TW200730653A - Spattering target, spattering target member and their manufacturing method - Google Patents

Spattering target, spattering target member and their manufacturing method

Info

Publication number
TW200730653A
TW200730653A TW095141087A TW95141087A TW200730653A TW 200730653 A TW200730653 A TW 200730653A TW 095141087 A TW095141087 A TW 095141087A TW 95141087 A TW95141087 A TW 95141087A TW 200730653 A TW200730653 A TW 200730653A
Authority
TW
Taiwan
Prior art keywords
spattering target
spattering
target member
manufacturing
making
Prior art date
Application number
TW095141087A
Other languages
Chinese (zh)
Inventor
Yutaka Kojima
Kazuo Matsumae
Seigo Katsuragi
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200730653A publication Critical patent/TW200730653A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon

Abstract

This invention provides a spattering target that more effectively reduces the occurrence of arcing, a spattering target member suitable for such spattering target, and a method for making such spattering target. The spattering target member is prepared by cutting under the presence of a oil component such that the spattering target member before spattering has an oil film having a thickness of 1.5nm or less adhered to the surface of the spattering target member. The spattering target comprises the above said spattering target member and a backing plate. The method for making the spattering target member and the spattering target includes a cleaning process of cleaning the surface of the spattering target member by contacting the surface of the spattering target member with steam.
TW095141087A 2006-02-06 2006-11-07 Spattering target, spattering target member and their manufacturing method TW200730653A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006028881 2006-02-06

Publications (1)

Publication Number Publication Date
TW200730653A true TW200730653A (en) 2007-08-16

Family

ID=38344958

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095141087A TW200730653A (en) 2006-02-06 2006-11-07 Spattering target, spattering target member and their manufacturing method

Country Status (5)

Country Link
JP (1) JP5065915B2 (en)
KR (1) KR101032049B1 (en)
CN (1) CN101360844A (en)
TW (1) TW200730653A (en)
WO (1) WO2007091351A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5611886B2 (en) * 2011-04-19 2014-10-22 Jx日鉱日石金属株式会社 Laminated structure and manufacturing method thereof
CN104694887A (en) * 2013-12-09 2015-06-10 财团法人金属工业研究发展中心 Coating equipment
JP5902333B1 (en) * 2015-02-27 2016-04-13 Ｊｘ金属株式会社 Sputtering target and manufacturing method thereof
CN107761064A (en) * 2016-08-15 2018-03-06 合肥江丰电子材料有限公司 The processing method of copper target material
CN110885963B (en) * 2019-10-09 2022-03-04 安泰天龙钨钼科技有限公司 Tungsten-nickel alloy target material and preparation method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6462463A (en) * 1987-09-01 1989-03-08 Seiko Epson Corp Method for cleaning sputtering target
JPH06256984A (en) * 1993-12-21 1994-09-13 Mitsubishi Kasei Corp Washing device for object stained with oil
JP4270971B2 (en) * 2003-07-24 2009-06-03 三井金属鉱業株式会社 Manufacturing method of sputtering target
JP4213611B2 (en) * 2004-03-18 2009-01-21 日鉱金属株式会社 ITO sputtering target

Also Published As

Publication number Publication date
JP5065915B2 (en) 2012-11-07
CN101360844A (en) 2009-02-04
JPWO2007091351A1 (en) 2009-07-02
KR20080088627A (en) 2008-10-02
WO2007091351A1 (en) 2007-08-16
KR101032049B1 (en) 2011-05-02

Similar Documents

Publication Publication Date Title
TW200741022A (en) Pre-conditioning a sputtering target prior to sputtering
TW200730653A (en) Spattering target, spattering target member and their manufacturing method
PL1853652T3 (en) Process for applying a coating onto a surface of a lens substrate
AU2012242671A8 (en) Method of dissolving and/or inhibiting the deposition of scale on a surface of a system
WO2010002679A3 (en) Method of forming a microstructure
BRPI0516121A (en) apparatus and method for ultrasonic processing of laminates
TW200741972A (en) Semiconductor device and method for making the same
WO2007096461A3 (en) Method for producing high-quality surfaces and a product having a high-quality surface
WO2008010901A3 (en) Surface for reduced friction and wear and method of making the same
WO2006089733A3 (en) Method of improving nematode tolerant or resistant plant growth
TW200718556A (en) Preformed liner adhered to a pipe with an adhesive
WO2007033013A3 (en) Enzymatic oil interesterification
WO2006105356A3 (en) Methods of manufacturing bioactive 3-esters of betulinic aldehyde and betulinic acid
WO2008027883A3 (en) Lubricating composition
WO2007140173A3 (en) Methods of maintaining and using a high concentration of dissolved copper on the surface of a useful article
WO2006097611A3 (en) Formation of ultra-thin films that are grafted to electrically-conducting or -semiconducting surfaces
WO2013030503A3 (en) Utensil comprising a non-stick coating having improved properties of adhesion to the support
EP3517656A3 (en) Method and device for plating a recess in a substrate
WO2007109689A3 (en) A method for functionalizing an atomic force microscope tip
PL2089560T3 (en) Sliding mating part in lubricated regime, coated by a thin film
TW200602507A (en) Sputtering target and manufacturing method therefor
WO2007019235A3 (en) Oxide coating for enhancing metal formability
WO2007096709A3 (en) Improved method for on-line removal of corrosive components of transformer oil
WO2009010215A8 (en) Device for adjusting an actuator
WO2008127439A3 (en) Gear material for an enhanced rotorcraft drive system