WO2011093584A3 - Broadband mems microphone structure - Google Patents

Broadband mems microphone structure Download PDF

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Publication number
WO2011093584A3
WO2011093584A3 PCT/KR2010/008294 KR2010008294W WO2011093584A3 WO 2011093584 A3 WO2011093584 A3 WO 2011093584A3 KR 2010008294 W KR2010008294 W KR 2010008294W WO 2011093584 A3 WO2011093584 A3 WO 2011093584A3
Authority
WO
WIPO (PCT)
Prior art keywords
mems microphone
chip
microphone structure
microphone
acoustic
Prior art date
Application number
PCT/KR2010/008294
Other languages
French (fr)
Korean (ko)
Other versions
WO2011093584A2 (en
Inventor
박두영
김창원
김정민
Original Assignee
주식회사 비에스이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 비에스이 filed Critical 주식회사 비에스이
Publication of WO2011093584A2 publication Critical patent/WO2011093584A2/en
Publication of WO2011093584A3 publication Critical patent/WO2011093584A3/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • H04R1/083—Special constructions of mouthpieces
    • H04R1/086—Protective screens, e.g. all weather or wind screens
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Abstract

The present invention relates to a MEMS microphone which is capable of enhancing acoustic performance. According to the present invention, provided is a MEMS microphone comprising: a microphone chip and an ASIC chip which are mounted on a silicon substrate; a metal case which is installed so as to surround the microphone chip and ASIC chip, and thus to form an acoustic cavity which is formed with an acoustic hole so as to allow the inflow of sound; and a volume reduction member which is disposed within the metal case and reduces the volume of the acoustic cavity.
PCT/KR2010/008294 2010-01-27 2010-11-23 Broadband mems microphone structure WO2011093584A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100007543A KR101109097B1 (en) 2010-01-27 2010-01-27 Broadband mems microphone structure
KR10-2010-0007543 2010-01-27

Publications (2)

Publication Number Publication Date
WO2011093584A2 WO2011093584A2 (en) 2011-08-04
WO2011093584A3 true WO2011093584A3 (en) 2011-11-03

Family

ID=44319939

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/008294 WO2011093584A2 (en) 2010-01-27 2010-11-23 Broadband mems microphone structure

Country Status (2)

Country Link
KR (1) KR101109097B1 (en)
WO (1) WO2011093584A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104220365B (en) 2012-03-29 2016-08-17 罗伯特·博世有限公司 Chamber encapsulation design
KR20150094730A (en) * 2012-12-19 2015-08-19 노우레스 일렉트로닉스, 엘엘시 Digital microphone with frequency booster
TWI581374B (en) * 2013-03-14 2017-05-01 博世股份有限公司 Cavity package design
KR101455079B1 (en) * 2013-07-05 2014-10-27 주식회사 비에스이 method of adjusting sound level according to distance and ear set using the same
US9668047B2 (en) 2015-08-28 2017-05-30 Hyundai Motor Company Microphone

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060127166A (en) * 2004-03-09 2006-12-11 마츠시타 덴끼 산교 가부시키가이샤 Electret condenser microphone
KR100737726B1 (en) * 2006-07-10 2007-07-10 주식회사 비에스이 Packaging structure of mems microphone
KR20080005801A (en) * 2006-07-10 2008-01-15 주식회사 비에스이 Packging structure of mems microphone
KR20080071340A (en) * 2007-01-30 2008-08-04 주식회사 비에스이 Condenser microphone using ceramic package

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100460988B1 (en) * 2002-05-20 2004-12-29 서기원 connecting structure of heater of hot-blast welder for synthetic resin
KR200389794Y1 (en) 2005-05-04 2005-07-18 주식회사 씨에스티 Microphone assembly
KR100675025B1 (en) 2005-08-20 2007-01-29 주식회사 비에스이 Silicon based condenser microphone

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060127166A (en) * 2004-03-09 2006-12-11 마츠시타 덴끼 산교 가부시키가이샤 Electret condenser microphone
KR100737726B1 (en) * 2006-07-10 2007-07-10 주식회사 비에스이 Packaging structure of mems microphone
KR20080005801A (en) * 2006-07-10 2008-01-15 주식회사 비에스이 Packging structure of mems microphone
KR20080071340A (en) * 2007-01-30 2008-08-04 주식회사 비에스이 Condenser microphone using ceramic package

Also Published As

Publication number Publication date
WO2011093584A2 (en) 2011-08-04
KR101109097B1 (en) 2012-01-31
KR20110087896A (en) 2011-08-03

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