KR20090010001A - A radiatior of l.e.d lighting module - Google Patents

Abstract

A radiator of LED lighting module is provided to prevent degradation of optical property of a LED lamp and lifetime reduction of a device by rapidly dissipating heat generated in a LED lamp and a resistor. A radiator of LED lighting module comprises a LED lamp(110) and a substrate(100). The LED lamp emits a light by a power supply. A device including the LED lamp is connected to the substrate. A hole(102) is formed on the substrate. A heat sink(120) having high thermal conduction property is inserted in the hole, and is contacted with the device. A stepped jaw(104) is formed inside the hole. A diameter of the stepped jaw is narrow from a top to a bottom. The heat sink comprises a body(122) and a flange part(124). The body passes through the hole. The flange part is formed in a body, and is contacted with the device. The stepped jaw hangs on the flange part.

Description

Heat dissipation device for LED lighting module {A RADIATIOR OF L.E.D LIGHTING MODULE}

The present invention relates to a heat dissipation device of an LED lighting module, and in particular, to emit heat generated from the LED lamp in the LED lighting module using a high output LED lamp to the bottom of the substrate through a high thermal conductivity object.

In general, an LED (light-emitting diode) is a light emitting device using the phenomenon that light is generated when a current flows through the PN junction of compound semiconductors such as GaP, GaAs, etc., by controlling the component ratio of the semiconductor compound It can generate light of the wavelength.

These LEDs are used not only for medical use using a predetermined wavelength but also for promoting plant growth. In particular, LEDs have low power consumption and high visibility. Therefore, LEDs are recently used as traffic lights, vehicle rear lamps, and outdoor advertising signs. Also widely applied, the scope of application is gradually expanded to replace the known lighting means.

A general LED module as a lighting device for a signboard using such an LED is shown in FIG. 1.

In the LED module illustrated in this figure, a plurality of LED lamps 40 are connected to the substrate 30, and the substrate 30 is mounted inside the case 10.

The screw 50 passes through the substrate 30 and the supply wire 20 to energize each other, and a filler for waterproofing is filled in the periphery of the substrate 30, the LED lamp 40, and the wire 20.

As such a filler, epoxy, silicone, or the like is used.

Silicon has been widely applied because it has a merit that cracks do not occur due to heat change due to its unique soft properties.

In the lighting module using the LED lamp 40 having a normal output of 1 wh or less, damage of components due to heat hardly occurred.

However, recently, high output LED lamps with high brightness and high light quantity have been developed. The LED module using the high power LED lamp generates high temperature heat from the LED lamp and the resistor.

When a high output LED lamp is used in a structure such as a conventional LED module, the performance of the LED lamp may be drastically degraded by high heat, or the life of the substrate, resistance, silicon, and case may be shortened due to deformation of physical properties due to heat. do.

Therefore, in order to reduce the damage caused by the heat in the LED module using a high power LED lamp, a structure for quickly dispersing and dissipating heat generated from the LED lamp and the resistance is required.

The present invention has been made to solve the above problems, an object of the present invention is to embed a fluid with high heat transfer efficiency around the components that generate heat, such as LED lamp and resistance in the LED lighting module using a high-power LED lamp By installing a tube to dissipate heat quickly, the functional components of the LED module are prevented from being reduced in function and life.

The present invention for achieving the above object, in the LED lighting module having an LED lamp for generating light by the supply of power, and a substrate to which the element including the LED lamp is connected,

Forming a hole in the substrate, and inserting a highly conductive object in contact with the device in the hole to provide a heat dissipation device of the LED lighting module, characterized in that for discharging the heat of the device below the substrate.

A hole is formed below the device among the substrates, and a step of narrowing a diameter is formed inside the hole, and the object is integral with the body and is in contact with the device. It consists of a flange part which is prevented from being caught by the step and falling down.

The object is made of a metallic material having high thermal conductivity.

As described above, the present invention can prevent the heat generated from the elements such as the LED lamp and the resistor from being rapidly discharged to the lower side of the substrate through the lead carrier, thereby preventing the functional degradation and life of the components constituting the LED module from being shortened. It can be effective.

Hereinafter, a preferred embodiment of the LED lighting module of the present invention will be described with the accompanying drawings.

Figure 2 is an exploded perspective view of the LED module according to an embodiment of the present invention, Figure 3 is a perspective view of the combined state of the LED module shown in Figure 2, Figure 4 is a cross-sectional view of the LED module shown in FIG.

In the LED lighting module illustrated in this figure, the LED lamp 100 is fixed to the substrate 100 through the electricity supply lead 112. The bottom surface of the LED lamp 100 is attached to a metallic heat sink 114 for dissipating heat.

A hole 102 is formed below the heat sink 114 of the substrate 100, and a step 104 is formed in the hole 102 to narrow the diameter.

A heat transfer member 120 is provided to receive heat from the heat sink 114 and release the heat to the outside. The heat carrier 120 is made of a metal having high thermal conductivity, which is commonly known.

Platinum, copper, or the like is used as a material of the heat transfer body 120.

The heat transfer member 120 is connected to the body 122 passing through the hole 102 and the body 122, and is in contact with the heat sink 114 and is caught by the step 104 of the hole 102 of the substrate 100. The flange portion 124 is prevented from falling downward.

In the state in which the heat carrier 120 is mounted on the substrate 100, the flange 124 contacts the heat sink 114 of the LED lamp 110, and the body 122 protrudes downward through the hole 102. do.

Hereinafter will be described the operation of the LED lighting module having the configuration as described above.

When power is supplied to the LED lamp 110 through the lead 112, the LED lamp 110 connected to the substrate 100 is turned on. While the LED lamp 110 is turned on, heat is generated in the elements such as the LED lamp 110 and the resistor. As the output of the LED lamp 110 is higher, high heat is generated.

The generated heat is transferred to the lower heat sink 114, and is discharged downward through the body 122 through the flange portion 124 of the heat carrier 120 in contact with the heat sink 114.

Accordingly, since the LED lamp 110 and the elements such as the resistance are not overheated to a certain level or more, the LED lamp 110 is prevented from deteriorating optical characteristics due to the high temperature, or the life of the elements such as the resistor shortened due to the high temperature. do.

The present invention is applied to the LED module to quickly release the heat generated from the elements such as the LED lamp and the resistance to the lower side of the substrate through the transfer carrier.

The present invention has been described above as a specific embodiment, but the present invention is not limited to the above-described embodiment, and those skilled in the art without departing from the gist of the present invention claimed in the claims. Anyone can make a variety of variations.

1 is a perspective view showing a conventional LED module,

Figure 2 is an exploded perspective view of the LED module according to an embodiment of the present invention,

3 is a perspective view of the coupled state of the LED module shown in FIG.

4 is a cross-sectional view of the LED module shown in FIG.

<Explanation of symbols for main parts of drawing>

100: substrate 102: hole

104: step 110: LED lamp

112: lead 114: heat sink

120: heat transfer body 122: body

124: flange

Claims (3)

In the LED lighting module having an LED lamp for generating light by the supply of power, and a substrate to which the device including the LED lamp is connected, And forming a hole in the substrate and inserting an object having high conductivity in contact with the device to dissipate heat of the device under the substrate. The method of claim 1, wherein a hole is formed below the element of the substrate, the stepped to narrow the diameter is formed inside the hole, The object is a heat dissipation device of the LED lighting module, characterized in that the body is made of a flange portion which is integral with the body and is in contact with the element and is prevented from falling downward caught on the step. The heat dissipation device of an LED lighting module according to claim 1, wherein the object is made of metal having high thermal conductivity.

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