CN201330949Y - Strip LED lamp - Google Patents

Strip LED lamp Download PDF

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Publication number
CN201330949Y
CN201330949Y CNU2008202067612U CN200820206761U CN201330949Y CN 201330949 Y CN201330949 Y CN 201330949Y CN U2008202067612 U CNU2008202067612 U CN U2008202067612U CN 200820206761 U CN200820206761 U CN 200820206761U CN 201330949 Y CN201330949 Y CN 201330949Y
Authority
CN
China
Prior art keywords
metal substrate
led chip
base plate
line layer
metal base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2008202067612U
Other languages
Chinese (zh)
Inventor
熊书明
李燕
李国平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongli Zhihui Group Co Ltd
Original Assignee
Guangzhou Hongli Tronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangzhou Hongli Tronic Co Ltd filed Critical Guangzhou Hongli Tronic Co Ltd
Priority to CNU2008202067612U priority Critical patent/CN201330949Y/en
Application granted granted Critical
Publication of CN201330949Y publication Critical patent/CN201330949Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

A strip LED lamp comprises a metal base plate and three or more than three LED chips, wherein the metal base plate is provided with a module line layer, the LED chips are arranged on the module line layer in a matrix series-parallel connection way, and are arranged on the metal base plate in equal interval, high heat-conducting glue is arranged between the LED chips and the metal base plate, and high heat-conducting glue is also arranged on the module line layer and the metal base plate, a reflecting frame is arranged on the periphery of the LED chip region on the metal base plate, a refracting surface is arranged on the inner surface of the reflecting frame, a transparent colloid is arranged in the reflecting frame, and a location mounting groove is arranged on the base plate. With the structure, the irradiation region of the lamp can be changed, the part of circuits can be completely separated from the part of radiation, therefore, the use is safe, the installation of the LED chips is firm, and the radiation of the lamp can not be affected.

Description

A kind of strip LED lamp
Technical field
The utility model relates to a kind of LED lamp, especially LED illuminating lamp.
Background technology
Along with developing rapidly of LED lamp, its technology is being applied in the daily illuminating lamp gradually also, and now, people in use, and are also more and more higher to the requirement of lamp, such as heat radiation situation, brightness, service life etc.At present, the patent No. is 200720008026.6 to have disclosed a kind of led light source, comprise some led chips, this led chip adopts matrix-style serial, parallel way to be bundled on the metal substrate, led chip is encapsulated with a clad outward, be provided with microscope carrier between metal substrate and led chip, microscope carrier comprises the metal forming on upper strata and the insulating barrier of lower floor.The LED light irradiation distance of this structure is longer, and the irradiation of light is even, and volume is little, but the direction of illumination of its light can not be changed as required.
Summary of the invention
The purpose of this utility model is for a kind of strip LED lamp is provided, and utilizes the utility model can change the irradiation area of lamp as required, and circuit part and radiator portion are separately.
For achieving the above object, strip LED lamp of the present utility model comprises metal substrate and the led chip more than three or three, metal substrate is provided with the module line layer, led chip adopts the series-parallel system of matrix form to be located on the module line layer, led chip is to be installed on the metal substrate by the mode that equi-spaced apart is arranged, can guarantee the uniformity consistency of LED lamp wiring, be provided with the bonded adhesives of high heat conduction between described led chip and the metal substrate, also be provided with high heat conduction bonded adhesives on module line layer and the metal substrate, led chip is to be connected on the module line layer by gold thread, the periphery in led chip zone is provided with reflection box on the described metal substrate, the inner surface of reflection box is provided with plane of refraction, is provided with the printing opacity colloid in the reflection box.
Adopt this structure, owing to be provided with reflection box on metal substrate, reflection box is provided with plane of refraction, and described plane of refraction can change the direction of light of sending, thereby changes the irradiation area of lamp; Because be provided with the bonded adhesives of high heat conduction between led chip, module wiring board and metal substrate, its circuit part is separated fully with the metal substrate that is used to dispel the heat, and described bonded adhesives is highly heat-conductive material, like this, and practical safety, and radiating effect.
As improvement, described metal substrate is provided with the location and installation groove, is convenient to like this install.
Compared with prior art, because led chip is to be installed on the metal substrate by the mode that equi-spaced apart is arranged, therefore, can change the uniformity consistency of light; Owing to be provided with reflection box, and reflection box is provided with plane of refraction, therefore, can change the irradiation area of lamp; Owing to be provided with high heat conduction bonded adhesives, circuit part and radiator portion are separated fully, therefore safe in utilization, the installation of led chip is firm, and does not influence the heat radiation of lamp.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is an exploded view of the present utility model;
Fig. 3 is the circuit connection diagram of LED lamp.
The specific embodiment
Strip LED lamp as depicted in figs. 1 and 2, comprise the led chip 2 that metal substrate 1, three or the matrix-style serial more than three are connected in parallel, its connected mode as shown in Figure 3, adopt this connected mode, even burning out also, one or more led chip 2 can not influence the luminous of whole lamp, like this, improved the service life of lamp; Led chip 2 is fixed on the metal substrate 1 by high heat conduction bonded adhesives, like this, the installation of led chip 2 is fastening, described metal substrate 1 is used for heat radiation, high heat conduction bonded adhesives is set between metal substrate 1 and led chip, like this, radiator portion and circuit part is separated fully, therefore, safe in utilization; Be provided with module line layer 3 outside led chip 2 zones on high heat conduction bonded adhesives, one of its effect is to be used to connect extraneous power supply, and two of effect is to be used for led chip 2 is connected together; Led chip 2 zone is outer on the metal substrate 1 is equipped with a reflection box 4, and reflection box 4 is provided with plane of refraction, can change the direction of illumination of light like this, thereby changes the irradiation area of lamp, and reflection box 4 can play the effect of heat radiation, has improved radiating efficiency like this; Be provided with printing opacity colloid 5 on reflection box 4, described metal substrate 1 is provided with installs mounting groove 6.

Claims (2)

1. strip LED lamp, comprise metal substrate and the led chip more than three or three, metal substrate is provided with the module line layer, led chip adopts the series-parallel system of matrix form to be located on the module line layer, led chip is located on metal substrate for the mode that adopts equi-spaced apart to arrange, it is characterized in that: the bonded adhesives that is provided with high heat conduction between described led chip and the metal substrate, also be provided with high heat conduction bonded adhesives on module line layer and the metal substrate, led chip is to be connected on the module line layer by gold thread, the periphery in led chip zone is provided with reflection box on the described metal substrate, the inner surface of reflection box is provided with plane of refraction, is provided with the printing opacity colloid in the reflection box.
2. strip LED lamp as claimed in claim 1, it is characterized in that: described metal substrate is provided with the location and installation groove.
CNU2008202067612U 2008-12-31 2008-12-31 Strip LED lamp Expired - Fee Related CN201330949Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008202067612U CN201330949Y (en) 2008-12-31 2008-12-31 Strip LED lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008202067612U CN201330949Y (en) 2008-12-31 2008-12-31 Strip LED lamp

Publications (1)

Publication Number Publication Date
CN201330949Y true CN201330949Y (en) 2009-10-21

Family

ID=41224330

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008202067612U Expired - Fee Related CN201330949Y (en) 2008-12-31 2008-12-31 Strip LED lamp

Country Status (1)

Country Link
CN (1) CN201330949Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102135253A (en) * 2011-04-28 2011-07-27 中山市共炫光电科技有限公司 LED (light emitting diode) illuminating structure with heat conducting radiator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102135253A (en) * 2011-04-28 2011-07-27 中山市共炫光电科技有限公司 LED (light emitting diode) illuminating structure with heat conducting radiator

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: 510800 Dongfeng Road West, automobile city, Huadu District, Guangdong, Guangzhou

Patentee after: Guangzhou Hongli Tronic Co., Ltd.

Address before: 510800 Dongfeng Road West, automobile city, Huadu District, Guangdong, Guangzhou

Patentee before: Guangzhou Hongli Photoelectron Co., Ltd.

C56 Change in the name or address of the patentee
CP03 Change of name, title or address

Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1

Patentee after: Hongli Newell group Limited by Share Ltd

Address before: 510800 Dongfeng Road West, automobile city, Huadu District, Guangdong, Guangzhou

Patentee before: Guangzhou Hongli Tronic Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20091021

Termination date: 20171231