KR20080031346A - 미소 구조체의 검사 장치, 검사 방법 및 검사 프로그램이 기록된 기록 매체 - Google Patents

미소 구조체의 검사 장치, 검사 방법 및 검사 프로그램이 기록된 기록 매체 Download PDF

Info

Publication number
KR20080031346A
KR20080031346A KR1020087002357A KR20087002357A KR20080031346A KR 20080031346 A KR20080031346 A KR 20080031346A KR 1020087002357 A KR1020087002357 A KR 1020087002357A KR 20087002357 A KR20087002357 A KR 20087002357A KR 20080031346 A KR20080031346 A KR 20080031346A
Authority
KR
South Korea
Prior art keywords
microstructure
frequency band
output
predetermined
characteristic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020087002357A
Other languages
English (en)
Korean (ko)
Inventor
마사미 야카베
나오키 이케우치
Original Assignee
도쿄 일렉트론 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄 일렉트론 가부시키가이샤 filed Critical 도쿄 일렉트론 가부시키가이샤
Publication of KR20080031346A publication Critical patent/KR20080031346A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
    • G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0035—Testing
    • B81C99/005—Test apparatus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/34—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor
    • G01N29/346—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor with amplitude characteristics, e.g. modulated signal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/36—Detecting the response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/42—Detecting the response signal, e.g. electronic circuits specially adapted therefor by frequency filtering or by tuning to resonant frequency
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
    • G01P2015/0842—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass the mass being of clover leaf shape

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
KR1020087002357A 2005-08-04 2006-08-02 미소 구조체의 검사 장치, 검사 방법 및 검사 프로그램이 기록된 기록 매체 Ceased KR20080031346A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005226867A JP2007040896A (ja) 2005-08-04 2005-08-04 微小構造体の検査装置、検査方法および検査プログラム
JPJP-P-2005-00226867 2005-08-04

Publications (1)

Publication Number Publication Date
KR20080031346A true KR20080031346A (ko) 2008-04-08

Family

ID=37708786

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087002357A Ceased KR20080031346A (ko) 2005-08-04 2006-08-02 미소 구조체의 검사 장치, 검사 방법 및 검사 프로그램이 기록된 기록 매체

Country Status (6)

Country Link
EP (1) EP1930732A1 (https=)
JP (1) JP2007040896A (https=)
KR (1) KR20080031346A (https=)
CN (1) CN101238376A (https=)
TW (1) TW200720659A (https=)
WO (1) WO2007015506A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5633470B2 (ja) * 2011-05-16 2014-12-03 三菱電機株式会社 半導体装置の製造方法
CN102890165B (zh) * 2012-10-19 2014-07-09 华锐风电科技(集团)股份有限公司 风机加速度传感器检测方法及装置
JP6775347B2 (ja) * 2016-07-29 2020-10-28 株式会社日立製作所 電圧検出器及び電圧検出方法
JP7056097B2 (ja) * 2017-11-28 2022-04-19 富士電機株式会社 診断装置及び方法
CN113998662A (zh) * 2021-09-29 2022-02-01 无锡微奥科技有限公司 Mems微动平台的检测装置及检测方法
CN114192911B (zh) * 2021-12-03 2023-05-23 中国航发北京航空材料研究院 一种涡轮叶片电火花制孔贯穿检测方法
CN116007484A (zh) * 2022-12-12 2023-04-25 中国科学院上海微系统与信息技术研究所 一种微结构测量方法、装置、电子设备及存储介质

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3706765C3 (de) * 1987-03-03 1995-11-09 Telefunken Microelectron Aufprallsensor für ein Fahrzeug, mit einer Prüfschaltung
JPH0534371A (ja) * 1991-07-31 1993-02-09 Tokai Rika Co Ltd 半導体加速度センサの感度測定装置
JPH0933567A (ja) * 1995-07-21 1997-02-07 Akebono Brake Ind Co Ltd 半導体加速度センサのセンサチップ検査方法及び検査装置
JP4007692B2 (ja) * 1998-07-07 2007-11-14 Ｈｏｙａ株式会社 メンブレンリングの製造方法
JP2001264185A (ja) * 2000-03-21 2001-09-26 Nikon Corp レチクルのメンブレンの内部応力測定方法及び装置、並びに半導体デバイスの製造方法
JP4387987B2 (ja) * 2004-06-11 2009-12-24 株式会社オクテック 微小構造体の検査装置、微小構造体の検査方法および微小構造体の検査プログラム

Also Published As

Publication number Publication date
CN101238376A (zh) 2008-08-06
TW200720659A (en) 2007-06-01
JP2007040896A (ja) 2007-02-15
WO2007015506A1 (ja) 2007-02-08
TWI300844B (https=) 2008-09-11
EP1930732A1 (en) 2008-06-11

Similar Documents

Publication Publication Date Title
TWI289204B (en) Minute structure inspection device, minute structure inspection method, and minute structure inspection program
KR101011491B1 (ko) 미소 구조체의 검사 장치, 미소 구조체의 검사 방법 및 기판 유지 장치
JP4387987B2 (ja) 微小構造体の検査装置、微小構造体の検査方法および微小構造体の検査プログラム
CN101151540B (zh) 微小结构体的探针卡、微小结构体的检查装置以及检查方法
KR20080088638A (ko) 미소 구조체의 검사 장치 및 미소 구조체의 검사 방법
KR100845485B1 (ko) 프로브 카드 및 미소 구조체의 검사 장치
JP2006078435A (ja) 微小構造体の検査装置および微小構造体の検査方法
KR20080031346A (ko) 미소 구조체의 검사 장치, 검사 방법 및 검사 프로그램이 기록된 기록 매체
US20080223136A1 (en) Minute structure inspection device, inspection method, and inspection program
JP2010048599A (ja) 微小構造体の検査装置および微小構造体の検査方法
KR101013594B1 (ko) 프로브 카드 및 미소 구조체의 검사 장치
JP4822846B2 (ja) 微小構造体の検査装置、微小構造体の検査方法および微小構造体の検査プログラム
JP4712474B2 (ja) 半導体装置、半導体装置の製造方法、半導体装置の製造方法プログラムおよび半導体製造装置
JP2010048597A (ja) 微小構造体の検査装置および微小構造体の検査方法
JP2006284553A (ja) 微小構造体の検査装置、微小構造体の検査方法および微小構造体の検査プログラム
JPWO2007018186A1 (ja) 微小構造体の検査装置，検査方法および検査プログラム
JP2010048598A (ja) 微小構造体の検査装置および微小構造体の検査方法

Legal Events

Date Code Title Description
A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000