KR20090022674A - Flexible printed cirucit board and method of forming the same - Google Patents

Flexible printed cirucit board and method of forming the same Download PDF

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Publication number
KR20090022674A
KR20090022674A KR1020070088226A KR20070088226A KR20090022674A KR 20090022674 A KR20090022674 A KR 20090022674A KR 1020070088226 A KR1020070088226 A KR 1020070088226A KR 20070088226 A KR20070088226 A KR 20070088226A KR 20090022674 A KR20090022674 A KR 20090022674A
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South Korea
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protective layer
layer
forming
flexible printed
copper foil
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KR1020070088226A
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Korean (ko)
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KR101393991B1 (en
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이병률
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엘지이노텍 주식회사
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

A FPCB(Flexible Printed Circuit Board) having high ESD(Electro Static Discharge) shielding effect and a manufacturing method thereof are provided to prevent crack in a step region between a rigid PCB of a camera module and a FPCB by forming a protective layer on a top of a first protective layer. A copper foil layer is formed on a top of an insulating film layer(200). A dry film for forming a circuit pattern is laminated on a top of the copper foil layer. The circuit pattern is formed on a copper foil pattern layer(202a) by lithography and etching. A first protective layer(208) is formed on a top of the copper pattern layer. A second protective layer(210) is formed on a top of the first protective layer by a sputtering process. Thickness of the second protective layer is 10um ~ 14um. The second protective layer is made of silver nano material.

Description

연성인쇄회로기판 및 그 형성방법{Flexible Printed Cirucit Board and Method of forming The Same}Flexible Printed Cirucit Board and Method of Forming The Same

도 1은 종래 기술에 따른 카메라 모듈 및 커넥터에 연결된 연성인쇄회로기판을 나타낸 블록도.1 is a block diagram illustrating a flexible printed circuit board connected to a camera module and a connector according to the prior art.

도 2a 내지 도 2d는 본 발명에 따른 연성인쇄회로기판 형성방법을 설명하기 위한 단면도.2A to 2D are cross-sectional views illustrating a method of forming a flexible printed circuit board according to the present invention.

도 3은 본 발명에 따른 카메라 모듈 및 커넥터에 연결된 연성인쇄회로기판을 나타낸 블록도.3 is a block diagram illustrating a flexible printed circuit board connected to a camera module and a connector according to the present invention.

본 발명은 특히, 소형 카메라 모듈(CCM:Compact Camera Module)과 같은 소형 전자 제품에 이용되는 연성인쇄회로기판(FPCB:Flexible Printed Circuit Board) 및 그 형성 방법에 관한 것이다.In particular, the present invention relates to a flexible printed circuit board (FPCB) used in small electronic products such as compact camera modules (CCM) and a method of forming the same.

최근 전자산업기술분야에서 반도체 집적회로의 집적도의 급속한 발전 및 소형 칩 부품을 집적 탑재하는 표면 실장기술의 발전에 따라 전자장비들이 소형화됨에 따라 보다 복잡하고 협소한 공간에서도 내장이 용이하도록 하는 것을 필요로 하 고 있으며, 이러한 요구에 부응하여 연성인쇄회로기판(FPCB)이 개발되고 있다.With the recent rapid development of the degree of integration of semiconductor integrated circuits and the development of surface mount technology for integrated mounting of small chip components in the electronic industrial technology field, as electronic equipments are miniaturized, it is necessary to make it easy to embed in more complicated and narrow spaces. To meet these demands, flexible printed circuit boards (FPCBs) are being developed.

이러한 연성인쇄회로기판은 휴대 단말기, 프린터 헤드, LCD(Liquid Crystal Display), PDP(Plasma Display Panel) 등의 기술발전으로 인하여 사용이 급격히 증가하면서 그 요구는 더욱 늘어가고 있는 실정이다.Such flexible printed circuit boards are rapidly increasing in use due to the development of technologies such as portable terminals, printer heads, liquid crystal displays (LCDs), plasma display panels (PDPs), and the demands thereof are increasing.

그러나 도 1에서 나타낸 바와 같이, 휴대 단말기 등에 장착되는 소형 카메라 모듈(CCM)에 사용되는 단면(Single Side) 연성인쇄회로기판(FPCB)은 소형 카메라 모듈에 굴곡지게 형성되어 조립되는데 이때, 리지드(Rigid) PCB(Printed Circuit Board)와 Flexible PCB 간의 절곡되는 차단영역에서 많은 크랙(Crack)이 발생되는 문제점이 있다.However, as shown in FIG. 1, a single side flexible printed circuit board (FPCB) used in a small camera module (CCM) mounted on a portable terminal is bent and assembled in the small camera module. ) There is a problem that many cracks are generated in the blocking area bent between the printed circuit board (PCB) and the flexible PCB.

여기서, 도 1은 종래 기술에 따른 카메라 모듈 및 커넥터에 연결된 연성인쇄회로기판을 나타낸 블록도이다.1 is a block diagram illustrating a flexible printed circuit board connected to a camera module and a connector according to the related art.

또한, 소형 카메라 모듈 특성상 무선감도에 많은 영향을 받는데, 이때 연성인쇄회로기판(FPCB) 패턴(pattern) 자체에서 노출되는 정전기(ESD:ElectroStatic Discharge)를 차단하지 못하는 문제점이 있다.In addition, due to the characteristics of the small camera module is greatly affected by the wireless sensitivity, there is a problem that can not block the electrostatic discharge (ESD) exposed from the flexible printed circuit board (FPCB) pattern itself.

본 발명은 소형 카메라 모듈(Copact Camera Module)의 리지드(Rigid) PCB와 Flexible PCB 간의 절곡되는 차단영역에서 발생하는 크랙(Crack)을 방지할 수 있는 연성인쇄회로기판 및 그 형성방법을 제공하는 것을 목적으로 한다.It is an object of the present invention to provide a flexible printed circuit board and a method of forming the same, which can prevent cracks occurring in a blocking area bent between a rigid PCB and a flexible PCB of a compact camera module. It is done.

본 발명의 특징은 절연 필름층 상면에 동박층을 형성하는 단계와, 상기 동박 층 상면에 회로패턴을 형성하기 위한 드라이 필름을 형성하는 단계와, 노광 및 식각을 통해 회로패턴이 형성된 동박 패턴층을 형성하는 단계와, 상기 동박 패턴층 상면에 제1 보호층을 형성하는 단계와, 상기 제1 보호층 상면에 소정의 두께로 제2 보호층을 형성하는 단계를 포함한다.Features of the present invention include the steps of forming a copper foil layer on the upper surface of the insulating film layer, forming a dry film for forming a circuit pattern on the upper surface of the copper foil layer, and a copper foil pattern layer having a circuit pattern formed through exposure and etching And forming a first protective layer on an upper surface of the copper foil pattern layer, and forming a second protective layer on the upper surface of the first protective layer with a predetermined thickness.

본 발명에서 상기 제2 보호층은 스퍼터링(Sputtering) 공정으로 형성된다.In the present invention, the second protective layer is formed by a sputtering process.

본 발명에서 상기 소정의 두께는 10μ㎜ ~ 14μ㎜ 두께로 이루어진다.In the present invention, the predetermined thickness is made of 10μmm ~ 14μmm thickness.

본 발명에서 상기 제2 보호층은 은 나노 재질로 이루어진다.In the present invention, the second protective layer is made of silver nano material.

본 발명의 다른 특징은 절연 필름층과, 상기 절연 필름층 상면에 회로패턴이 형성된 동박층 패턴과, 상기 회로패턴을 포함하고, 상기 동박 패턴층 상면에 형성된 제1 보호층과, 상기 제1 보호층 상면에 소정의 두께로 형성된 제2 보호층을 포함한다.Another feature of the present invention is an insulating film layer, a copper foil layer pattern having a circuit pattern formed on an upper surface of the insulating film layer, a first protective layer formed on the upper surface of the copper foil pattern layer, including the circuit pattern, and the first protective layer. A second protective layer formed on the upper surface of the layer to a predetermined thickness.

본 발명에서 상기 제2 보호층은 스퍼터링(Sputtering) 공정으로 형성된다.In the present invention, the second protective layer is formed by a sputtering process.

본 발명에서 상기 소정의 두께는 10μ㎜ ~ 14μ㎜ 두께로 이루어진다.In the present invention, the predetermined thickness is made of 10μmm ~ 14μmm thickness.

본 발명에서 상기 제2 보호층은 은 나노 재질로 이루어진다.In the present invention, the second protective layer is made of silver nano material.

이하에서 첨부된 도면을 참조하여 본 발명에 따른 연성인쇄회로기판 및 그 형성 방법에 대해서 상세히 설명한다.Hereinafter, a flexible printed circuit board and a method of forming the same will be described in detail with reference to the accompanying drawings.

도 2a 내지 도 2d는 본 발명에 따른 연성인쇄회로기판(FPCB) 형성방법을 설명하기 위한 단면도들이다.2A to 2D are cross-sectional views illustrating a method of forming a flexible printed circuit board (FPCB) according to the present invention.

먼저, 도 2a에서 나타낸 바와 같이, 절연 필름층(200) 상면에 회로패턴을 형성하기 위한 동박층(202)을 열 압착하여 베이스(Base)층(204)을 형성한다.First, as shown in FIG. 2A, the base layer 204 is formed by thermally compressing the copper foil layer 202 for forming a circuit pattern on the upper surface of the insulating film layer 200.

여기서, 동박층(202)에는 커넥터 연결 패턴과 소형 카메라 모듈(CCM:Copact Camera Module) 연결패턴이 형성된다.Here, the copper foil layer 202 is formed with a connector connection pattern and a small camera module (CCM) connection pattern.

이 후, 도 2b에서 나타낸 바와 같이, 베이스층(204)의 동박층(202) 상면에 회로 패턴을 형성하기 위한 드라이 필름(206)이 라미네이팅(Laminating)된다.Thereafter, as shown in FIG. 2B, the dry film 206 for forming a circuit pattern on the upper surface of the copper foil layer 202 of the base layer 204 is laminated.

또한, 도 2c 및 도 2d에서 나타낸 바와 같이, 노광 및 식각을 통해 회로 패턴이 형성된 동박 패턴층(202a)을 형성하고, 동박 패턴층(202a) 상면에 제1 보호층(Cover Lay)(208)을 형성한 후 제1 보호층(208) 상면에 스퍼터링(Sputtering) 공정을 통해 예컨대, 10μ㎜ ~ 14μ㎜ 두께로 은나노 재질의 제2 보호층(210)을 형성하여 연성인쇄회로기판(FPCB)을 완성한다.In addition, as shown in FIGS. 2C and 2D, a copper foil pattern layer 202a having a circuit pattern formed through exposure and etching is formed, and a first protective layer (Cover Lay) 208 is formed on the upper surface of the copper foil pattern layer 202a. After forming the first protective layer 208 by sputtering (Sputtering) on the upper surface, for example, by forming a second protective layer 210 of silver nano material to a thickness of 10μ ~ 14μ㎜ to form a flexible printed circuit board (FPCB) Complete

여기서, 동박 패턴층(202a)에는 커넥터 연결 패턴과 소형 카메라 모듈 연결 패턴이 형성되어 있어 커넥터와 소형 카메라 모듈이 실장되며, 동박 패턴층(202a)의 커넥터와 소형 카메라 모듈이 실장될 부분에는 제1 보호층(208)및 제2 보호층(210)을 형성하지 않고 오픈(a)시킨다.Here, the copper foil pattern layer 202a is formed with a connector connection pattern and a small camera module connection pattern so that the connector and the small camera module are mounted, and a portion of the copper foil pattern layer 202a on which the connector and the small camera module are to be mounted is a first The protective layer 208 and the second protective layer 210 are opened (a) without being formed.

은 나노 재질의 제2 보호층(210)이 제1 보호층(208) 상면에 형성된 연성인쇄회로기판(FPCB)은 도 3에서 나타낸 바와 같이 카메라 모듈의 리지드(Rigid) PCB와 연성인쇄회로기판(FPCB) 간의 절곡되는 차단영역에서 발생하는 크랙(Crack)을 방지할 수 있다.As shown in FIG. 3, the flexible printed circuit board (FPCB) having the second protective layer 210 made of silver nano material on the upper surface of the first protective layer 208 is a rigid PCB and a flexible printed circuit board of the camera module. It is possible to prevent cracks occurring in the blocking region bent between the FPCBs.

또한, 은 나노 재질의 제2 보호층으로 형성된 연성인쇄회로기판(FPCB)은 3dB 정도로 우수한 정전기(ESD:ElectroStatic Discharge) 차폐 효과 얻을 수 있다.In addition, the flexible printed circuit board (FPCB) formed of the second protective layer made of silver nano material may have an excellent electrostatic discharge (ESD) shielding effect of about 3 dB.

여기서, 도 3은 본 발명에 따른 카메라 모듈 및 커넥터에 연결된 연성인쇄회 로기판을 나타낸 블록도이다.3 is a block diagram illustrating a flexible printed circuit board connected to a camera module and a connector according to the present invention.

이상과 같이 본 발명은 비록 한정된 실시예와 도면에 의해 설명되었으나, 본 발명은 상기의 실시예에 한정되는 것이 아니며, 본 발명이 속하는 분야에서 통상의 지식을 가진 자라면, 이러한 기재로부터 다양한 수정 및 변형이 가능하다. 그러므로, 본 발명의 범위는 설명된 실시 예에 국한되어 정해져서는 아니되며, 후술하는 특허청구범위뿐만 아니라 이 특허 청구범위와 균등한 것들에 의해 정해져야 한다.As described above, although the present invention has been described by way of limited embodiments and drawings, the present invention is not limited to the above-described embodiments, and those skilled in the art to which the present invention pertains can make various modifications and Modifications are possible. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined not only by the claims below but also by the equivalents of the claims.

이상에서 설명한 바와 같이, 본 발명의 연성인쇄회로기판 및 그 형성방법에 따라 연성인쇄회로기판의 제1 보호층 상면에 은 나노 재질의 제2 보호층을 형성함으로써, 소형 카메라 모듈과 연성인쇄회로기판의 단차 영역에서 발생하는 크랙(Crack)을 방지할 수 있는 효과가 있다.As described above, according to the flexible printed circuit board and the method of forming the same, a small camera module and a flexible printed circuit board are formed by forming a second protective layer of silver nano material on the upper surface of the first protective layer of the flexible printed circuit board. There is an effect that can prevent cracks occurring in the step area of the.

Claims (8)

절연 필름층 상면에 동박층을 형성하는 단계와,Forming a copper foil layer on the upper surface of the insulating film layer; 상기 동박층 상면에 회로패턴을 형성하기 위한 드라이 필름을 형성하는 단계와,Forming a dry film for forming a circuit pattern on an upper surface of the copper foil layer; 노광 및 식각을 통해 회로패턴이 형성된 동박 패턴층을 형성하는 단계와,Forming a copper foil pattern layer on which a circuit pattern is formed through exposure and etching; 상기 동박 패턴층 상면에 제1 보호층을 형성하는 단계와,Forming a first protective layer on an upper surface of the copper foil pattern layer; 상기 제1 보호층 상면에 소정의 두께로 제2 보호층을 형성하는 단계를 포함하는 연성인쇄회로기판 제조 방법.And forming a second protective layer on the upper surface of the first protective layer with a predetermined thickness. 제1항에 있어서,The method of claim 1, 상기 제2 보호층은 스퍼터링(Sputtering) 공정으로 형성되는 연성인쇄회로기판 제조 방법.The second protective layer is a method of manufacturing a flexible printed circuit board is formed by a sputtering process. 제1항에 있어서,The method of claim 1, 상기 소정의 두께는 10μ㎜ ~ 14μ㎜ 두께로 이루어지는 연성인쇄회로기판 제조 방법.The predetermined thickness is a flexible printed circuit board manufacturing method consisting of 10μ㎜ ~ 14μ㎜ thickness. 제1항에 있어서,The method of claim 1, 상기 제2 보호층은 은나노 재질로 이루어지는 연성인쇄회로기판 제조 방법. The second protective layer is a flexible printed circuit board manufacturing method made of silver nano material. 절연 필름층과,With insulation film layer, 상기 절연 필름층 상면에 회로패턴이 형성된 동박층 패턴과,A copper foil layer pattern having a circuit pattern formed on an upper surface of the insulating film layer, 상기 회로패턴을 포함하고, 상기 동박 패턴층 상면에 형성된 제1 보호층과,A first protective layer including the circuit pattern and formed on an upper surface of the copper foil pattern layer; 상기 제1 보호층 상면에 소정의 두께로 형성된 제2 보호층을 포함하는 인쇄회로기판.A printed circuit board comprising a second protective layer formed on the upper surface of the first protective layer to a predetermined thickness. 제5항에 있어서,The method of claim 5, 상기 제2 보호층은 스퍼터링(Sputtering) 공정으로 형성되는 연성인쇄회로기판.The second protective layer is a flexible printed circuit board formed by a sputtering process. 제5항에 있어서,The method of claim 5, 상기 소정의 두께는 10μ㎜ ~ 14μ㎜ 두께로 이루어지는 연성인쇄회로기판.The predetermined thickness is a flexible printed circuit board made of a thickness of 10μ㎜ ~ 14μ㎜. 제5항에 있어서,The method of claim 5, 상기 제2 보호층은 은나노 재질로 이루어지는 연성인쇄회로기판.The second protective layer is a flexible printed circuit board made of silver nano material.
KR1020070088226A 2007-08-31 2007-08-31 Flexible Printed Cirucit Board and Method of forming The Same KR101393991B1 (en)

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