KR20080088627A - Sputtering target, sputtering target material and process for producing these - Google Patents

Abstract

[PROBLEMS] To provide a sputtering target capable of reducing arcing with enhanced effectiveness; a sputtering target material suitable therefor; and a process for producing these. [MEANS FOR SOLVING PROBLEMS] There is provided a sputtering target material having been cut machined in the presence of oil contents, characterized in that the thickness of oil film adhering to the surface of target material before sputtering is 1.5 nm or less. Further, there is provided a sputtering target characterized by including the above sputtering target material and a backing plate. Still further, there are provided a process for producing a sputtering target material, and process for producing a sputtering target, characterized by having the cleaning step of bringing steam into contact with a surface of target material to thereby clean the surface of target material.

Description

Sputtering target, sputtering target material and manufacturing method thereof {SPUTTERING TARGET, SPUTTERING TARGET MATERIAL AND PROCESS FOR PRODUCING THESE}

The present invention relates to a sputtering target, a sputtering target material, and a manufacturing method thereof. More specifically, it relates to the sputtering target which effectively reduced arcing, the sputtering target material suitable for this, and its manufacturing method.

Background Art Conventionally, foreign matters such as grinding powder adhering to the surface of a target material of a sputtering target, in particular, the surface (sputtering surface) provided for the sputtering, are known to be a cause of arcing during sputtering. When the arcing is bundled, a part of the target material melts and scatters in all directions, causing scattering bubbles, called splashes, to adhere onto the substrate or the film formation, thereby lowering the yield of film formation. This is one of the factors of high cost.

Various attempts have been made to remove the grinding powder adhering to the sputtering surface of the target material. For example, the method of sticking an adhesive tape to the sputtering surface of a target material, peeling off, the method of carrying out multiple oscillation ultrasonic cleaning of a target material (refer patent document 1), and the method of spraying water of predetermined pressure on a target material (refer patent document 2). ).

However, from the viewpoint of further improving the production yield of the film formation, the arcing suppression effect of the degree realized by these methods is still not enough, and development of a method for further effectively reducing the occurrence of arcing has been desired.

However, in the blast treatment using the abrasive, the abrasive may adhere to the sputtering surface of the target material, or may cause damage such as minute cracks or scratches, and further contact the target material with the etchant. In the etching treatment, the surface composition of the target material was changed, which may affect the physical properties of the film formed.

By the way, the cutting of the surface of a metal target material or an alloy target material is generally performed by a phrase or a lathe. In this case, since oil, such as cutting oil, is used at the time of cutting, cutting oil remains on the surface of the target material immediately after cutting. Therefore, the surface of the target material is usually wiped with an organic solvent after cutting.

Patent Document 1: Japanese Patent Application Laid-Open No. 11-117062

Patent Document 2: Japanese Patent Application Laid-Open No. 2005-42169

An object of this invention is to provide the sputtering target which can further reduce generation | occurrence | production of arcing, the sputtering target material suitable for this, and its manufacturing method.

MEANS TO SOLVE THE PROBLEM The present inventors carry out the wiping process of the surface of the target material by the organic solvent, and the oil content which remains in trace amounts on the surface of the target material after cutting is one of the factors which generate | occur | produces arcing, and wash | cleans by making steam contact a target material surface. Then, the inventors found that the oil can be effectively removed to further reduce the occurrence of arcing, and the present invention has been completed.

That is, this invention relates to the following matters.

The sputtering target material which concerns on this invention is a sputtering target material by which cutting was performed in presence of oil, The thickness of the oil film adhering to the target material surface before sputtering is 1.5 nm or less.

It is preferable that the said target material is a metal target material or an alloy target material.

Moreover, the sputtering target which concerns on this invention is characterized by including the said sputtering target material and a backing plate.

Moreover, the manufacturing method of the sputtering target material which concerns on this invention, and the manufacturing method of a sputtering target are characterized by having the washing | cleaning process which wash | cleans the said target material surface by making steam contact a surface of a target material.

It is preferable that the said washing | cleaning process is a process of contacting steam of the temperature of 40 degreeC or more for 3 second or more per 100 mm x 100 mm of surfaces of the said target material, and wash | cleaning the said target material surface.

In addition, the steam, preferably, comprises any one of water, an organic solvent, and a mixture thereof.

Moreover, it is preferable that the said target material is a metal target material or alloy target material by which the cutting process was performed in presence of oil.

[effect]

The sputtering target material of this invention is removed as much as possible the oil adhering to the surface, and the thickness of an oil film is reduced. Therefore, according to the sputtering target provided with the said sputtering target material, generation | occurrence | production of the arcing at the time of sputtering can be reduced more effectively, As a result, generation | occurrence | production of splash can be suppressed and the manufacturing yield of film-forming can be improved remarkably. .

Moreover, according to the manufacturing method of the sputtering target material of this invention, even if it is the target material with oil component, the said oil content can be removed as much as possible, and a clean sputtering target material can be obtained. In addition, the cleaning treatment for removing oil content is sufficient only by bringing steam into contact with the target material surface for a short time, and large-scale equipment is unnecessary, so that a high-quality sputtering target material can be produced at low cost and with high production efficiency.

Moreover, according to the manufacturing method of the sputtering target of this invention, even if it is the sputtering target provided with the target material in which the cutting process was carried out in the presence of oil, since the oil adhering to the surface of the said target material can be removed as much as possible, It is possible to provide an excellent sputtering target that can further reduce generation. In addition, the cleaning process for removing oil is sufficient only to bring steam into contact with the surface of the target material for a short time, and large-scale equipment is unnecessary, so that a high-quality sputtering target can be manufactured at low cost and with high production efficiency.

1 is a graph showing the relationship between the thickness of an oil film attached to a target material and the number of arcing occurrences.

EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated concretely.

First, the sputtering target material and sputtering target of this invention are described, Next, the manufacturing method of the sputtering target material of this invention, and the manufacturing method of a sputtering target are described.

<Sputtering target material and sputtering target>

The sputtering target material of this invention is a sputtering target material by which cutting was performed in presence of oil, The thickness of the oil film adhering to the target material surface before sputtering is 1.5 nm or less, It is characterized by the above-mentioned.

According to the findings of the present inventors, even if the surface of the target material subjected to the cutting process performed in the presence of oil such as a phrase or a lathe is subjected to a wiping treatment with an organic solvent, the oil is traced in a small amount. This remainder is formed, and the said oil forms and adheres the oil film about 3.5-4.5 nm in thickness.

As the oil content is removed as much as possible and the thickness of the oil film is made thinner, the number of occurrences of arcing can be reduced, but it is practically difficult to set the thickness to 0 nm, and from the viewpoint of suppressing the splash, the thickness of the oil film is usually 1.5. It may be nm or less, preferably 1.0 nm or less. In addition, the lower limit of the thickness of an oil film is not specifically limited, It exceeds Onm.

In addition, in this invention, the thickness of an oil film means the detection peak position (maximum value) of carbon measured using the glow discharge luminescence analysis (GDS) apparatus.

Particularly problematic among the locations where the oil film is formed is the sputtering surface of the target material, which is actually sputtered, and it is preferable to reduce the thickness of the oil film on the sputtering surface below the above numerical value.

The metal target material or the alloy target material is mentioned as a target material to which the cutting process performed in presence of oil is performed. Since these target materials are generally cut and processed by phrases, lathes, etc., oil remains on the surface, and the oil film is formed.

As a metal target material, Mo, Al, Ti, Ta, Cr, W, Ni, Cu, Ag, Au, Pt, Fe, Co, Mg etc. are mentioned specifically ,. As the alloy target material, specifically, for example, Al-Mg, Al-Ti, Ni-Fe, Ni-Cr, Fe-Co, Fe-Ta, Co-Cr, Co-Cr-Pt, Co- Zr, Co-Pt, Pt-Mn, Ir-Mn, Ti-W, etc. are mentioned. Among these, since the Al target material has a low melting point and relatively easy splash, the effect of the present invention is remarkable.

In addition, the sputtering target of this invention is equipped with the backing plate which is a cooling plate in addition to the said target material, and may further provide the bonding material layer as needed.

Although a backing plate should just be used as a backing plate of a sputtering target normally, the backing plate made from copper and a copper alloy is mentioned at the point with favorable thermal conductivity. Moreover, the shape may also be a well-known thing, and is not specifically limited.

A bonding material can be suitably selected from a well-known bonding material according to the combination of a target material and a backing plate, and can be used as needed. As a bonding material, the bonding material called In solder specifically, In-type alloys, such as In-Sn, In-Pb, In-Ag, In-Zn, In are mentioned, for example. In these, since handling is good, In is widely used and it is mentioned preferably.

In addition, the said sputtering target material and a sputtering target can be manufactured suitably by the manufacturing method of a sputtering target material, and the manufacturing method of a sputtering target which have the following specific cleaning process.

<Method for producing sputtering target material and method for producing sputtering target>

The manufacturing method of the sputtering target material of this invention, and the manufacturing method of a sputtering target are characterized by having the washing | cleaning process which wash | cleans the said target material surface by making steam contact a surface of a target material. Processes other than this washing | cleaning process follow the same process as the manufacturing method and manufacturing conditions of a well-known sputtering target material or sputtering target, and are not specifically limited.

Specifically, for example, the target material may be a vacuum dissolving method in which a raw material is air-melted or vacuum-melted, cast, calcined, and then mechanically ground; A powder metallurgy method in which a raw material powder is sintered and calcined after molding by HP method (hot press method), HIP (hot isostatic press) method, CIP (cold isostatic press) method, or the like; In addition, the raw material may be melted, preformed by spray forming, and then plasticized and manufactured by mechanical grinding.

In the manufacturing method of the sputtering target material of this invention, and the manufacturing method of a sputtering target, the various target materials manufactured by these well-known methods are wash | cleaned in the said washing process.

More specifically, as said target material, metal oxide target materials, such as ITO (Indium-Tin Oxide), a metal target material, an alloy target material, etc. are mentioned. In addition, the specific example of a metal target material and an alloy target material is as having already mentioned.

Among these target materials, if the target material is subjected to cutting in the presence of oil, the effect of the present invention is more clearly exhibited and is preferable. Generally from this viewpoint, the metal target material or alloy target material which cuts are often performed in presence of oil component is mentioned preferably. In addition, among the metal target materials, the Al target material has a low melting point and relatively easy splash, and therefore, the effect of the present invention is easily exhibited remarkably, which is suitable for applying the present invention.

In the manufacturing method of the sputtering target material of this invention, and the manufacturing method of a sputtering target, in the washing | cleaning process, the surface of the said target material is wash | cleaned by making steam contact the surface of the target material of any one of these. Therefore, the manufacturing method of the sputtering target material of this invention, and the manufacturing method of a sputtering target also have a side surface as a washing | cleaning method of an existing target material or sputtering target.

What is necessary is just to generate | occur | produce steam used for the said washing | cleaning process by a well-known method, The method is not specifically limited. For example, the method of generating steam by filling the tank with the liquid used as a raw material of steam, and heating by a normal method in the state of pressurization, normal pressure, or reduced pressure, etc. are mentioned. Can be. In addition to being able to be quickly removed from the target material after being brought into contact with the target material in the state of steam, the liquid serving as the raw material of steam is required to have easy handling, and from that point of view, water and an organic solvent are required. It is preferable to comprise any one of these, and a mixture thereof. Among them, the organic solvents are more preferably contained in terms of dissolving the oil itself and improving the removal efficiency of the oil. In consideration of safety and ease of handling, mixing of the organic solvent and water A solution is more preferable, and the mixed solution of water-soluble organic solvent and water is especially preferable.

As water, the water which passed the refinement | purification process, such as distilled water, ion-exchange water, and purified water, is preferable. As an organic solvent, Water-soluble organic solvents, such as C2-C5 lower alcohols, such as ethanol, propyl alcohol, and isopropyl alcohol, acetone, ethyl acetate; And non-aqueous organic solvents such as toluene, hexane, petroleum benzene and ethylene glycol.

Although the mixing ratio of the organic solvent and water differs depending on the organic solvent used, it is set as the mixed solution below the lower explosion limit. For example, when using ethanol as an organic solvent, what is necessary is just to set it as the aqueous solution of 1-4.3 vol% normally.

The pressure at the time of injecting the generated steam on the target material surface is not particularly limited, and a well-known means capable of achieving the following steam temperatures is appropriately employed in accordance with the balance with the distance from the target material surface to be cleaned. Just do it.

The temperature of the steam at the time of reaching the target material surface to be cleaned is usually room temperature (25 ° C) or more, but the oil is heated to increase its removal effect, further reduce the thickness of the oil film, and effectively generate arcing. From a viewpoint to suppress, 40 degreeC or more is preferable, 60 degreeC or more is more preferable, and 70 degreeC or more is more preferable. The upper limit of the steam temperature at the time of reaching the target material surface as the object to be cleaned is not particularly limited, and is preferably high temperature in view of oil removal efficiency. However, considering the balance between the oil removal efficiency and the cost, it is usually 90 ℃ or less. In addition, the arrival temperature of this steam is calculated | required previously by measuring the temperature of the steam which reaches the point for every predetermined distance from a steam injection port with a thermometer.

The distance between the surface of the target material as the object to be cleaned and the injection port of steam is not particularly limited and may be any distance capable of achieving the above-described steam temperature, but is usually about 20 mm to 200 mm.

Moreover, in this invention, it is preferable to contact the steam of the said temperature continuously for 3 seconds or more normally, preferably 6 seconds or more normally per 100 mm x 100 mm of surfaces of the said target material. Although there is no upper limit in particular in the time which keeps steam contacting, in consideration of the balance of oil removal efficiency and work efficiency, it is normally enough for 60 second or less.

In addition, after the washing step, it is preferable to provide a drying step and to actively remove the droplets condensed by steam cooling from the target material surface from the viewpoint of production efficiency. The drying means in the drying step and the conditions thereof are in accordance with known means and conditions, and are not particularly limited. For example, the use of an air blow, a dryer, etc. which spray compressed air to room temperature or warm it, and inject | pour into the target material which passed through the washing process is mentioned preferably.

In addition, in the manufacturing method of the sputtering target of this invention, the said washing | cleaning process (a washing | cleaning process and a drying process, when providing a drying process) may be performed in all the time points before and behind joining a target material with a backing plate. Among these, when the cleaning step is performed after the bonding, new oil, dust or the like can be prevented from adhering to the surface of the cleaned target material in the bonding step of the target material and the backing plate, which is preferable.

A well-known method can be suitably employ | adopted also about the joining method of a target material and a backing plate. The backing plate should just be used as a backing plate of a sputtering target normally, and the backing plate made from copper and copper alloy is mentioned at the point with favorable thermal conductivity. Moreover, the shape may also be a well-known thing, and is not specifically limited.

Although the bonding of a target material and a backing plate is not specifically limited, A method of bonding through bonding materials, such as In solder, is preferable at the point of cost and productivity. Specifically, the target material before or after cutting is heated to a temperature equal to or higher than the melting point of the In solder, and the molten In solder is applied to the surface to be joined to the backing plate of the target material while maintaining the temperature. It can be bonded by a method such as bonding to a backing plate, leaving it to cool while pressing, and cooling to room temperature.

Hereinafter, although this invention is demonstrated further more concretely based on an Example, this invention is not limited to these Examples.

Example

EXAMPLES 1-7

The sputtering surface after cutting Al target material (5N (99.999%), 590 * 730 * 8tmm, Al target; product made by Sumitomo Kagaku Co., Ltd.) which carried out the phrase processing to the size of φ152.4mm * 8mm Cutting oil was applied to the. Ion exchange water is supplied to a steam generating injection device (Toshiba steam cleaner JQ-25; manufactured by Nippon Densan Shibaura Co., Ltd.) to generate steam, and an accessory gun (steam hose 2 mm integrated type) is supplied to the device. And a nozzle head were mounted, and the generated steam was sprayed from the nozzle head to the sputtering surface of the Al target material under the conditions shown in Table 1 to perform cleaning.

Thereafter, air was jetted to the target material from a distance of 20 cm using an air gun (3 kgf / cm 2) to remove droplets on the surface of the target material. Next, the said target material was dried at 80 degreeC for 4 hours.

The thickness of the oil film remaining on the sputtering surface of the Al target material after drying was measured using a glow discharge luminescence analysis (GDS) device (JY-5000RF; manufactured by Horiba Seisakusho).

Moreover, the Al target material different from what was used for GDS was prepared by the same method and conditions as the above, This Al target material was bonded with the copper backing plate through In solder, and the sputtering target was produced.

Using this sputtering target, sputtering is carried out under the following sputtering conditions, using a μ arcing monitor (manufactured by Landmark Technology Inc.), an arc detection voltage of 100 V, a large arc energy boundary of 50 mJ, and a medium and small arc energy boundary of 10 mJ. Under the condition of, the number of occurrences of arcing for 30 minutes from the start of sputtering was evaluated.

These results are put together in Table 1 and shown.

<Sputtering condition>

Device; DC magnetron sputtering device, exhaust system; Clio Pumps, Rotary Pumps

Reach vacuum degree; 4 × 10 ^-4 ㎩

Sputtering pressure; 0.5 ㎩

Input power; 2㎾

[Examples 8-9]

A 3 vol% ethanol aqueous solution was supplied to the steam generating injector, and steam was injected into the sputtering surface of the target material under the conditions shown in Table 1, except that the same procedure as in Examples 1 to 7 was carried out, and the same evaluation was made.

The results are shown in Table 1.

[Reference Examples 1-2]

Except having sprayed steam on the sputtering surface of a target material on the conditions shown in Table 1, it wash | cleaned like Example 1-7, and evaluated similarly.

The results are shown in Table 1.

Comparative Example 1

After apply | coating cutting oil to the sputtering surface of Al target material, it carried out similarly to Examples 1-7 and evaluated similarly except wiping the target material using toluene without spraying steam.

The results are shown in Table 1.

Comparative Example 2

After applying cutting oil to the sputtering surface of the Al target material, steam was not sprayed, and the same procedure as in Examples 1 to 7 was performed except that 15 ° C. ion-exchanged water was sprayed on the sputtering surface of the target material for 60 seconds without spraying steam. Evaluated the same.

The results are shown in Table 1.

Comparative Example 3

After applying the cutting oil to the sputtering surface of the Al target material, the same as in Examples 1 to 7 except that 15 ° C. ion-exchanged water was sprayed to the sputtering surface of the target material from a distance of 50 mm without spraying steam, at a pressure of 30 MPa. And evaluated similarly.

The results are shown in Table 1.

[Comparative Example 4]

After applying cutting oil to the sputtering surface of the Al target material, the target material was set to 80% of the target material in an ultrasonic cleaner (UT-205S; manufactured by Sharp, maximum output 200 W) using ion-exchanged water without spraying steam. Then, it carried out similarly to Examples 1-7 and performed the same evaluation except having performed the ultrasonic washing process at 35 kPa for 30 minutes.

The results are shown in Table 1.

[Comparative Example 5]

After applying cutting oil to the sputtering surface of the Al target material, the target material was not sprayed with steam, and the target material was 80% at an ultrasonic cleaner (UT-205S; manufactured by Sharp, maximum output 200 W) using 99.5 vol% ethanol aqueous solution. It set to, it carried out similarly to Examples 1-7 except having performed the ultrasonic washing process at 35 kPa for 10 minutes, and evaluated similarly.

The results are shown in Table 1.

Comparative Example 6

After applying cutting oil to the sputtering surface of the Al target material, the target material was not sprayed with steam, and the target material was 80% at an ultrasonic cleaner (UT-205S; manufactured by Sharp, maximum output 200 W) using 99.5 vol% ethanol aqueous solution. It set to, and carried out similarly to Examples 1-7, except having performed the ultrasonic washing process at 35 kPa for 5 minutes, and evaluated similarly.

The results are shown in Table 1.

TABLE 1

Number of arcing occurrences Thickness of the oil film (nm) Cleaning method and condition Example 1 10 1.2 Pure steam cleaning time: 3 seconds Distance: 75 mm Temperature: 55 ° C Example 2 8 0.9 Pure steam cleaning time: 6 seconds Distance: 50 mm Temperature: 65 ° C. Example 3 9 0.8 Pure steam cleaning time: 10 seconds Distance: 50 mm Temperature: 65 ° C. Example 4 6 0.7 Pure steam cleaning time: 15 seconds Distance: 20 mm Temperature: 85 ° C. Example 5 8 0.6 Pure steam cleaning time: 30 seconds Distance: 50 mm Temperature: 65 ° C. Example 6 7 0.4 Pure steam cleaning time: 60 seconds Distance: 30 mm Temperature: 75 ° C Example 7 11 1.1 Pure steam cleaning time: 6 seconds Distance: 100 mm Temperature: 45 ° C Example 8 6 0.5 Ethanol steam cleaning time: 6 seconds Distance: 20 mm Temperature: 85 ° C. Example 9 18 1.5 Ethanol steam cleaning time: 6 seconds Distance: 120 mm Temperature: 40 ° C. Reference Example 1 25 2.0 Pure steam cleaning time: 6 seconds Distance: 150 mm Temperature: 35 ° C. Reference Example 2 60 3.0 Pure steam cleaning time: 6 seconds Distance: 200 mm Temperature: 25 ° C Comparative Example 1 89 4.0 Wiping cleaning with toluene Comparative Example 2 92 4.0 Pure water flowing time: 60 seconds Water temperature: 15 ° C Pressure: 30 MPa Comparative Example 3 58 3.0 Pure high pressure cleaning time: 60 seconds Distance: 50 mm Water temperature: 15 ℃ Pressure: 30 MPa Comparative Example 4 15 1.6 Pure ultrasonic cleaning time: 30 minutes Comparative Example 5 30 1.9 Ethanol Ultrasonic Cleaning Time: 10 minutes Comparative Example 6 34 2.5 Ethanol Ultrasonic Cleaning Time: 10 minutes

* In Table 1, pure water means ion-exchanged water, the time of each steam washing | cleaning means the contact time per 100 mm x 100 mm of target materials, and temperature means the temperature reached of steam.

From Table 1, it turns out that the oil removal effect is high compared with the toluene wiping washing | cleaning of the comparative example 1, when steam is sprayed and wash | cleaned to a target material. In addition, it is understood from Examples 1 to 9 that if the attainment temperature of steam is 40 ° C. or higher, and if the organic solvent is contained in the steam, the oil removal effect is further increased, and thus the effect of suppressing arcing is significantly increased. Can be.

On the other hand, in the flowing water cleaning using ion-exchanged water of Comparative Example 2 and the high-pressure water cleaning of Comparative Example 3, although the treatment was performed for 60 seconds, the oil removal effect was low, and arcing was not effectively suppressed. Able to know.

Moreover, in the ultrasonic washing | cleaning of Comparative Examples 4-6, the removal effect of oil and the suppression effect of an arcing are recognized, but compared with steam washing | cleaning, processing time is long for 5 to 10 minutes and production efficiency falls. In addition, the ultrasonic treatment requires a bath immersed in the target material, it is difficult to clean a large target material, and when an organic solvent is used, a large amount of the organic solvent needs to be supplied to the bath. This is undesirable from a safety and environmental standpoint. On the other hand, steam cleaning only needs to contact steam on the surface of a target material for a short time, and it is not only excellent in production efficiency, but there exists an advantage that a small quantity may be sufficient even when using an organic solvent.

Moreover, based on the data shown in Table 1, when the thickness of the oil film and the number of arcing occurrences which were affixed to the target material were employ | adopted on both axes, and the relationship was investigated, as shown in FIG. 1, the clear correlation was recognized between them. .

Claims (13)

A sputtering target material in which cutting is performed in the presence of oil, wherein the thickness of the oil film adhered to the surface of the target material before sputtering is 1.5 nm or less. The method of claim 1, The sputtering target material, wherein the target material is a metal target material or an alloy target material. A sputtering target provided with the sputtering target material of Claim 1 or 2, and a backing plate. The manufacturing method of the sputtering target material characterized by having a washing | cleaning process which wash | cleans the said target material surface by making steam contact a surface of a target material. The method of claim 4, wherein The said washing process is a process of contacting the steam of the temperature of 40 degreeC or more for 3 second or more per 100 mm x 100 mm of surfaces of the said target material, and wash | cleaning the said target material surface, The manufacturing method of the sputtering target material characterized by the above-mentioned. The method according to claim 4 or 5, The method for producing a sputtering target material, characterized in that the steam comprises any one of water, an organic solvent, and a mixture thereof. The method according to claim 4 or 5, The said target material is a metal target material or an alloy target material by which the cutting process was performed in the presence of oil, The manufacturing method of the sputtering target material characterized by the above-mentioned. The method of claim 6, The said target material is a metal target material or an alloy target material by which the cutting process was performed in the presence of oil, The manufacturing method of the sputtering target material characterized by the above-mentioned. The manufacturing method of the sputtering target characterized by having the washing | cleaning process which wash | cleans the said target material surface by making steam contact a surface of a target material. The method of claim 9, The said cleaning process is a process of contacting steam of the temperature of 40 degreeC or more for 3 second or more per 100 mm x 100 mm of surfaces of the said target material, and wash | cleaning the said target material surface, The manufacturing method of the sputtering target characterized by the above-mentioned. The method according to claim 9 or 10, The method for producing a sputtering target, characterized in that the steam comprises any one of water, an organic solvent, and a mixture thereof. The method according to claim 9 or 10, The said target material is a metal target material or alloy target material by which the cutting process was performed in the presence of oil, The manufacturing method of the sputtering target characterized by the above-mentioned. The method of claim 11, The said target material is a metal target material or alloy target material by which the cutting process was performed in the presence of oil, The manufacturing method of the sputtering target characterized by the above-mentioned.

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