KR20080108743A - Organic electro-luminescence display device and method for fabricating thereof - Google Patents

Abstract

An organic elestroluminescent display device and manufacturing method thereof are provided to prevent damage of an organic luminous cell and improve lifetime by completely protecting an organic luminous cell array from moisture and oxygen from external environment. An organic luminous cell array portion has a structure in which organic luminous cells are arranged to a matrix type. A thin-film transistor array part(220) including driver components for operating the organic luminous cell is formed on a first substrate. A second substrate is attached through the first substrate and organic sealant(226) and packages the organic luminous cell array portion. A inorganic sealant(236) is separated the organic sealant with a predetermined distance and is made of soldering materials with surrounding the organic sealant.

Description

Organic Electroluminescence Display Device and Method For Fabricating Thereof}

1 is a circuit diagram illustrating a pixel of a typical active organic light emitting display device.

2 is a diagram for explaining a light emission principle of an organic light emitting cell of an organic light emitting display device.

3 is a schematic cross-sectional view of an active organic light emitting display device according to the present invention;

FIG. 4 is a view illustrating region A of the organic light emitting display device of FIG. 3 in detail.

FIG. 5 is a flowchart schematically illustrating a method of manufacturing the organic light emitting display device of FIG. 4. FIG.

6 is a cross-sectional view illustrating an organic light emitting display device of a dual panel type according to the present invention.

7 is a flowchart schematically illustrating a method of manufacturing the organic light emitting display device of FIG. 6.

<Explanation of symbols for the main parts of the drawings>

102 substrate 152 glass cap

126, 226: organic sealant 60: cell driving unit

115,215: organic light emitting array portion 120,220: thin film transistor array portion

4,104,204; First electrode 10,110,210: organic light emitting layer

12,112,212: second electrode 136,236: inorganic sealant

137,237: first dummy metal pattern 138,238: second dummy metal pattern

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting display device, and more particularly, to an organic light emitting display device and a method of manufacturing the same, which can improve the lifespan of an organic light emitting cell by protecting the organic light emitting cell from an external environment.

Recently, various flat panel displays have been developed to reduce weight and volume, which are disadvantages of cathode ray tubes. Such flat panel displays include liquid crystal displays (hereinafter referred to as "LCDs"), field emission displays (FEDs), plasma display panels (hereinafter referred to as PDPs), and electroluminescence. And an EL-luminescence display device using an element (Electro-luminescence Device: hereinafter referred to as an "EL device"), etc. To improve the display quality of such a flat panel display device, Attempts have been made to actively screen large screens.

Among them, PDP is attracting attention as a display device which is light and small and is most advantageous for large screen because of its simple structure and manufacturing process. However, PDP has low luminous efficiency, low luminance and high power consumption. On the other hand, an active matrix LCD having a thin film transistor (hereinafter referred to as a TFT) as a switching element has a disadvantage in that it is difficult to large screen due to the semiconductor process and consumes a lot of power due to the backlight unit. , Optical prism sheet, diffusion plate, etc. are characterized by high optical loss and narrow viewing angle.

In contrast, the EL display device is classified into an inorganic EL display device and an organic EL display device according to the material of the light emitting layer. The EL display device is a self-luminous device that emits light by itself, and has a high response speed and high luminous efficiency, luminance, and viewing angle. Inorganic EL display devices have higher power consumption and higher luminance than organic EL display devices, and cannot emit various colors of R, G, and B. On the other hand, the organic EL device is driven at a low DC voltage of several tens of volts, has a fast response speed, obtains high brightness, and emits various colors of R, G, and B, which is suitable for next-generation flat panel display devices.

The method of driving such an organic EL display device may be classified into a passive matrix type and an active matrix type.

The passive matrix type organic EL display device has a simple structure and a simple manufacturing method. However, the passive matrix type organic EL display device has a high power consumption and a large area of the display device, and the opening ratio decreases as the number of wires increases.

On the other hand, an active matrix organic EL display device has an advantage of providing high luminous efficiency and high image quality.

FIG. 1 is a circuit diagram schematically showing one pixel P of an active organic EL display device, and FIG. 2 is a diagram illustrating a light emission principle of an organic light emitting cell.

The active organic EL display device has a structure in which pixels P, which are respectively provided in regions defined by intersections of the gate line GL and the data line DL, are arranged in a matrix form. Each pixel P receives a data signal from the data line DL when a gate pulse is supplied to the gate line GL, and generates light corresponding to the data signal.

To this end, each of the pixels P is connected to an organic EL cell EL having a cathode connected to a base voltage source GND, a gate line GL, a data line DL, and a supply voltage source VDD, and an organic light emitting diode. It is provided with the cell drive part 60 connected to the anode of the cell EL, and for driving the organic EL cell EL. The cell driver 152 includes a switching thin film transistor T1, a driving thin film transistor T2, and a capacitor C.

The switching thin film transistor T1 is turned on when a scan pulse is supplied to the gate line GL, and supplies the data signal supplied to the data line DL to the first node N1. The data signal supplied to the first node N1 is charged to the capacitor C and supplied to the gate terminal of the driving thin film transistor T2. The driving thin film transistor T2 controls the amount of light emitted from the organic light emitting cell EL by controlling the amount of current I supplied from the supply voltage source VDD to the organic EL cell EL in response to a data signal supplied to the gate terminal. Done. In addition, since the data signal is discharged from the capacitor C even when the switching thin film transistor T1 is turned off, the driving thin film transistor T2 is supplied from the supply voltage source VDD until the data signal of the next frame is supplied. The current I is supplied to the organic light emitting cell EL.

Accordingly, as shown in FIG. 2, the electrons generated from the second electrode (or “cathode electrode”) 12 of the organic light emitting cell EL may form the electron injection layer 10a and the electron transport layer 10b. The holes generated from the first electrode (or " anode electrode ") 4 are moved toward the light emitting layer 10c through the hole injection layer 10d and the hole transport layer 10d. Move. Accordingly, in the light emitting layer 10c, light is generated by collision and recombination of electrons and holes supplied from the electron transport layer 10b and the hole transport layer 10d, and the light is emitted to the outside through the first electrode 4. The image is displayed.

The conventional active organic EL display device driven by the above-described driving method includes a thin film transistor array portion formed on a transparent substrate, an organic light emitting cell array portion and an organic light emitting cell array portion located on the thin film transistor array portion from an external environment. Glass caps for isolation.

The organic light emitting cell array unit includes organic light emitting cells EL connected to the driving thin film transistor of the thin film transistor array unit in a matrix form.

The organic light emitting cell EL has a property of being easily degraded by moisture and oxygen as it is made of an organic material. In order to solve this problem, an encapsulation (encapsulation) process is performed to bond the substrate and the glass cap on which the organic light emitting cell array part is formed through the sealant.

However, the sealant has a problem that it is not possible to sufficiently protect the organic material and the like of the organic light emitting cell array unit from the external environment. The conventional sealant is made of a porous material such as epoxy resin, and thus has an advantage of improving adhesion between the glass cap and the substrate, but has a disadvantage in that it cannot sufficiently block the penetration of moisture and oxygen from the outside.

As a result, the organic light emitting cell EL may not be sufficiently protected from moisture and oxygen, and the organic light emitting cell EL may be damaged, resulting in a decrease in the lifespan of the organic light emitting display device.

Accordingly, an object of the present invention is to provide an organic light emitting display device and a method for manufacturing the same, which can prevent damage to an organic light emitting cell and improve its life by sufficiently protecting the organic light emitting cells from an external environment.

In order to achieve the above object, the organic light emitting display device according to the present invention includes an organic light emitting cell array having a structure in which the organic light emitting cells are arranged in a matrix form; A thin film transistor array unit formed on a first substrate and including driving elements for driving the organic light emitting cell; A second substrate bonded to the first substrate through an organic sealant to package the organic light emitting cell array; The inorganic sealant may be positioned between the first and second substrates and may be spaced apart from the organic sealant by a predetermined distance to surround the organic sealant.

The organic light emitting cell array unit is formed on the thin film transistor array unit.

A first dummy metal pattern disposed between the inorganic sealant and the second substrate; A second dummy metal pattern is disposed between the inorganic sealant and the first substrate, wherein the second dummy metal pattern is the same material as any one of the metal thin film patterns included in the thin film transistor array unit.

The organic light emitting cell array unit is formed on the second substrate and is electrically connected to the thin film transistor array unit through a conductive spacer.

A first dummy metal pattern disposed between the inorganic sealant and the second substrate and formed of the same material as any one of the metal thin film patterns included in the organic light emitting cell array unit; It is formed between the inorganic sealant and the first substrate and made of the same material as any one of the thin film patterns included in the thin film transistor array unit.

The inorganic sealant is a soldering material.

The inorganic sealant includes at least one of lead (Pb) and silver (Ag).

A method of manufacturing an organic light emitting display device according to the present invention includes forming a thin film transistor array unit formed on a first substrate and including driving elements for driving an organic light emitting cell; Forming an organic light emitting cell array having a structure in which the organic light emitting cells are arranged in a matrix form; Bonding the first substrate and the second substrate using an organic sealant to package the organic light emitting cell array unit, and the bonding of the first substrate and the second substrate may be performed between the first and second substrates. And an inorganic sealant positioned at and spaced apart from the organic sealant by a predetermined distance to surround the organic sealant.

The organic light emitting cell array unit is formed on the thin film transistor array unit.

Forming a first dummy metal pattern positioned between the inorganic sealant and the second substrate; The method may further include forming a second dummy metal pattern formed between the inorganic sealant and the first substrate and formed of the same material as any one of the metal thin film patterns included in the thin film transfer array unit.

The organic light emitting cell array unit is formed on the second substrate and is electrically connected to the thin film transistor array unit through a conductive spacer.

The forming of the organic light emitting cell array unit may include a first dummy metal pattern positioned between the inorganic sealant and the second substrate and simultaneously formed of the same material as any one of the metal thin film patterns included in the organic light emitting cell array unit. Forming a; The forming of the thin film transistor array unit may include forming a second dummy metal pattern positioned between the inorganic sealant and the first substrate and simultaneously formed of the same material as any one of the thin film patterns included in the thin film transistor array unit. It further comprises the step.

Other objects and features of the present invention in addition to the above object will become apparent from the description of the embodiments with reference to the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described with reference to FIGS. 3 to 7.

3 is a view schematically showing an active organic EL display device according to an exemplary embodiment of the present invention, and FIG. 4 is a view showing region A of FIG. 4 in detail.

3 and 4, the organic EL display device includes a thin film transistor array unit 120 formed on a transparent substrate 102, an organic light emitting cell array unit 115 positioned on the thin film transistor array unit 120, It includes a glass cap (152) to isolate the organic light emitting cell array 115 from the external environment. In addition, the organic sealant 126 and the organic sealant 126 for adhering the glass cap 152 and the substrate 102 and protecting the organic light emitting cell array unit 120 from the outside are positioned side by side at a predetermined distance. It further includes an inorganic sealant 136 surrounding the organic sealant 126.

The thin film transistor array unit 120 includes driving elements for driving the organic light emitting cell EL, such as a gate line, a data line, and a cell driver. In FIG. 3, only the driving thin film transistor T2 positioned in the cell driving unit of the thin film transistor array unit 120 is illustrated, but the shape of the switching thin film transistor in the cell driving unit is substantially the same as that of the driving thin film transistor T2. Have.

In the organic light emitting array unit 115, organic light emitting cells EL connected to the driving thin film transistor T2 of the thin film transistor array unit 120 are arranged in a matrix form.

The organic light emitting cell EL is formed of a first electrode 104 and a mesh structure that are directly connected to the driving thin film transistor T2 to receive a data signal from the driving thin film transistor T2. A bank (or “insulation film”) 106 defining an area where each organic EL cell EL is located by exposing the electrode 104, an organic light emitting layer 110, and an organic light emitting layer in which electrons and holes are recombined to emit light. A second electrode 112 constituting the organic light emitting cell EL is formed together with the 110 and the first electrode 104.

The organic sealant 126 serves to protect and isolate the organic light emitting cell array 115 from the external environment by bonding the glass cap 152 and the substrate 102.

As the glass cap 152, a substrate on which an organic light emitting cell is formed may be used.

The organic sealant 126 is made of an organic material having high adhesion such as an epoxy resin.

The inorganic sealant 136 is formed to be parallel to the organic sealant 126 at a predetermined distance and to surround the organic sealant 126 in a direction opposite to the organic light emitting cell array 115 based on the organic sealant 126. . In addition, the inorganic sealant 136 serves to assist or enhance the function of the organic sealant 126 to protect and isolate the organic light emitting cell array 115 by being sandwiched between the glass cap 152 and the substrate 102. . Accordingly, the organic light emitting cell EL of the organic light emitting cell array unit 115 according to the present invention is sufficiently protected from the external environment by the inorganic sealant 136 as well as the organic sealant 126.

In more detail, the organic sealant 126 is made of a porous material such as an epoxy resin to improve adhesion between the glass cap 152 and the substrate 102, while infiltrating moisture and oxygen from the outside. Can't block enough. Accordingly, in the present invention, by adding an inorganic sealant 136 made of metal, unlike the organic sealant 126, the organic light emitting cell EL may be sufficiently protected from moisture and oxygen from the external environment. In other words, the organic sealant 126 is used to maintain the adhesion between the glass cap 152 and the substrate 102 and the inorganic sealant 136 may be added to completely isolate the organic material in the organic light emitting display device from the external environment. It becomes possible.

Accordingly, damage to the organic light emitting cell EL can be prevented, thereby extending the life of the organic light emitting cell EL and extending the life of the organic light emitting display device.

As the inorganic sealant 136, a low melting soldering material such as lead (Pb) or silver (Ag) may be used, and the soldering material may be formed by soldering the soldering material to a desired region by a metal melt coating apparatus. As the metal melt coating apparatus, a known metal melt coating apparatus such as a dispenser apparatus capable of melting a metal having a low melting point and injecting it into a specific region may be used.

On the other hand, the metal used for the inorganic sealant 136 may not be very good adhesion to the substrate 102. Thus, by placing the dummy metal pattern between the inorganic sealant 136 and the substrate 102 without directly contacting the inorganic sealant 136 with the substrate 102, the inorganic sealant 136 uses the dummy metal pattern as a medium. It can be sandwiched between the substrates. In FIG. 3, a first dummy metal pattern 137 positioned between the inorganic sealant 136 and the glass cap 152, and a second dummy metal pattern 138 positioned between the organic sealant 136 and the substrate 102. This position is indicated.

Molybdenum (Mo), aluminum (Al), chromium (Cr), or the like is used for the first dummy metal pattern 137 and the second dummy metal pattern 138. In particular, the second dummy metal pattern 138 is simultaneously formed with any one metal thin film in the organic light emitting cell array unit 115 and the thin film transistor array unit 120. For example, the gate electrode may be formed simultaneously with the gate pattern of the thin film transistor array unit 120 or simultaneously with the second electrode 112 of the organic light emitting cell array unit 115. As described above, the first and second dummy metal patterns 137 are made of the same material as the thin film in the organic light emitting display device, and thus the inorganic sealant having the adhesive force to the substrate 102 is made of lead (Pb), silver (Ag), or the like. It is better than 136. Accordingly, the adhesive force may be further improved by placing the first or second dummy metal pattern 137 therebetween than the inorganic sealant 136 directly adheres to the substrate 102.

5 is a flowchart illustrating a manufacturing process of an organic light emitting display device according to the present invention.

First, a thin film transistor array unit 120 including a thin film transistor, a signal line, and the like is formed on the substrate 102. (S2) At the same time, a second dummy is formed in the region where the inorganic sealant 136 is located on the substrate 102. FIG. The metal pattern 138 is formed. The second dummy metal pattern 138 may be formed at the same time as a metal pattern such as a gate pattern of the thin film transistor array unit 120.

Thereafter, the organic light emitting cell array unit 115 is formed on the thin film transistor array unit 120 (S4).

Thereafter, the glass cap 152 is provided, the organic sealant 126 is coated on the substrate, and the inorganic sealant 136 is formed by the soldering process. (S6) In the region of the glass cap to be in contact with the inorganic sealant 136 The first dummy metal pattern 137 may be further formed.

Thereafter, as the encapsulation process is performed, the glass cap 152 and the substrate 102 are bonded to each other, and the organic light emitting cell array unit 115 is packaged (S10). Accordingly, the organic light emitting cell array unit ( 115 is sufficiently protected from moisture and oxygen in the external environment by the organic sealant 126 as well as the inorganic sealant 136.

6 is a cross-sectional view illustrating an organic light emitting display device according to another embodiment of the present invention. The organic light emitting display device shown in FIG. 6 is a dual panel type organic light emitting display device, and the light emitted by the light is emitted toward the upper substrate so that the upper substrate becomes the display surface.

The dual panel type organic light emitting display device illustrated in FIG. 6 includes an upper substrate 252 having an organic light emitting cell array 215 in which a plurality of organic light emitting cells EL are arranged in a matrix form, and an organic light emitting cell ( For electrically connecting the lower substrate 202 on which the thin film transistor array unit 220 having the driving thin film transistor T2 for driving the ELs is formed, and the organic light emitting cell EL and the driving thin film transistor T2. Spacer 270 is provided. In addition, the organic substrate 252 and the organic substrate 252 for bonding the upper substrate 252 and the lower substrate 202 to protect the organic light emitting cell array unit 215 from the outside, and are positioned side by side with a predetermined distance from the organic sealant 226. And an inorganic sealant 236 surrounding the organic sealant 226.

The organic light emitting cell array unit 215 formed on the upper substrate 252 has a structure in which the organic light emitting cells EL partitioned by the partition wall 274 are arranged in a matrix form. Each organic light emitting cell EL has the same structure as the organic light emitting cell EL illustrated in FIGS. 3 and 4. That is, each organic light emitting cell EL is insulated from each other and intersects the first electrode 204 and the second electrode 212, and the organic light emitting layer positioned between the first electrode 204 and the second electrode 212. 210 is provided. The organic light emitting layer 210 includes an electron related layer 210a including an electron injection layer and an electron transport layer, a light emitting layer 210b for implementing a specific color, a hole related layer 210c including a hole injection layer and a hole transport layer. .

The partition wall 274 separates the adjacent organic light emitting cells EL and separates the second electrode 212.

The organic sealant 226 has the same structure and the same function as the organic sealant 126 in FIG. 3. That is, the organic sealant 226 of FIG. 6 is formed of an adhesive organic material such as an epoxy resin, and the upper substrate 252 and the lower substrate 202 are bonded to protect the organic light emitting cell array 215 from the external environment. And isolate.

The inorganic sealant 236 also serves to assist or enhance the function of the organic sealant 126 to protect and isolate the organic light emitting cell array 115, similarly to the inorganic sealant 136 in FIG. 3. The first dummy metal pattern 237 may be further located between the inorganic sealant 236 and the upper substrate 252, and the second dummy metal pattern 238 may also be disposed between the inorganic sealant 236 and the lower substrate 202. ) May be located further. Here, the first dummy metal pattern 237 is formed at the same time as either the first electrode 204 or the second electrode 212 included in the organic light emitting cell array 115, and the second dummy metal pattern 238. ) Is formed simultaneously with any one of the metal patterns constituting the thin film transistor array unit 220. In FIG. 6, the first dummy metal pattern 237 is formed simultaneously with the second electrode 112, and the second dummy metal pattern 238 is formed simultaneously with the gate pattern of the driving thin film transistor T2.

Accordingly, the dual panel type organic light emitting display device also includes an inorganic sealant 236 to sufficiently protect the organic light emitting cell array 215 from the external environment, thereby extending the life of the organic light emitting display device. .

7 is a flowchart schematically illustrating a manufacturing process of a dual panel type organic light emitting display device.

First, a thin film transistor array unit 220 including a thin film transistor, a signal line, and the like is formed on the lower substrate 202. (S22) Then, a region in which the inorganic sealant 236 is positioned on the lower substrate 202 is formed. Two dummy metal patterns 238 are formed. Here, the second dummy metal pattern 238 may be simultaneously formed with a metal pattern such as a gate pattern of the thin film transistor array unit 220.

The thin film transistor array 220 further includes a conductive spacer 270 in contact with the driving thin film transistor T2.

Thereafter, the organic light emitting cell array unit 215 is formed on the separate upper substrate 252. In operation S24, the first dummy metal pattern 237 is located in the region where the inorganic sealant 236 is positioned on the upper substrate 252. ) Is formed. The first dummy metal pattern 237 is simultaneously formed of the same material as the first electrode 204 or the second electrode 212 of the organic light emitting array unit 215.

Thereafter, the organic sealant 226 is coated on the upper substrate 252 or the lower substrate 202 and an inorganic sealant 236 is formed using a soldering process (S26).

Thereafter, as the encapsulation process is performed, the lower substrate 202 and the upper substrate 252 are bonded to each other so that the organic light emitting cell array unit 215 is packaged (S28). Accordingly, the organic light emitting cell array unit 215 is sufficiently protected from moisture and oxygen in the external environment by the organic sealant 126 as well as the inorganic sealant 136.

On the other hand, the organic light emitting display device and the manufacturing method thereof according to the present invention have been described with a limited structure of the active organic EL display device, but the present invention is not limited thereto, but is also used for a passive organic EL display device that does not require a thin film transistor array unit. Can be.

As described above, the organic light emitting display device and the manufacturing method thereof according to the present invention can further protect the organic light emitting cell array from moisture and oxygen from the external environment by further adding an inorganic sealant surrounding the organic sealant. do. Accordingly, damage to the organic light emitting cells in the organic light emitting cell array can be prevented, thereby extending the life of the organic light emitting cell EL. As a result, the lifetime of the organic light emitting display device can also be maximized.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (12)

An organic light emitting cell array having a structure in which organic light emitting cells are arranged in a matrix form; A thin film transistor array unit formed on a first substrate and including driving elements for driving the organic light emitting cell; A second substrate bonded to the first substrate through an organic sealant to package the organic light emitting cell array; And an inorganic sealant positioned between the first and second substrates and spaced apart from the organic sealant by a predetermined distance to surround the organic sealant and to be formed of a soldering material. The method of claim 1, And the organic light emitting cell array unit is formed on the thin film transistor array unit. The method of claim 2, A first dummy metal pattern disposed between the inorganic sealant and the second substrate; And a second dummy metal pattern disposed between the inorganic sealant and the first substrate. The second dummy metal pattern is the same material as any one of the metal thin film patterns included in the thin film transistor array unit. The method of claim 1, And the organic light emitting cell array portion is formed on the second substrate and electrically connected to the thin film transistor array portion through a conductive spacer. The method of claim 4, wherein A first dummy metal pattern disposed between the inorganic sealant and the second substrate and formed of the same material as any one of the metal thin film patterns included in the organic light emitting cell array unit; And a second dummy metal pattern disposed between the inorganic sealant and the first substrate and formed of the same material as any one of the thin film patterns included in the thin film transistor array unit. The method of claim 1, The inorganic sealant includes at least one of lead (Pb) and silver (Ag). Forming a thin film transistor array unit formed on the first substrate and including driving devices for driving the organic light emitting cell; Forming an organic light emitting cell array having a structure in which the organic light emitting cells are arranged in a matrix form; Packaging the organic light emitting cell array by bonding the first and second substrates together using an organic sealant; Bonding the first substrate and the second substrate Manufacturing an organic light emitting display device, the method comprising: soldering an inorganic sealant positioned between the first and second substrates and spaced apart from the organic sealant by a predetermined distance to surround the organic sealant Way. The method of claim 7, wherein And the organic light emitting cell array portion is formed on the thin film transistor array portion. The method of claim 8, Forming a first dummy metal pattern positioned between the inorganic sealant and the second substrate; And forming a second dummy metal pattern formed between the inorganic sealant and the first substrate and made of the same material as any one of the metal thin film patterns included in the thin film transfer array unit. A method of manufacturing an organic light emitting display device. The method of claim 7, wherein And the organic light emitting cell array portion is formed on the second substrate and electrically connected to the thin film transistor array portion through a conductive spacer. The method of claim 10, The forming of the organic light emitting cell array unit may include forming a first dummy metal pattern positioned between the inorganic sealant and the second substrate, the first dummy metal pattern being the same material as any one of the metal thin film patterns included in the organic light emitting cell array unit. Including a step; The forming of the thin film transistor array unit may include forming a second dummy metal pattern disposed between the inorganic sealant and the first substrate and made of the same material as any one of the thin film patterns included in the thin film transistor array unit. A method of manufacturing an organic light emitting display device, characterized in that it further comprises. The method of claim 7, wherein The inorganic sealant is a method of manufacturing an organic light emitting display device, characterized in that it comprises at least one material of lead (Pb) and silver (Ag).

Images