KR20080071340A - Condenser microphone using ceramic package - Google Patents

Abstract

A condenser microphone using a ceramic package is provided to prevent a defect due to a curling process by eliminating the curling process. A ceramic package(10) has a shape of a cylinder having one open side and includes a first space(10a) and a second space(10b). A MEMS(Micro-Electro-Mechanical Systems) microphone chip(30) is mounted on the first space. An integrated circuit semiconductor chip(40) is mounted on the second space. A lid(20) includes a sound hole(20a) for receiving external sound and is used for covering the open side of the ceramic package. The MEMS microphone chip is used for generating an electrical signal by the received external sound. The integrated circuit semiconductor chip is connected to the MEMS microphone chip in order to amplify the electrical signal of the MEMS microphone chip.

Description

Condenser microphone using ceramic package {CONDENSER MICROPHONE USING CERAMIC PACKAGE}

1 is a perspective view showing a condenser microphone using a ceramic package according to the present invention;

2 is a perspective view illustrating a condenser microphone using a ceramic package according to the present invention;

3 is a three side view showing a ceramic package of a condenser microphone according to the present invention;

4 is a first layer pattern diagram of a ceramic package of a condenser microphone according to the present invention;

5 is a second layer pattern diagram of a ceramic package of a condenser microphone according to the present invention;

6 is a third layer pattern diagram of a ceramic package of a condenser microphone according to the present invention;

7 is a fourth layer pattern diagram of a ceramic package of a condenser microphone according to the present invention;

8 is a fifth layer pattern diagram of a ceramic package of a condenser microphone according to the present invention;

9 is a sixth layer pattern diagram of a ceramic package of a condenser microphone according to the present invention;

* Explanation of symbols for main parts of the drawings

10: ceramic package 10a: first mounting space

10b: second mounting space 11: first ceramic package plate

12: second ceramic package plate 13: third ceramic package plate

14: fourth ceramic package plate 15: fifth ceramic package plate

18: bulkhead 20: lid

20a: Sound hole 30: MEMS microphone chip

40: semiconductor chip A, B, C, D: external connection electrode

C, C2, C3: Upper conductive pattern B1, B2, B3: Bottom conductive pattern

H1 ~ H6: Through Hole

The present invention relates to a condenser microphone, and more particularly to a condenser microphone using a ceramic package.

In general, a condenser microphone widely used in a mobile communication terminal or an audio device includes a voltage bias element, a diaphragm / backplate pair forming a capacitor C that changes in response to sound pressure, and a buffer for output signal. It consists of a field effect transistor (JFET). This type of condenser microphone is manufactured by assembling the diaphragm, spacer ring, insulation ring, back plate, conduction ring and PCB in one case and then curing the end of the case.

By the way, such a typical electret condenser microphone has a problem that the sound quality is degraded due to a failure occurs in the curing process of bending the end of the case.

On the other hand, as a technology recently used for the integration of micro devices, there is a semiconductor processing technology using micromachining. This technology, called MEMS (Micro Electro Mechanical System), can produce micro sensors, actuators, and electromechanical structures in micrometers using micromachining technology using semiconductor processing, especially integrated circuit technology. MEMS chip microphones manufactured using this micromachining technology are capable of miniaturization, high performance, multifunction, integration through ultra-precision micromachining, and have the advantage of improving stability and reliability.

However, the MEMS chip microphone manufactured by using the micromachining technique needs to be packaged together with other integrated circuit (IC) semiconductor chip devices because it requires electrical driving and signal processing.

The present invention has been proposed to meet the above necessity, and an object of the present invention is to provide a condenser microphone using a ceramic package.

In order to achieve the above object, the present invention is a ceramic package having a first shape for mounting a MEMS microphone chip and a second space for mounting an integrated circuit semiconductor chip as an open cylindrical shape; A sound hole for introducing external sound into the MEMS microphone, the lid closing and closing the opening surface of the ceramic package; A MEMS microphone chip mounted in the first space of the ceramic package to generate an electrical signal by sound introduced from the outside; And an integrated circuit semiconductor chip mounted in the second space of the ceramic package and connected to the MEMS microphone chip to amplify an electrical signal of the MEMS microphone chip and output the amplified electrical signal to the outside. do.

In the ceramic package, the first space and the second space may be divided by partition walls. The ceramic package may include a combination of first to fifth ceramic package plates. It is possible to construct a typical signal path.

In particular, since the MEMS microphone chip and the integrated circuit semiconductor chip may be a single chip or a stacked chip, the first space and the second space of the ceramic package may also be mounted in a single space.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing a condenser microphone using a ceramic package according to the present invention, Figure 2 is a cutaway perspective view showing a condenser microphone using a ceramic package according to the present invention.

As shown in FIGS. 1 and 2, the condenser microphone using the ceramic package according to the present invention has a rectangular tube shape having one surface open, and has a first space for mounting the MEMS microphone chip 30 by the partition wall 18. 10a and the ceramic package 10 in which the second space 10b for mounting the integrated circuit semiconductor chip 40 are separated and mounted in the first space 10a of the ceramic package 10 are introduced from the outside. MEMS microphone chip 30 to generate an electrical signal by the physical sound, and is mounted in the second space (10b) of the ceramic package to amplify the electrical signal of the MEMS microphone chip 30 to output to the outside An integrated circuit semiconductor chip 40 and a lid 20 having a sound hole 20a for introducing external sound into the MEMS microphone 30 while closing the opening surface of the ceramic package.

As shown in FIG. 3, the ceramic package 10 according to the present invention is composed of the coupling of the first to fifth ceramic package plates 11 to 15, and the coupling surface MP1 to the respective plates 11 to 15. In MP6), a pattern as shown in FIGS. 4 to 9 is formed to constitute an electrical signal path.

In FIG. 3, (a) is a plan view of the ceramic package 10 according to the present invention, (b) is a front view with a part cut away, and (c) is a side view with a part cut away. In the ceramic package 10 illustrated in FIG. 3, concave grooves are formed at four corners in a rectangular tube shape, C1, C2, and C3 conductive patterns are formed on the upper end of the partition wall 18, and are integrated circuit (IC) semiconductors. B1, B2, and B3 conductive patterns are formed on the bottom surface where the chip is mounted. 9, A, B, C, and D connection patterns are formed on the bottom of the ceramic package 10 to receive power and transmit signals to the outside.

The conductive patterns formed in each of the layers MP1 to MP6 are interconnected through the through holes H1 to H6. In the embodiment of the present invention, the connection pattern A is connected to the B1 conductive pattern and the C2 conductive pattern, and the connection pattern D Is connected to the B2 conductive pattern, and the connection patterns B and C are connected to the metal lid 20 through the conductive patterns C1, C3, B3 and through holes H1 and H2.

4 is a first layer (MP1) pattern diagram of the ceramic package of the condenser microphone according to the present invention, it can be seen that through-holes (H1, H2) for connecting to the metal lid 20 is formed. 5 is a second layer (MP2) pattern diagram of the ceramic package of the condenser microphone according to the present invention.

And FIG. 6 is a third layer (MP3) pattern diagram of the ceramic package of the condenser microphone according to the present invention, and FIG. 7 is a fourth layer (MP4) pattern diagram of the ceramic package of the condenser microphone according to the present invention. The fifth layer (MP5) pattern diagram of the ceramic package of the condenser microphone according to the present invention, Figure 9 is a sixth layer (MP6) pattern diagram of the ceramic package of the condenser microphone according to the present invention.

The pattern of the third layer MP3 corresponds to the upper end of the inner partition 18 of the ceramic package, and the C1, C2, and C3 patterns are formed on the upper end of the partition of the portion where the semiconductor chip is located. The pattern MP4 is a pattern of a portion corresponding to the bottom surface of the mounting space, in which patterns B1, B2, and B3 are formed, and the sixth layer MP6 is a bottom surface of the ceramic package, and a connection pattern A for connecting with an external signal. , B, C, and D are formed.

Each pattern of the third layer MP3 is connected to a lower layer pattern through corresponding through holes H3, H4, and H5. That is, the C1 pattern is connected to the B3 pattern of the fourth layer MP4 through the through hole H3, and the C2 pattern is connected to the A connection pattern at the fifth layer MP5 through the through hole H4, and C3 The pattern is connected to the C and D connection patterns in the fifth layer MP5. Each of the A and D connection patterns is connected to the fifth layer MP5 along the concave grooves formed at the corners of the rectangular cylindrical shape, and the B and C connection patterns are formed of the fifth layer MP5 along the concave grooves formed at the corners of the rectangular cylindrical shape. And a fourth layer MP4.

As described above, in the ceramic package according to the embodiment of the present invention, the connection pattern A is connected to the B1 pattern and the C2 pattern, the connection pattern D is connected to the B2 pattern, and the connection patterns B and C are the conductive patterns C1, C3, and B3. And the metal lid 20 through the through holes H1 and H2. Therefore, the ceramic package 10 according to the present invention may be connected to the ground patterns B and C by the ground plate patterns formed on the lid 20 and the fifth layer to block external electromagnetic waves, thereby reducing noise.

In the embodiment of the present invention, the specific connection structure of this pattern is only one embodiment, and may be connected in various structures according to the connection terminal of the component to be mounted. For example, in the exemplary embodiment of the present invention, the integrated circuit semiconductor chip 40 and the MEMS microphone chip 30 are wire bonded (W), but a conductive pattern may be formed and connected.

Referring again to FIGS. 1 and 2, the lid 20 is a rectangular plate corresponding to the ceramic package 10 in which the sound holes 20a are formed, and is made of a conductive metal, a PCB, a plastic, or the like. Is joined to the top of the open surface. The bonding method may be various methods such as soldering, using a conductive adhesive, and the metal lid 20 is connected to the ground electrode through a through hole pattern formed in the ceramic package 10.

In addition, the MEMS microphone chip 30 is mounted in the first space 10a of the ceramic package, and the integrated circuit (IC) semiconductor chip 40 is mounted in the second space 10b, and a capacitor or a resistor is formed in the pattern on the partition wall. And other devices may be mounted. The MEMS microphone chip 30 and the integrated circuit (IC) semiconductor chip 40 mounted in the first space 10a are connected by wire bonding (W) or SMD.

In general, the MEMS microphone chip 30 has a structure in which a back plate is formed on a silicon wafer by using MEMS technology and a vibration membrane is formed between spacers. The integrated circuit (IC) semiconductor chip 40 A part connected to the MEMS microphone chip 30 to process an electrical signal, and amplifies or amplifies the electric sound signal detected through the voltage pump and MEMS microphone chip to provide a voltage so that the MEMS microphone chip 30 operates as a condenser microphone. It may be composed of a buffer IC for matching the impedance to provide to the outside through the connection terminal.

The ceramic package microphone according to the present invention configured as described above is mounted on the main circuit board of the electronic product after assembly and is operated by receiving power from the main board through connection patterns (A, B, C, D). . The external sound pressure introduced through the acoustic hole 20a formed in the lid 20 induces the vibration of the diaphragm formed in the MEMS microphone chip 30 to appear as a change in capacitance, and the electrical signal is wire bonding (W). Through the amplified and amplified by the IC chip 40 through the connection patterns (A, B, C, D) formed in the bottom portion of the ceramic package 10 to the main board side.

In the above embodiment, the ceramic package is divided into two mounting spaces as an example. However, when the MEMS microphone chip 30 and the integrated circuit semiconductor chip 40 are single chips or overlapping chips, the ceramic package is used. The first space and the second space of the one also can be mounted in a single space.

Although the present invention has been described in detail through specific embodiments, the present invention is not limited to the above-described embodiments, and various changes may be made by those skilled in the art to which the present invention pertains without departing from the spirit and scope of the present invention. It may be changed and implemented.

As described above, since the ceramic package microphone according to the present invention does not require a curing process, it is possible to solve the problems caused by the curing in the microphone of the conventional structure, and is suitable for the SMD type due to the high temperature characteristics of the ceramic package, and thus is stable. Properties can be provided.

Claims (8)

A ceramic package having a cylindrical shape having one surface open and having a first space for mounting a MEMS microphone chip and a second space for mounting an integrated circuit semiconductor chip; A sound hole for introducing external sound into the MEMS microphone, the lid closing and closing the opening surface of the ceramic package; A MEMS microphone chip mounted in the first space of the ceramic package to generate an electrical signal by sound introduced from the outside; And And an integrated circuit semiconductor chip mounted in the second space of the ceramic package and connected to the MEMS microphone chip to amplify an electrical signal of the MEMS microphone chip and output the amplified electrical signal to the outside. Condenser microphone with ceramic package. The method of claim 1, wherein the ceramic package The condenser microphone using a ceramic package, characterized in that the first space and the second space is divided by a partition wall. The method of claim 2, wherein the ceramic package, A condenser microphone using a ceramic package, comprising a combination of first to fifth ceramic package plates, wherein a predetermined pattern is formed on a joining surface of each plate to form an electrical signal path. The method of claim 3, wherein the ceramic package Concave grooves are formed at four corners in a rectangular shape, C1, C2, and C3 patterns are formed at the top of the partition wall, and B1, B2, and B3 conductive patterns are formed on the bottom surface on which the integrated circuit semiconductor chip is mounted. And A, B, C, and D connection patterns are formed on a bottom of the ceramic package to receive power and transmit signals to the outside of the ceramic package. The method of claim 4, wherein the conductive patterns formed on each of the layers Interconnected through a through hole, wherein the connection pattern A is connected to the B1 pattern and the C2 pattern, the connection pattern D is connected to the B2 pattern, and the connection patterns B and C are the patterns C1, C3, B3 and the through Condenser microphone using a ceramic package, characterized in that connected to the lid through the holes (H1, H2). The method of claim 1, wherein the lid is Condenser microphone using a ceramic package, characterized in that made of any one of metal, PCB, or plastic. The method of claim 1, wherein the MEMS microphone chip and the integrated circuit semiconductor chip, A condenser microphone using a ceramic package, characterized in that connected by wire bonding or SMD method. The method of claim 1, wherein the MEMS microphone chip and the integrated circuit semiconductor chip is a single chip or a stacked chip, and the first space and the second space of the ceramic package are also integrated into a single space. A condenser microphone using a ceramic package.

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