KR20090030914A - Plunger contact bios probe - Google Patents
Plunger contact bios probe Download PDFInfo
- Publication number
- KR20090030914A KR20090030914A KR1020070096600A KR20070096600A KR20090030914A KR 20090030914 A KR20090030914 A KR 20090030914A KR 1020070096600 A KR1020070096600 A KR 1020070096600A KR 20070096600 A KR20070096600 A KR 20070096600A KR 20090030914 A KR20090030914 A KR 20090030914A
- Authority
- KR
- South Korea
- Prior art keywords
- contact
- plunger
- probe
- contact means
- spring
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a parabolic plunger contact bias probe that is supplemented and improved to improve the contact resistance of a probe that is used for functional test of a product in a printed circuit board and a semiconductor (I, C) tester.
The present invention for this purpose, the body 10 is built in the spring 20 is a micro-assembly structure of the left rod end of the plunger 30 that is the primary contact has a shape suitable for the characteristics of the inspection. In the spring contact bias probe for measuring the energization of the electrical element in contact with the tip by the electrical signal passing through the probe body (10), the right rod of the plunger in the body to the inner fastening portion of the contact means as a secondary contact It is installed by tight fastening, and the elasticity of the expanded parts in the contact means fastened internally through the right rod of the plunger is forcibly contacted with the inner wall of the body, thereby minimizing the electrical resistance of the probe. do.
Description
The present invention relates to a parabola type plunger contact bias probe which can achieve smooth conduction because a plurality of enlarged portions of contact means coupled with the right rod of the plunger are forced to contact the inner wall of the body during measurement.
SPRIN CONTACT PROBE is a medium that checks whether the product is good or bad by receiving signals from test equipment on PCB and semiconductor. It is an ultra-small pin-type structure as a core component that determines whether a printed circuit board and a semiconductor are good or bad by receiving electrical signals between the printed circuit board and the semiconductor tester.
At this time, the moving part is supported by a spring and can be moved. To minimize the electric resistance, all parts are plated with expensive precious metals such as gold or rhodium which have very low electric resistance and high surface strength. It is a test part that maintains the operating pressure and the minimum electric resistance value and the tip of the plunger, which is a contactor, is sharp or keeps the tip to match the characteristics of the product.
Conventional probes have a disadvantage in that contact between the plunger and the body is unstable due to the presence of a minute gap for operating the inner portion of the body and the plunger pressing the spring. In order to reduce the internal contact resistance, when the plunger is moved by moving from one side to the inside of the body, one side is always in a completely metal contact state and is used in the form of reducing contact electrical resistance.
For example, the bias probe of the inclined cross-sectional structure type may be effective due to its low contact resistance due to its initial contact with one side, but when the probe is operated thousands of times, the one-sided wear phenomenon may occur due to its strong contact with only one side. As the frictional resistance of the marked part becomes very high, the mechanical operating resistance and the electrical resistance are greatly increased, and even if the tip of the plunger is in contact with the measurement product, the measured value cannot be properly delivered. This causes a problem of signal transmission that is not normal for the inspection of printed circuit boards and semiconductors that require high-precision measurement, and thus a problem of frequent malfunctions and errors in measurement occurs.
In order to solve this problem, the bias probe has been developed to improve the performance of the bias probe that directly contacts the ball or the spring to the inclined cross section, but it has not solved the problem of shortened life due to the one-sided wear problem. The technical method has been applied to increase the thickness of the gold plating or to make the surface smoother to reduce the mechanical resistance. However, these methods increase the manufacturing cost significantly, lowers the price competitiveness, and gradually causes manufacturers to evade product inspection or to increase product cost.
Because of the above problems, the present inventors have come up with a new type of contact means by taking multiple measures so that the inner wall of the plunger and the body can be completely contacted to solve irregular resistance values during measurement.
The present invention solves the problems of the conventional probe in view of the above circumstances, a plurality of enlarged parts of the contact means in which the plunger is tightly fitted in the body is configured to always contact with the inner wall at least resistance value during measurement An object of the present invention is to provide a parabolic plunger contact probe that can provide smooth conduction.
The present invention for achieving the above object, the body (10) with a built-in
As described above, according to the plunger contact bias probe of the present invention, the contact means is always in contact with each other to forcibly maintain the inner metal contact between the contact means coupled to the right side of the plunger and the inner wall of the body, even during operation of several hundred thousand times in the probe measurement operation. Since the multiple enlarged parts of the contacts contact in all directions, it is possible to easily prevent the increase in the operating resistance due to the wear of the conventional probe, and also to realize the metal contact as the bias probe at all times to guarantee the life of several hundred thousand times as well as the lifetime. Accurate measurements are also guaranteed.
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
1 is a cross-sectional view showing a plunger contact probe according to an embodiment of the present invention, the present invention is a
The measuring probe is a core element of the semiconductor functional measuring device as well as inspecting the insertion and soldering of electronic components of the printed circuit board. The
2 is an exploded perspective view showing in detail the plunger and the contact means shown in FIG. The
As the secondary contactor to which the
3 is a state diagram in which the plunger and the contact means shown in FIG. 2 are combined. The
4 is a state diagram in which a contact means of the plunger is inserted into the body in the plunger contact bias probe of the present invention, FIG. 5 is a working state diagram for caulking the plunger contact bias probe of the present invention, and FIG. The plunger contact bias probe shows the insertion process when the plunger and the contact means are operated.
The
Pressing the
That is, the
When the measurement product reaches the tip of the left rod of the
In this way, the contact becomes a metal contact to reduce the electrical contact resistance of the probe itself, so that the measurement is smoothly performed. When the next operation is performed, the same contact is made, and the right rod of the
Therefore, the spring contact bias probe of the present invention installs a printed circuit board, drills a plurality of holes in the measurement fixture, and installs a measurement probe in the hole, and presses the printed circuit board placed on the probe to the inner spring of the probe. This causes the sharp leading end of the plunger, which engages the contact means in the probe body, to the appropriate pressure to contact the solder or terminal line of the electronic component on the printed circuit board.
Therefore, the characteristic that the electrical resistance should be kept below a certain level becomes important, but especially inside the probe, the current must be connected to the body through the contact means at the plunger and flow directly to the measuring terminal of the measuring instrument, i.e. with the plunger The bias probe is a structure in which electrical resistance is minimized by making direct contact with the inner wall of the body at each enlarged portion of the contact means which is in secondary contact with the plunger so that no current flows through the spring in the contact means.
Although the technical concept of the plunger contact bias probe of the present invention has been described based on the exemplary drawings, this is illustrative of the best embodiment of the present invention and is not intended to limit the claims of the present invention. It will be apparent to those skilled in the art that various modifications and imitations can be made without departing from the scope of the technical idea of the present invention.
1 is a cross-sectional view showing a plunger contact bias probe according to an embodiment of the present invention;
Figure 2 is an exploded perspective view showing in detail the plunger and the contact means shown in FIG.
3 is a state in which the plunger and the contact means shown in FIG.
4 is a state in which the contact means of the plunger is inserted into the body in the plunger contact bias probe of the present invention;
5 is a working state diagram for caulking the plunger contact bias probe of the present invention;
6 is an insertion process diagram when the plunger and the contact means operate in the plunger contact bias probe of the present invention.
* Explanation of symbols for the main parts of the drawings
10: torso
20: spring
30: Plunger
33: right rod
40: contact means
46: enlarged portion
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070096600A KR20090030914A (en) | 2007-09-21 | 2007-09-21 | Plunger contact bios probe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070096600A KR20090030914A (en) | 2007-09-21 | 2007-09-21 | Plunger contact bios probe |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20090030914A true KR20090030914A (en) | 2009-03-25 |
Family
ID=40697143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070096600A KR20090030914A (en) | 2007-09-21 | 2007-09-21 | Plunger contact bios probe |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20090030914A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101300473B1 (en) * | 2013-05-02 | 2013-09-02 | 주식회사 프로이천 | Probe pin for probing solder ball |
KR20230060703A (en) * | 2021-10-28 | 2023-05-08 | 주식회사 메가터치 | Probe for test of electronic device |
-
2007
- 2007-09-21 KR KR1020070096600A patent/KR20090030914A/en active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101300473B1 (en) * | 2013-05-02 | 2013-09-02 | 주식회사 프로이천 | Probe pin for probing solder ball |
KR20230060703A (en) * | 2021-10-28 | 2023-05-08 | 주식회사 메가터치 | Probe for test of electronic device |
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A302 | Request for accelerated examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
N231 | Notification of change of applicant | ||
NORF | Unpaid initial registration fee |