KR20090065047A - Heat radiating device and led streetlight comprising the same - Google Patents

Abstract

A heat radiating device and a radiating structure of an LED street light employing the same are provided to allow a heat absorber to absorb the heat generated from each LED in order to maintain the inner temperature of the LED street light to optimal temperature or less. A heat radiating device consists of a heat-emitting module, a heat absorber, a heat transferring unit and a heat radiating unit. The heat-emitting module(110) is composed of a plurality of LEDs combined with the one side of a PCB(120). The heat absorber(130) connected to the other side of the PCB absorbs the heat generated from the heat-emitting module. The heat transferring unit(140) adheres to the heat absorber and transfers the heat absorbed by the heat absorber. The heat radiating unit(150) discharges the heat transferred by the heat transferring unit to the outside.

Description

Heat radiating device and LED streetlight comprising the same

The present invention relates to a heat dissipation device and a heat dissipation structure of an LED street light including the same, and more particularly, to a heat dissipation structure of a lighting device using a light emitting diode (LED), for example, an LED street light. Heat generated by a plurality of LEDs is absorbed by a heat absorbing part having excellent thermal conductivity, a heat transfer part in contact with the heat absorbing part is transferred to a plurality of heat sinks, and each heat sink radiates heat transferred to the outside, and is generated in each light emitting diode. The present invention relates to a heat dissipation device capable of efficiently dissipating heat, and a heat dissipation structure of an LED street light including the same.

Today, with the development of electric / electronic technology, various electrically stable light emitting devices have been developed, and a representative light emitting device is a light emitting diode (LED).

LED is one of the solid-state light emitting devices, and the white light LED which can be applied to various fields as well as the monochromatic LED which generates light of the three primary colors of light (R), green (G) and blue (B) Developed.

In the field of application of the LED, the range of application is gradually expanded to a next-generation lighting equipment that can replace an incandescent light bulb, a fluorescent lamp, or a street light as well as a light emitting source for a backlight of a display in a general display device.

Unlike LED lamps, LED lamps, such as LED lamps, have a simple lighting circuit, do not require inverter circuits and iron ballasts, and consume less power and have a longer lifespan. There is this.

However, the disadvantages of such LED street light is that the characteristics deterioration and failure due to thermal stress occurs. This is because the higher the power input to the plurality of LEDs to operate the LED, the more heat is generated, causing failure and deterioration of characteristics.

For example, a printed circuit board (PCB) of a LED street light is implemented with a control circuit for controlling the blinking of a plurality of LEDs on a PCB, and a power circuit for supplying power supplied from outside to each LED. Control boards malfunction or fail due to thermal stress caused by the heat generated by many LEDs.

Therefore, the conventional LED street light is to solve the thermal stress caused by the light emission of the LED by mounting a heat sink such as a heat sink or slug using a metal material having excellent thermal conductivity, but this is the limit of the metal material constituting the heat sink In order to satisfy the required heat dissipation efficiency, the thickness of the heat sink is increased, so the size of the LED street light is also increased.

1 is an installation perspective view showing a state in which a general street light is installed.

As shown in FIG. 1, a general street light includes a post 1 rising vertically from the ground and a luminaire 10 at an end of the support 2 extending substantially parallel to the ground on the top of the post 1. .

The luminaire 10 emits light on the basis of external power supplied by a plurality of LEDs mounted on a control board, and the lower part of the luminaire 10 is covered with a transparent cover 8 made of a transparent material capable of transmitting light. The upper part is covered with a cover 6 to seal the inside of the luminaire 10 so that foreign matter (eg, dust, water, etc.) does not penetrate from the outside.

Therefore, since heat generated by emitting a plurality of LEDs is difficult to escape to the outside of the luminaire 10, deterioration and failure of characteristics of the luminaire 10 may occur due to thermal stress.

Therefore, as described above, a structure for dissipating heat generated by the LED is provided by installing a heat sink such as a heater sink on an opposite portion of the control board on which the plurality of LEDs are mounted. (10) Since it is difficult to radiate heat to the outside, it is difficult to expect the heat radiation efficiency to maintain the temperature inside the luminaire 10 below the required temperature.

In fact, when a plurality of LEDs are mounted on the control board according to the existing heat dissipation structure and the heat sink is installed on the opposite side of the LEDs, each LED is emitted while observing the temperature change inside the lamp 10, After a certain time, it was observed that the temperature inside the luminaire 10 continued to rise as well as the temperature inside the luminaire 10 did not fall below an appropriate temperature for a long time even when the power supply to the light emitting diode was stopped. This means that the heat radiation efficiency of the luminaire 10 to which the existing heat sink is applied does not satisfy the required value.

In addition, the structure of constituting the heat sink in the luminaire 10, the thickness of the heat sink is thick in order to maintain the temperature inside the luminaire 10 below the required temperature, due to the increased manufacturing cost of the luminaire 10 Since the production efficiency is lowered and the weight of the luminaire 10 itself increases, the strut 1 and the support 2 for installing the street light should reinforce the strength and the supporting force.

In addition, in general, since the lamp 10 of the street lamp is located at a considerable height from the ground, the lamp 10 causes a failure due to thermal stress, or a separate maintenance worker approaches the street lamp on a regular basis, and separately, Repair / maintenance of the lamp 10 through the equipment (for example, a crane) of, or after the lamp 10 is removed from the support 20 to repair / maintain, so a lot of maintenance and maintenance of the street light Done.

The present invention has been proposed to solve the above problems, and an object thereof is to provide a heat dissipation device capable of efficiently dissipating heat generated from each LED to the outside in a lighting device using light emitted from a plurality of LEDs.

In addition, the present invention absorbs heat generated from each LED in the LED street light, the heat absorbing portion made of a metal having excellent thermal conductivity, and effectively transfer the heat transfer portion to a plurality of heat sinks, thereby efficiently dissipating heat generated in each LED It is an object of the present invention to provide a heat dissipation device capable of maintaining an internal temperature of a luminaire below a proper temperature and a heat dissipation structure of an LED street light including the same.

In addition, an object of the present invention is to provide a heat dissipation device that can be cooled by the inlet / outflow of the air in the interior of the luminaire while minimizing the size of the heat dissipation structure of the LED street light, and a heat dissipation structure of the LED street light including the same.

According to an aspect of the present invention, a heat dissipation device includes: a light emitting module unit including a plurality of LEDs coupled to one side of a printed circuit board (PCB) on which a control circuit and a power supply circuit are implemented, and the PCB A heat absorbing part which contacts the other side of the heat absorbing part and absorbs heat generated by the light emitting module part, a heat transferring part which is attached to the heat absorbing part and transmits the heat absorbed by the heat absorbing part, and each of the heat transferring parts Including a plurality of heat sinks for dissipating the heat transmitted to the outside, the heat absorbed by the heat absorbing unit may be transferred to the heat sinks arranged in a predetermined pattern around the heat transfer unit to radiate heat.

The heat dissipation device according to the present invention includes a fixing part for fixing the position of the PCB and the light emitting module therein, fixing the heat absorbing part, and each of the heat dissipation plates coupled to each other to fix the heat dissipation plate by being fixed to the fixing part. Includes more cover.

The cover of the heat dissipation device according to the present invention, at least one or more side surfaces having one or more vent holes for introducing / outflowing the air in the inner space provided by the heat absorbing portion and the cover, through the respective vent holes Can be cooled by inflow / outflow.

The heat absorbing portion and the heat sink of the heat dissipating device according to the present invention are formed of any one metal of aluminum (Al), gold (Au), silver (Ag), and copper (Cu) to absorb and radiate heat more effectively. .

Each of the heat transfer parts according to the present invention comprises: an adhesive part attached to an adhesive region set in the heat absorbing part to absorb heat from the heat absorbing part, a pillar part transferring the absorbed heat vertically extended from the adhesive part; It is composed of a wing portion that extends in parallel with the heat absorbing portion from each of the pillar portions and transfers heat transmitted through each of the pillar portions to each of the heat sinks, thereby easily transferring heat.

According to another aspect of the present invention, a heat dissipation structure of an LED street light includes: a support member connected to a support vertically connected to a prop of the street light, a fixing part extending from the support member, and located inside the fixing part, A PCB in which a control circuit for controlling the blinking of a power supply and a power supply circuit for supplying external power are implemented, and an input / output terminal is connected to the power supply circuit on one side of the PCB to emit light based on the supplied external power. A light emitting module unit consisting of two LEDs, a heat absorbing unit in contact with the other side of the PCB, and absorbing heat generated from the light emitting module unit; and a heat absorbing unit in contact with the heat absorbing unit to transfer heat absorbed by the heat absorbing unit. A heat transfer unit, a plurality of heat sinks for dissipating heat transferred from each heat transfer unit to the outside, and the heat sinks are coupled to each other, A cover is formed in the upper part of the street lamp while fixing the heat sinks in a predetermined position, and a transparent cover is formed to transmit the light generated by the light emitting module unit to form the bottom shape of the street lamp. Efficiently dissipate heat.

According to the present invention described above, a light absorbing device using a light generated from a plurality of LEDs, for example, in the heat dissipation structure of the LED street light absorbs a heat absorbing portion having excellent thermal conductivity by heat generated from each LED, Since the bonded heat transfer unit receives heat absorbed by the heat absorption unit and releases it into the air, heat generated inside the luminaire can be efficiently radiated.

In addition, a plurality of heat sinks are combined to provide a plurality of vent holes for inflow / outflow of the air in the inner space on each side of the cover for fixing each heat sink, an internal space formed between the heat absorbing portion and the cover to release heat Cooling the air can increase the heat radiation efficiency.

Therefore, the heat generated inside the heat dissipation structure of the LED street light can be effectively dissipated, thereby preventing malfunction or failure caused by thermal stress caused by the heat generated from each LED, and maintaining / maintaining the street light. The cost can be reduced.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In the description of the present invention, the terms defined are defined in consideration of the functions in the present invention, and should not be construed as limiting the technical components of the present invention. Detailed description of the technical content is omitted.

2 is a cross-sectional view illustrating a heat dissipation structure of the LED street light according to the preferred embodiment of the present invention.

Referring to FIG. 2, a support member 3 is fixedly installed on the support 2 that is horizontally connected to the ground to the support, and the cover 160 is covered by an upper portion of the lamp 100. The lower cover is covered with a transparent cover 220 to form an outer shape.

In addition, the lamp 100 is composed of a plurality of LEDs, the light emitting module unit 110 to emit light by receiving external power, and each LED constituting the light emitting module unit 110 is attached to the front, each LED flashes PCB 120 and a control circuit for controlling the power and a power circuit for supplying power to each LED is implemented, extending from the support member (3), is implemented in a metal having excellent thermal conductivity, contact the back of the PCB 120 The heat absorbing part 130, the plurality of heat transfer parts 140 adhered to the heat absorbing part 130, and the plurality of heat sinks 150 are located in the inner space 60 in which the heat transfer part 140 is not formed. And, each heat sink 150 is attached, or consists of a cover 160 formed integrally.

Meanwhile, a power terminal (not shown) for supplying power to the light emitting module unit 110, a control box (not shown) for controlling the blinking of each LED, and other components may be further provided. Detailed description thereof will be omitted.

Each input / output terminal of each LED constituting the light emitting module unit 110 of the luminaire 100 is connected to and attached to a power circuit of the PCB 120 and emits light based on the power supplied through the PCB 120. Generates heat

The light emitting module unit 110 and the PCB 120 are mounted and fixed inside the fixing unit 40 extending from the supporting member 3.

The heat absorption unit 130 may be formed of a metal having excellent thermal conductivity, for example, metals such as aluminum (Al), gold (Au), silver (Ag), copper (Cu), and the like, and the production cost of the LED street light In consideration of such productivity, it can be formed of an appropriate metal, for example, aluminum.

In addition, the area of the heat absorbing unit 130 is formed to be the same or somewhat larger than the area of the PCB 120, and is fixed to, for example, bolted and fixed to the fixing unit 40 while contacting the PCB 120 The absorbing heat generated from the light emitting module unit 110 and applied to the PCB 120 is transferred to the heat transfer unit 140.

That is, since the heat absorbing part 120 is a metal having excellent thermal conductivity, for example, aluminum, the heat absorbing part 120 absorbs heat applied to the PCB 120 because the thermal conductivity is higher than that of the PCB 120.

The heat transfer part 140 may be implemented as a plurality of heat pipes, for example, a pair of heat pipes, and transfers the heat absorbed by the heat absorber 130 to the plurality of heat sinks 150. The number of heat pipes constituting the heat transfer part 140 may be designed or implemented as one or two or more depending on the heat dissipation efficiency required for the heat dissipation structure of the LED street light.

The plurality of heat sinks 150 may be made of a metal having excellent thermal conductivity, for example, aluminum, and radiate heat by dissipating heat transferred through the heat transfer part 140 to the outside. That is, the plurality of heat sinks 150 emits heat from the interior space 60 formed between the cover 160 and the metal plate 130 to the outside of the luminaire 100.

Hereinafter, the heat dissipation device according to the present invention will be described in detail with reference to FIGS. 3A to 3D.

3A to 3C are perspective views illustrating a heat dissipation device of the LED street light according to the preferred embodiment of the present invention.

Figure 3a is a perspective view for explaining the heat dissipation structure of the LED street light, that is, the heat absorbing unit 130, Figure 3b is a superstructure of the luminaire, that is, the heat transfer unit 140, the heat sink 150 and the cover 160 It is a perspective view for demonstrating, FIG. 3C is a coupling perspective view which shows the coupling relationship of the upper / lower structure of a luminaire.

3A to 3C, the heat absorbing part 130 is fixedly coupled to the fixing part 40 extending from the supporting member 3 and having the PCB 120 and the light emitting module part 110 therein. .

Fixing portion 40 is open on the upper / lower side, and has a border form that is sealed front / rear / left / right side, the PCB 120 is coupled to the inside of the border, a plurality of LEDs on the PCB 120 The light emitting module unit 110 is connected to each other, and the PCB 120 is fixed to the fixing unit 40.

In addition, the fixing part 40 is formed in a stair shape such that the upper surface of the support member 3 and the predetermined distance h are spaced apart, and the heat transfer part is formed in the space generated by the separation distance h of the heat absorbing part 130. 140 and each heat sink 150 are located. In addition, the distance (h) between the fixing portion 40 and the upper surface of the support member 30 is preferably set equal to the height of the cover 160 to which each heat sink 150 is attached.

The heat absorbing unit 130 may be implemented in a polygonal shape, for example, a quadrangular shape, and for fixing the heat absorbing unit 130 to the fixing unit 40 at each corner, as well as for coupling the cover 160. A plurality of screw holes 31 are provided.

In the detailed description of the present invention, for example, the case in which the cover 160 and the heat absorbing unit 130 are implemented in a polygonal shape will be described. However, the cover 160 and the heat absorbing unit 130 may be implemented in other shapes such as circles, ellipses, and the like.

The heat transfer part 140 contacts the metal plate 130 and the cover 160 to efficiently transfer heat generated from the light emitting module unit 110 to the plurality of heat sinks coupled to the cover 160.

3D is a cross-sectional view of each heat transfer unit according to the present invention. As shown in FIG. 3D, each heat transfer unit 141 or 142 has a 'T' shape as a whole by bending a central portion thereof, and the heat absorption unit 130 is disposed in the heat absorption unit 130. Bonding portion 140a to be bonded, a pillar portion 140b vertically extending from the bonding portion 140a, and a wing portion for transferring the heat absorbed through the bonding portion 140a and transferred to the pillar portion 140b to the cover 160. And 140c.

The adhesive part 140a absorbs heat from the heat absorbing part 130 to be bonded, and the wing part 140c transmits the heat transmitted through the pillar part 140b to the cover 160 that contacts the heat. At this time, the wing portion 140c is vertically extended from the pillar portion 140b to increase the area in contact with the cover 160 to facilitate heat transfer, one wing portion 140c from the pillar portion 140b or It may extend vertically in two or more directions to maximize the contact area with the lid 160.

The bottom surface of the adhesive portion 140a of the heat transfer parts 141 and 142 is hermetically adhered to the adhesive region a set in the heat absorbing part 130.

The adhesive area a to which the adhesive parts 140a of the heat transfer parts 141 and 142 adhere may be determined by the number of heat pipes constituting the heat transfer part 140 and the area of the heat absorbing part 130. It is preferable that the heat absorbed by the absorber 130 is designed to be effectively transferred to each heat transfer unit 140.

The area of the adhesive part 14a is set to such that each of the heat transfer parts 141 and 142 is fixedly supported by the adhesive force of the adhesive or the tape, or is set in proportion to the total area of the heat absorbing part 130, and thus the heat absorbing part 130 Easy heat transfer from the heat absorbing portion 130 so as not to be separated.

The method of bonding the adhesive parts 140a of the heat transfer parts 141 and 142 to the heat absorbing part 130 may be applied in a fusion method and a bonding method. In the case of adhesion to 130, it may be adhered with an acrylic or epoxy thermally conductive adhesive or a thermally conductive tape.

On the other hand, each of the heat transfer parts 141, 142 is not only a thermally conductive adhesive, but also a conductive adhesive, for example, silicone, epoxy, acrylic conductive adhesive (isotropic adhesive), anisotropic conductive paste (ACP) or anisotropic conductive The film may be bonded using an anisotropic conductive film (ACF).

In addition, the pillar portions 140b may be vertically extended at both sides of the bonding portion 140a in a plurality, for example, and the height of the pillar portions 140b may be the upper surface and the heat absorbing portion 130 of the supporting member 3. It is set smaller than the separation distance (h) of, so that the heat transfer portion (141, 142) is located in the inner space 60 formed between the cover 160 and the heat absorbing portion (130).

Since the heat absorbing unit 130 has higher thermal conductivity than the PCB 120, the heat absorbing unit 130 absorbs heat generated from the light emitting module unit 110 and transmits the heat to the heat transfer unit 140 adhered to the bonding region a. That is, each of the heat transfer parts 140 absorbs the heat of the heat absorbing part 130 through the adhesive part 140a of each heat transfer part 140 because the thermal conductivity is greater than that of air, and the adhesive part of each heat transfer part 140. Heat absorbed by the 140a is transferred to the cover 160 through the pillar portion 140b and the wing 140c, and is discharged to the outside through the plurality of heat sinks 150 coupled to the cover 160.

Therefore, the heat absorbing unit 130 absorbs heat generated from the light emitting module unit 110, transfers the heat to the cover 160 through the heat transfer unit 140, and each heat sink 150 coupled to the cover 160. Since the heat is emitted to the outside, the thermal stress due to the heat generated from the light emitting module unit 110 can be eliminated.

On the other hand, the cover 160 has an area similar to that of the heat absorbing unit 130, is formed at a height corresponding to the separation distance (h) of the support member 3 and the heat absorbing unit 130, a plurality of discharge plate ( It is formed integrally with the 150, or manufactured separately from each discharge plate 150, each discharge plate 150 may be combined.

The plurality of discharge plates 150 may be formed of a metal having excellent thermal conductivity, for example, aluminum, and radiate heat emitted from the heat absorbing part 130 and each heat transfer part 140.

At this time, the cover 160 may be formed of a resin or a metal material, and is formed of a metal material having excellent thermal conductivity to increase heat dissipation efficiency by dissipating heat emitted from the heat absorbing unit 130 and each heat transfer unit 140. It is preferable to make it.

In addition, at least one vent hole 50 is provided at each side surface of the cover 160 to allow the air in the internal space 60 to flow out to the outside, or to allow the cooled external air to flow into the internal space 60.

Therefore, a plurality of vent holes 50 are provided in the cover 160 to inflow / outflow the air in the space where the light emitting module unit 110 and the PCB 120 of the heat dissipation structure of the LED street light are located, and thus, the internal space 60. Since it can be cooled, the heat radiation efficiency of heat generated from the light emitting module unit 110 can be increased.

Each heat sink 150 may be arranged in a predetermined pattern around the heat transfer part 140, and the length and heat transfer part 140 of the first heat sink 151 located in the inner space 60 without the heat transfer part 140. The length of the second heat sink 152 located on the wing 140c of the) is set differently, and each heat sink 150 is arranged side by side on both sides in a double structure.

That is, in order to increase the heat dissipation efficiency of the heat emitted from the heat absorbing unit 130 and each heat transfer unit 140 by maximizing the area where each heat sink 150 is in contact with the air of the internal space 50, The length of the first heat dissipation plate 151 arranged in the inner space 60 where each heat transfer part 140 is not located is the second heat dissipation plate 152 positioned on the side of the wing 140c of each heat transfer part 140. It is set longer than the length of by a predetermined length.

Therefore, the ratio of the contact area between the air in the internal space 60 where the heat transfer parts 140 are not located and the heat dissipation plate 150 is maximized, thereby maximizing heat dissipation efficiency by the heat dissipation plate 150.

In addition, a through hole 32 through which the bolt B may be penetrated is provided at the edge portion of the cover 160 to fix the cover 160 on the fixing part 40.

Through the bolts (B) through each of the through holes 32 provided in each Mori portion of the cover 160 is coupled to the screw hole 31 provided in each corner portion of the heat absorbing portion 130 to cover ( 160 and the heat absorbing portion 130 is fixed to the fixing portion (40).

Therefore, the cover 160 and the heat absorbing part 130 are fixed on the fixing part 40 while being fixed at the set position of each heat sink 150 coupled to the inside of the cover 160.

4 is a perspective view illustrating a state in which a heat dissipation device of an LED street light according to the present invention is assembled, and the bonding portion 140a of the pair of heat transfer parts 140 is attached to the bonding area a set in the heat absorbing portion 130. In close contact with each other, for example, a plurality of bolts, for example, four bolts, penetrate through the through holes 31 provided in the respective corner portions of the cover 160, respectively, through the screw holes 310 of the corresponding heat absorbing units 130. When the cover 160 is fixed by bolting to the fixing part 40, the heat dissipation device of the LED street light as shown in FIG. 4 is assembled.

As described above, the heat dissipation device of the LED street light absorbs heat generated from the light emitting module unit 110 by the heat absorbing unit 130, which is made of a metal having excellent thermal conductivity, thereby relieving thermal stress applied to the PCB 120. Heat absorbed by the heat transfer part 140 adhered to the heat absorbing part 130 is transferred to the plurality of heat sinks 150, and the heat generated by the heat dissipation structure of the LED street light by each heat sink 150 radiates heat. It is possible to increase the heat dissipation efficiency of emitting the heat.

In addition, since the air in the internal space 60 can be introduced / exited through one or more vent holes 50 provided on each side of the cover 160 to which the heat sinks 150 are coupled, the internal space 60 is cooled. You can.

The heat dissipation device and the luminaire of the LED street light of the present invention has been described above with reference to the accompanying drawings, which illustrate the best embodiment of the present invention by way of example and not limit the present invention.

Therefore, it is obvious that any person skilled in the art can make various modifications and imitations such as dimensions, shapes, structures, etc. without departing from the scope of the technical idea of the present invention.

1 is an installation perspective view showing a state in which a general street light is installed.

Figure 2 is a cross-sectional view for explaining a heat radiation structure of the LED street light according to an embodiment of the present invention.

3A to 3C are perspective views illustrating a heat dissipation device of the LED street light according to the preferred embodiment of the present invention.

Figure 3d is a cross-sectional view of each heat transfer unit according to the present invention.

Figure 4 is a perspective view showing a state in which the heat dissipation device of the LED street light according to the present invention is assembled.

** Description of the symbols for the main parts of the drawings **

40: fixing part 50: vent hole

10, 100: lamp 110: light emitting module

120: printed circuit board

130: heat absorption unit 140: heat transfer unit

140a: bonding portion 140b: pillar portion

140c: wing 150: heat sink

160: cover 220: transparent cover

Claims (14)

A light emitting module unit including a plurality of LEDs coupled to one side of a printed circuit board (PCB) on which a control circuit and a power circuit are implemented; A heat absorbing part in contact with the other side of the PCB and absorbing heat generated from the light emitting module part; A heat transfer part adhered to the heat absorption part to transfer heat absorbed by the heat absorption part; And a plurality of heat sinks for dissipating heat transferred by each of the heat transfer parts to the outside. According to claim 1, A fixing part for fixing the PCB and the light emitting module part inside and fixing the heat absorption part; Each of the heat sink is coupled, the heat dissipation device further comprising a cover for fixing the respective heat sink by being fixed to the fixing portion. The method of claim 1 or 2, wherein the cover, And at least one vent hole on at least one side of the air inlet / outlet of the internal space provided by the heat absorber and the cover. The method of claim 2, wherein the cover, A heat dissipation device, characterized in that formed of a metal material and integrally with each of the heat sinks, or formed of a resin material separately from each of the heat sinks and combined with each of the heat sinks. The method of claim 1, wherein the heat absorbing portion and the heat sink, A heat radiation device, characterized in that formed of any one of aluminum (Al), gold (Au), silver (Ag), copper (Cu). The method of claim 1, wherein each of the heat transfer unit, An adhesive part adhered to an adhesive region set in the heat absorbing part to absorb heat from the heat absorbing part; A pillar portion for transferring the absorbed heat vertically stretched from the adhesive portion; The heat dissipation device comprising a wing portion extending from the respective column portions in parallel with the heat absorbing portion and transferring the heat transferred through the respective column portions to the respective heat sinks. The method of claim 6, wherein the adhesive portion, The heat dissipating device, characterized in that fused to the adhesive region of the heat absorbing portion. The method of claim 6, wherein the adhesive portion, And a heat conductive adhesive, a heat conductive tape, a conductive adhesive, or a conductive tape to the adhesive region of the heat absorbing portion. The heat sink according to claim 1 or 6, wherein each of the heat sinks is Arranged in a predetermined pattern around the heat absorbing portion, the heat radiation device, characterized in that the first length of the first heat sink and the second length of the second heat sink located on the side of the wing portion is set different from each other. The method according to claim 1 or 2, A plurality of through holes are provided in the cover, and a plurality of screw holes are provided in the heat absorbing part, and a plurality of bolts are coupled to the screw holes while penetrating the through holes to be fixed to the fixing part. Device. In the LED street light, A support member connected to a support vertically connected to the prop of the street light; A fixed part extending from the support member; A PCB which is located inside the fixed part and which a control circuit for controlling the blinking of the street light and a power circuit for supplying external power are implemented; A light emitting module unit having an input / output terminal connected to the power circuit on one side of the PCB, the light emitting module unit including a plurality of LEDs emitting light based on the supplied external power; A heat absorbing part in contact with the other side of the PCB and absorbing heat generated from the light emitting module part; A heat transfer part in contact with the heat absorber to transfer heat absorbed by the heat absorber; A plurality of heat sinks for dissipating heat transferred from each of the heat transfer parts to the outside; The cover is coupled to each of the heat sinks, and fixed to the fixing portion to form the upper appearance of the street lamp while fixing the heat sinks in the set position, The heat dissipation structure of the LED street light including a transparent cover which transmits the light generated by the light emitting module unit to form an outer appearance of the street light. The method of claim 11, wherein the cover, The heat dissipation structure of the LED street light comprising a plurality of vent holes for cooling the internal space by inflow / outflow of the air in the internal space formed between the heat absorbing portion and the cover on at least one side. The method of claim 11, wherein Heat dissipation of the LED street light, characterized in that through the plurality of bolts through the plurality of through holes provided in the corner portion of the cover coupled to the plurality of screw holes provided in the corner portion of the heat absorbing portion and fixed to the fixing portion rescue. The method of claim 11, wherein the heat transfer unit, The heat dissipation structure of the LED street light, characterized in that composed of at least one heat pipe.

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