KR20080083171A - Pipd 종이 및 그로부터 제조된 성분 - Google Patents
Pipd 종이 및 그로부터 제조된 성분 Download PDFInfo
- Publication number
- KR20080083171A KR20080083171A KR1020087017566A KR20087017566A KR20080083171A KR 20080083171 A KR20080083171 A KR 20080083171A KR 1020087017566 A KR1020087017566 A KR 1020087017566A KR 20087017566 A KR20087017566 A KR 20087017566A KR 20080083171 A KR20080083171 A KR 20080083171A
- Authority
- KR
- South Korea
- Prior art keywords
- paper
- pipd
- fibers
- weight
- pulp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H11/00—Pulp or paper, comprising cellulose or lignocellulose fibres of natural origin only
- D21H11/16—Pulp or paper, comprising cellulose or lignocellulose fibres of natural origin only modified by a particular after-treatment
- D21H11/20—Chemically or biochemically modified fibres
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H5/00—Special paper or cardboard not otherwise provided for
- D21H5/12—Special paper or cardboard not otherwise provided for characterised by the use of special fibrous materials
- D21H5/1272—Special paper or cardboard not otherwise provided for characterised by the use of special fibrous materials of fibres which can be physically or chemically modified during or after web formation
- D21H5/1281—Special paper or cardboard not otherwise provided for characterised by the use of special fibrous materials of fibres which can be physically or chemically modified during or after web formation by chemical treatment
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H5/00—Special paper or cardboard not otherwise provided for
- D21H5/12—Special paper or cardboard not otherwise provided for characterised by the use of special fibrous materials
- D21H5/14—Special paper or cardboard not otherwise provided for characterised by the use of special fibrous materials of cellulose fibres only
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0278—Polymeric fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Paper (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US75306005P | 2005-12-21 | 2005-12-21 | |
| US60/753,060 | 2005-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20080083171A true KR20080083171A (ko) | 2008-09-16 |
Family
ID=38218802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020087017566A Ceased KR20080083171A (ko) | 2005-12-21 | 2006-12-19 | Pipd 종이 및 그로부터 제조된 성분 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20090126887A1 (https=) |
| EP (1) | EP1963567B1 (https=) |
| JP (1) | JP2009521624A (https=) |
| KR (1) | KR20080083171A (https=) |
| CN (1) | CN101341292B (https=) |
| DE (1) | DE602006017883D1 (https=) |
| WO (1) | WO2007076364A2 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8118975B2 (en) * | 2007-12-21 | 2012-02-21 | E. I. Du Pont De Nemours And Company | Papers containing fibrids derived from diamino diphenyl sulfone |
| US8114251B2 (en) * | 2007-12-21 | 2012-02-14 | E.I. Du Pont De Nemours And Company | Papers containing fibrids derived from diamino diphenyl sulfone |
| US20100048078A1 (en) * | 2008-08-21 | 2010-02-25 | E. I. Du Pont De Nemours And Company | Folded Core Having a High Compression Modulus and Articles Made from the Same |
| JP2015160321A (ja) * | 2014-02-26 | 2015-09-07 | セイコーエプソン株式会社 | 接着紙及び接着紙の製造方法 |
| JP6402005B2 (ja) * | 2014-11-04 | 2018-10-10 | 太陽ホールディングス株式会社 | 樹脂含有シート、並びに、それを用いた構造体および配線板 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3756908A (en) * | 1971-02-26 | 1973-09-04 | Du Pont | Synthetic paper structures of aromatic polyamides |
| US4472241A (en) * | 1983-06-15 | 1984-09-18 | E. I. Du Pont De Nemours And Company | Co-refining of aramid fibrids and floc |
| US4729921A (en) * | 1984-10-19 | 1988-03-08 | E. I. Du Pont De Nemours And Company | High density para-aramid papers |
| US4698267A (en) * | 1985-09-17 | 1987-10-06 | E. I. Du Pont De Nemours And Company | High density para-aramid papers |
| US5084136A (en) * | 1990-02-28 | 1992-01-28 | E. I. Du Pont De Nemours And Company | Dispersible aramid pulp |
| US5171402A (en) * | 1990-02-28 | 1992-12-15 | E. I. Du Pont De Nemours And Company | Dispersible aramid pulp |
| US5137768A (en) * | 1990-07-16 | 1992-08-11 | E. I. Du Pont De Nemours And Company | High shear modulus aramid honeycomb |
| DE69412250T2 (de) * | 1993-04-28 | 1999-02-11 | Akzo Nobel N.V., Arnheim/Arnhem | Pyridobismidazole enthaltendes rigid-rod-Polymer |
| JPH1072752A (ja) * | 1996-05-15 | 1998-03-17 | Matsushita Electric Ind Co Ltd | プリント配線板用不織布基材とこれを用いたプリプレグ |
| JP3349062B2 (ja) * | 1997-04-08 | 2002-11-20 | 昭和飛行機工業株式会社 | アラミドハニカム |
| US5833807A (en) * | 1997-04-17 | 1998-11-10 | E. I. Du Pont De Nemours And Company | Aramid dispersions and aramid sheets of increased uniformity |
| JP3588423B2 (ja) * | 1999-04-06 | 2004-11-10 | 帝人テクノプロダクツ株式会社 | 耐熱性繊維紙及びその製造方法並びに該耐熱性繊維紙を用いたプリプレグ |
| WO2002100355A1 (en) * | 2001-06-12 | 2002-12-19 | Stick Tech Oy | A prepreg, a composite and their uses |
| DE60229955D1 (de) * | 2001-08-29 | 2009-01-02 | Georgia Tech Res Inst | Zusammensetzungen, welche stäbchenförmige polymere und nanoröhrenförmige strukturen umfassen, sowie verfahren zur herstellung derselben |
| JP4184705B2 (ja) * | 2002-04-26 | 2008-11-19 | 本田技研工業株式会社 | 水素分離膜構造体 |
| US7026033B2 (en) * | 2002-05-02 | 2006-04-11 | Teijin Techno Products Limited | Heat-resistant synthetic fiber sheet |
| JP3711101B2 (ja) * | 2002-10-28 | 2005-10-26 | 阿波製紙株式会社 | パラ系芳香族ポリアミド紙とその製造方法 |
| US20050230072A1 (en) * | 2004-04-16 | 2005-10-20 | Levit Mikhail R | Aramid paper blend |
-
2006
- 2006-12-19 EP EP06840315A patent/EP1963567B1/en not_active Not-in-force
- 2006-12-19 CN CN2006800477512A patent/CN101341292B/zh not_active Expired - Fee Related
- 2006-12-19 WO PCT/US2006/062314 patent/WO2007076364A2/en not_active Ceased
- 2006-12-19 JP JP2008547731A patent/JP2009521624A/ja not_active Ceased
- 2006-12-19 US US12/084,005 patent/US20090126887A1/en not_active Abandoned
- 2006-12-19 KR KR1020087017566A patent/KR20080083171A/ko not_active Ceased
- 2006-12-19 DE DE602006017883T patent/DE602006017883D1/de active Active
Also Published As
| Publication number | Publication date |
|---|---|
| DE602006017883D1 (de) | 2010-12-09 |
| EP1963567A2 (en) | 2008-09-03 |
| WO2007076364A3 (en) | 2007-09-27 |
| JP2009521624A (ja) | 2009-06-04 |
| CN101341292A (zh) | 2009-01-07 |
| US20090126887A1 (en) | 2009-05-21 |
| CN101341292B (zh) | 2011-06-08 |
| EP1963567B1 (en) | 2010-10-27 |
| WO2007076364A2 (en) | 2007-07-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1756360B1 (en) | Aramid paper blend | |
| US20100048078A1 (en) | Folded Core Having a High Compression Modulus and Articles Made from the Same | |
| US20110281080A1 (en) | Folded Core Based on Carbon Fiber Paper and Articles Made from Same | |
| JP2012500735A (ja) | 高圧縮強度を有するハニカムコアおよびそれから製造される物品 | |
| US8444814B2 (en) | Paper comprising PIPD floc and process for making the same | |
| KR20080083171A (ko) | Pipd 종이 및 그로부터 제조된 성분 | |
| KR101426882B1 (ko) | 폴리피리도비스이미다졸 펄프의 제조 방법 | |
| US8137506B2 (en) | Paper comprising PIPD pulp and process for making same | |
| US20110244193A1 (en) | Folded Core Having a High Compression Modulus and Articles Made from the Same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20080718 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20111216 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20130718 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20131023 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20130718 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |