KR20090026533A - Apparatus for fabricating semiconductor and method for fabricating semiconductor using the same - Google Patents

Apparatus for fabricating semiconductor and method for fabricating semiconductor using the same Download PDF

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Publication number
KR20090026533A
KR20090026533A KR1020070091581A KR20070091581A KR20090026533A KR 20090026533 A KR20090026533 A KR 20090026533A KR 1020070091581 A KR1020070091581 A KR 1020070091581A KR 20070091581 A KR20070091581 A KR 20070091581A KR 20090026533 A KR20090026533 A KR 20090026533A
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KR
South Korea
Prior art keywords
wafer
rinse nozzle
back rinse
rail
semiconductor manufacturing
Prior art date
Application number
KR1020070091581A
Other languages
Korean (ko)
Inventor
유해욱
Original Assignee
주식회사 하이닉스반도체
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 하이닉스반도체 filed Critical 주식회사 하이닉스반도체
Priority to KR1020070091581A priority Critical patent/KR20090026533A/en
Publication of KR20090026533A publication Critical patent/KR20090026533A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Abstract

A manufacturing apparatus for a semiconductor and a semiconductor manufacturing method using the same are provided to improve the yield and the reliability of semiconductor manufacturing process by installing the mobile back rinse nozzle. A manufacturing apparatus for a semiconductor comprises a back rinse nozzle(130) for spraying the washing solution on the rear side of wafer; a rail(100) installed at the lower part of the back rinse nozzle; a driving unit(150) which horizontally moves the back rinse nozzle along the rail; a controller for applying the signal to the driving unit. The back rinse nozzle of 2~8 are installed.

Description

Semiconductor manufacturing apparatus and semiconductor manufacturing method using the same {APPARATUS FOR FABRICATING SEMICONDUCTOR AND METHOD FOR FABRICATING SEMICONDUCTOR USING THE SAME}

1 is a schematic configuration cross-sectional view of a wafer back rinse nozzle apparatus according to the prior art.

2 is a schematic view showing a semiconductor manufacturing apparatus according to the present invention.

3 and 4 are schematic views showing a semiconductor manufacturing apparatus and a semiconductor manufacturing method using the same according to the present invention.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus and a semiconductor manufacturing method using the same. In order to solve a problem in which impurities are generated on the back surface of the wafer during the semiconductor manufacturing process and affect subsequent processes, the present invention can move freely at the bottom of the wafer. By further comprising a back rinse nozzle including a drive device and a rail to make it, the invention relates to maximize the cleaning effect and to improve the yield and reliability of the semiconductor manufacturing process.

In general, semiconductor manufacturing is accomplished by a combination of numerous processes. That is, a semiconductor can be manufactured by forming a film on a wafer or by forming a pattern on the film to be formed, and sequentially performing these steps while repeating a plurality of processes such as cleaning.

Photoresist (photo resist) is essentially used to form an etching mask, an ion implantation mask, or a planarization mask for forming a desired pattern in a semiconductor device manufacturing process.

In order to form a patterning process for forming an element in a semiconductor manufacturing process, an etched layer on which a pattern is formed is formed on a wafer, and a photoresist pattern defining an element is formed thereon. Next, the etching target layer is etched using the photoresist pattern as a mask to form a pattern.

Here, the etched layer is formed by performing processes such as physical vapor deposition (PVD) and chemical vapor deposition (CVD) on the wafer, and then a photoresist layer is formed on the etched layer and exposed. And a photoresist pattern defining the semiconductor device using the development process. In this case, the photoresist is formed by using a spin coating method. In this process, a photoresist or a developer formed on the upper surface of the wafer is unnecessarily formed on the back surface of the wafer, thereby causing a problem of impurities.

These impurities can contaminate the wafer, and when moved to the wafer stage of the exposure and development apparatus for subsequent processing, the defocus problem that the exposure process is not performed normally does not occur because the wafer is not aligned evenly by the impurities. Can be induced. In addition, even if the wafer is moved to another place after the exposure and development processes are completed, impurities remaining on the back surface of the wafer remain on the wafer stage to contaminate the apparatus.

Therefore, in order to solve the above problem, in the case of the photoresist coating equipment, after the photoresist is applied on the wafer, the side photoresist of the wafer is removed using a side rinse apparatus and flowed into the back of the wafer. The photoresist is removed using a back rinse nozzle apparatus.

1 is a schematic configuration cross-sectional view of a wafer back rinse nozzle apparatus according to the prior art.

Referring to FIG. 1, a chuck 10 for seating a wafer at the center of the wafer 30 is provided with a wafer back rinse nozzle apparatus according to the prior art.

Next, a rinse nozzle 20 is fixed to the lower part of the chuck 10 toward the outside of the chuck 10 and sprays the rinse liquid 25 on the back surface of the wafer 30.

Next, the chamber support 40 is provided to prevent the rinse liquid from splashing out when the rinse liquid 25 is injected.

Although not shown, a supply nozzle or a developer supply nozzle may be provided on the chuck 10 to supply photoresist on the wafer 30.

Since the back rinse nozzle apparatus provided as described above is sprayed by being fixed at a predetermined angle on the back surface of the wafer, the entire back surface of the wafer cannot be completely cleaned. Therefore, contaminants may remain on the back surface of the wafer. In this case, a defect occurs in the exposure process for patterning the semiconductor element, and a problem occurs that contaminates the apparatus even after the exposure process.

When placing the wafer on the wafer stage for subsequent processing, a problem arises in that the wafer is not aligned correctly horizontally due to impurities generated on the back surface.

In particular, since the defocus problem may occur in a region where impurities are generated when the wafer is horizontally displaced in the exposure process, the present invention provides a semiconductor device for cleaning the back surface of the wafer before the exposure process, and a semiconductor manufacturing method using the same. to provide.

Therefore, the reliability of the semiconductor manufacturing process is lowered, and if the apparatus is contaminated, the process of cleaning it has to be performed separately, thereby lowering the yield of the semiconductor manufacturing process.

In order to solve the above problems of the prior art, the present invention includes a back rinse nozzle that can move freely at the bottom of the wafer. Herein, a semiconductor manufacturing apparatus and a driving apparatus including a control unit for applying an independent signal to each other to move the back rinse nozzle or a control unit for applying the same movement signal, to maximize the cleaning effect, and using the same Its object is to provide a semiconductor manufacturing method.

The semiconductor manufacturing apparatus according to the present invention for achieving the above object is

A back rinse nozzle for spraying a cleaning liquid on the back of the wafer,

A rail provided below the back rinse nozzle,

A driving device for horizontally moving the back rinse nozzle along the rail;

It characterized in that it comprises a control unit for applying the same or independent signals to the drive device, respectively.

Here, the back rinse nozzle is characterized in that it is provided with 2 to 8, the back rinse nozzle is characterized in that it further comprises a support moving along the rail, the back rinse nozzle is a wafer outward direction relative to the vertical direction It characterized in that the inclined 45 to 60 °, further comprising a first immersion protection cover surrounding the rail and the back rinse nozzle on the upper rail, the second immersion on the drive unit and the control unit A protective cover is further provided, wherein the rails are arranged along the circumferential direction of the wafer, and the rails are arranged along the direction perpendicular to the tangent of the wafer, and the rails are circulated. It is characterized in that it is provided in the form of a closed curve.

In addition, the method of forming a semiconductor device performed using the semiconductor manufacturing apparatus according to the present invention

Loading the wafer into the chamber; And

And cleaning the back side of the wafer using a back rinse nozzle provided on the rail.

Here, the back surface of the wafer is cleaned while moving the back rinse nozzle in one direction or an independent direction.

Hereinafter, a semiconductor manufacturing apparatus and a semiconductor manufacturing method using the same according to the present invention will be described in detail with reference to the accompanying drawings.

In the semiconductor manufacturing process, a lithography process using a photosensitive film is performed by forming a device pattern on a semiconductor substrate. First, a photoresist film is formed on a wafer, and a mask pattern for forming a semiconductor device is formed by performing exposure and development processes on the photoresist film.

Here, the wafer used as the semiconductor substrate is moved through track equipment formed so that each process proceeds sequentially. The track equipment includes a chamber in which each process is performed, and forms a photoresist film in each chamber, and performs a process of exposing and developing the photoresist film. At this time, the step of cleaning the wafer is performed at each step, if the impurity is formed on the back surface of the wafer is not easy to clean the process in the present invention is provided with a cleaning nozzle to move each independently.

2 is a schematic view showing a semiconductor manufacturing apparatus according to the present invention.

Referring to FIG. 2, a back rinse nozzle 130 for spraying a cleaning liquid on a rear surface of the wafer is provided, and a support 120 for supporting and driving the nozzle is provided below the back rinse nozzle 130. The support 120 is mounted to the rail 100 capable of changing the phase of the nozzle. In this case, the rail 100 may be arranged along the circumferential direction of the wafer, or may be arranged along the direction perpendicular to the tangent of the wafer. In addition, it is preferable that the bottom of the wafer is provided in the form of a circular closed curve so as to affect the entire back surface of the wafer.

Next, a driving device 150 for horizontally moving the back rinse nozzle 130 at an edge portion of the rail 100 is provided. In this case, when the rail 100 is provided in a chain rail manner, the driving device 150 includes a stepping motor.

In addition, the driving device 150 includes a control unit for applying a signal to the rail (100).

In general, since two to eight back rinse nozzles 130 are provided at a lower portion of the wafer, the control unit provided in each driving device 150 is connected to each one system so that the same signal is applied to each driving device 150. Or by applying an independent signal to the back rinse nozzle 130 to move dynamically. As such, the dynamic back rinse nozzle 130 actively responds to impurities generated on the back surface of the wafer, thereby enabling an effective cleaning process.

Here, the back rinse nozzle 130 is preferably provided to be inclined 45 ~ 60 ° in the wafer outward direction with respect to the direction perpendicular to the wafer surface in order to be able to push the impurities to the outside of the wafer during the cleaning process. In addition, in order to solve the problem in which the cleaning liquid penetrates the rail 100 or the driving device 150 in the cleaning process, the first submersion protection cover 140 and the second submersion protection cover 160 are further provided.

3 and 4 are schematic views illustrating a semiconductor manufacturing apparatus and a semiconductor manufacturing method using the same according to the present invention.

Referring to FIG. 3, it can be seen that the back rinse nozzle 230 is provided in the coating apparatus 260 for forming the photosensitive film on the wafer. A wafer chuck 240 is provided in the center of the coating apparatus 260, and a coating nozzle 250 is provided on the wafer chuck 240.

When the wafer is adsorbed on the wafer chuck 240 and the coating process is performed, impurities may occur on the back surface of the wafer that is not adsorbed on the wafer chuck 240, so that the back rinse nozzle may be moved around the wafer chuck 240. The 230 and the rail 200 are provided to allow the cleaning process to be performed smoothly.

4 illustrates a back rinse nozzle 330 provided in the developing apparatus 350. The developing nozzle 360 is provided at one side of the wafer 340, and the lower surface of the wafer is efficiently cleaned on the back surface of the wafer. A back rinse nozzle 330 and a rail 300 are provided.

As described above, the present invention performs a process of cleaning the back surface of the photosensitive film between the process of forming a photoresist film on the wafer and the process of exposing and developing the photoresist film, wherein the fixed cleaning nozzle uniformly cleans the entire back surface of the wafer. Since this is impossible, the back rinse nozzle which can move freely in the lower part of a wafer is provided. Here, by further providing a driving device and a rail including a control unit for applying an independent signal to each other to move the back rinse nozzle, or the same movement signal, to maximize the cleaning effect and to generate impurities on the back of the wafer to Defocus problems or subsequent semiconductor manufacturing apparatus contamination may be solved in the process.

As described above, the semiconductor manufacturing apparatus and the semiconductor manufacturing method using the same according to the present invention includes a back rinse nozzle that can move freely at the bottom of the wafer, thereby maximizing the cleaning effect on the back surface of the wafer and It provides the effect of improving the yield and reliability.

In addition, a preferred embodiment of the present invention is for the purpose of illustration, those skilled in the art will be able to various modifications, changes, substitutions and additions through the spirit and scope of the appended claims, such modifications and changes are the following claims It should be seen as belonging to a range.

Claims (11)

A back rinse nozzle provided to spray the cleaning liquid onto the back surface of the wafer; A rail provided under the back rinse nozzle; A drive device for horizontally moving the back rinse nozzle along the rail; And And a control unit for applying a signal to the driving device. The method of claim 1, The back rinse nozzle is provided with 2 to 8 semiconductor manufacturing apparatus, characterized in that provided. The method of claim 1, The back rinse nozzle further comprises a support moving along the rail. The method of claim 1, The back rinse nozzle is a semiconductor manufacturing apparatus, characterized in that provided inclined 45 ~ 60 ° in the wafer outward direction with respect to the vertical direction. The method of claim 1, And a first submersion protection cover surrounding the rail and the back rinse nozzle on the rail. The method of claim 1, And a second submersion protection cover on the driving device and the control unit. The method of claim 1, And the rails are arranged along the circumferential direction of the wafer. The method of claim 1, And the rails are arranged along a direction perpendicular to the tangent of the wafer. The method of claim 1, The rail is a semiconductor manufacturing apparatus, characterized in that provided in the form of a circular closed curve. Loading the wafer into the chamber; And Cleaning the back of the wafer using a back rinse nozzle provided as in claim 1, characterized in that the semiconductor manufacturing method. The method of claim 10, And cleaning the back surface of the wafer while moving the back rinse nozzle in one direction or an independent direction.
KR1020070091581A 2007-09-10 2007-09-10 Apparatus for fabricating semiconductor and method for fabricating semiconductor using the same KR20090026533A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070091581A KR20090026533A (en) 2007-09-10 2007-09-10 Apparatus for fabricating semiconductor and method for fabricating semiconductor using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070091581A KR20090026533A (en) 2007-09-10 2007-09-10 Apparatus for fabricating semiconductor and method for fabricating semiconductor using the same

Publications (1)

Publication Number Publication Date
KR20090026533A true KR20090026533A (en) 2009-03-13

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