KR20080083171A - Ｐｉｐｄ 종이 및 그로부터 제조된 성분 - Google Patents
Ｐｉｐｄ 종이 및 그로부터 제조된 성분 Download PDFInfo
- Publication number
- KR20080083171A KR20080083171A KR1020087017566A KR20087017566A KR20080083171A KR 20080083171 A KR20080083171 A KR 20080083171A KR 1020087017566 A KR1020087017566 A KR 1020087017566A KR 20087017566 A KR20087017566 A KR 20087017566A KR 20080083171 A KR20080083171 A KR 20080083171A
- Authority
- KR
- South Korea
- Prior art keywords
- paper
- pipd
- fibers
- weight
- pulp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 229920012306 M5 Rigid-Rod Polymer Fiber Polymers 0.000 title claims description 37
- 239000004615 ingredient Substances 0.000 title description 2
- 239000000835 fiber Substances 0.000 claims abstract description 48
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- 239000011230 binding agent Substances 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000005011 phenolic resin Substances 0.000 claims abstract description 12
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 11
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229920000642 polymer Polymers 0.000 claims description 33
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 239000000243 solution Substances 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 14
- 239000000843 powder Substances 0.000 claims description 8
- 238000003490 calendering Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 239000002002 slurry Substances 0.000 claims description 4
- 239000000725 suspension Substances 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims description 3
- 239000000839 emulsion Substances 0.000 claims description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 2
- 239000011231 conductive filler Substances 0.000 claims description 2
- 238000005470 impregnation Methods 0.000 claims description 2
- 239000000049 pigment Substances 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 229920003235 aromatic polyamide Polymers 0.000 description 16
- 239000004760 aramid Substances 0.000 description 9
- 239000006185 dispersion Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 229920000137 polyphosphoric acid Polymers 0.000 description 5
- 239000010902 straw Substances 0.000 description 4
- 238000010998 test method Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 244000144992 flock Species 0.000 description 3
- 229940098779 methanesulfonic acid Drugs 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- OYFRNYNHAZOYNF-UHFFFAOYSA-N 2,5-dihydroxyterephthalic acid Chemical compound OC(=O)C1=CC(O)=C(C(O)=O)C=C1O OYFRNYNHAZOYNF-UHFFFAOYSA-N 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 229920006231 aramid fiber Polymers 0.000 description 2
- 206010061592 cardiac fibrillation Diseases 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000002600 fibrillogenic effect Effects 0.000 description 2
- QZUPTXGVPYNUIT-UHFFFAOYSA-N isophthalamide Chemical compound NC(=O)C1=CC=CC(C(N)=O)=C1 QZUPTXGVPYNUIT-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920006376 polybenzimidazole fiber Polymers 0.000 description 2
- IAYUQKZZQKUOFL-UHFFFAOYSA-N pyridine-2,3,5,6-tetramine Chemical compound NC1=CC(N)=C(N)N=C1N IAYUQKZZQKUOFL-UHFFFAOYSA-N 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229920003261 Durez Polymers 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- 229920003369 Kevlar® 49 Polymers 0.000 description 1
- 239000004693 Polybenzimidazole Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000007900 aqueous suspension Substances 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 210000003793 centrosome Anatomy 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229920006253 high performance fiber Polymers 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- CYVYLVVUKPNYKL-UHFFFAOYSA-N quinoline-2,6-dicarboxylic acid Chemical compound N1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 CYVYLVVUKPNYKL-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H11/00—Pulp or paper, comprising cellulose or lignocellulose fibres of natural origin only
- D21H11/16—Pulp or paper, comprising cellulose or lignocellulose fibres of natural origin only modified by a particular after-treatment
- D21H11/20—Chemically or biochemically modified fibres
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H5/00—Special paper or cardboard not otherwise provided for
- D21H5/12—Special paper or cardboard not otherwise provided for characterised by the use of special fibrous materials
- D21H5/1272—Special paper or cardboard not otherwise provided for characterised by the use of special fibrous materials of fibres which can be physically or chemically modified during or after web formation
- D21H5/1281—Special paper or cardboard not otherwise provided for characterised by the use of special fibrous materials of fibres which can be physically or chemically modified during or after web formation by chemical treatment
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H5/00—Special paper or cardboard not otherwise provided for
- D21H5/12—Special paper or cardboard not otherwise provided for characterised by the use of special fibrous materials
- D21H5/14—Special paper or cardboard not otherwise provided for characterised by the use of special fibrous materials of cellulose fibres only
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0278—Polymeric fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Paper (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US75306005P | 2005-12-21 | 2005-12-21 | |
| US60/753,060 | 2005-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20080083171A true KR20080083171A (ko) | 2008-09-16 |
Family
ID=38218802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020087017566A Ceased KR20080083171A (ko) | 2005-12-21 | 2006-12-19 | Ｐｉｐｄ 종이 및 그로부터 제조된 성분 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20090126887A1 (enExample) |
| EP (1) | EP1963567B1 (enExample) |
| JP (1) | JP2009521624A (enExample) |
| KR (1) | KR20080083171A (enExample) |
| CN (1) | CN101341292B (enExample) |
| DE (1) | DE602006017883D1 (enExample) |
| WO (1) | WO2007076364A2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8118975B2 (en) * | 2007-12-21 | 2012-02-21 | E. I. Du Pont De Nemours And Company | Papers containing fibrids derived from diamino diphenyl sulfone |
| US8114251B2 (en) * | 2007-12-21 | 2012-02-14 | E.I. Du Pont De Nemours And Company | Papers containing fibrids derived from diamino diphenyl sulfone |
| US20100048078A1 (en) * | 2008-08-21 | 2010-02-25 | E. I. Du Pont De Nemours And Company | Folded Core Having a High Compression Modulus and Articles Made from the Same |
| JP2015160321A (ja) * | 2014-02-26 | 2015-09-07 | セイコーエプソン株式会社 | 接着紙及び接着紙の製造方法 |
| JP6402005B2 (ja) * | 2014-11-04 | 2018-10-10 | 太陽ホールディングス株式会社 | 樹脂含有シート、並びに、それを用いた構造体および配線板 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3756908A (en) * | 1971-02-26 | 1973-09-04 | Du Pont | Synthetic paper structures of aromatic polyamides |
| US4472241A (en) * | 1983-06-15 | 1984-09-18 | E. I. Du Pont De Nemours And Company | Co-refining of aramid fibrids and floc |
| US4729921A (en) * | 1984-10-19 | 1988-03-08 | E. I. Du Pont De Nemours And Company | High density para-aramid papers |
| US4698267A (en) * | 1985-09-17 | 1987-10-06 | E. I. Du Pont De Nemours And Company | High density para-aramid papers |
| US5171402A (en) * | 1990-02-28 | 1992-12-15 | E. I. Du Pont De Nemours And Company | Dispersible aramid pulp |
| US5084136A (en) * | 1990-02-28 | 1992-01-28 | E. I. Du Pont De Nemours And Company | Dispersible aramid pulp |
| US5137768A (en) * | 1990-07-16 | 1992-08-11 | E. I. Du Pont De Nemours And Company | High shear modulus aramid honeycomb |
| CN1041208C (zh) * | 1993-04-28 | 1998-12-16 | 阿克佐诺贝尔公司 | 吡啶并双咪唑基刚性棒形聚合物 |
| JPH1072752A (ja) * | 1996-05-15 | 1998-03-17 | Matsushita Electric Ind Co Ltd | プリント配線板用不織布基材とこれを用いたプリプレグ |
| JP3349062B2 (ja) * | 1997-04-08 | 2002-11-20 | 昭和飛行機工業株式会社 | アラミドハニカム |
| US5833807A (en) * | 1997-04-17 | 1998-11-10 | E. I. Du Pont De Nemours And Company | Aramid dispersions and aramid sheets of increased uniformity |
| JP3588423B2 (ja) * | 1999-04-06 | 2004-11-10 | 帝人テクノプロダクツ株式会社 | 耐熱性繊維紙及びその製造方法並びに該耐熱性繊維紙を用いたプリプレグ |
| JP2005502492A (ja) * | 2001-06-12 | 2005-01-27 | スティック テック オサケユイチア | プリプレグ、複合物およびそれらの使用 |
| WO2003020638A1 (en) * | 2001-08-29 | 2003-03-13 | Georgia Tech Research Corporation | Compositions comprising rigid-rod polymers and carbon nanotubes and process for making the same |
| JP4184705B2 (ja) * | 2002-04-26 | 2008-11-19 | 本田技研工業株式会社 | 水素分離膜構造体 |
| AU2003235945A1 (en) * | 2002-05-02 | 2003-11-17 | Teijin Techno Products Limited | Heat-resistant synthetic fiber sheet |
| JP3711101B2 (ja) * | 2002-10-28 | 2005-10-26 | 阿波製紙株式会社 | パラ系芳香族ポリアミド紙とその製造方法 |
| US20050230072A1 (en) * | 2004-04-16 | 2005-10-20 | Levit Mikhail R | Aramid paper blend |
-
2006
- 2006-12-19 EP EP06840315A patent/EP1963567B1/en not_active Not-in-force
- 2006-12-19 KR KR1020087017566A patent/KR20080083171A/ko not_active Ceased
- 2006-12-19 JP JP2008547731A patent/JP2009521624A/ja not_active Ceased
- 2006-12-19 DE DE602006017883T patent/DE602006017883D1/de active Active
- 2006-12-19 CN CN2006800477512A patent/CN101341292B/zh not_active Expired - Fee Related
- 2006-12-19 US US12/084,005 patent/US20090126887A1/en not_active Abandoned
- 2006-12-19 WO PCT/US2006/062314 patent/WO2007076364A2/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| CN101341292B (zh) | 2011-06-08 |
| WO2007076364A2 (en) | 2007-07-05 |
| EP1963567A2 (en) | 2008-09-03 |
| US20090126887A1 (en) | 2009-05-21 |
| CN101341292A (zh) | 2009-01-07 |
| WO2007076364A3 (en) | 2007-09-27 |
| EP1963567B1 (en) | 2010-10-27 |
| DE602006017883D1 (de) | 2010-12-09 |
| JP2009521624A (ja) | 2009-06-04 |
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| US8444814B2 (en) | Paper comprising PIPD floc and process for making the same | |
| KR20080083171A (ko) | Ｐｉｐｄ 종이 및 그로부터 제조된 성분 | |
| KR101426882B1 (ko) | 폴리피리도비스이미다졸 펄프의 제조 방법 | |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20080718 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20111216 Comment text: Request for Examination of Application |
|
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20130718 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20131023 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20130718 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |