KR20090029585A - Apparatus for chucking substrate - Google Patents

Apparatus for chucking substrate Download PDF

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Publication number
KR20090029585A
KR20090029585A KR1020070094938A KR20070094938A KR20090029585A KR 20090029585 A KR20090029585 A KR 20090029585A KR 1020070094938 A KR1020070094938 A KR 1020070094938A KR 20070094938 A KR20070094938 A KR 20070094938A KR 20090029585 A KR20090029585 A KR 20090029585A
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KR
South Korea
Prior art keywords
substrate
unit
finger
potential difference
electrode
Prior art date
Application number
KR1020070094938A
Other languages
Korean (ko)
Inventor
왕현철
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020070094938A priority Critical patent/KR20090029585A/en
Publication of KR20090029585A publication Critical patent/KR20090029585A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)

Abstract

An apparatus for chucking a substrate is provided to improve efficiency in working a transfer robot by clamping a substrate in a finger unit and by confirming existence of a substrate in a finger unit. An apparatus for chucking a substrate includes a finger unit(10) and an electrostatic generating unit(20). The finger unit is connected to an arm(3) of a transfer robot(1), and supports a substrate(S). The electrostatic generating unit has an electrode unit(21) and a voltage supply unit(22), is positioned in the finger unit, forms a potential difference in the finger unit, generates an electrostatic force in the finger unit by using the potential difference of the finger unit, and clamps the substrate in the finger unit by using the electrostatic force of the finger unit.

Description

Substrate chucking device {Apparatus for chucking substrate}

The present invention relates to a substrate chucking apparatus, and more particularly, to a substrate chucking apparatus for chucking a substrate to a finger portion of a transfer robot in a vacuum state by using electrostatic force due to a potential difference.

In general, to manufacture semiconductor devices such as diodes, transistors, thyristors, etc., various processes such as deposition, etching, cleaning, and etching are performed in a vacuum state. Therefore, in order to perform all of these processes, the semiconductor substrates must be transferred to another process after each process. To this end, a transfer robot for transferring a substrate to a process chamber in which each semiconductor device manufacturing process is performed is used.

The transfer robot is fixed to the end of the arm portion of the articulated arm portion, the substrate is mounted on the finger portion. The finger portion rotates and moves up and down when transferring the substrate in a vacuum state.

However, since the finger portion of the conventional transfer robot does not have a separate substrate chucking function, if the operation speed of the transfer robot is increased above a certain speed in order to shorten the substrate transfer time in a vacuum state, a problem may occur in that the substrate is slid out of the finger portion. have. Therefore, problems such as damage to expensive semiconductor substrates and equipment and reduced productivity may occur.

In addition, the finger portion of the conventional transfer robot has only a function of simply supporting the substrate without a function of detecting the presence or absence of the substrate. Therefore, in order to detect the substrate during the transfer operation of the substrate in a vacuum state, a sequence for detecting the presence of the substrate with the naked eye or using a separate sensor is required. Therefore, there is a problem that the structure of the equipment is complicated and expensive.

The present invention has been made to solve the above problems, to provide a substrate chucking device capable of stably clamping the substrate to the finger portion of the transfer robot in a vacuum state using the electrostatic force by the potential difference.

Another object of the present invention is to provide a substrate chucking apparatus capable of detecting the presence or absence of a substrate chucked to the finger using a potential difference without a separate sensor and sequence.

The objects of the present invention are not limited to the above-mentioned objects, and other objects that are not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, a substrate chucking apparatus according to an embodiment of the present invention, the finger portion for supporting the substrate, and the electrostatic generating unit for generating a constant power by the potential difference to the finger portion to clamp the substrate do.

Specific details of other embodiments are included in the detailed description and the drawings.

According to the substrate chucking device of the present invention as described above, by clamping the substrate to the finger portion of the transfer robot using the electrostatic force by the potential difference, it is possible to reliably transfer the substrate and speed up in a vacuum state, the productivity of the entire equipment Can improve.

In addition, by detecting the presence of the substrate chucked by the finger using the potential difference, there is no need for a separate sensor and sequence.

Effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and only the embodiments make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

Hereinafter, a substrate chucking apparatus according to a preferred embodiment of the present invention with reference to the accompanying drawings will be described in detail. For reference, in the following description of the present invention, if it is determined that a detailed description of related known functions or configurations may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

1 is a perspective view showing a substrate chucking apparatus of a transfer robot according to an embodiment of the present invention, Figures 2a and 2b is a schematic diagram showing the configuration of detecting the presence or absence of the substrate by the potential difference in the substrate chucking apparatus of the present invention. .

1, 2A and 2B, the substrate chucking apparatus according to an embodiment of the present invention is provided with a finger 10, the electrostatic generating unit 20, the detector 30 and the detector 40, and the like. do.

The finger portion 10 is coupled to the end of the transfer robot arm 3 and lifts and rotates by the shaft portion 5, and serves to support the substrate S. Finger portion 10 has an approximately 'U' shape with the front side open. Since the transfer robot 1 may be understood as a robot of a known technique that performs an operation of transferring the substrate S to the process chamber in a vacuum state, a detailed description thereof will be omitted.

The electrostatic generating unit 20 generates the electrostatic force due to the potential difference in the finger portion 10 to clamp the substrate (S). The electrostatic generating unit 20 includes an electrode portion 21 and a voltage supply portion 22.

The electrode unit 21 is provided with at least one pair at the finger portion 10 at a predetermined interval. The electrode part 21 is provided on one side of the finger part 10 and is provided on the first electrode 21a to which a positive voltage is applied from the voltage supply part 22 and on the other side of the finger part 10. 22, a second electrode 21b to which a negative voltage is applied.

The voltage supply part 22 applies a voltage so that a potential difference occurs in the electrode part 21.

The detection unit 30 is a detection sensor that detects the potential difference of the electrode unit 21.

The detector 40 detects the presence or absence of the substrate S supported by the finger unit 10 according to the potential difference generation signal detected by the detector 30.

In the substrate chucking apparatus according to the exemplary embodiment of the present invention configured as described above, the finger portion 10 uses electrostatic force generated by applying a voltage to the finger portion 10 of the transfer robot 1 operating in a vacuum state. The substrate S is clamped. More specifically, when a positive voltage and a negative voltage are applied to the first and second electrodes 21a and 21b provided in the finger part 10 from the voltage supply part 22, respectively, the first and second electrodes A potential difference occurs between (21a) and (21b), and electrostatic power is generated. The substrate S is clamped to the finger portion 10 by the electrostatic force generated by the electrode portion 21 of the finger portion 10. Therefore, even when the transfer robot 1 operates at a constant speed or more in a vacuum state, the substrate S can be stably transferred without sliding or detachment of the substrate S, and the transfer speed of the substrate S is maintained. Can improve.

In addition, the substrate chucking apparatus of the present invention may detect the presence or absence of the substrate S chucked to the finger portion 10 by the potential difference generation signal of the electrode portion 21 without a separate sensor and sequence. More specifically, as shown in FIG. 2A, when the substrate S is not chucked to the finger portion 10, the potential difference between the electrode portions 21 does not occur. As illustrated in FIG. 2B, when the substrate S is chucked to the finger portion 10, a potential difference between the electrode portions 21 is generated and detected through the detector 30, and the detector 40 detects the detector 30. The substrate S is chucked to the finger part 10 by the potential difference detection signal detected by the sensing unit 10.

Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may implement the present invention in other specific forms without changing the technical spirit or essential features thereof. I can understand that. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. The scope of the present invention is shown by the following claims rather than the above description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.

1 is a perspective view showing a substrate chucking device of the transfer robot according to an embodiment of the present invention.

Figure 2a and 2b is a schematic diagram showing a configuration for detecting the presence or absence of the substrate by the potential difference in the substrate chucking apparatus of the present invention.

<Description of Symbols for Main Parts of Drawings>

10: finger portion 20: power failure unit

21: electrode portion 21a: first electrode

21b: second electrode 22: voltage supply unit

30: detector 40: detector

Claims (5)

A finger supporting the substrate; And And an electrostatic generating unit for generating an electrostatic force due to a potential difference in the finger portion to clamp the substrate.  According to claim 1, wherein the power failure unit, At least one pair of electrode parts disposed at the finger parts at predetermined intervals; And And a voltage supply unit configured to apply a voltage to the electrode unit. The method of claim 2, wherein the electrode unit, A first electrode provided at one side of the finger part, to which a positive voltage is applied from the voltage supply part; And And a second electrode provided at the other side of the finger part, to which a negative voltage is applied from the voltage supply part. The method of claim 1, And a detection unit for detecting a potential difference of the electrode unit. The method of claim 4, wherein And a sensing unit configured to detect the presence or absence of the substrate supported by the finger unit in accordance with the potential difference generation signal detected by the detection unit.
KR1020070094938A 2007-09-18 2007-09-18 Apparatus for chucking substrate KR20090029585A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070094938A KR20090029585A (en) 2007-09-18 2007-09-18 Apparatus for chucking substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070094938A KR20090029585A (en) 2007-09-18 2007-09-18 Apparatus for chucking substrate

Publications (1)

Publication Number Publication Date
KR20090029585A true KR20090029585A (en) 2009-03-23

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KR1020070094938A KR20090029585A (en) 2007-09-18 2007-09-18 Apparatus for chucking substrate

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105470180A (en) * 2014-09-05 2016-04-06 北京北方微电子基地设备工艺研究中心有限责任公司 Wafer lifting assembly, and mechanical arm used for placing wafer on or taking wafer from wafer lifting assembly
KR20180065205A (en) * 2016-12-07 2018-06-18 크린팩토메이션 주식회사 Apparatus for mounting top flange on wafer cassette
CN110504202A (en) * 2018-05-17 2019-11-26 细美事有限公司 Transmission unit and substrate board treatment including the transmission unit

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105470180A (en) * 2014-09-05 2016-04-06 北京北方微电子基地设备工艺研究中心有限责任公司 Wafer lifting assembly, and mechanical arm used for placing wafer on or taking wafer from wafer lifting assembly
KR20180065205A (en) * 2016-12-07 2018-06-18 크린팩토메이션 주식회사 Apparatus for mounting top flange on wafer cassette
CN110504202A (en) * 2018-05-17 2019-11-26 细美事有限公司 Transmission unit and substrate board treatment including the transmission unit
KR20190131652A (en) * 2018-05-17 2019-11-27 세메스 주식회사 Transfer unit, apparatus for treating substrate including the same
US11251066B2 (en) 2018-05-17 2022-02-15 Semes Co., Ltd. Transfer unit and substrate processing apparatus including the same

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E601 Decision to refuse application