KR20080076681A - Picker for transfer tool and transfer tool having same - Google Patents

Abstract

A picker for a transfer tool and a transfer tool having the same are provided to minimize a space for installing the picker by utilizing a single pneumatic cylinder. A picker for a transfer tool includes a picker main body(100), an absorption load(200), an elastic member(310), and a pneumatic cylinder(300). The picker main body is coupled with a couple module for moving a picker. The absorption load movably formed at the picker main body includes a vertical vacuum path therein, an absorption head for absorbing semiconductor devices at a low portion thereof, and a pneumatic connector connected to a vacuum generator for generating vacuum pressure used for absorbing the semiconductor devices by the absorption head. The elastic member maintains a moved state of the absorption head by applying elastic force on the absorption head to a lower direction. The pneumatic cylinder implemented at the picker main body moves the absorption head to an upper direction through the vacuum pressure.

Description

Picker of transfer tool and transfer tool having it {Picker for transfer tool and transfer tool having same}

1 is a perspective view showing a picker of the transfer tool according to the present invention.

2 is an exploded perspective view showing a picker of the transfer tool of FIG.

3 is a cross-sectional view showing a cross section of the picker of the transfer tool of FIG.

4 is an operation view showing a state in which the adsorption head of the picker of the transfer tool of FIG. 1 is moved upward by adsorbing the semiconductor device.

Figure 5 is an exploded perspective view showing a picker of the transfer tool according to a second embodiment of the present invention.

6 is a cross-sectional view showing a picker of the transfer tool of FIG.

FIG. 7 is a cross-sectional view illustrating a state in which the picker of the transfer tool of FIG. 6 is moved downward to adsorb a semiconductor device.

***** Explanation of symbols for main parts of drawing *****

100, 400: Picker body

200, 500: adsorption rod 220, 520: adsorption head

300, 600: pneumatic cylinder 310, 710: elastic member

The present invention relates to a transfer tool, and more particularly, to a picker of a transfer tool and a transfer tool having the transfer target to pick up the transfer target such that a transfer target such as a semiconductor device can be transferred to another place.

In general, semiconductor devices completed up to the package process are subjected to various tests such as burn-in tests for reliability tests due to external thermal factors, and tests for electrical characteristics such as direct current (DC) characteristics. Are classified.

In the inspection and classification of the semiconductor device as described above, after the plurality of semiconductor devices are stacked on the tray and / or the board, the tray is sequentially transported to perform the inspection and classification.

Meanwhile, semiconductor devices loaded on a tray and / or a board are picked up by a transfer tool to a socket, a tray, a board, and the like of the inspection apparatus for sorting or inspection.

In addition, a conventional transfer tool for picking up a semiconductor device generally includes a suction rod having a suction head for adsorbing an upper surface of the semiconductor device by forming a vacuum pressure at an end thereof, and a pneumatic cylinder portion for moving the suction rod up and down. .

At this time, the pneumatic cylinder is connected to the air supply pipe for supplying air is formed to move the suction rod up or down by the supply of air.

On the other hand, the transfer tool as described above is configured to transfer several semiconductor devices at once by setting a set of two, four, eight, etc., the number and arrangement of pickers constituting the transfer tool that can be combined according to the structure Is determined.

In particular, since the number of semiconductor devices to be transferred is determined according to the number and arrangement of pickers of the transfer tool forming the set as described above, the structure of the picker of the transfer tool is large in the performance of the classification or inspection apparatus of the semiconductor device using the transfer tool. Will be affected.

In addition, the adsorption head constituting the picker of the transfer tool for transporting the semiconductor device comes into contact with the semiconductor device, and the pressure applied to the semiconductor device by the adsorption head may damage the semiconductor device and damage or deform the lead. There is this.

In addition, the height of the semiconductor device for movement may vary depending on the type, there is a problem that a separate picker of the transfer tool for the transfer according to the height of the semiconductor device.

SUMMARY OF THE INVENTION An object of the present invention is to provide a transfer tool having a structure capable of forming a large number of pickers constituting the transfer tool in view of the above points.

Another object of the present invention is to provide a picker of a transfer tool that can minimize the pressure applied to the semiconductor device when transferring the semiconductor device.

It is still another object of the present invention to provide a picker of a transfer tool capable of transferring a semiconductor device without being limited by the height of the semiconductor device.

The present invention has been created to achieve the object of the present invention as described above, the present invention includes a picker body coupled to the moving module for moving the picker; The picker body is installed to be movable up and down, and a vacuum pipe penetrating up and down is formed therein, and an adsorption head for adsorbing a semiconductor device is formed at a lower end thereof, and an adsorption head is provided with a vacuum pressure for adsorbing a semiconductor device at an upper end thereof. An adsorption rod having a pneumatic connection portion connected to the vacuum pressure generating device; An elastic member for applying an elastic force to the lower side with respect to the adsorption rod to maintain the state moved downward with respect to the picker body; The picker of the transfer tool is installed on the picker body and includes a pneumatic cylinder for moving the suction rod upward with respect to the picker body by pneumatic pressure.

The picker body may be formed with one or more guide holes to prevent rotation while the adsorption rod is moved up and down.

The guide hole may form a polygonal shape, and the suction rod may be configured such that a portion moving along the guide hole forms a polygonal shape.

The elastic member may be installed at a lower side of the picker body and may be configured as a coil spring into which the suction rod is fitted.

The picker body includes a first body portion; It may be configured to include a second body portion coupled to the first body portion and the pneumatic cylinder portion installed therein.

The pneumatic cylinder portion is movably inserted into the cylinder space formed to be open to the second body portion to the upper side and coupled to the adsorption rod on the top includes a piston tube for moving the adsorption rod by the movement, the piston The pipe is formed at the lower end of the air discharge port is discharged and the upper end is connected to the air supply pipe for supplying air to the air outlet and the outer circumferential surface to block the air discharged to the air outlet is discharged to the outside of the cylinder space A sealing part may be formed to move the piston tube upward by the pressure of the air supplied through the air discharge port.

The first body portion may be formed with support protrusions on the upper and lower sides, respectively, so that the upper and lower ends of the second body are fitted.

The present invention also discloses a transfer tool, characterized in that it comprises at least one picker having the above configuration, and a moving module for moving the picker in combination with the picker.

The present invention also includes a picker body coupled to the moving module for moving the picker; The picker body is installed to be movable up and down, and a vacuum pipe penetrating up and down is formed therein, and an adsorption head for adsorbing a semiconductor device is formed at a lower end thereof, and an adsorption head is provided with a vacuum pressure for adsorbing a semiconductor device at an upper end thereof. An adsorption rod having a pneumatic connection portion connected to the vacuum pressure generating device; An elastic member for applying an elastic force to the lower side with respect to the adsorption rod to maintain the state moved downward with respect to the picker body; The picker of the transfer tool is installed on the picker body and includes a pneumatic cylinder for moving the suction rod up and down with respect to the picker body by pneumatic pressure.

The pneumatic cylinder unit may be configured to have two pneumatic chambers, the pneumatic cylinder unit is installed in parallel to each other on the picker body and the first guide shaft and the second guide shaft, each having a conduit therein, and the first guide A first pneumatic chamber coupled to the shaft and the second guide shaft so as to be movable upward and downward, and connected to a conduit of the first guide shaft, and divided into two chamber spaces by a sealing part coupled to the second guide shaft. And each of the chamber spaces includes a cylinder body in which a second pneumatic chamber is connected to the conduit of the second guide shaft and the first pneumatic chamber, and the suction rod is movable up and down on one side of the cylinder body. Can be installed.

The cylinder body may be formed with one or more guide holes to which the adsorption rod is coupled to prevent rotation of the adsorption rod.

The guide hole is formed in a polygonal shape, the adsorption rod may be configured such that the portion moving along the guide hole in a polygonal shape, the elastic member is installed on the lower side of the picker body and the coil spring is fitted It may be configured as.

Hereinafter, with reference to the accompanying drawings with respect to the picker of the transfer tool according to the present invention will be described in detail.

1 is a perspective view showing a picker of the transfer tool according to the invention, Figure 2 is an exploded perspective view showing a picker of the transfer tool of Figure 1, Figure 3 is a cross-sectional view showing a cross section of the picker of the transfer tool of Figure 1, 4 is an operation diagram showing a state in which the adsorption head of the picker of the transfer tool of FIG. 1 is moved upward by adsorbing the semiconductor device.

The transfer tool according to the present invention is coupled to a moving module to move by a control of a control unit (not shown) and the moving module to be moved by the movement of the moving module, and picks up the semiconductor device 1 to another place. And one or more pickers for loading the picked-up semiconductor device 1.

The moving module includes a mounting unit to which one or more pickers are mounted, and includes a moving device for moving the mounting unit in the X direction or the Y direction, or the X-Y direction.

The picker, as shown in Figures 1 to 3, the picker body (100); An adsorption rod 200 installed on the picker body 100 so as to be movable up and down, an elastic member 310 that applies an elastic force downward to the adsorption rod 200, and a pneumatic cylinder for moving the adsorption rod 200 upwards. It is configured to include a portion (300).

1 and 2, the picker body 100 is installed to allow the suction rod 200 to move up and down while one side is coupled to the moving module by screws or the like by screwing.

The picker body 100 may be composed of one member, or as shown in FIGS. 1 and 2, the first body part 110 and the first body part in which the suction rod 200 is movably installed. It may be composed of a plurality of members, such as a fixed coupling 110 and a second body portion 120 is installed inside the pneumatic cylinder portion 300 is installed. At this time, the second body portion 120 coupled to the moving module may be formed with a screw hole 121 for coupling with the moving module.

On the other hand, the picker body 100, that is, the first body portion 110 may be formed with one or more guide holes 111 to prevent the rotation while the adsorption rod 200 is moved up and down.

The guide hole 111 may have various structures in cross section, and may be formed to form a polygonal shape such as a quadrangle so as to prevent rotation of the adsorption rod 200 to be inserted. At this time, the adsorption rod 200 forms a polygonal shape in which the portion 211 moving along the guide hole 111 corresponds to the cross-sectional shape of the guide hole 111. Here, the shape of the inner circumferential surface of the guide hole 635 and the shape of the outer circumferential surface of the adsorption rod 200 may be any shape to prevent fire of the adsorption rod 200.

Since the first body part 110 and the second body part 120 may have a relative behavior in the vertical direction, the first body 110 and the second body 120 may be coupled to each other to prevent the relative behavior in the vertical direction. The support protrusions 112 and 113 may be formed at the upper and lower sides of the 110, respectively, such that the upper and lower ends of the second body 120 are fitted to each other.

The adsorption rod 200 is installed to be moved up and down on the picker body 100 and a vacuum tube 210 penetrating up and down is formed therein.

An adsorption head 220 for adsorbing the semiconductor device 1 may be formed at a lower end of the adsorption rod 200 or may be combined as a separate member. At the upper end of the adsorption rod 200, a vacuum pressure generator for generating a vacuum pressure for the adsorption head 220 to adsorb the semiconductor device 1 and a pneumatic connection unit 230 connected by a pneumatic transfer tube are formed or separately. It can be combined as an absence of.

The elastic member 310 may be configured to maintain a state moved downward with respect to the picker body 100 by applying an elastic force to the lower side, that is to the semiconductor device 1 side with respect to the adsorption rod 200. In addition, the elastic member 310 may be installed to apply an elastic force to the opposite side of the semiconductor device (1).

The elastic member 310 is installed on the lower side of the picker body 100 and may be composed of a coil spring to which the adsorption rod 200 is fitted. At this time, the coil of the elastic member 310 is formed on the outer circumferential surface of the adsorption rod 200. Protruding jaw 241 may be formed to support the spring.

The pneumatic cylinder unit 300 is installed in the picker body 100 and is configured to move the suction rod 200 upward with respect to the picker body 100 by pneumatic pressure.

The pneumatic cylinder part 300 is inserted into the cylinder space 123 formed to be open to the second body portion 120 to the upper side and is coupled to the adsorption rod 200 on the upper side of the adsorption rod 200 by the movement. It is configured to include a piston tube 320 to move).

The piston pipe 320 penetrates up and down to form a pipe 321 and an air outlet 322 is formed at the bottom to discharge air into the cylinder space 123, and the air is supplied to the air outlet 321 at the top. It is connected to the air supply pipe (not shown).

And the outer circumferential surface of the piston tube 320 blocks the air discharged to the air outlet 321 is discharged to the outside of the cylinder space 123 by the pressure of the air supplied through the air outlet 321 the piston pipe A sealing unit 324 may be formed to move the 320 upward.

As shown in FIG. 3, the sealing part 324 may be configured as an annular protrusion protruding from the outside, and around the sealing part 324 while reducing friction with an inner wall of the cylinder space 123. A separate sealing member may be additionally installed to maintain the sealing state.

At the upper end of the cylinder space 123, a guide ring 325 is inserted into which the piston tube 320 is inserted to prevent the piston tube 320 from moving outward while preventing the piston tube 320 from being pushed outward. Can be combined. At this time, the side wall of the second body portion 120 is smoothly discharged in the upper cylinder space 123 of the cylinder space 123 partitioned by the sealing portion 324 due to the installation of the guide ring 325. Through holes (not shown) may be formed.

The piston tube 320 is connected by the connecting member 330 so that the shangdong of the piston tube 320 is transmitted to the adsorption rod 200.

Referring to the operation of the picker of the transfer tool having the configuration as described above in detail as follows.

The picker of the transfer tool is moved above the semiconductor device 1 for pickup by the transfer module. At this time, the picker of the transfer tool is in the state in which the suction rod 200 is moved upward. In this case, of course, the semiconductor device 1 is not adsorbed in FIG.

Here, the pneumatic cylinder unit 300 maintains a state in which air is injected into the cylinder space 123 through the air outlet 321 of the piston tube 320 to maintain the state in which the adsorption rod 200 is moved upward. do.

When the picker of the transfer tool is transferred to the upper side of the semiconductor device 1 to be transferred, the pneumatic cylinder unit 300 stops the air injection through the air outlet 321, so that the elastic force of the elastic member 310 is applied to the suction rod. 200 moves to the lower side, that is, the upper side of the semiconductor device 1.

Here, the semiconductor device 1 is held in a tray, a socket, etc., but the suction rod 200 moves downward so that the suction head 220 contacts the semiconductor device 1. In this case, the semiconductor device 1 may have a small deformation in the lead due to the contact force of the adsorption head 220. Instead of using pneumatic pressure that is difficult to control the contact force, such as a coil spring that is relatively easy to control the contact force. By using the elastic member it is possible to prevent the minute deformation of the lead.

Meanwhile, as the adsorption rod is moved to the upper side of the semiconductor device 1, air is sucked into the adsorption head 220 through the pneumatic connection 230 coupled to the adsorption rod 200. Inhalation vacuum pressure is generated.

The vacuum pressure generated under the adsorption head 220 is in a state in which the semiconductor device 1 is lifted up and adsorbed onto the adsorption head 220 to be picked up.

At this time, the pneumatic cylinder unit 300 injects air into the cylinder space 123 through the air outlet 321 of the piston tube 320, whereby the adsorption rod 200 is moved upwards, as shown in FIG. As described above, the semiconductor device 1 is moved upward in the adsorbed state.

When the semiconductor device is moved upward in the state of being adsorbed, the moving module moves to the position to which the adsorbed semiconductor device is to be transferred according to the control signal.

As described above, the picker of the transfer tool according to the present invention significantly reduces the space occupied by the pneumatic cylinder by using a single pneumatic cylinder, thereby minimizing the pitch interval between pickers, thereby providing a transfer tool having a larger number of pickers. It can be provided.

On the other hand, the technical feature of the present invention is to minimize the impact force applied to the upper surface of the semiconductor device when the picker of the transfer tool approaches the upper surface of the semiconductor device to adsorb the semiconductor device is used two or more, in particular two pneumatic cylinders It can be applied to double acting cylinder.

5 is an exploded perspective view showing a picker of a transfer tool according to a second embodiment of the present invention, FIG. 6 is a cross-sectional view illustrating a picker of the transfer tool of FIG. 5, and FIG. 7 is a semiconductor device of the picker of the transfer tool of FIG. 6. It is a cross-sectional view showing a state moved to the lower side to adsorb.

Pickers of the transfer tool according to the second embodiment of the present invention as shown in Figures 5 to 7, the picker body 400 coupled to the moving module for moving the picker, and the picker body 400 up and down It is installed to be movable and a vacuum pipe 510 penetrating up and down is formed therein, and an adsorption head 520 for adsorbing the semiconductor device 1 is formed at the lower end, and an adsorption head 520 is formed at the upper end of the semiconductor device 1. An adsorption rod 500 having a pneumatic connection part 530 connected to a vacuum pressure generator (not shown) for generating a vacuum pressure for adsorbing); An elastic member 710 for applying an elastic force downward to the suction rod 500 to maintain the state moved downward relative to the picker body 400; It may be configured to include a pneumatic cylinder unit 600 installed on the picker body 400 to move the suction rod 500 up and down with respect to the picker body 400 by pneumatic pressure.

The picker body 400 may have various shapes and structures as a member detachably coupled to the moving module, and at least one screw hole 401 may be formed at one side for coupling with the moving module. .

The adsorption rod 500 is installed to be movable up and down with respect to the picker body 100, and a vacuum tube path 510 penetrating up and down is formed therein.

An adsorption head 520 for adsorbing the semiconductor device 1 may be formed at a lower end of the adsorption rod 500 or may be combined as a separate member. At the upper end of the adsorption rod 500, a vacuum pressure generator for generating a vacuum pressure for the adsorption head 520 to adsorb the semiconductor device 1 and a pneumatic connection part 530 connected by a pneumatic transfer tube are formed or separately. It can be combined as an absence of.

Meanwhile, the elastic member 710 may be configured to maintain a state in which the elastic member 710 is moved downward with respect to the picker body 400 by applying an elastic force to the lower side, that is, the semiconductor device 1 side. In addition, the elastic member 710 may be installed to apply an elastic force to the opposite side of the semiconductor device (1).

The elastic member 710 may be installed on the upper side or the lower side of the adsorption rod 500, it may be composed of a coil spring to which the adsorption rod 500 is fitted, the elastic member on the outer peripheral surface of the adsorption rod 250 Protruding jaw 541 may be formed to support the coil spring (710).

Meanwhile, the pneumatic cylinder unit 600 is coupled to the adsorption rod 500 to move the adsorption rod up and down. Various configurations are possible, and may be configured to have two pneumatic chambers.

That is, the pneumatic cylinder part 600 is installed in parallel to each other in the picker body 400, as shown in Figs. 6 and 7, the first guide shaft 610 in which the conduits 611 and 612 are formed, respectively. And a pipe 611 and a second guide shaft of the first guide shaft 610 coupled to the second guide shaft 620 to be movable up and down with the first guide shaft 610 and the second guide shaft 620. A cylinder body 630 having a first pneumatic chamber 631 and a second pneumatic chamber 632 connected to the conduit 621 of 610 may be formed.

The first guide shaft 610 and the second guide shaft 620 are fixedly coupled to one or more coupling holes 403 formed in the picker body 400 by screwing, the first guide shaft 610 and Pipe lines 611 and 621 formed on the second guide shaft 620 are connected to the pneumatic transmission device by pneumatic transfer tubes, respectively. Here, reference numeral 404 denotes a fixing member for fixing the first guide shaft 610 and the second guide shaft 620 to the picker body 400.

On the other hand, one side of the cylinder body 630 is installed so that the adsorption rod 500 is movable up and down, one or more guide holes to which the adsorption rod 500 is coupled to prevent the coupling and the rotation of the adsorption rod 500 ( 635 may be formed.

At this time, the guide hole 635 is formed in a polygonal shape to prevent the rotation of the adsorption rod 500, the adsorption rod 500 may be formed in a square, polygonal shape that moves along the guide hole 635. Here, the shape of the inner circumferential surface of the guide hole 635 and the shape of the outer circumferential surface of the adsorption rod 500 may be any shape to prevent fire of the adsorption rod 500.

The cylinder body 630 is composed of one or more members to form a first pneumatic chamber 631 and a second pneumatic chamber 632.

A first guide shaft 610 and a second guide shaft 620 are inserted into the first pneumatic chamber 631 and the second pneumatic chamber 632, respectively, and the first pneumatic chamber 631 is a first guide shaft. It is connected to the pipeline 611 of 610, the second pneumatic chamber 632 is divided into two chamber spaces (632a, 632b) by a sealing portion 612 coupled to the second guide shaft 620 Each of the chamber spaces 632a and 632b is connected to the conduit 621 and the first pneumatic chamber 631 of the second guide shaft 620 by a connection flow path 633.

At this time, the first pneumatic chamber 631 and the second pneumatic chamber 632 are each sealed by a sealing member 645 installed up and down, the first guide shaft 610 in the sealing member 635 in a sealed state And a first guide shaft 610 and a second guide shaft 620 so as to be movable up and down along the second guide shaft 620.

The sealing part 612 is a protrusion 612b coupled to or protruding from the second guide shaft 620 so as to partition the second pneumatic chamber 632 into two chamber spaces 632a and 632b up and down, and a protrusion ( It may be configured to include a sealing member 612a installed in the 612b to isolate the two chamber spaces 632a and 632b from each other.

Referring to the operation of the picker of the transfer tool according to the second embodiment of the present invention having the above configuration in detail as follows.

The picker of the transfer tool is moved to a predetermined position under the control of a controller (not shown) to a position of a semiconductor device to be picked up (transferred in a picked up state) in a state of being coupled to a moving module. At this time, the adsorption rod 500 of the picker is located at the uppermost side, as shown in FIG.

When the picker of the transfer tool coupled to the moving module is positioned above the semiconductor device 1 corresponding to each picker, the pneumatic cylinder unit 600 moves the suction rod 500 under the control of the control unit, that is, the semiconductor device ( Move to the upper side of 1).

The suction rod 500 moves downward to come into contact with the upper surface of the semiconductor device 1. In this case, when the height of the semiconductor device 1 is changed or when the loaded state is incomplete, the upper surface of the semiconductor device 1 may be positioned higher than when the suction rod 500 is moved to the lowermost side.

However, since the adsorption rod 500 is installed on the pickup body 400 to move up and down, the adsorption rod 500 is connected to the pneumatic cylinder unit 600 even after contact with the upper surface of the semiconductor device 1. Since the suction rod 500 is moved up and down by the pickup main body 400 even if it is moved further downward than the upper surface of (1), the suction rod 500 is no longer lowered.

On the other hand, the suction rod 500 is maintained in contact with the upper surface of the semiconductor device 1 by the elastic member 710 to apply an elastic force in the downward direction, so that when the vacuum pressure is generated in the vacuum tube 510, the semiconductor device 1 is naturally adsorbed by the adsorption head 520 of the adsorption rod 500. In this case, the contact force applied to the semiconductor device 1 may be optimized by adjusting the elastic modulus of the elastic member 710.

When the semiconductor device 1 is adsorbed by the adsorption rod 500, the pneumatic cylinder unit 600 moves the adsorption rod 500 upward and is moved to the position where the semiconductor device 1 is to be transferred by the moving module.

Meanwhile, the operation of the pneumatic cylinder unit 600 will be described in more detail as follows.

When the suction rod 500 is moved from the upper side to the lower side, as shown in FIG. 6, pneumatic pressure is transmitted to the first pneumatic chamber 631 through the conduit 611 of the first guide shaft 610.

When the pneumatic pressure is delivered to the first pneumatic chamber 631, the pneumatic pressure is transferred to the chamber space 632b of the second pneumatic chamber 622 located below by the connecting passage 633 to expand and the cylinder body 630 is picker. The body 400 moves downward, and as a result, the adsorption rod 500 coupled to the cylinder body 630 also moves downward.

In contrast, when the adsorption rod 500 is moved from the lower side to the upper side, as shown in FIG. 7, the chamber of the second pneumatic chamber 632 located at the upper side through the conduit 621 of the second guide shaft 620. Pneumatic pressure is transmitted to the space 632a, and the chamber space 632a of the second pneumatic chamber 632 is expanded by pneumatic pressure so that the cylinder body 630 moves upward with respect to the picker body 400, and as a result, As a result, the adsorption rod 500 coupled to the cylinder body 630 is also moved upward.

Although the preferred embodiments of the present invention have been described above by way of example, the scope of the present invention is not limited to these specific embodiments, and may be appropriately changed within the scope described in the claims.

The picker of the transfer tool according to the present invention has an advantage of significantly reducing the space occupied by the pneumatic cylinder by using a single pneumatic cylinder, thereby minimizing the space for installing the picker.

In addition, the picker of the transfer tool according to the present invention has the advantage of providing a transfer tool having a large number of pickers by minimizing the installation space occupied by each picker by having a single pneumatic cylinder. In particular, by minimizing the interval between the pickers, it is possible to adjust the interval between each picker to be used regardless of the device having a different standard.

In addition, the picker of the transfer tool according to the present invention has an advantage of minimizing the contact force of the adsorption head when picking up the semiconductor device, thereby preventing damage or deformation of the lead due to impact of the semiconductor device due to the contact force of the adsorption head.

In addition, the picker of the transfer tool according to the present invention allows the adsorption head to move upward by the contact of the semiconductor device when the semiconductor device contacts the upper surface of the semiconductor device to pick up the semiconductor device, regardless of the difference in the height of the semiconductor device. There is an advantage of transferring the device.

Claims (14)

A picker body coupled to the moving module for moving the picker; The picker body is installed to be movable up and down, and a vacuum pipe penetrating up and down is formed therein, and an adsorption head for adsorbing a semiconductor device is formed at a lower end thereof, and an adsorption head is provided with a vacuum pressure for adsorbing a semiconductor device at an upper end thereof. An adsorption rod having a pneumatic connection portion connected to the vacuum pressure generating device; An elastic member for applying an elastic force to the lower side with respect to the adsorption rod to maintain the state moved downward with respect to the picker body; Picker of the transfer tool is installed on the picker body and comprises a pneumatic cylinder for moving the suction rod upward with respect to the picker body by pneumatic. The method of claim 1, The picker body is a picker of the transfer tool, characterized in that the adsorption rod is moved up and down is formed with one or more guide holes to prevent rotation. The method of claim 2, The guide hole forms a polygonal shape, The adsorption rod picker of the transfer tool, characterized in that the portion moving along the guide hole to form a polygonal shape. The method of claim 1, The elastic member is a picker of the transfer tool, characterized in that the coil spring is installed on the lower side of the picker body and the suction rod is fitted. The method of claim 1, The picker body A first body portion; Picker of the transfer tool coupled to the first body portion, characterized in that it comprises a second body portion is installed inside the pneumatic cylinder. The method of claim 5, The pneumatic cylinder portion A piston tube movably inserted into a cylinder space formed to be opened upward to the second body part and coupled to the suction rod at an upper end thereof to move the suction rod by the movement; The piston pipe is formed with an air outlet through which air is discharged from the lower end, and an upper end is connected with an air supply pipe for supplying air to the air outlet. Picker of the transfer tool characterized in that the sealing portion for moving the piston pipe upward by the pressure of the air supplied through the air outlet is formed. The method of claim 5, The first body portion picker of the transfer tool, characterized in that the support protrusions are formed on the upper and lower sides, respectively, so that the upper and lower ends of the second body are fitted. At least one picker according to claim 1, And a transfer module coupled to the picker to move the picker. A picker body coupled to the moving module for moving the picker; The picker body is installed to be movable up and down, and a vacuum pipe penetrating up and down is formed therein, and an adsorption head for adsorbing a semiconductor device is formed at a lower end thereof, and an adsorption head is provided with a vacuum pressure for adsorbing a semiconductor device at an upper end thereof. An adsorption rod having a pneumatic connection portion connected to the vacuum pressure generating device; An elastic member for applying an elastic force to the lower side with respect to the adsorption rod to maintain the state moved downward with respect to the picker body; Picker of the transfer tool is installed on the picker body and comprises a pneumatic cylinder for moving the suction rod up and down with respect to the picker body by pneumatic pressure. The method of claim 9, The pneumatic cylinder portion picker of the transfer tool, characterized in that it has two pneumatic chambers. The method of claim 10, The pneumatic cylinder portion A first guide shaft and a second guide shaft installed in the picker body in parallel with each other and having a pipe line therein; A first pneumatic chamber coupled to the first guide shaft and the second guide shaft so as to be movable upward and downward, and connected to a conduit of the first guide shaft, and two sealing parts coupled to the second guide shaft. A cylinder body partitioned into a chamber space and each chamber space having a second pneumatic chamber connected with a conduit of the second guide shaft and the first pneumatic chamber, Picker of the transfer tool, characterized in that the suction rod is installed on one side of the cylinder body to move up and down. The method according to any one of claims 9 to 11, Picker of the transfer tool is characterized in that the cylinder body is formed with one or more guide holes coupled to the adsorption rod to prevent rotation of the adsorption rod. The method of claim 12, The guide hole forms a polygonal shape, The adsorption rod picker of the transfer tool, characterized in that the portion moving along the guide hole to form a polygonal shape. The method according to any one of claims 9 to 11, The elastic member is a picker of the transfer tool, characterized in that the coil spring is installed on the lower side of the picker body and the suction rod is fitted.

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