KR20080059751A - Unit for collecting liquid and apparatus for processing a substrate including the same - Google Patents

Abstract

A liquid recovery unit and a substrate processing apparatus including the same are provided to suppress contamination of a substrate by preventing the rebound of a scattered liquid rebounded from a substrate. A substrate processing apparatus includes a stage for supporting a substrate, a liquid supply unit for supplying a liquid onto the substrate, a liquid recovery unit(20) disposed adjacent to the stage for recovering the liquid. The liquid recovery unit has a liquid recovery duct(21) having an inlet portion for receiving the liquid scattered from the substrate, and a rebound preventing member(25) disposed adjacent to the inlet portion for suppressing rebound of the liquid from the substrate.

Description

Liquid recovery unit and substrate processing apparatus including same {UNIT FOR COLLECTING LIQUID AND APPARATUS FOR PROCESSING A SUBSTRATE INCLUDING THE SAME}

1 is a configuration diagram for explaining a conventional liquid recovery unit.

2 is a cross-sectional view illustrating a liquid recovery unit according to an embodiment of the present invention.

FIG. 3 is a partially enlarged plan view for describing the rebound prevention member shown in FIG. 2.

4 is a cross-sectional view illustrating a substrate processing apparatus according to an embodiment of the present invention.

5 is a cross-sectional view illustrating a substrate processing apparatus according to an embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

20, 30, 200: liquid recovery unit 21: liquid recovery duct

31a, 31b, 31c: Paul 22, 32a, 32b, 32c: body

23, 33a, 33b, 33c: inclined portions 25, 35a, 35b, 35c: rebound prevention member

300: substrate processing apparatus 350: stage

360: rotating chuck 370: support pin

380: drive shaft 390: drive

W: Substrate

The present invention relates to a liquid recovery unit and a substrate processing apparatus including the same, and more particularly, to a liquid recovery unit for recovering a liquid for processing a substrate and a substrate processing apparatus including the same.

In general, a semiconductor device includes a Fab (FAB) process for forming an electrical circuit on a wafer, an electrical die sorting (EDS) process for inspecting electrical characteristics of the semiconductor devices formed in the fab process, and the semiconductor devices are epoxy. It is manufactured through a package assembly process for encapsulating and individualizing with resin.

The fab process includes various unit processes, and the unit processes are repeatedly performed to form an electrical device on a semiconductor substrate. The unit processes include a deposition process, a photolithography process, an etching process, a chemical mechanical polishing process, an ion implantation process, a cleaning process, and the like.

The cleaning process is a process of removing contaminants from the wafer, which may cause various problems in a semiconductor device in which fine patterns of several micrometers or less are formed. Among the pollutants, the main concern is metal contamination, particles, polymers and the like.

In order to perform the cleaning process, a method of providing a cleaning liquid to a substrate and cleaning the substrate using the cleaning liquid is known.

1 is a schematic cross-sectional view for explaining a conventional substrate processing apparatus.

Referring to FIG. 1, a conventional substrate cleaning apparatus 100 includes a liquid recovery unit 110 that supports a substrate W, and recovers a liquid supplied to a rotatable stage 150 and a rotating substrate W. FIG. do.

The liquid recovery unit 110 may have a multi-stage structure including a plurality of pauls 111, 112, and 113. When the substrate treating process sequentially supplies various kinds of liquids, the plurality of pauls 111, 112, and 113 have a height corresponding to the substrate W at a position where the respective liquids are supplied. Therefore, the plurality of height-adjusted pauls 111, 112, and 113 may separate the liquid according to the type of each liquid.

Meanwhile, as the stage 150 rotates, the substrate W may rotate, and the liquid may scatter. Thus, the plurality of pauls 111, 112, 113 for suppressing the scattering of the liquid have inclined portions 111a, 112a, 113a inclined toward the substrate W. As shown in FIG. The scattered liquid flows into the recovery passage formed inside the pauls 111, 112 and 113 by the inclined portions 111a, 112a and 113a. However, the splashed liquid may be rebound towards the substrate W. Rebound liquid may contaminate the surface of the substrate (W). Therefore, the process efficiency of the substrate processing process using a substrate cleaning apparatus can be reduced.

One object of the present invention is to provide a liquid recovery unit that can suppress the rebound of the liquid to the substrate.

Another object of the present invention is to provide a substrate processing apparatus including a liquid recovery unit capable of suppressing rebound of liquid to a substrate.

Liquid recovery unit according to an embodiment of the present invention for achieving the above object is provided with an inlet for introducing the liquid splashed from the substrate and the liquid recovery duct for recovering the liquid splashed through the inlet and the inlet portion And a rebound prevention member for suppressing rebound of the liquid to the substrate. Here, the rebound prevention member may have a mesh structure. In addition, the liquid recovery duct is a multi-stage structure composed of a plurality of pauls, the rebound preventing member may be located in each of the pauls.

A substrate processing apparatus according to an embodiment of the present invention for achieving the above object is a stage for supporting a substrate, a liquid supply unit for supplying a liquid to the substrate and a liquid disposed adjacent to the stage, the liquid for recovering the liquid And a recovery unit, the liquid recovery unit having an inlet for introducing liquid scattered from the substrate and disposed adjacent to the inlet and a liquid recovery duct for recovering the liquid scattered through the inlet; And a rebound prevention member for suppressing rebound to the substrate. Here, the rebound prevention member may have a mesh structure. In addition, the liquid recovery duct is a multi-stage structure composed of a plurality of pauls, the rebound preventing member may be located in each of the pauls.

According to the liquid recovery unit and the substrate processing apparatus of the present invention, as the rebound prevention member is disposed on one side of the liquid recovery duct, the rebound of the liquid to the substrate can be suppressed. Therefore, it is possible to suppress the contamination of the substrate which may be caused by the liquid rebound to the substrate.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments introduced herein are provided to ensure that the disclosed subject matter is thorough and complete, and that the spirit of the present invention to those skilled in the art will fully convey. Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component. When a component is referred to as being "connected" or "connected" to another component, it may be directly connected to or connected to that other component, but it may be understood that other components may be present in between. Should be. On the other hand, when a component is said to be "directly connected" or "directly connected" to another component, it should be understood that there is no other component in between. Other expressions describing the relationship between components, such as "between" and "immediately between" or "neighboring to" and "directly neighboring", should be interpreted as well. In addition, although the Example of this invention limits a semiconductor substrate, the Example of this invention can also be extended also to a glass substrate, a printed circuit board, etc.

Liquid recovery unit

2 is a cross-sectional view illustrating a liquid recovery unit according to an embodiment of the present invention. 3 is a plan view illustrating the rebound prevention member illustrated in FIG. 2.

2 and 3, the liquid recovery unit 20 according to an embodiment of the present invention includes a liquid recovery duct 21 and a rebound prevention member 25.

The liquid recovery duct 21 recovers the liquid scattered from the substrate. The chemical liquid recovery duct 21 includes a body portion 22 and an inlet portion 23. The liquid used herein may include a cleaning liquid for cleaning the substrate, a photoresist for forming a photoresist pattern, an etchant for etching a thin film formed on the substrate, and the like.

The body portion 22 has a cylindrical shape surrounding the substrate and having an open top. The body portion 22 provides a space for the substrate to accommodate the liquid splashed during the processing process. The inlet 23 extends from the end of the body 22 towards the substrate to recover the scattered liquid.

The rebound prevention member 25 is disposed at an inlet portion of the liquid recovery duct 21 into which the scattered liquid flows. For example, the rebound prevention member 25 is formed at the end of the inflow portion 23.

On the other hand, the rebound prevention member 25 is formed with a hole through which the scattered liquid can pass. Thus, the rebound prevention member 25 suppresses the rebound of the scattered liquid toward the substrate while passing the scattered liquid.

In one embodiment of the present invention, the rebound prevention member 25 has a mesh structure formed with a plurality of holes. The rebound prevention member 25 having the mesh structure primarily passes the liquid splashed from the substrate and reduces the flow rate of the liquid splashed. Therefore, the liquid scattered through the rebound prevention member 25 hits the side wall of the inflow portion 23 and is reflected downward by gravity. As a result, the rebound prevention member 25 can suppress the rebound of the scattered liquid to the substrate.

In one embodiment of the invention, the liquid recovery unit 20 may further comprise a recovery line 27 connected to the liquid recovery duct 21. The recovery line 27 connects the liquid recovery duct 21 and a container (not shown) for storing the liquid. Thus, the liquid scattered through the recovery line is stored in the container.

Examples of the substrate mentioned may include a semiconductor substrate, a glass substrate, a printed circuit board, and the like. However, in the exemplary embodiment of the present invention, only the semiconductor substrate is described. Therefore, the apparatus according to the embodiment of the present invention can be applied to all cleaning of semiconductor substrates, glass substrates, printed circuit boards and the like.

4 is a cross-sectional view illustrating a liquid recovery unit according to an embodiment of the present invention. Since the liquid recovery unit according to an embodiment of the present invention is substantially the same as the liquid recovery unit shown in FIG. 2 except that the liquid recovery duct includes a plurality of bowls, detailed description thereof will be omitted.

Referring to FIG. 4, the liquid recovery unit 30 according to an embodiment of the present invention includes a liquid recovery duct 34 having a plurality of pauls 31a, 31b, and 31c and the plurality of pauls 31a and 31b. , A plurality of rebound prevention members 35a, 35b, 35c disposed with respect to 31c, respectively.

The liquid recovery duct 34 may have a multistage structure that includes a plurality of pauls 31a, 31b, 31c. Particularly, in the cleaning process, when various kinds of cleaning liquids are individually provided on the substrate, the liquid recovery duct 34 is preferably to separate and recover the various kinds of cleaning liquids by their types. Therefore, the liquid recovery duct 34 may include the plurality of Pauls 31a, 31b, and 31c, and the plurality of Pauls 31a, 31b, and 31c may separate and recover various types of cleaning solutions.

In one embodiment of the invention, the liquid recovery duct 34 includes a first Paul 31a, a second Paul 31b and a third Paul 31c. The first to third pauls 31a, 31b and 31c include first to third body portions 32a, 32b and 32c and first to third inlets 33a, 33b and 33c, respectively.

Rebound preventing members 35a, 35b, 35c are disposed at the ends of the first to third inlets 35a, 35b, 35c, respectively. In the cleaning process, when various kinds of cleaning liquids are sequentially provided to the substrate and the cleaning liquids provided on the substrate are scattered from the substrate, the cleaning liquids scattered through the rebound prevention members 35a, 35b, and 35c are sequentially disposed in the liquid recovery duct 34 ) Is recovered inside.

In one embodiment of the present invention, the rebound prevention members 35a, 35b, 35c include first to third rebound prevention members 35a, 35b, 35c. The first to third rebound prevention members 35a, 35b, and 35c may be positioned at ends of the first to third inlets 33a, 33b and 33c, respectively.

In one embodiment of the present invention, the rebound prevention members 35a, 35b, 35c have a mesh structure in which a plurality of holes are formed. The rebound prevention members 35a, 35b, 35c having a mesh structure primarily pass the liquid splashed from the substrate and reduce the flow rate of the scattered liquid. Therefore, the liquid scattered through the rebound prevention members 35a, 35b, 35c hits the inlets 33a, 33b, 33c and is reflected downward by gravity. As a result, the rebound prevention members 35a, 35b, 35c can suppress the rebound of the scattered liquid into the substrate.

In one embodiment of the invention, the liquid recovery unit 30 may further comprise a recovery line (not shown) connected with the liquid recovery duct 34. The recovery line connects the liquid recovery duct 34 to a container (not shown) for storing liquid. Thus, the liquid scattered through the recovery line is stored in the container.

Substrate processing equipment

5 is a cross-sectional view illustrating a substrate processing apparatus according to an embodiment of the present invention.

Referring to FIG. 5, the substrate processing apparatus 300 according to the exemplary embodiment includes a stage 350, a liquid supply unit 390, and a liquid recovery unit 200.

The stage 350 supports the substrate W. The stage 350 may directly support the back surface of the substrate W. Alternatively, the stage 350 may be spaced apart from the back surface of the substrate W to support the substrate W.

The liquid supply unit 390 is disposed above the stage 350. Alternatively, the liquid supply unit 390 may be disposed under the stage 350 to supply liquid to the rear surface of the substrate W. FIG.

The liquid supply unit 390 supplies the liquid to the top or the bottom of the substrate (W). The liquid supply unit 390 may provide, for example, a cleaning solution, an etching solution or a developing solution to the substrate.

In one embodiment of the invention, the liquid supply unit 390 is a storage tank (not shown) for storing liquid, a supply line 395 connected from the storage tank to provide a liquid to the substrate (W) and the supply It may include an injection unit 397 connected to the line 395 to provide the liquid to the upper portion of the substrate (W).

The liquid recovery unit 200 is disposed adjacent to the stage 350. The liquid recovery unit 200 recovers the liquid scattered from the substrate W supported by the stage 350.

The liquid recovery unit 200 includes a liquid recovery duct 205 and rebound prevention members 241, 242, and 243.

The liquid recovery duct 205 recovers the liquid scattered from the substrate W. As shown in FIG. The drug recovery duct 205 includes first to third pauls 210, 220, 230. The first to third pauls 210, 220, and 230 include body portions 211, 221, and 231 and inlets 213, 223, and 233, respectively. The liquid used herein may include a cleaning liquid for cleaning the substrate W, a photoresist for forming a photoresist pattern, an etchant for etching a thin film formed on the substrate W, and the like.

The body parts 211, 221, and 231 have a cylindrical shape that wraps around the substrate W and has an open upper portion. Therefore, the liquid scattered during the treatment process with respect to the substrate W is recovered. The inlets 213, 223, 233 extend from the ends of the body parts 211, 221, 231 toward the substrate W to recover the scattered liquid.

In one embodiment of the present invention, the liquid recovery duct 205 may have a multi-stage structure including a plurality of pauls (210, 220, 230). Particularly, in the cleaning process, when various kinds of cleaning liquids are individually provided on the substrate W, the liquid recovery duct 205 may separate and recover the various kinds of cleaning liquids by their types. Accordingly, the liquid recovery duct 205 may include the plurality of the pauls 210, 220, and 230, and the plurality of the pauls 211, 221, and 231 may separate and recover various types of cleaning liquids.

In one embodiment of the invention, the liquid recovery duct 205 includes first to third pauls 210, 220, 230. The first to third pauls 210, 220, and 230 include first to third body parts 211, 221, and 231 and first to third inlets 213, 223, and 233, respectively.

The rebound prevention members 241, 242, and 243 are disposed at an inlet portion of the liquid recovery duct 205 into which the scattered liquid flows. For example, the rebound prevention members 241, 242, 243 are formed at the ends of the inlets 213, 223, 233.

Meanwhile, the rebound prevention members 241, 242, and 243 are formed with holes through which the scattered liquid passes. Accordingly, the rebound prevention members 241, 242, and 243 pass the scattered liquid and suppress the rebound of the scattered liquid toward the substrate W. FIG.

In one embodiment of the present invention, the rebound prevention members 241, 242, 243 have a mesh structure in which a plurality of holes are formed. The rebound prevention members 241, 242, and 243 having the mesh structure primarily pass the liquid splashed from the substrate W and reduce the flow rate of the scattered liquid. Therefore, the liquid scattered through the rebound prevention members 241, 242, and 243 hits the inlets 213, 223, and 233 and is reflected downward by gravity. As a result, the rebound prevention members 241, 242, 243 can suppress the rebound of the scattered liquid to the substrate W. As shown in FIG.

In one embodiment of the invention, the rebound preventing members 241, 242, 243 are disposed at the ends of the plurality of inlets 213, 223, 233, respectively. In the cleaning process, when various kinds of cleaning liquids are sequentially provided to the substrate W and the cleaning liquid provided to the substrate W is scattered from the substrate W, it is scattered past the rebound prevention members 241, 242, and 243. The cleaned solution is sequentially collected into the liquid recovery duct 205.

For example, the rebound prevention members 241, 242, and 243 include first to third rebound prevention members 241, 242, and 243. The first to third rebound prevention members 241, 242, and 243 may be located at ends of the first to third inlets 213, 223, and 233, respectively.

As mentioned, according to the liquid recovery unit and the substrate processing apparatus of the present invention, the rebound prevention member is disposed in the liquid recovery duct so that the liquid supplied on the substrate hits the inlet and rebounds to the substrate. Therefore, contamination of the substrate which may be caused by the rebounded liquid can be suppressed.

While the foregoing has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

Claims (6)

A liquid recovery duct having an inlet for introducing liquid scattered from the substrate and recovering the liquid scattered through the inlet; And And a rebound preventing member disposed adjacent said inlet to suppress rebound of said liquid to said substrate. The liquid recovery unit according to claim 1, wherein the rebound prevention member has a mesh structure. The liquid recovery unit according to claim 1, wherein the liquid recovery duct is a multistage structure composed of a plurality of pauls, and the rebound preventing member is located at each of the pauls. A stage for supporting the substrate; A liquid supply unit supplying a liquid to the substrate; And A liquid recovery unit disposed adjacent to the stage and recovering the liquid, wherein the liquid recovery unit includes: A liquid recovery duct having an inlet for introducing liquid scattered from the substrate and recovering the liquid scattered through the inlet; And And a rebound prevention member disposed adjacent said inlet to suppress rebound of said liquid to said substrate. The liquid recovery unit according to claim 4, wherein the rebound preventing member has a mesh structure. 5. The liquid recovery unit according to claim 4, wherein the liquid recovery duct is a multistage structure composed of a plurality of pauls, and the rebound preventing member is located at each of the pauls.

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