KR20080036381A - A radiatior of l.e.d lighting module - Google Patents

Abstract

A radiator of an LED(Light Emitting Diode) lighting module is provided to prevent functions and life spans of components of the LED module from being lowered and shortened by rapidly diffusing and discharging heat of the components. A radiator of an LED lighting module includes a substrate(110) and a case(100). A high-output LED lamp(120) is connected to the substrate. The substrate is accommodated in the case. A radiation body having high heat transfer efficiency is installed around an element connected to the substrate and emitting heat and the heat emitted from the element is rapidly diffused and radiated. The radiation body(150) is composed of a metallic plate having an exposure hole(162) for exposing the LED lamp. A wire(102) is attached from an outside of the case. A screw consecutively penetrates the substrate and the wire to electrically connect the substrate and the wire to each other.

Description

Heat dissipation device for LED lighting module {A RADIATIOR OF L.E.D LIGHTING MODULE}

1 is a perspective view showing a conventional LED module,

Figure 2 is an exploded perspective view of the LED module according to an embodiment of the present invention,

3 is a perspective view of the coupled state of the LED module shown in FIG.

4 is a plan view of the LED module shown in FIG.

5 is a cross-sectional view of the LED module shown in FIG.

6 and 7 are perspective views showing the manufacturing process of the heat dissipation plate shown in FIG.

<Explanation of symbols for main parts of drawing>

100: case 102: wire

110: substrate 112: screw

120: LED lamp 130: resistance

140: silicon 150: heat dissipation plate

160: bottom plate 162: exposed hole

170: side plate 180: embossing

The present invention relates to a heat dissipation device of an LED lighting module, and in particular, in an LED lighting module using a high output LED lamp, a heat dissipation efficiency is installed around a component that generates heat such as an LED lamp and a resistance to quickly disperse heat and By discharging, it is to prevent the functional degradation and life of the components constituting the LED module is shortened.

In general, an LED (light-emitting diode) is a light emitting device using the phenomenon that light is generated when a current flows through the PN junction of compound semiconductors such as GaP, GaAs, etc., by controlling the component ratio of the semiconductor compound It can generate light of the wavelength.

These LEDs are used not only for medical use using a predetermined wavelength but also for promoting plant growth. In particular, LEDs have low power consumption and high visibility. Therefore, LEDs are recently used as traffic lights, vehicle rear lamps, and outdoor advertising signs. Also widely applied, the scope of application is gradually expanded to replace the known lighting means.

One example known in the art as a signboard lighting apparatus using such an LED will be described.

1 is a perspective view showing a conventional LED module.

In the LED module shown in this figure, a plurality of LED lamps 5 are connected to the substrate 2, and the substrate 2 is mounted inside the case 1.

The power supply wire 30 is connected to the substrate 2, and a filler for waterproofing is filled in the periphery of the substrate 2, the LED lamp 5, and the wire 30.

As such a filler, epoxy, silicone, or the like is used.

Silicon not only has a waterproof function, but also has a function of dissipating heat generated from elements connected to the LED lamp 5 and the substrate 2, and has the advantage that cracking does not occur due to its unique soft properties. This is widely applied.

In the lighting module using the LED lamp 5 of which the output is usually 1 wh or less, damage of components due to heat is hardly generated.

However, recently, high output LED lamps with high brightness and high light quantity have been developed. The LED module using the high power LED lamp generates high temperature heat from the LED lamp and the resistor.

When a high output LED lamp is used in a structure such as a conventional LED module, the performance of the LED lamp may be drastically degraded by high heat, or the life of the substrate, resistance, silicon, and case may be shortened due to deformation of physical properties due to heat. do.

Therefore, in order to reduce the damage caused by the heat in the LED module using a high power LED lamp, a structure for quickly dispersing and dissipating heat generated from the LED lamp and the resistance is required.

The present invention has been made to solve the above problems, an object of the present invention is to install a high heat transfer efficiency in the LED lighting module using a high-power LED lamp around the components that generate heat such as resistance and resistance By dissipating and dissipating heat quickly, the functional components of the LED module are prevented from being reduced in function and life.

In the present invention for achieving the above object, in the LED lighting module having a substrate to which the LED lamp is connected, and the substrate is contained,

Provided is a heat dissipation device of the LED lighting module characterized in that the heat dissipation of high heat transfer around the element is connected to the substrate to generate heat to quickly dissipate and dissipate heat generated from the element.

The heat sink may be formed of a metallic plate body having exposed holes for exposing the LED lamp.

The plate body may have a portion bent at the edge.

The plate body may be formed with a plurality of embossing.

The inside of the case may be filled with a resin having a waterproof function, and the heat sink may be precipitated inside the resin.

A portion of the heat sink may be exposed to the outside from the resin.

Hereinafter, a preferred embodiment of the LED lighting module of the present invention will be described with the accompanying drawings.

Figure 2 is an exploded perspective view of the LED module according to an embodiment of the present invention, Figure 3 is a perspective view of the combined state of the LED module shown in Figure 2, Figure 4 is a plan view of the LED module shown in FIG. 5 is a cross-sectional view of the LED module shown in Figure 3, Figure 6 and Figure 7 is a perspective view showing the manufacturing process of the heat dissipation plate shown in FIG.

In the LED lighting module illustrated in this figure, the substrate 110 to which the high output LED lamp 120 is connected is contained in the case 100. The wire 102 is attached from the outside of the case 100, and the substrate 110 and the wire 102 are energized by the screw 112 passing through the substrate 110 and the wire 102 continuously.

A heat dissipation plate 150 made of a metallic plate having high heat transfer efficiency is installed around the LED lamp 120 and the resistor 130 connected to the substrate 110. The heat dissipation plate 150 is preferably made of a metal having good thermal conductivity such as aluminum and copper.

An exposed hole 162 for exposing the LED lamp 120 is formed in the bottom plate 160 of the heat dissipation plate 150, and the side plate 170 bent upward is formed at the edge thereof.

Then, the inside of the case 100 is filled with silicon 140 having a waterproof function, the bottom plate 160 of the heat dissipation plate 150 is precipitated in the inside of the silicon 140, the side plate 170 is a silicon ( Protrudes from 140 and contacts air.

In addition, a plurality of embossing 180 is formed on the bottom plate 160 and the side plate 170 of the heat dissipation plate 150. The embossing 180 formed on the bottom plate 160 widens the contact area with the silicon 140, and the embossing 180 formed on the side plate 170 widens the contact area with the air.

When manufacturing the heat dissipation plate 150, first, the side plate 170 is cut into the shape of the bottom plate 160 on a flat metal plate as shown in FIG. 6, and then the exposed hole 162 and the embossing 180 are formed. As shown in FIG. 7, the side plate 170 is bent from the bottom plate 160 to be completed.

Hereinafter will be described the operation of the LED lighting module having the configuration as described above.

When power is supplied to the substrate 110 through the wire 102, the LED lamp 120 connected to the substrate 110 is turned on. Heat is generated in the LED lamp 120 and the resistor 130 while the LED lamp 120 is turned on. As the output of the LED lamp 120 is higher, high heat is generated.

The generated heat is absorbed by the heat dissipation plate 150 and rapidly dissipated, as shown in FIG.

Therefore, since the LED lamp 120 and the resistor 130 are not overheated to a certain level or higher, the LED lamp 120 has a low optical characteristic due to high heat, or the resistor 130 and the silicon 140 and the case 100 are It is prevented that the life is shortened due to deformation of properties due to high heat.

As described above, the present invention provides a heat dissipation plate having a high heat transfer efficiency around an LED lamp and a component that generates heat such as resistance, thereby dispersing and dissipating heat quickly, thereby deteriorating the function and life of the components constituting the LED module. There is an effect that can be prevented from being shortened.

The present invention has been described above by way of specific embodiments, but the present invention is not limited to the above-described embodiments, and those skilled in the art without departing from the gist of the present invention claimed in the claims. Anyone can make a variety of variations.

Claims (6)

In the LED lighting module having a substrate to which the LED lamp is connected, and the case in which the substrate is contained, The heat dissipation device of the LED lighting module, characterized in that the heat dissipation high efficiency is installed around the device connected to the substrate to generate heat to quickly dissipate and dissipate heat generated from the device. The method according to claim 1, The heat dissipator is a heat dissipation device of the LED lighting module, characterized in that made of a metal plate formed with an exposure hole for exposing the LED lamp. The method according to claim 2, The plate body is a heat dissipation device of the LED lighting module, characterized in that it has a portion bent at the edge. The method according to claim 2, The plate is a heat dissipation device of the LED lighting module, characterized in that a plurality of embossing is formed. The method according to claim 1, The inside of the case is filled with a resin having a waterproof function, the heat dissipating device of the LED lighting module, characterized in that precipitated in the interior of the resin. The method according to claim 5, A portion of the heat sink is a heat radiation device of the LED lighting module, characterized in that exposed to the outside from the resin.

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