minor component powder in order to control minor component slurry; adding main component powder to the minor component slurry; and performing a second dispersing process so as to obtain ceramic slurry. The minor component powder is one or more compounds having one or more elements selected from the group consisting of Mg, Ba, Ca, Si, Mn, Al, V, Dy, Y, Ho and Yb. The minor component powder of the minor component slurry has less than 0.1mum of average particle size.

Description

Manufacturing method of ceramic slurry, ceramic slurry manufactured thereby, greensheet, sintered body and multi layered ceramic condenser comprising ceramic slurry }

The present invention provides a method for producing a ceramic slurry having a good dispersibility, which can produce a green sheet having a small surface roughness and high firing temperature stability, and further capable of obtaining a multilayer ceramic capacitor having a low short rate, a ceramic slurry produced using the same, The present invention relates to a green sheet, a sintered body, and a ceramic capacitor including a ceramic slurry.

The conventional multilayer ceramic capacitor is manufactured by repeating the process of forming a green sheet by molding it into a sheet shape using a barium titanate (BaTio ₃ ) -based ceramic dielectric material and laminating the printed electrode on the green sheet. have.

In recent years, with the miniaturization of electronic device products, the densification of electronic circuits has progressed, and as a result, there has been a great demand for miniaturization of multilayer ceramic capacitors. In order to realize this demand, the thickness of the internal electrode layer and the dielectric layer is increased and the number of stacked layers is increased.

For this reason, the green sheet which forms a dielectric layer is also made thin, and the surface roughness (unevenness | corrugation) of a green sheet became impossible to ignore about thickness. This is because when the thickness of the dielectric layer after firing is caused due to the surface roughness, the electric field strength of the multilayer ceramic capacitor becomes uneven, and short-circuit (short) defects occur.

Therefore, a technique for producing a green sheet having a smooth surface and uniform thickness has become indispensable for the production of multilayer ceramic capacitors. In order to smooth the surface of the thin green sheet and to make the thickness uniform, it is necessary to refine the ceramic powder in the green sheet and to increase the dispersibility of the ceramic powder in the green sheet. Insufficient dispersion of the ceramic powder in the green sheet also adversely affects the stability of the ceramic powder particle size after firing and the stability of the electrical properties of the multilayer ceramic capacitor.

In order to increase the dispersibility of the ceramic powder in the green sheet, it is necessary to increase the dispersibility of the ceramic powder in the ceramic slurry used as the raw material. However, as described in Patent Document 1, the ceramic powder containing the main component and the subcomponent may be dispersed in a dispersion medium, a dispersant, Even if it mix | blends with a binder, a plasticizer, etc. in a predetermined ratio, and mixes and disintegrates using a disperser, such as a bead mill and a ball mill, it is difficult to fully disperse a ceramic powder in a ceramic slurry. Moreover, even if the high pressure dispersion process of the ceramic powder of the subcomponent described in patent document 2 is not carried out, a uniformly dispersed ceramic slurry cannot be obtained.

Therefore, there is a need for a method of preparing a ceramic slurry in which ceramic powder is uniformly dispersed.

[Patent Document 1] Japanese Patent Laid-Open No. 2001-106578

[Patent Document 2] Japanese Patent Laid-Open No. 2007-137693

Accordingly, an object of the present invention is to provide a method for producing a ceramic slurry having good dispersibility in view of the above phenomenon, a ceramic slurry manufactured by using the same, a green sheet including the ceramic slurry, a sintered body and a ceramic capacitor.

That is, the manufacturing method of the ceramic slurry which concerns on this invention is a method of manufacturing the ceramic slurry used as a dielectric material, Comprising: The process of adjusting a subsidiary slurry by giving a 1st dispersion process to the mixture containing at least subsidiary powder; And adding a main component powder to the subcomponent slurry to perform a second dispersion treatment to prepare the ceramic slurry, wherein the subcomponent powder is Mg, Ba, Ca, Si, Mn, Al, V, Dy, Y It consists of at least 1 sort (s) of compound chosen from the group which consists of a compound containing any 1 element of Ho, or Yb, The average particle diameter of the said subcomponent powder in the said subcomponent slurry is 0.1 micrometer or less, It is characterized by the above-mentioned.

If it is such a thing, by disperse | distributing using a bead mill etc. using nanoparticles whose average particle diameter is 0.1 micrometer or less as a subsidiary powder, the subsidiary slurry with which the aggregated subcomponent powder was unwound and the subcomponent powder was uniformly dispersed can be obtained. Furthermore, the main component powder is added to the said subcomponent slurry, and it disperse | distributes using a bead mill etc., and the aggregated main component powder is solved, and the ceramic slurry which the main component powder and the subcomponent powder disperse | distributed uniformly can be obtained.

On the other hand, Patent Document 2 has a pulverizing process (paragraph number [0095]) obtained by plasticizing the raw material of the subcomponent powder to adjust the slurry of the subcomponent powder having an average particle diameter of 0.1㎛ or less, and then the slurry is subjected to high pressure dispersion treatment. Although it is described, in the present invention, [subcomponent powder] corresponds to [raw material] of the subcomponent powder in Patent Document 2, and is substantially free of two or more metal elements. In the method described in Patent Document 2, although the ceramic slurry is manufactured through such a frequent process, the particle size distribution of the obtained ceramic slurry is only D50 = 0.37 µm (paragraph [0100]), and the effect is still insufficient. Do. It is thought that this is because even if the average particle diameter of the subsidiary powder is 0.1 µm or less, the variation in the particle diameter is large and the particle size is large. On the other hand, as will be described later, all of the ceramic slurries produced using the method according to the present invention have a D99 value of 0.35 µm or less, and the ceramic powders of the main component and the subcomponent are extremely uniformly dispersed.

In the present invention, the dispersion treatment is preferably performed using a bead mill.

Dispersion treatment using the beads mill is preferably made of a circumferential speed (v) of 5m / s <v <15m / s using beads having a particle diameter of 0.03 ~ 0.3mm.

The main component powder is preferably a barium titanate-based dielectric powder.

It is preferable that the average particle diameter of the said barium titanate type dielectric powder before a said 2nd dispersion process is 0.3 micrometer or less.

It is preferable that the largest particle diameter of the subcomponent powder in the said subcomponent slurry is 3/4 or less of the average particle diameter of the said main component powder before the said 2nd dispersion process.

It is preferable that the said mixture containing the said subcomponent powder contains the 1st mixed solvent and the 1st dispersing agent.

When adding the main ingredient powder to the subcomponent slurry, it is preferable to further add a second dispersant.

The slurry obtained by adding and mixing a second mixed solvent and a binder to the ceramic slurry obtained by the production method according to the present invention is also one of the present inventions.

The green sheet manufactured by apply | coating the slurry which concerns on this invention in a sheet form on a base material is also one of this invention.

The sintered compact manufactured by baking the green sheet which concerns on this invention is also one of this invention.

A plurality of electrodes; A dielectric layer made of the sintered body according to the present invention provided between the electrodes; Also provided is a ceramic capacitor having one of the present invention.

It is preferable that the said electrode contains Ni or a Ni alloy.

According to the present invention, agglomeration of the ceramic powder is released and a ceramic slurry having good dispersibility can be obtained. Since the green sheet produced using such a ceramic slurry has the high dispersibility of a main component powder and a subcomponent powder, and its surface roughness is small, the thickness of the dielectric layer after sintering becomes uniform and the short rate of a multilayer ceramic capacitor becomes low. In addition, since the green sheet produced using such a ceramic slurry has a dense structure and uniform particle diameter, the particle size after firing is stable, the electrical properties are stable, and the temperature range of the effective firing temperature is also widened.

EMBODIMENT OF THE INVENTION Hereinafter, the multilayer ceramic capacitor 1 which concerns on one Embodiment of this invention is demonstrated with reference to drawings.

As shown in FIG. 1, the multilayer ceramic capacitor 1 according to the present embodiment includes a capacitor chip body 2 in which a dielectric layer 3 and an internal electrode 4 are alternately stacked, and a surface of the capacitor chip body 2. It is provided with the external electrode 5 provided in the electrical conduction with the internal electrode 4. As shown in FIG. The internal electrodes 4 are laminated so that their ends are alternately exposed on two opposite surfaces of the capacitor chip body 2, and are formed on the surface of the capacitor chip body 2 to form an external capacitor ( 5) is electrically connected.

The dielectric layer 3 is made of a sintered body of ceramic powder, and in the present embodiment, the ceramic powder is obtained as a ceramic slurry. In order to obtain the ceramic powder as a ceramic slurry, first, the mixture containing at least the accessory powder is dispersed (first dispersion) to adjust the accessory slurry.

Examples of the subcomponent powders include powders of compounds such as oxides and carbonates containing any one of Mg, Ba, Ca, Si, Mn, Al, V, Dy, Y, Ho, and Yb. 1 type may be used for such a compound powder, and 2 or more types may be used together.

It is preferable that a said 1st dispersion process is performed using a bead mill. It is preferable that the dispersion | distribution process using such a bead mill consists of circumferential speed v of 5 m / s <v <15 m / s using the beads whose particle diameter is 0.03-0.3 mm. If the particle size and the circumferential velocity of the gemstone are smaller than this range, it is difficult to sufficiently disperse the aggregated subcomponent powders and disperse. On the other hand, if the particle size and the circumferential velocity of the gemstone are larger than this range, the crystallinity of the subcomponent powder is lowered and becomes fine powder.

It is preferable that the said mixture contains a 1st mixed solvent and a 1st dispersing agent in addition to a subsidiary powder.

It does not specifically limit as said 1st mixed solvent, For example, glycols, such as ethyl carbitol, butanediol, 2-butoxyethanol: alcohols, such as methanol, ethanol, a propanol, butanol: acetone, methyl ethyl ketone, diacetone Ketones such as alcohols; esters such as methyl acetate and ethyl acetate; aromatics such as toluene, xylene, benzyl acetate, and the like.

The first dispersant is not particularly limited, and examples thereof include polyvinyl butyral dispersants, polyvinyl acetal dispersants, polycarboxylic acid dispersants, maleic acid dispersants, polyethylene glycol dispersants, allyl ether copolymer dispersants, and the like. Can be.

The average particle diameter of the subcomponent powder in the subcomponent slurry obtained by the first dispersion treatment is 0.1 µm or less, preferably 0.02 to 0.06 µm. If it exceeds 0.1 µm, a green sheet having a low surface smoothness and a nonuniform thickness is obtained.

In order to obtain the said ceramic slurry, main component powder is then added to a subcomponent slurry, and a dispersion process (2nd dispersion process) is performed.

As the main component powder is not particularly limited, for example, _{Ba x Ca 1 - x TiO 3} (0 <x ≤1) can be adapted to the barium titanate-based dielectric powder consisting of such use.

It is preferable that the average particle diameter of the said barium titanate type dielectric powder is 0.3 micrometer or less. When the thickness exceeds 0.3 µm, a green sheet having a low surface smoothness and a nonuniform thickness is obtained.

It is preferable that the largest particle diameter of the subcomponent powder in a subcomponent slurry is 3/4 or less of the average particle diameter of a main component powder before a said 2nd dispersion process. When the maximum particle diameter of the subcomponent powder in the subcomponent slurry exceeds this range, the sintering reaction of the main component powder and the subcomponent powder hardly occurs uniformly during firing.

It is preferable to further add a second dispersant when adding the main component powder to the subcomponent slurry. It does not specifically limit as a 2nd dispersing agent, For example, the same thing as a 1st dispersing agent is mentioned.

It is preferable to perform a said 2nd dispersion process similarly to the said 1st dispersion process using a bead mill, for example.

The slurry for green sheet formation can be obtained by adding and mixing a 2nd mixing solvent and a binder with the ceramic slurry obtained in this way.

It does not specifically limit as a 2nd mixed solvent, For example, the same thing as a 1st mixed solvent is mentioned.

The binder is not particularly limited, and examples thereof include acrylic resins, polyvinyl butyral resins, polyvinyl acetal resins, and ethyl cellulose resins.

It is preferable that the binder is dissolved in the second mixed solvent in advance, filtered and left as a solution, and then the ceramic slurry is added to the solution. Binder resin of high polymerization degree is hard to melt | dissolve in a solvent, and there exists a tendency for the dispersibility of a slurry to deteriorate by a normal method. After dissolving the binder resin of high polymerization degree in a solvent, adding other components to this solution can improve the dispersibility of each component in the slurry for green sheet formation, and can also suppress the generation of undissolved binder resin. On the other hand, it is not possible to raise solid content concentration with solvents other than the said 2nd mixed solvent, and there exists a tendency for the aging change of lacquer viscosity to increase.

The green sheet is formed by applying the thus prepared green sheet forming slurry to a substrate made of polyethylene terephthalate or the like in a sheet form. The dielectric layer 3 consists of a sintered compact obtained by baking the obtained green sheet.

It does not specifically limit as the internal electrode 4, For example, metals, such as Cu, Ni, W, Mo, Ag, these alloys, etc. are mentioned.

It does not specifically limit as the external electrode 5, For example, metals, such as Cu, Ni, W, Mo, Ag, or alloys thereof; Alloys such as In-Ga and Ag-10Pd; Carbon, graphite, the mixture which consists of carbon and graphite, etc. are mentioned.

Although it does not specifically limit as a manufacturing method of the multilayer ceramic capacitor which concerns on this embodiment, For example, it manufactures as follows. First, the electrically conductive paste for internal electrode 4 containing the said various metals etc. is screen-printed in the predetermined shape on the said green sheet, and the electrically conductive paste film for internal electrode 4 is formed.

Subsequently, as described above, a plurality of green sheets on which the conductive paste film for the internal electrode 4 is formed are laminated, and the green sheets on which the conductive paste film is not formed in the form of sandwiching these green sheets are laminated and pressed, and then necessary. By cutting according to the above, a laminate (green chip) is obtained.

Then, after the binder is subjected to the binder removal process, the green chip is fired in a reducing atmosphere, for example, to obtain the capacitor chip body 2. In the capacitor chip body 2, the dielectric layer 3 and the internal electrode 4 which consist of a sintered compact formed by baking a green sheet are alternately laminated | stacked.

It is preferable to perform an annealing treatment on the obtained capacitor chip body 2 in order to reoxidize the dielectric layer 3.

Next, an electrode made of the above various metals is applied on the end face of the capacitor chip body 2 so that the external electrode 5 is electrically connected to each end edge of the internal electrode 4 exposed at the end face of the capacitor chip body 2. The external electrode 5 is formed by this. If necessary, a coating layer is formed on the surface of the external electrode 5 by plating or the like.

Hereinafter, although an Example is given and this invention is demonstrated in detail, this invention is not limited only to these Examples.

BaCO ₃ , MgO, SiO ₂ , Mn ₃ O _4, and Dy ₂ O ₃ were prepared as side components. For after the main component of the sub-component added to the barium titanate (BaCO _3), the added amount of Ba element is 0.95mol%, and the addition amount of Si elements is 1.55mol%, and the addition amount of 0.65mol% Dy element, Mg source cattle The addition amount is 1.2 mol%, and the addition amount of the Mn element is 0.13 mol%.

Next, 390 parts by weight of a mixed solution of ethanol and toluene were added to 100 parts by weight of the prepared subcomponent, and 6 parts by weight of a polyvinyl butyral dispersant (BL-1, manufactured by Sekisui Chemical Co., Ltd.) was used as a dispersant. And mixed with a homogenizer. Next, these mixtures were dispersed and pulverized under the conditions shown in Table 1 using a vertical bead mill having a function of separating beads and slurry by centrifugal force. On the other hand, the sample supply amount is 100 ml / min.

Biz Mill Condition Bead diameter (mm) Circumferential speed (ms) Pass Comparative Example 1 0.4 12 7 Comparative Example 2 0.05 15 7 Comparative Example 3 - - - Comparative Example 4 0.05 12 7 Example 1 0.05 12 7 Example 2 0.05 12 14 Example 3 0.05 10 7 Example 4 0.1 12 7 Example 5 0.05 8 7

Next, with respect to 100 weight part of barium titanate powder which is a main component, the subcomponent slurry after dispersion and disintegration process was added so that each element might add the above-mentioned addition amount. On the other hand, the particle diameters of the subcomponent powder and the main component powder in the subcomponent slurry are shown in Table 2. The particle diameter of Table 2 observed each powder with the scanning electron microscope, measured the particle diameter of 300 particle | grains, respectively, and calculated | required the average value.

Subsidiary Particle Size (㎛) Principal component particle size (㎛) Comparative Example 4 0.2 0.2 Another example 0.05 0.2

Furthermore, 0.87 wt% of said BL-1 was added with respect to 100 weight part of barium titanate powders as a dispersing agent, and it mixed with the homogenizer. Next, these mixtures were dispersed and disintegrated under the conditions shown in Table 3 using a vertical bead mill having a function of separating beads and slurry by centrifugal force. On the other hand, the sample supply amount is 100 ml / min.

Biz Mill Condition Bead diameter (mm) Circumferential speed (ms) Pass Comparative Example 1 0.4 12 4 Comparative Example 2 0.05 15 6 Comparative Example 3 0.1 6 4 Comparative Example 4 0.05 12 4 Example 1 0.05 12 4 Example 2 0.05 12 6 Example 3 0.05 10 4 Example 4 0.1 12 10 Example 5 0.05 8 8

Next, the obtained ceramic slurry was put into a ball mill and mixed with a toluene-ethanol mixed solvent, a polyvinyl butyral system binder, and a plasticizer until it became a suitable viscosity, and the slurry for green sheet formation was prepared. And the said slurry was apply | coated by the doctor blade method on the polyethylene terephthalate film, and the green sheet was produced.

Subsequently, after screen-printing the conductive paste for internal electrodes which consisted of Ni powder on each green sheet to a predetermined | prescribed shape, several green sheets in which the conductive paste film was formed were laminated | stacked, thermocompression-bonded, and the laminated body was produced.

The laminate was heated at 300 ° C. for 10 hours in air to remove the organic binder, and then calcined for 2 hours in a reducing atmosphere of 1100 ° C., followed by reoxidation and sintering for 2 hours in an N ₂ gas atmosphere at 1000 ° C. The capacitor chip body was obtained. Next, after the end face of the obtained capacitor chip body was polished by sandblasting, an In-Ga electrode was applied to the end face to form an external electrode, and a multilayer ceramic capacitor having the structure illustrated in FIG. 1 was produced.

Various characteristics of the ceramic slurry, the green sheet, and the multilayer ceramic capacitor were evaluated as follows, and the results are shown in Table 4.

<Evaluation of Ceramic Slurry>

The particle size distribution of the produced ceramic slurry was measured by LA-920 manufactured by Horiba Seisakusho. The sample whose D99 value exceeded 0.35 micrometer was evaluated by NG.

<Evaluation of Green Sheet>

The surface roughness (Rz) of the green sheet was measured by a scanning probe microscope (SPM-9500J3 manufactured by Shimadzu Corporation). Samples with Rz exceeding 0.4 μm were evaluated by NG.

<Evaluation of Multilayer Ceramic Capacitor>

The short rate was calculated | required by measuring the resistance value of 100 samples per laminated ceramic capacitor with the insulation ohmmeter, and determining the sample whose resistance value becomes 100 k ohm or less as a defective product. Samples with short rates above 10% were evaluated by NG.

Dispersibility of the Ceramic Slurry D99 (㎛) Surface Roughness Rz (µm) of Sheet Short rate (%) Non-professional 1 0.45 0.46 15 Comparative Example 2 0.42 0.48 13 Comparative Example 3 0.43 0.49 20 Comparative Example 4 0.44 0.45 30 Example 1 0.34 0.35 5 Example 2 0.30 0.32 3 Example 3 0.34 0.30 5 Example 4 0.35 0.36 4 Example 5 0.30 0.34 3

<Production Method and Measurement Conditions of Single-Plate Samples>

The evaluation sample of the single plate was produced as follows. The green sheets were cut at 1 cm squares and stacked to have a thickness of 1 mm. This was then molded at a pressure of 1000 kg / cm ³ . Next, in order to incinerate a resin component, it baked at 300 degreeC in air | atmosphere for 10 hours, and baked at the baking temperature and reducing atmosphere shown in Table 5 after that for 2 hours. Thereafter, the mixture was stabilized at 1000 ° C. in nitrogen gas and subjected to reoxidation for 2 hours.

About the obtained single plate sample, the density, particle diameter, and effective baking temperature range were evaluated as follows, and the result was shown in Table 5.

Density (g / cm ³ ) was measured using the Archimedes method.

The presence or absence of the particle | grains of particle size 0.5 micrometer or more was determined by measuring the particle diameter of a sintered compact with a scanning electron microscope.

The effective firing temperature range indicates the effective range of the firing temperature on the condition that there are no particles having a density of 5.8 g / cm ³ or more and a particle diameter of 0.5 µm or more.

If the density is 5.8 g / cm ³ or more, the particle size after sintering is less than 0.5 μm, and the effective firing temperature range does not satisfy at least one of the conditions of 20 ° C. or more, the evaluation results are regarded as failing to obtain desired characteristics. ].

evaluation Firing temperature (℃) Density (g / cm ³ ) Presence of particles over 0.5㎛ Effective firing temperature range (℃) NG Comparative Example 1 1150 5.74 Plastic insufficiency NG 1155 5.80 radish 5 ℃ (1155 ~ 1160 ℃) NG 1160 5.85 radish NG 1165 5.89 U NG Comparative Example 2 1125 5.76 radish radish NG 1130 5.83 U NG Comparative Example 3 1120 5.79 Plastic insufficiency NG 1125 5.82 radish 15 ℃ (1125 ~ 1140 ℃) NG 1140 5.89 radish NG 1145 5.89 U NG Comparative Example 4 1165 5.79 Plastic insufficiency radish NG 1190 5.85 U NG Example 1 1120 5.70 Plastic insufficiency 1125 5.80 radish 65 ℃ (1125 ~ 1190 ℃) 1130 5.83 radish 1134 5.87 radish 1149 5.93 radish 1176 5.90 radish 1190 5.91 radish NG 1195 5.92 U NG Example 2 1120 5.70 Plastic insufficiency 1125 5.80 radish 85 ℃ (1125 ~ 1210 ℃) 1130 5.83 radish 1134 5.87 radish 1150 5.93 radish 1174 5.90 radish 1210 5.91 radish NG 1215 5.92 U NG Example 3 1120 5.70 Plastic insufficiency 1125 5.85 radish 65 ℃ (1125 ~ 1190 ℃) 1130 5.84 radish 1134 5.86 radish 1148 5.87 radish 1175 5.89 radish 1190 5.90 radish NG 1195 5.90 U NG Example 4 1125 5.76 Plastic insufficiency 1130 5.83 radish 30 ℃ (1130 ~ 1160 ℃) 1143 5.87 radish 1150 5.93 radish 1160 5.90 radish NG 1165 5.91 U NG Example 5 1125 5.76 Plastic insufficiency 1130 5.83 radish 30 ℃ (1130 ~ 1160 ℃) 1143 5.87 radish 1150 5.93 radish 1160 5.90 radish NG 1165 5.91 U

1: is a schematic cross section of the multilayer ceramic capacitor which concerns on one Embodiment of this invention.

<Description of the symbols for the main parts of the drawings>

1 multilayer ceramic capacitor

2 condenser chip

3 laminate layer

4 internal electrodes

5 external electrodes

Claims (13)

In the method for producing a ceramic slurry used as a dielectric material, Performing a first dispersion treatment on the mixture containing at least the accessory powder to adjust the accessory slurry; And adding a main component powder to the subcomponent slurry, and then performing a second dispersion treatment to prepare the ceramic slurry. The subcomponent powder is made of at least one compound selected from the group consisting of compounds containing any one element of Mg, Ba, Ca, Si, Mn, Al, V, Dy, Y, Ho or Yb, The average particle diameter of the said subcomponent powder in the said subcomponent slurry is 0.1 micrometer or less, The manufacturing method of the ceramic slurry. According to claim 1, The said dispersion process is a manufacturing method of the ceramic slurry which uses a bead mill. The method of claim 2, The dispersion process using the bead mill is a ceramic slurry production method comprising a circumferential speed (v) of 5 m / s <v <15 m / s using beads having a particle diameter of 0.03 ~ 0.3mm. According to claim 1, The main component powder is a method for producing a ceramic slurry is a barium titanate-based dielectric powder. The method of claim 4, wherein The average particle diameter of the said barium titanate type dielectric powder before a said 2nd dispersion process is a manufacturing method of the ceramic slurry which is 0.3 micrometer or less. According to claim 1, The maximum particle size of the subcomponent powder in the said subcomponent slurry is 3/4 or less of the average particle diameter of the said main component powder before a said 2nd dispersion process. According to claim 1, The said mixture containing at least the said subcomponent powder contains the 1st mixed solvent and the 1st dispersing agent, The manufacturing method of the ceramic slurry. According to claim 1, A method of producing a ceramic slurry in which a second dispersant is further added when the main component powder is added to the subcomponent slurry. The slurry obtained by adding and mixing a 2nd mixing solvent and a binder with the ceramic slurry obtained by the manufacturing method in any one of Claims 1-8. The green sheet manufactured by apply | coating the slurry of Claim 9 in the sheet form on a base material. The sintered compact manufactured by baking the green sheet of Claim 10. A plurality of electrodes; A dielectric layer made of the sintered body according to claim 11 provided between the electrodes; Ceramic capacitor provided with. The method of claim 12, And the electrode contains Ni or a Ni alloy.

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