KR20090033930A - Apparatus for holding a substrate - Google Patents

Apparatus for holding a substrate Download PDF

Info

Publication number
KR20090033930A
KR20090033930A KR1020070099005A KR20070099005A KR20090033930A KR 20090033930 A KR20090033930 A KR 20090033930A KR 1020070099005 A KR1020070099005 A KR 1020070099005A KR 20070099005 A KR20070099005 A KR 20070099005A KR 20090033930 A KR20090033930 A KR 20090033930A
Authority
KR
South Korea
Prior art keywords
substrate
seated
gas
gas supply
pressure
Prior art date
Application number
KR1020070099005A
Other languages
Korean (ko)
Inventor
권오진
장수일
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020070099005A priority Critical patent/KR20090033930A/en
Publication of KR20090033930A publication Critical patent/KR20090033930A/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A substrate gripping device can sense the change of gas pressure due to loading of a substrate and confirm whether the substrate is mounted or not. The substrate gripping device(100) comprises the grasping part(110), and the gas supply channel(120) and sensor(130). The grip portion is passed through in the gas supply channel. The sensor is connected to the gas supply channel. The gas is flowed to the pressure fixed to the gas supply channel. If the substrate is settled in the grip portion, the sensor senses the change of gas pressure due to loading of a substrate and confirms whether the substrate is mounted or not.

Description

Apparatus for holding a substrate}

The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a substrate holding apparatus for holding a substrate in order to perform the manufacturing process.

In general, a semiconductor device includes a fabrication (FAB) process for forming an electrical circuit on a silicon wafer used as a semiconductor substrate, a process for inspecting electrical characteristics of the semiconductor devices formed in the process, and the semiconductor devices. Each is manufactured through a package assembly process for encapsulation and individualization of epoxy resins.

The pep process is performed by using a deposition process for forming a film on a semiconductor substrate, a chemical mechanical polishing process for planarizing the film, a photolithography process for forming a photoresist pattern on the film, and the photoresist pattern. An etching process for forming the film into a pattern having electrical characteristics, an ion implantation process for implanting specific ions into a predetermined region of the semiconductor substrate, a cleaning process for removing impurities on the semiconductor substrate, and the film or pattern Inspection process for inspecting the surface of the formed semiconductor substrate;

The apparatus for performing the various semiconductor manufacturing processes mentioned includes a substrate holding apparatus on which a substrate to be processed is mounted. Here, in order to stably perform the manufacturing process, confirmation (detection) of whether or not the substrate is mounted on the substrate holding apparatus must be preceded. As a method for checking whether the substrate is seated, there is a method of supplying light to a substrate to be seated and checking whether the substrate is seated through a change of light.

However, the method of checking whether the substrate is seated using light has a problem in stably checking whether the substrate is seated because the change of light appears differently according to the type (eg, material, transparency, etc.) of the substrate.

The problem to be solved through the embodiments of the present invention is to provide a substrate holding apparatus that can check whether the substrate is mounted stably regardless of the type of the substrate.

In order to achieve the object of the present invention, the substrate holding apparatus according to the present invention comprises a holding part, a gas supply flow path and a sensing part. The substrate is mounted on the gripping portion. The gas supply flow passage passes through the gripping portion and flows gas at a constant pressure. The sensing unit is connected to the gas supply passage, and senses whether the substrate is seated by sensing a change in pressure of the gas flowing into the gas supply passage due to the substrate being seated.

According to an embodiment of the present invention, the gas supply passage is positioned adjacent to the rear surface of the substrate on which the end of the passage is seated on the gripping portion to impart a discriminating force to the pressure change of the flowed gas when the substrate is seated. It may be characterized by.

The substrate holding apparatus according to the present invention flows the gas at a predetermined pressure through the flow path, senses the pressure change of the flowed substrate due to the substrate is seated, and confirms whether the substrate is seated through this, regardless of the type of the substrate It is possible to stably check whether the substrate is seated.

Hereinafter, a substrate holding apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar elements. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

1 and 2 are schematic views showing a substrate holding apparatus according to an embodiment of the present invention.

1 and 2, the substrate holding apparatus 100 may be used to hold a semiconductor substrate, such as a silicon wafer, to perform a process for manufacturing the semiconductor device.

The substrate holding apparatus 100 may include a holding unit 110, a gas supply passage 120, and a sensing unit 130.

The holding part 110 is mounted with a substrate (W) to perform a process. The gripping portion 110 generally has a disc structure having a diameter larger than the diameter of the substrate W, and a stage having a flat structure on which the substrate W to be processed is mounted is positioned on an upper surface thereof. A plurality of support members 110a may be provided on an upper surface (eg, a stage) of the gripper 110 to directly contact the rear surface of the substrate W to substantially support the substrate W. The substrate W seated on the gripper 110 by the support member 110a may be positioned to be spaced apart from the upper surface of the gripper 110 by a predetermined distance. In addition, although not shown, a plurality of guide pins may be provided along the periphery of the substrate W to be seated to guide the substrate W to be seated at the correct position when the substrate W is seated on the grip portion 110. Alternatively, the holding unit 110 may hold the substrate W by a vacuum suction method using a vacuum hole.

A drive shaft 112 having a cylindrical structure is connected to the lower portion of the gripping portion 110. The drive shaft 112 serves to drive the gripping portion 110. For example, the driving shaft 112 rotates the substrate W by lifting (up and down) the holding part 110 or rotating the holding part 110 at a constant speed during a process. Do this.

The gas supply passage 120 has a structure that penetrates the gripping portion 110, and an end portion of the gas supply passage 120 is positioned on an upper surface (stage) of the gripping portion 110. That is, it may have a structure that penetrates the holding unit 110 through the drive shaft 112. An end portion of the gas supply passage 120 may have a height corresponding to an upper surface of the gripping portion 110 or may protrude to a predetermined height from an upper surface of the gripping portion 110. Here, the end of the gas supply passage 120 has a height that does not directly contact the substrate (W).

The gas supply passage 120 is connected to a gas supply source (not shown) for supplying gas, and receives the gas to flow the gas at a constant pressure. That is, the gas supply passage 120 flows the gas provided from the gas supply source (not shown) and discharges the gas toward the upper direction. Here, the gas flowing through the gas supply flow path 120 is a gas for checking whether the substrate W seated on the gripping part 110 is seated and does not affect the manufacturing process of the substrate W. It is preferable to select from among. For example, nitrogen gas (N 2 ), which may be used in the process as the gas, may be mentioned. In some cases, the gas supply passage 120 may use an existing passage for supplying a process gas to the substrate W to perform the process.

When the substrate W is seated on the gripping portion 110, the gas supply passage 120 changes the pressure of the gas flowing due to interference by the substrate W to be seated. That is, when the substrate W is not seated on the gripping part 110, the gas flowing into the gas supply passage 120 is smoothly discharged. On the other hand, when the substrate W is seated on the gripping part 110, the pressure of the flowed gas is increased by preventing the smooth discharge of the gas flowing into the gas supply passage 120. For example, as the gas to be supplied flows at a constant pressure, as the gas discharged (discharged) by the substrate W placed on the substrate W becomes smaller than the supply amount, the gas flowed, that is, the pressure in the flow path increases.

The sensing unit 130 is connected to the gas supply passage 120. The sensing unit 130 senses a pressure change of the gas flowing into the gas supply flow path 120, which is indicated by interference by the substrate W seated on the holding unit 110, and senses a substrate based on the sensed result. Check whether (W) is seated. That is, when the pressure of the gas flowing into the gas supply passage 130 is sensed and is a constant pressure provided from the gas supply source (not shown), the substrate W is not seated on the gripping portion 110. On the other hand, when the pressure of the gas flowing into the gas supply passage 130 is changed to be higher than a predetermined pressure supplied, the substrate W is seated on the holding part 110.

Therefore, the sensing unit 130 may be formed of a pressure sensor, a pressure gauge, a pressure switch (electronic pressure switch), or the like capable of sensing the pressure of the gas flowing into the gas supply flow path 120. 1 and 2 illustrate a case in which a pressure gauge is used as the sensing unit 130, and the pressure and the substrate W when the substrate W is not seated on the holding unit 110 are shown. As it rests, the pressure increases, indicating that the pressure is increased.

Here, the sensing unit 130 may serve only to display the pressure of the sensed gas, and include a display member for displaying whether the substrate W is seated to the user based on the pressure of the sensed gas. Can be. In addition, a control signal may be generated according to whether the substrate W is seated, and the control signal may be output to a controller for controlling a process.

Meanwhile, in order to stably check whether the substrate W is seated, it is preferable that the pressure change of the gas flowing into the gas supply passage 120 according to whether the substrate W is seated has a discriminating power. This discriminating force is obtained by forming a smaller diameter of the gas supply passage 120 or by positioning an end portion of the gas supply passage 120 adjacent to a rear surface of the substrate W seated on the gripping portion 110. can do. For example, within the range of not damaging the substrate W, the closer the end of the gas supply passage 120 is to the rear surface of the substrate W, the pressure of the flowed gas depending on whether or not the substrate W is seated. The change makes a big difference.

As described above, the substrate holding apparatus 100 flows the gas to the gas supply flow path 120 at a constant pressure, and the pressure of the gas flowed into the gas supply flow path 120 due to the interference by the substrate W being seated. By sensing the change to check whether the substrate W is seated, it is possible to accurately determine whether the substrate W is seated. In particular, when checking whether the substrate W is seated using light, the measured value varies according to the type of the substrate W, and it is difficult to stably check whether the substrate W is seated. The 100 may stably determine whether the substrate W is seated through a change in pressure (eg, positive pressure).

Hereinafter, an example in which the substrate holding apparatus 100 mentioned above is used in a semiconductor manufacturing apparatus (for example, a substrate cleaning apparatus) will be described with reference to the drawings.

3 is a schematic diagram showing a substrate cleaning apparatus having the substrate holding apparatus mentioned. Here, since the substrate holding portion shown in FIG. 3 is similar to the substrate holding apparatus described with reference to FIG. 1, the same reference numerals are used for the same members, and detailed description thereof will be omitted.

Referring to FIG. 3, the substrate cleaning apparatus includes a substrate holding part 100, a process container 200, and a cleaning liquid supplying part 300.

The substrate holding part 100 includes a holding part 110, a gas supply flow path 120, and a seat detecting part 130, and the substrate W on which the process is performed is seated. The substrate holding unit 100 may detect whether the substrate W is seated on the holding unit 110 through the gas supply passage 120 and the seat detecting unit 130.

The process container 200 provides a process space for performing a cleaning process on the substrate (W). For example, the process vessel 200 may have a bowl shape open in an upward direction and have an eave structure in which an upper end is bent inward. The process container 200 accommodates the substrate holding part 100 therein. The process container 200 may prevent fluids such as a cleaning liquid supplied to the substrate W from being scattered during the cleaning process of the substrate W. In addition, the process container 200 may be formed on a bottom surface or a sidewall, and may include a discharge part (not shown) for discharging a fluid such as a cleaning liquid used to clean the substrate W to the outside in the process space. .

The cleaning liquid supplying part 300 supplies the cleaning liquid for cleaning to the substrate W when the substrate W is seated on the substrate holding part 100 and the cleaning is performed on the substrate W. The cleaning solution supply unit 300 flows the cleaning solution and the nitrogen gas N 2 through different flow paths having end portions adjacent to each other, thereby forming the cleaning solution in the form of droplets by the nitrogen gas N 2 to form a substrate W. To supply. Here, an example of the cleaning liquid supplied to the substrate W includes deionized water (DIW). In addition, when the cleaning liquid supply unit 300 supplies the cleaning liquid in the form of droplets, the cleaning liquid supply unit 300 may supply the cleaning liquid in the form of droplets to the substrate W while moving along a predetermined path from the upper portion of the substrate W.

Here, the cleaning liquid supply unit 300 of the substrate cleaning apparatus uses a gas that flows at a constant pressure through the gas supply passage 120 to confirm whether the substrate W is seated in the substrate holding unit 100. By using nitrogen gas (N 2 ), it is possible to continuously check whether the substrate (W) is seated while performing the process on the substrate (W).

As described above, the substrate holding apparatus according to the preferred embodiment of the present invention includes a flow path for flowing the gas at a constant pressure, and senses a pressure change (for example, an increase in pressure) of the flowed gas by the seated substrate. By confirming the seating, it is possible to stably check whether the mounting of the substrate regardless of the type of the substrate. In addition, when the substrate holding apparatus mentioned above is disposed and used inside the process vessel (chamber), by using the gas (gas) used in the manufacturing process as the gas flowing into the flow path, whether or not the substrate is continuously seated during the process is performed. You can check it.

Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

1 and 2 are schematic views showing a substrate holding apparatus according to an embodiment of the present invention.

3 is a schematic diagram showing a substrate cleaning apparatus having the substrate holding apparatus mentioned.

Explanation of symbols on the main parts of the drawings

100: substrate holding device 110: holding part

110a: support member 112: drive shaft

120: gas supply passage 130: seating detection unit

200: process vessel 300: cleaning liquid supply unit

W: Substrate

Claims (2)

A gripping portion on which the substrate is seated; A gas supply flow passage passing through the gripping portion and flowing gas at a constant pressure; And And a sensing unit connected to the gas supply passage and configured to sense whether the substrate is seated by sensing a change in pressure of the gas flowing into the gas supply passage when the substrate is seated. According to claim 1, wherein the gas supply flow path is characterized in that the end of the flow path is positioned adjacent to the back surface of the substrate seated on the gripping portion so as to impart a discriminating force to the pressure change of the flow of the flow of the gas is seated. Substrate holding device.
KR1020070099005A 2007-10-02 2007-10-02 Apparatus for holding a substrate KR20090033930A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070099005A KR20090033930A (en) 2007-10-02 2007-10-02 Apparatus for holding a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070099005A KR20090033930A (en) 2007-10-02 2007-10-02 Apparatus for holding a substrate

Publications (1)

Publication Number Publication Date
KR20090033930A true KR20090033930A (en) 2009-04-07

Family

ID=40759989

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070099005A KR20090033930A (en) 2007-10-02 2007-10-02 Apparatus for holding a substrate

Country Status (1)

Country Link
KR (1) KR20090033930A (en)

Similar Documents

Publication Publication Date Title
JP6722532B2 (en) Substrate processing apparatus and processing cup cleaning method
US8654325B2 (en) Substrate processing apparatus, substrate processing method, and computer-readable storage medium having program for executing the substrate processing method stored therein
JP7042704B2 (en) Board processing equipment and board processing method
KR100689664B1 (en) Apparatus for cleaning a wafer
JP2009218402A (en) Substrate processing device and substrate processing method
KR20090033930A (en) Apparatus for holding a substrate
US20220384233A1 (en) Substrate processing apparatus and substrate processing method
JP2008252006A (en) Substrate processing apparatus
KR20060129880A (en) Manufacturing equipment for semiconductor
JP2020035794A (en) Substrate processing apparatus and manufacturing method of semiconductor device
KR102037901B1 (en) Unit for supplying chemical and Apparatus for treating substrate
CN110832619B (en) Substrate processing apparatus and component inspection method for substrate processing apparatus
KR102612855B1 (en) Leakage determination method and plating device
JP7379141B2 (en) Substrate holding device, substrate processing method
JP7409956B2 (en) Substrate processing equipment and substrate processing method
WO2023058317A1 (en) Substrate processing device and substrate processing method
JP2011204948A (en) Treatment liquid supply device and treatment liquid supply method
KR20090055268A (en) Apparatus of processing wafers
KR20090035793A (en) Apparatus for cleaning a wafer
JP2023148699A (en) Wafer processing device
KR20230083035A (en) Apparatus for inspecting droplet and substrate processing apparatus including the same and method for inspecting drople
KR20220112185A (en) Substrate treatment apparatus, substrate treatment method and computer readable storage medium
KR100873330B1 (en) Apparatus for cleaning a wafer
KR20240047800A (en) Apparatus for testing chemical and apparatus for processing substrate
CN116264177A (en) Apparatus and method for supplying chemical liquid and substrate processing apparatus

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination