CN101238376A - 微结构体的检查装置、检查方法以及检查程序 - Google Patents

微结构体的检查装置、检查方法以及检查程序 Download PDF

Info

Publication number
CN101238376A
CN101238376A CNA2006800288474A CN200680028847A CN101238376A CN 101238376 A CN101238376 A CN 101238376A CN A2006800288474 A CNA2006800288474 A CN A2006800288474A CN 200680028847 A CN200680028847 A CN 200680028847A CN 101238376 A CN101238376 A CN 101238376A
Authority
CN
China
Prior art keywords
microstructure
frequency band
output
predetermined
predetermined frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006800288474A
Other languages
English (en)
Chinese (zh)
Inventor
八壁正巳
池内直树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN101238376A publication Critical patent/CN101238376A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
    • G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0035—Testing
    • B81C99/005—Test apparatus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/34—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor
    • G01N29/346—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor with amplitude characteristics, e.g. modulated signal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/36—Detecting the response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/42—Detecting the response signal, e.g. electronic circuits specially adapted therefor by frequency filtering or by tuning to resonant frequency
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
    • G01P2015/0842—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass the mass being of clover leaf shape

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
CNA2006800288474A 2005-08-04 2006-08-02 微结构体的检查装置、检查方法以及检查程序 Pending CN101238376A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP226867/2005 2005-08-04
JP2005226867A JP2007040896A (ja) 2005-08-04 2005-08-04 微小構造体の検査装置、検査方法および検査プログラム

Publications (1)

Publication Number Publication Date
CN101238376A true CN101238376A (zh) 2008-08-06

Family

ID=37708786

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006800288474A Pending CN101238376A (zh) 2005-08-04 2006-08-02 微结构体的检查装置、检查方法以及检查程序

Country Status (6)

Country Link
EP (1) EP1930732A1 (https=)
JP (1) JP2007040896A (https=)
KR (1) KR20080031346A (https=)
CN (1) CN101238376A (https=)
TW (1) TW200720659A (https=)
WO (1) WO2007015506A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113998662A (zh) * 2021-09-29 2022-02-01 无锡微奥科技有限公司 Mems微动平台的检测装置及检测方法
CN114192911A (zh) * 2021-12-03 2022-03-18 中国航发北京航空材料研究院 一种涡轮叶片电火花制孔贯穿检测方法
CN116007484A (zh) * 2022-12-12 2023-04-25 中国科学院上海微系统与信息技术研究所 一种微结构测量方法、装置、电子设备及存储介质

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5633470B2 (ja) * 2011-05-16 2014-12-03 三菱電機株式会社 半導体装置の製造方法
CN102890165B (zh) * 2012-10-19 2014-07-09 华锐风电科技(集团)股份有限公司 风机加速度传感器检测方法及装置
JP6775347B2 (ja) * 2016-07-29 2020-10-28 株式会社日立製作所 電圧検出器及び電圧検出方法
JP7056097B2 (ja) * 2017-11-28 2022-04-19 富士電機株式会社 診断装置及び方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3706765C3 (de) * 1987-03-03 1995-11-09 Telefunken Microelectron Aufprallsensor für ein Fahrzeug, mit einer Prüfschaltung
JPH0534371A (ja) * 1991-07-31 1993-02-09 Tokai Rika Co Ltd 半導体加速度センサの感度測定装置
JPH0933567A (ja) * 1995-07-21 1997-02-07 Akebono Brake Ind Co Ltd 半導体加速度センサのセンサチップ検査方法及び検査装置
JP4007692B2 (ja) * 1998-07-07 2007-11-14 Ｈｏｙａ株式会社 メンブレンリングの製造方法
JP2001264185A (ja) * 2000-03-21 2001-09-26 Nikon Corp レチクルのメンブレンの内部応力測定方法及び装置、並びに半導体デバイスの製造方法
JP4387987B2 (ja) * 2004-06-11 2009-12-24 株式会社オクテック 微小構造体の検査装置、微小構造体の検査方法および微小構造体の検査プログラム

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113998662A (zh) * 2021-09-29 2022-02-01 无锡微奥科技有限公司 Mems微动平台的检测装置及检测方法
CN114192911A (zh) * 2021-12-03 2022-03-18 中国航发北京航空材料研究院 一种涡轮叶片电火花制孔贯穿检测方法
CN116007484A (zh) * 2022-12-12 2023-04-25 中国科学院上海微系统与信息技术研究所 一种微结构测量方法、装置、电子设备及存储介质

Also Published As

Publication number Publication date
TW200720659A (en) 2007-06-01
KR20080031346A (ko) 2008-04-08
JP2007040896A (ja) 2007-02-15
WO2007015506A1 (ja) 2007-02-08
TWI300844B (https=) 2008-09-11
EP1930732A1 (en) 2008-06-11

Similar Documents

Publication Publication Date Title
KR101011491B1 (ko) 미소 구조체의 검사 장치, 미소 구조체의 검사 방법 및 기판 유지 장치
TWI289204B (en) Minute structure inspection device, minute structure inspection method, and minute structure inspection program
CN101151540B (zh) 微小结构体的探针卡、微小结构体的检查装置以及检查方法
JP4387987B2 (ja) 微小構造体の検査装置、微小構造体の検査方法および微小構造体の検査プログラム
KR20080088638A (ko) 미소 구조체의 검사 장치 및 미소 구조체의 검사 방법
CN1866030B (zh) 探针卡及微小结构体的检查装置
US20080302185A1 (en) Microstructure Inspecting Apparatus and Microstructure Inspecting Method
CN101238376A (zh) 微结构体的检查装置、检查方法以及检查程序
US20080223136A1 (en) Minute structure inspection device, inspection method, and inspection program
JP2010048599A (ja) 微小構造体の検査装置および微小構造体の検査方法
KR101013594B1 (ko) 프로브 카드 및 미소 구조체의 검사 장치
JP4712474B2 (ja) 半導体装置、半導体装置の製造方法、半導体装置の製造方法プログラムおよび半導体製造装置
JP4822846B2 (ja) 微小構造体の検査装置、微小構造体の検査方法および微小構造体の検査プログラム
JP4856426B2 (ja) 微小構造体の検査装置、及び微小構造体の検査方法
JP2010048597A (ja) 微小構造体の検査装置および微小構造体の検査方法
JPWO2007018186A1 (ja) 微小構造体の検査装置，検査方法および検査プログラム
JP2006284553A (ja) 微小構造体の検査装置、微小構造体の検査方法および微小構造体の検査プログラム

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20080806