KR20080114733A - High-power light emitting diode illuminating equipment with efficiently heat-dissipating module - Google Patents

Abstract

A light-emitting diode illuminating equipment (3) comprises a heat-dissipating plate device (31), a plurality of heat-dissipating fins (32), a plurality of diode light-emitting apparatuses (33, 34), and a plurality of bar-shaped heat-conducting devices (35) with high heat-conducting coefficient. The heat-dissipating fins extend from the surface of the heat-dissipating plate device, the heat-conducting devices are closely attached to the surface of the heat-dissipating plate device and are disposed between the heat-dissipating fins. Thus, the heat generated by each diode light-emitting apparatus during working is uniformly distributed over the heat-dissipating plate device and the heat-dissipating fins via high efficiently heat-conducting effect of the heat-conducting devices, so that the diode light-emitting apparatuses have consistent junction temperature in order to ensure the consistency of light-emitting performance and life of the diode light-emitting apparatuses. ® KIPO & WIPO 2009

Description

High-power light emitting diode illuminating equipment with highly efficient heat-dissipating module

The present invention relates to a light emitting diode (LED) lighting apparatus, and more particularly, to a high output LED lighting apparatus having a high efficiency heat diffusion and heat dissipation structure.

LEDs have advantages in power saving, vibration resistance, high speed response, productivity, and the like, and thus, lighting apparatuses having LED light sources have been widely researched and developed. Current high-power LEDs have a problem of over-high temperature when emitting light continuously for a predetermined time, so that the luminous efficiency of the LED may be lowered and the brightness may not be increased. Therefore, products with high power LEDs need good heat conduction and heat dissipation mechanisms. In addition, since a conventional illumination device having a plurality of LEDs does not have a uniform heat distribution during operation, the photoelectric effect of the LED is weakened due to the extremely high junction temperature by continuously maintaining the thermal shock in the illumination device, and the luminous efficiency is low. Lowers. In addition, if the lighting device dissipates heat unevenly, the LEDs in the lighting device have a different lifetime, and the brightness of the entire lighting device is indirectly affected.

Regarding the heat radiation problem, a heat radiation fin with a heat radiation fin is widely used. With reference to FIG. 1A, FIG. 1A is a schematic diagram illustrating an apparatus 1 according to this method. The device 1 includes a heat sink element 11, a plurality of heat sink fins 12, and a plurality of diode light emitting elements 13. The heat sink element 11 has a first surface 112 and a second surface 114 opposite to the first surface 112. Diode light emitting elements 13 are disposed on the first surface 112. The heat dissipation fins 12 are formed on the second surface 114. Therefore, heat generated by each of the diode light emitting elements is dissipated through the heat sink element 11 and the heat dissipation fins 12. In order to dissipate heat uniformly, the distances from the end of the heat radiation fins 12 to the second surface 114 are different. As shown in FIG. 1A, the central heat dissipation fins 12 are designed to avoid the occurrence of hot spots that weaken the photoelectric effect of the diode light emitting elements 13 under thermal shock, thereby reducing luminous efficiency. It is longer than the heat radiating fins 12 and can dissipate more heat. However, since the heat dissipation fins 12 may have a temperature difference of 10% or more, the heat dissipation fins 12 may still not dissipate heat uniformly, and heat dissipation efficiency may not be good, resulting in hot spots. Thus, the above mentioned problem still remains unresolved.

Another solution to dissipate heat is to use a vapor chamber. Referring to FIG. 1B, FIG. 1B is a schematic diagram illustrating an apparatus 2 according to this method. The device 2 comprises a heat sink element 21, a plurality of heat sink fins 22, a plurality of diode light emitting elements 23, and a vapor chamber. The heat sink element 21 has a first surface 212 and a second surface 214 opposite to the first surface 212. The vapor chamber 24 is disposed on the first surface 212, the diode light emitting elements 23 are disposed on the vapor chamber 24. The heat dissipation fins 22 are formed on the second surface 214. Compared to device 1 above, device 2 solves the problem of non-uniform temperature distribution, but it is suitable for practical application of device 2, since the cost of steam chamber 24 is too expensive and not easy to manufacture. Not.

Therefore, there is a need to provide an LED lighting device capable of high power, high thermal diffusion efficiency and uniform heat dissipation to solve the above-mentioned problems.

[Summary of invention]

The scope of the present invention is to provide an LED lighting device capable of high power, high thermal diffusion efficiency and uniform heat dissipation.

According to a preferred embodiment, the LED lighting apparatus of the present invention includes a heat sink element, a plurality of heat radiation fins, N first diode light emitting elements, M second diode light emitting elements, and a plurality of bar thermal conduction elements having a high thermal conductivity coefficient. . N is an integer greater than or equal to 3. M is a natural number. The heat sink element has a first surface and a second surface opposite to the first surface. The heat sink fins extend from the second surface of the heat sink element. The N first diode light emitting elements are disposed on the first surface of the heat sink element and form one region. Each of the first diode light emitting elements converts electrical energy into first light. M second diode light emitting elements are disposed on the first surface of the heat sink element and arranged in the region. Each of the second diode light emitting elements converts electrical energy into second light. The bar thermal conductive elements having a high thermal conductivity coefficient are closely attached to the second surface of the heat sink element and arranged between the heat sink fins so that the heat generated by each diode heat sink is evenly distributed to the heat sink element and the heat conduction elements. . Since heat is dissipated by the heat sink element and the heat dissipation fins, the diode light emitting elements on the first surface have the same junction temperature, so that the luminous efficiency and lifetime of the diode light emitting elements can be maintained to be consistent with each other.

Therefore, the LED lighting apparatus of the present invention has the advantages of high power and high heat dissipation efficiency, and in particular, distributes heat uniformly so as to keep the light emitting efficiency and lifetime of the diode light emitting elements consistent.

Advantages and spirit of the present invention can be understood by the following description in conjunction with the accompanying drawings.

1A is a schematic diagram illustrating an apparatus in accordance with a method for dissipating heat with heat dissipation fins.

1B is a schematic diagram illustrating an apparatus according to a method for dissipating heat to a vapor chamber.

2 illustrates an LED lighting apparatus of the first preferred embodiment according to the present invention.

3 is a cross-sectional view taken along the line X-X of FIG. 2.

4 is a configuration diagram of a diode light emitting device of a preferred embodiment.

5 is a cross-sectional view of the LED lighting apparatus of the second preferred embodiment according to the present invention.

Referring to Fig. 2, Fig. 2 illustrates the LED lighting apparatus of the first preferred embodiment according to the present invention. 3 is a cross-sectional view taken along the line X-X of FIG. 2. According to the first preferred embodiment, the LED lighting device 3 of the present invention comprises a heat sink element 31, a plurality of heat sink fins 32, N first diode light emitting elements 33, M second diode light emitting elements ( 34), a plurality of bar-shaped heat conducting elements 35 having a high thermal conductivity coefficient, a shield element 36, and a heat insulating ring 37. N is an integer greater than or equal to 3. M is a natural number.

The heat sink element 31 has a first surface 312 and a second surface 314 opposite to the first surface 312. The heat dissipation fins 32 extend from the second surface 314 of the heat sink element 31. The heat sink element 31 includes N first cavities 3122 formed on the first surface 312 and M second cavities 3124 formed on the first surface 312. Each of the first diode light emitting elements 33 corresponds to one of the first cavities 3122 and is disposed in the corresponding first cavity 3122. The first diode light emitting elements 33 surround a predetermined area S (not shown in FIG. 2). Each of the second diode light emitting elements 34 corresponds to one of the second cavities 3124 and is disposed in the corresponding second cavity 3124. The plurality of bar-shaped heat conducting elements 35 having a high thermal conductivity coefficient are closely attached to the second surface 314 of the heat sink element 31, and are arranged between the heat dissipation fins 32.

Each of the first diode light emitting elements 33 converts electrical energy into first light. Each of the second diode light emitting elements 34 converts electrical energy into second light. In addition, one of the first diode light emitting elements 33 includes at least one LED chip or at least one laser diode (LD) chip. One of the second diode light emitting elements 34 includes at least one LED chip or at least one LD chip.

The shield element 36 is coupled to the circumference of the heat sink element 31 by an insulating ring 37 to accommodate the first diode light emitting elements 33 and the second diode light emitting elements 34. To form a sealing space 38. The shield element 36 includes a transparent shield that allows the light emitted by each of the first diode light emitting elements 33 and the second diode light emitting elements 34 to pass therethrough.

 Since the bar-shaped thermal conductive elements 35 having a high thermal conductivity coefficient are closely attached to the second surface 314 of the heat sink element 31 and are arranged between the heat radiation fins 32, the first diode light emitting devices ( 33) and the heat generated by each of the second diode light emitting elements 34 are uniformly distributed on the heat sink element 31. This heat is dissipated by the heat sink element 31 and the heat sink fins 32. Each of the bar-shaped thermal conducting elements 35 having a high thermal conductivity may be a heat pipe or a vapor chamber.

It should be noted that the region S surrounded by the first diode light emitting elements 33 is composed of convex polygons, the first diode light emitting elements 33 are positioned at the boundary of the region S, and The two diode light emitting elements 34 are located in the area S to form the cluster arrangement shown in FIG. In this case, the brightness can be increased, but each of the second diode light emitting elements 34 is surrounded by different sources, i.e., other diode light emitting elements 33 and 34, thereby making it easier to hot spot. As a result, the chip junction temperature of the second diode light emitting elements 34 is overheated to shorten the lifespan, affects the luminous efficiency, and indirectly affects the brightness of the LED lighting device 3. However, according to the first preferred embodiment, the LED lighting device 3 of the present invention provides thermal conductivity efficiency by directly arranging the diode light emitting elements 33 and 34 on the first surface 312 of the heat sink element 31. Increase. In addition, the LED lighting device 3 is attached to the bar-shaped heat conducting elements 35 having a high thermal conductivity in close contact with the second surface 314 of the heat sink element 31 and between the heat radiation fins 32. By disposing the heat rapidly dissipated by the heat sink element 31 and the heat radiation fins 32, the heat is uniformly distributed.

According to a first preferred embodiment, the LED lighting device 3 of the present invention further comprises a circuit board. The circuit board is mounted on the first surface 312 and includes a plurality of bond pads and a plurality of holes. Here, each of the first diode light emitting elements 33 and the second diode light emitting elements 34 corresponds to one of the holes, and is disposed on the first surface 312 of the heat sink element 31 through the holes. . Bond pads provide an electrical connection between each of the first diode light emitting elements 33 and the second diode light emitting elements 34 and the circuit board.

The LED lighting device 3 further includes a control circuit. The control circuit is electrically connected to the first diode light emitting elements 33 and the second diode light emitting elements 34, respectively, to control light emission of the first diode light emitting elements 33 and the second diode light emitting elements 34. do. Here, the control circuit may be disposed inside the sealing space 38 or outside the sealing space 38.

5, FIG. 5 is a cross-sectional view of the LED lighting device 4 of the second preferred embodiment according to the present invention. According to the second preferred embodiment, the LED lighting device 4 of the present invention comprises a heat sink element 41, a plurality of heat sink fins 42, N diode light emitting elements 43, a plurality of heat conduction elements 44, a shield An element 45, and an insulating ring 46. N is an integer greater than or equal to 3.

The heat sink element 41 has a first surface 412 and a second surface 414 opposite to the first surface 412. The heat sink fins 42 extend from the second surface 414 of the heat sink element 41. The heat sink element 41 includes N first cavities 4122 formed on the first surface 412. Each of the diode light emitting elements 43 is disposed corresponding to one of the first cavities 4122. The heat conductive elements 44 are attached to the second surface 414 of the heat sink element 41 in close contact with each other, and are arranged between the heat sink fins 42. In addition, the third diode light emitting element 43 of the diode light emitting elements 43 includes one LED chip or at least one LD chip.

The shield element 45 is coupled to the periphery of the heat sink element 41 by the heat insulation ring 46 to form a sealing space for accommodating the diode light emitting elements 43. The shield element 45 includes a transparent shield capable of passing light emitted by each of the diode light emitting elements 43.

Since the heat conducting elements 44 are closely attached to the second surface 414 of the heat sink element 41 and are arranged between the heat dissipation fins 42, the heat conduction elements 44 are generated by each of the diode light emitting elements 43 in operation. Heat is evenly distributed on the heat sink element 41. This heat is dissipated by the heat sink element 41 and the heat sink fins 42. It is further noted here that the thermally conductive elements 44 may also be disposed on the first surface 412. In addition, the heat sink element 41 includes a plurality of recesses to which the heat conductive elements 44 may be attached in close contact with the first surface 412. One of the heat conduction elements 44 may be a heat pipe or a vapor chamber. In addition, when the first diode light emitting element 43 and the second diode light emitting element 43 of the diode light emitting elements 43 are all driven at one current, the first diode light emitting element 43 and the second diode light emitting element 43 The surface temperature difference between 43 can be controlled within a certain range. The range is determined by the arrangement of the heat conduction elements 44 arranged on the second surface 414 of the heat sink element 41. In general, the range can be controlled to a range of 10 ° C. and, when used with heat simulation, to a range of 5 ° C. or smaller.

 Here, it should be noted that according to the second preferred embodiment, the temperature control for the light emitting chip affects the luminous efficiency and lifetime of the light emitting chip. In addition, the temperature control test depends on the temperature measurement. However, it is not easy to measure junction temperature with current technology. Instead, the present invention measures the surface temperature of the diode light emitting elements, which indicates the junction temperature of the diode light emitting elements, in order to perform temperature control. Surface temperature may be measured using a thermocouple, infrared device or other device capable of measuring the surface temperature directly or indirectly. In addition, the temperature instead of the junction temperature is not limited only to the surface temperature of the diode light emitting devices. Other temperatures may be used that are directly or indirectly related to the junction temperature. If possible, it is also possible to incorporate the temperature measurement circuitry into the LED process.

According to a second preferred embodiment, the LED lighting device 4 of the present invention further comprises a circuit board. The circuit board is mounted on the first surface 412 and includes a plurality of bond pads and a plurality of holes. Here, each of the diode light emitting elements 43 corresponds to one of the holes, and the bond pads provide electrical connection of the N diode light emitting elements 43 to the circuit board.

The LED lighting device 4 further includes a control circuit. The control circuit is electrically connected to the N diode light emitting elements 43, respectively. Here, the control circuit is disposed inside the sealing space 47 or outside the sealing space 47.

As such, according to the preferred embodiments described above, the LED lighting apparatus of the present invention enables both high output brightness and high efficiency of heat diffusion and heat dissipation. In addition, the diode light emitting devices may have a junction temperature coinciding with each other, and the temperature difference of the diode light emitting devices may be controlled within a predetermined range so that the luminous efficiency and lifespan of the LED chips are kept equal to each other.

In addition, the arrangement of the bar-shaped heat conduction elements 35 and 44 having a high thermal conductivity coefficient disposed on the second surfaces 314 and 414 of the heat sink elements 31 and 41 is not limited to the form illustrated in the drawings. This arrangement can be designed according to the actual product. Therefore, it may be permissible to deform the bar-shaped heat conduction elements 35, 44 having a high thermal conductivity in a radial or other form depending on the experiment.

The features and spirits of the invention will be well understood with the examples and descriptions set forth above. Those skilled in the art will readily appreciate that various modifications and variations can be made while maintaining the principles of the invention. Accordingly, the foregoing description should be construed as limited only by the limitations and scope of the appended claims.

Claims (20)

A heat sink element having a first surface and a second surface opposite to the first surface; A plurality of heat sink fins extending from the second surface of the heat sink element; N first diode light emitting devices disposed on the first surface of the heat sink element to form a region, each of which is an integer greater than 3 for converting electrical energy into first light; M second diode light emitting elements disposed on the first surface and arranged in the region surrounded by the N first diode light emitting elements, each of which is a natural number for converting the electrical energy into second light; And In operation, heat generated by each of the N first diode light emitting elements and the M second diode light emitting elements is uniformly distributed on the heat sink element and the heat dissipation fins by high efficiency heat conduction, and then Dissipated by the heat dissipation fins so that the diode light emitting elements on the first surface are closely attached to the second surface of the heat sink element so as to have a matched junction temperature for keeping the lifetime and luminous efficiency consistent with each other. LED lighting device including a bar-shaped heat conduction element having a plurality of high conductivity coefficients disposed between the radiating fins together. The LED lighting device of claim 1, wherein each of the bar thermal conductive elements is a heat pipe or a vapor chamber. The heat sink of claim 1, wherein the heat sink element includes N first cavities formed on the first surface, and M second cavities formed on the first surface, wherein each of the first diode light emitting devices is configured to include the first diode light emitting device. An LED lighting device disposed in the first cavity corresponding to one of the first cavities, and each of the second diode light emitting elements disposed in the second cavity corresponding to one of the second cavities . The method of claim 1, wherein one of the N first diode light emitting devices includes at least one LED chip or at least one LD chip, and one of the M second diode light emitting devices is at least one LED chip or at least one LED chip. LED lighting device including one LD chip. The method of claim 4, wherein A circuit board mounted on the first surface and having a plurality of bond pads and a plurality of holes; Each of the first diode light emitting elements is disposed on the first surface of the heat sink element through the hole corresponding to one of the holes, and the bond pads are formed of the first diode light emitting elements and the second diode light emitting elements. LED lighting device providing an electrical connection between each and the circuit board. The method of claim 1, It is configured to form a sealing space for accommodating the first diode light emitting elements and the second diode light emitting elements in combination with the peripheral portion of the heat sink element, each of the first diode light emitting elements and the second diode light emitting elements LED lighting device further comprising a shield element comprising a transparent shield capable of passing heat emitted by the. The LED lighting device of claim 6, wherein the shield element is coupled to the peripheral portion of the heat sink element by a heat insulation ring. The display device of claim 6, further comprising a control circuit electrically connected to the first diode light emitting elements and the second diode light emitting elements, respectively, to control light emission of the first diode light emitting elements and the second diode light emitting elements. LED lighting equipment. The LED lighting apparatus of claim 8, wherein the control circuit is disposed in the sealed space. The LED lighting device of claim 8, wherein the control circuit is disposed outside the sealing space. A heat sink element having a first surface and a second surface opposite to the first surface; A plurality of heat sink fins extending from the second surface of the heat sink element; N diode light emitting elements having an integer greater than 3 arranged in a two-dimensional distribution on the first surface of the heat sink element; And A plurality of heat conductive elements disposed in close contact with the second surface of the heat sink element and disposed between the heat dissipation fins, The first diode light emitting device and the second diode light emitting device of the N diode light emitting devices are all driven in one circuit, and the surface temperature difference between the first diode light emitting device and the second diode light emitting device is 10 ° C. or less. . The LED lighting device of claim 1, wherein one of the heat conductive elements is a heat pipe or a vapor chamber. The LED lighting device of claim 1, wherein the heat sink element comprises N cavities, each of the diode light emitting elements correspondingly disposed in one of the N cavities. The LED lighting apparatus of claim 1, wherein the third diode light emitting devices of the N diode light emitting devices comprise one LED chip or one LD chip. The method of claim 4, wherein A circuit board mounted on the first surface and having a plurality of bond pads and a plurality of holes; Wherein each of the diode light emitting elements corresponds to one of the holes, and the bond pads provide electrical connection of the N diode light emitting elements to the circuit board. The method of claim 1, A transparent shield coupled to a periphery of the heat sink element to form a sealing space for accommodating the N diode light emitting elements, and capable of passing heat emitted by each of the first diode light emitting elements. LED lighting device further comprising a shield element. The LED lighting device of claim 6, wherein the shield element is coupled to the peripheral portion of the heat sink element by a heat insulation ring. The LED lighting apparatus of claim 6, further comprising a control circuit electrically connected to the N diode light emitting elements to control light emission of the N diode light emitting elements. The LED lighting device of claim 8, wherein the control circuit is disposed in the sealed space. The LED lighting device of claim 8, wherein the control circuit is disposed outside the sealing space.

Images