KR20080014505A - Auto cure oven - Google Patents

Abstract

An auto cure oven is provided to reduce cure time of a semiconductor package and to improve productivity by curing a magazine in which the semiconductor package is loaded. A temperature air conditioning unit(100) has plural heaters. A main frame(200) is formed on a lower portion of the temperature air conditioning unit to cure a magazine(M). A driving apparatus(300) is installed on a lower portion of the main frame to carry the magazine. A control unit(400) is electrically connected to the driving apparatus and controls the driving apparatus. The main frame includes a chamber(500), a loading unit(600), and a cooling room(700). The chamber is connected to the heaters through plural blast pipes. Plural carriers are formed in the chamber to carry the magazine. The loading unit is formed on a side of the chamber to moves the magazine to an entrance door of the chamber. A table for supporting the magazine is formed on the loading unit. Plural sensors are installed on the table. The cooling room is formed on an end of the chamber to lower the temperature of the magazine heated in the chamber.

Description

Auto Cure Oven {Auto cure oven}

1 is a front view showing a conventional semiconductor package manufacturing oven.

Figure 2 is a cross-sectional view showing the main part of the conventional semiconductor package manufacturing oven.

3 is a perspective view showing an automatic curing oven according to the present invention.

4 is a perspective view showing the inside of the temperature air conditioner and the chamber in the automatic cure oven according to the present invention.

5 is a perspective view showing a transfer unit in the automatic cure oven according to the present invention.

6 is a conceptual view showing a driving device in the automatic cure oven according to the present invention.

7 is a cross-sectional view showing a transfer device in the automatic cure oven according to the present invention.

8A to 8D are cross-sectional views illustrating a process of conveying a magazine in the automatic cure oven according to the present invention.

9 is a view showing the movement path of the magazine in the automatic cure oven according to the present invention.

<Explanation of symbols on main parts of the drawings>

1: automatic curing oven 100: temperature air conditioning unit

110: heater 200: body

210: blower pipe 300: drive device

310 (a, b, c, d, e, f): first moving cylinder 311: pusher member

320 (a, b, c): first operating cylinder 330 (a, b, c): first lift cylinder

340 (a, b): the first door cylinder 350 (a, b): the second door cylinder

360: second working cylinder 370: second moving cylinder

371: pusher member 380: second lift cylinder

390: third operation cylinder 391: pusher member

400: control unit 410: operation control unit

420: display unit 500: chamber

510: feeder 511: table

512: transfer unit 512a: transfer member

512a ': Hanging protrusion 512b: Connecting member

512c: support rod 513: sensor

520 (a, b): Entry and exit door 530: Separation wall

531 (a, b): separate door 540a: first chamber

540b: second chamber portion 540c: third chamber portion

600: loading unit 610: table

611 (a, b): Sensor 700: Cooling chamber

710: opening and closing door 711: viewing window

M: magazine F; Pen

The present invention relates to an automatic cure oven, and more particularly, to an automatic cure oven in which a cure time of a semiconductor package is shortened and productivity is improved by curing a magazine containing a package in an automated oven.

In general, a semiconductor package manufacturing process includes a sawing process for cutting a wafer into individual semiconductor chips, and a die attach process for attaching the cut semiconductor chip to a lead frame or a printed circuit board (PCB). A wire bonding process for connecting the bonding pads of the semiconductor chip and each lead of the lead frame with gold wires and a synthetic resin to protect the wire bonded semiconductor chip from the external environment and to use the USER. Encapsulation (encapsulation) process to form a package enclosed by a furnace and a curing process to cure the encapsulant by putting the package in an oven (oven).

The above-mentioned curing process is carried out by the worker carrying the package to a shelf-type table inside the oven, heating the inside, and then again taken out by the worker.

However, in order for the worker to cure the package, the worker has to move the package directly to the table inside the oven, and there is a problem that the cumbersome package has to be removed from the oven and time is lost. If the package is moved to the oven continuously as soon as the package is formed in order to speed up the work, the temperature inside the oven changes due to frequent opening and closing of the inlet of the oven, causing a process defect or injury to workers due to the high temperature air inside the oven. There was a problem wearing.

In addition, since the worker has to take out the heated package from the oven using a glove formed of a heat-resistant material, the operation is very dangerous, and there is a troublesome problem.

The conventional cure oven devised to solve this problem will be described below with reference to FIGS. 1 and 2.

1 is a front view illustrating a conventional semiconductor package manufacturing oven, and FIG. 2 is a cross-sectional view illustrating main parts of a conventional semiconductor package manufacturing oven.

As shown, a plurality of chambers 30 are provided in the main body 10 of the oven, and the doors 20 for opening and closing the chambers 30 are installed at the front of each chamber 30.

In addition, a magazine 40 for accommodating a lead frame or a printed circuit board (hereinafter referred to as a semi-finished semiconductor package) 42 having semiconductor chips attached thereto by an adhesive is installed in the chamber 30.

At this time, the magazine 40 is provided with a plurality of slots 41 for storing the semi-finished semiconductor package 42.

Each chamber 30 is provided with heating means 50 for heating the semiconductor package semi-finished product 42 by heating the inside to a temperature of 50 ° C. to 200 ° C. and for curing an adhesive (mainly an epoxy resin).

The heating means 50 is composed of a heater 51 and a blowing fan 52 to circulate the hot air heated by the heating means 50 into the chamber 30.

At this time, a plurality of through-holes 31 for circulating the hot air heated by the heating means 50 is formed on both side walls of the chamber 30.

In addition, after the heating of each of the semiconductor package semi-finished products 42 in the chamber 30 is finished, the cooling pipe 60 is further provided in each chamber 30 so as to slowly cool the inside and return to the original room temperature state. It is provided.

In the conventional semiconductor package manufacturing oven configured as described above, the semiconductor package semi-finished product 42 is stored in the magazine 40 mounted inside the chamber 30, and the heating means 50 is closed after the door 20 of the chamber 30 is closed. The adhesive of the semiconductor package semi-finished product 42 is cured by applying high temperature heat using

After the adhesive is cured, the cooling pipe 60 is operated to gradually open the door 20 and slowly cool the inside of the chamber 30 to room temperature so that the semiconductor package stored in the magazine 40 can be removed. The curing process is terminated.

However, the cure oven heats each chamber and takes out the semiconductor package while the chamber is cooled, and again heats the chamber for the cure process, thereby repeatedly heating and cooling each chamber to decrease efficiency. There was a problem, and the problem of deterioration in productivity due to the repetitive heating and cooling caused by the delay of the process and the time loss existed.

SUMMARY OF THE INVENTION The present invention has been made to solve the conventional problems, and an object of the present invention is to cure a magazine containing a semiconductor package in an automated oven, thereby providing an automatic curing oven in which the curing time of the semiconductor package is shortened and productivity is improved. Its purpose is to.

The present invention is an oven to cure a magazine in which the packages are stored to increase the hardness of the synthetic resin after finishing the lead frame molding process to form a package surrounded by synthetic resin to protect the chip fixed to the lead frame from the external environment And a temperature air conditioner having a plurality of heaters, a main body formed under the temperature air conditioner, and installed at a lower part of the main body and a lower part of the main body to cure the magazine, and electrically driven with the drive device. It is connected to the control unit and controls the drive device.

In addition, the main body is connected to the heater by a plurality of blower pipes, a plurality of transfer devices for transferring the magazine is provided therein, and a chamber having an entrance door and the door is formed on one surface of the chamber to form the magazine In order to move the entrance and exit door, the table is provided to support the magazine, the table is provided with a loading unit with a plurality of sensors, the cooling chamber formed at one end of the chamber and heated in the chamber to a predetermined temperature It is composed.

In addition, the inside of the chamber is partitioned and divided into a first chamber part, a second chamber part, and a third chamber part by a set of separating walls so that the separate door is heated by the heater to different temperatures at different temperatures. do.

The transfer apparatus may include a table for supporting the magazine, a transfer unit installed on the table to transfer the magazine, and a plurality of transfer units installed on the table to transmit an electrical signal to the controller after sensing the movement of the magazine. It consists of a sensor.

In addition, the transfer part is formed with a plurality of locking projections in the longitudinal direction so that the magazine is seated, locked and moved, the lower portion of the pair of transfer members equipped with support rods in the longitudinal direction are arranged to face each other by a pair of connecting members Connected.

In addition, the cooling chamber is provided with a fan on one side, opening and closing door is provided so that the magazine is discharged to the outside, the open door is provided with a see-through window to visually check the magazine aligned inside the cooling chamber. It is composed.

In addition, the driving device is installed in the lower portion of the main body to receive the electrical signal of the control unit to drive the transfer unit, the entrance and exit door, the separation door, the opening and closing door of the transfer device, the drive unit is the magazine to the transfer unit A plurality of first moving cylinders having a pusher member for moving each of the first chamber part, the second chamber part, the third chamber part, and the cooling chamber and the support rod to move the transfer part forward and backward. A first lift cylinder, a first lift cylinder installed at a lower portion of the first lift cylinder to move the first lift cylinder up and down, a set of first door cylinders to open and close the entry and exit doors, and the separation A set of second door cylinders for opening and closing the door, a set of second operation cylinders installed in the second chamber part for moving the conveying part forward and backward, A second moving cylinder having a pusher member at one end to move the magazine disposed in the loading unit, a set of second lift cylinders for moving the second working cylinder up and down, and a magazine moved to the cooling chamber It consists of a third operation cylinder with a pusher member to be aligned with.

Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment of the automatic curing oven according to the present invention with reference to the accompanying drawings. In this process, the thickness of the lines or the size of the components shown in the drawings may be exaggerated for clarity and convenience of description. In addition, terms to be described below are terms defined in consideration of functions in the present invention, which may vary according to the intention or convention of a user or an operator. Therefore, definitions of these terms should be made based on the contents throughout the specification.

In addition, the following examples are not intended to limit the scope of the present invention but merely presented by way of example, and there may be various embodiments implemented through the present invention.

3 is a perspective view showing an automatic cure oven according to the present invention, Figure 4 is a perspective view showing the inside of the temperature air conditioner and the chamber in the automatic cure oven according to the present invention, Figure 5 is an automatic cure according to the present invention In the oven, a perspective view showing a conveying part, Figure 6 is a conceptual diagram showing a driving device in the automatic cure oven according to the present invention, Figure 7 is a cross-sectional view showing a conveying device in the automatic cure oven according to the present invention, 8A to 8D are sectional views illustrating a process of conveying a magazine in the automatic cure oven according to the present invention, and FIG. 9 is a view illustrating a movement path of a magazine in the automatic cure oven according to the present invention.

The present invention automatic cure oven (1) is formed in the lower portion of the temperature air conditioning unit 100 and the temperature air conditioning unit 100 provided with a plurality of heaters 110, the main body 200 to cure the magazine (M) And a control unit 400 installed under the main body 200 to control the drive device 300 and the drive device 300 for transferring the magazine M.

Here, the main body 200 is to heat the magazine (M) to cure a plurality of packages (not shown) stored in the magazine (M), a plurality of transfer devices for transporting the magazine ( 510 is provided and a chamber 500 having entrance and exit doors 520a and 520b is formed, and a loading unit 600 is installed on one surface of the chamber 500, and the magazine 600 is installed on the loading unit 600. A table 610 supporting M) is provided, and a plurality of sensors 611 are installed on the table 610. In addition, the main body 200 is connected to the heater 110 by a plurality of blower pipes 210, a plurality of transfer devices 510 for transferring the magazine (M) is provided inside the chamber, The cooling chamber 700 is formed at one end of the chamber 500 and lowers the magazine M heated in the chamber 500 to a predetermined temperature.

In addition, the inside of the chamber 500 is separated by the heater 110 to heat the magazine M at different temperatures to cure the packages in the magazine M sequentially in rapid time ( The first chamber part 540a, the second chamber part 540b, and the third chamber part 540c are divided and divided by a set of separation walls 530 provided with 531a and 531b.

In addition, a transfer device 510 for moving the magazine M is installed in the first chamber part 540a, the second chamber part 540b, and the third chamber part 540c in the chamber 500. As such, the transfer device 510 has a table 511 formed on the bottom of each of the first chamber part 540a, the second chamber part 540b, and the third chamber part 540c. The transfer unit 512 for transporting the magazine M is installed, and a plurality of sensors 513 for detecting an movement of the magazine M and transmitting an electrical signal to the control unit 400 are installed.

In addition, the transfer part 512 is formed with a plurality of engaging projections (512a ') in the longitudinal direction so that the magazine (M) is seated, locked and moved, the lower portion of the pair of transport rods are mounted with a support rod (512c) in the longitudinal direction The members 512a are disposed to face each other, and are connected to each other by a pair of connecting members 512b, and the support rods 512c are mounted on the first working cylinders 320a, 320b, and 320c to be described later. By the 320a, 320b and 320c, the transfer part 512 interlocked with the supporting rod 512c is moved forward and backward.

In addition, the cooling chamber 700 is to lower the magazine (M) to a predetermined temperature so that the worker can move the magazine (M) cured in the chamber 500, such a cooling chamber is one side fan (F) It is provided to lower the temperature of the magazine (M) accommodated therein, the opening and closing door 720 is provided so that the magazine (M) is discharged to the outside, the open door 720 is provided with a see-through window (721) The magazine M aligned in the cooling chamber 700 may be visually checked.

In addition, the driving device 300 is installed below the main body 200, and receives the electrical signal of the control unit 400, the transfer unit 512 and the entrance and exit doors (520a, 520b), the separation door 531a, 531b) and driving the opening and closing door 710, the first and second moving cylinder (310a, 310b, 310c, 310d, 310f, 370) to move the magazine (M) to the chamber 500 and the cooling chamber 700 ), First actuating cylinders 320a, 320b and 320c for moving the transfer part 512, second actuating cylinders 360 installed on both sides of the first actuating cylinders 320a, 320b and 320c, and the A set of first lift cylinders 330a, 330b and 330c installed under the first operation cylinders 320a, 320b and 320c, the entrance and exit doors 520a and 520b and the separation doors 531a and 531b. A set of first door cylinders 340a and 340b, second door cylinders 350a and 350b, and a second movable cylinder 370 installed in the loading unit 600 and a lower portion of the second operation cylinder 370. 2nd of Agent consists of a lower second operating cylinder 360 is provided in the cylinder 380 and the cooling chamber (700).

Here, a plurality of the moving cylinders 310a, 310b, 310c, 310e, 310f is installed at the lower end of the main body, the pusher member 311 is mounted at one end, the moving cylinder (310a, 310b, 310c, 310e) By moving the magazine (M) to the transfer unit 512 by the operation of 310f, each of the first chamber portion 540a, the second chamber portion 540b, the third chamber portion 540c and the cooling chamber It is moved to 700 sequentially.

In addition, the first operation cylinders 320a, 320b, and 320c are connected to the support rods 512c to move the transfer unit 512 back and forth, and the first lift cylinders 330a, 330b, and 330c are connected to the first. It is installed below the operation cylinders 320a, 320b, and 320c to move the first operation cylinders 320a, 320b, and 320c up and down. The pair of first door cylinders 340a and 340b and the second door cylinders 350a and 350b move the entrance and exit doors 520a and 530b and the separation doors 531a and 531b up and down to form the magazine ( M) can be moved and the temperature inside the chamber 500 can be maintained.

At this time, the second chamber 540b is provided with a set of second operation cylinders 360 for moving the transfer part 512 back and forth. Thus, the second operation cylinder 360 is the second operation cylinder 360. It is installed to correspond to both sides with respect to the first operation cylinder 320b installed in the second chamber 540b.

In addition, a second moving cylinder 370 equipped with a pusher member 371 is installed at one end of the loading part 600 to move the magazine M disposed in the loading part 600. A set of second lift cylinders 380 for moving the second operation cylinder 370 up and down is provided, and a pusher member 391 for sequentially aligning the magazines M moved to the cooling chamber 700 is provided. It is installed with a third operation cylinder 390 provided.

Here, a base frame (B) for supporting the first operating cylinder (320a, 320b, 320c) is provided below the first working cylinder (320a, 320b, 320c), the upper surface of the base frame (B) A set of guide protrusions (H) for guiding the support bar (512c) is formed, the first lift cylinders (330a, 330b, 330c) is installed in the lower portion of the base frame (B), the first lift cylinder ( The first operation cylinders 320a, 320b, and 320c are moved up and down by the operations of 330a, 330b, and 330c. In addition, the first operation cylinders 320a, 320b, and 320c are interlocked with each other by the support bar 512c and the connection member 321, and the transfer unit 512 is driven by the first operation cylinders 320a, 320b, and 320c. ) Is moved.

In addition, the controller 400 turns on / off power, controls the temperature of the temperature air conditioning unit 100, and controls the driving device 300 to move the magazine M. A driving control unit 410 is provided to control the speed of the driving, and the magazine M is sequentially moved by applying power to the driving device 300 according to electrical signals of the sensors 513 and 620. In addition, the control unit 400 is formed with a display unit 420 to check the movement of the magazine (M) that is moved inside the chamber (500).

Referring to the operation relationship of the automatic cure oven 1 according to the present invention configured as described above, first, the operator operates the operation operation unit 410 of the control unit 400 and the heating temperature and driving of the temperature air conditioning unit 100 After setting and storing the operating time and the like of the apparatus 300, the oven 1 is driven and the magazine M is placed on the table 610 of the loading unit 600. In this case, the sensor 611a provided in the table 610 detects the magazine M, and sends a detected signal to the control unit 400 electrically connected to the sensor 611a. One control unit 400 applies the drive to the driving device 300, and presses and moves the magazine M while the pusher member 371 of the second moving cylinder 370 moves. As the second lift cylinder 380 interlocked with the lower portion of the moving cylinder 370 is lowered and the pusher member 371 of the second cylinder 370 is moved, the magazine M can be moved again. When the magazine M is disposed on the table 610, the second lift cylinder 380 is raised again to move the magazine M as described above.

The sensor 610 provided at an adjacent position of the entrance door 520a senses the magazine M moved to the front of the entrance door 520a to open the entrance door 520a. The first moving cylinder 310a is operated to move the pusher member 311 provided in the first moving cylinder 310a to the inside of the first chamber 540a while pressing the magazine M. As shown in FIG. That is, as shown in FIG. 8A, the first lift cylinder 330a raises the first operation cylinder 320a to move the magazine M transferred to the table 511 as shown in FIGS. 8A to 8B. It is moved to, the transfer member 512a interlocked with the first operation cylinder (320a) is to lift the magazine (M). In this state, as shown in FIG. 8B, the first operation cylinder 320a is operated to move the magazine M in the direction of the arrow, and as shown in FIG. 8C, the first lift cylinder 330a is connected to the first lift cylinder 330a. When the first operation cylinder 320a and the transfer member 512a are moved downward, the magazine M is fixed to the table 511 while being moved as shown in FIG. 8D and at the same time the first operation cylinder ( 320a moves the conveying member 512a to a position as shown in FIG. 8A, whereby the magazine M can be conveyed again by the driving method described above.

As described above, the magazine M transferred from the first chamber 540a is positioned in front of the separation door 531a mounted on the separation wall 530 and at the same position as the separation door 531a. The mounted sensor 513 detects the magazine M to open the separation door 531a, and the magazine M is opened at the first chapter portion 540a by the first moving cylinder 310b. The second chamber 540b is moved. In addition, the magazine M moved to the second chamber part 540b may include the first moving cylinders 310c, 310d, 310e, and 310f, the first working cylinders 320b and 320c, and the first lift cylinder 350b. 350c) and the second operation cylinder 360 are sequentially moved to the third chamber 540c and then transferred to the cooling chamber 700 to lower the magazine M to a predetermined temperature. In addition, the magazine M transferred to the cooling chamber 700 is sequentially aligned in the direction of the open door 71 by the third operation cylinder 390 provided with the pusher member 391, and at the same time, the cooling chamber ( The outside air is supplied by the fan (F) provided at 700 and after a predetermined time, the temperature is lowered to a predetermined temperature, that is, a temperature that allows the worker to hold the magazine (M), and the worker By opening the door 710 to take out the magazines (M), all processes are completed.

The automatic cure oven according to the present invention configured as described above has an effect of improving the productivity by shortening the cure time of the semiconductor package by curing the magazine containing the semiconductor package with the automated oven.

Claims (7)

In the oven for curing the magazine containing the package to increase the hardness of the resin after finishing the lead frame molding process to form a package surrounded by synthetic resin to protect the chip fixed to the lead frame from the external environment, A temperature air conditioner 100 having a plurality of heaters 110; A main body 200 formed below the temperature air conditioning unit 100 to cure the magazine M; A driving device installed at a lower portion of the main body 200 to transfer the magazine M; And Automatic cure oven, characterized in that consisting of a control unit 400 that is electrically connected to the drive device 300 and controls the drive device (300). The method of claim 1, The main body 200 is connected to the heater 110 by a plurality of blower pipes 210, and a plurality of transfer devices 510 for transferring the magazine M are provided therein, and entrance and exit doors 520a and 520b. Chamber 500 is provided; Is formed on one surface of the chamber 500 to move the magazine (M) to the entry and exit door 520a of the chamber 500, a table 610 for supporting the magazine (M) is provided, the The table 610 includes a loading unit 600 in which a plurality of sensors 611 are installed; And Automatic curing oven, characterized in that formed in one end of the chamber 500, the cooling chamber 700 for lowering the magazine (M) heated in the chamber 500 to a predetermined temperature. The method of claim 2, The interior of the chamber 500 may be separated by a pair of separation walls 530 so that the separating doors 531a and 531b are heated by the heater 110 to heat the magazine M at different temperatures. Automatic cure oven, characterized in that divided into the chamber portion (540a), the second chamber portion (540b), the third chamber portion (540c). The method of claim 1, The transfer device (510) comprises a table (511) for supporting the magazine (M); A transfer unit 512 installed on the table 511 to transfer the magazine M; And Installed on the table (511), the automatic curing oven, characterized in that consisting of a plurality of sensors (513) for transmitting the electrical signal to the control unit 400 after detecting the movement of the magazine (M). The method of claim 4, wherein The transfer part 512 is formed with a plurality of engaging projections (512a ') in the longitudinal direction so that the magazine (M) is seated, locked and moved, the lower portion of the pair of transfer members having a support rod (512c) in the longitudinal direction ( Automatic cure oven, characterized in that 512a is disposed to face each other and interconnected by a pair of connecting members (512b). The method of claim 1, The cooling chamber 700 is provided with a fan (F) on one side, the opening and closing door 710 is provided so that the magazine (M) is discharged to the outside, the open door 710 is provided with a see-through window (711) Automatic cure oven, characterized in that to visually check the magazine (M) arranged in the cooling chamber (700). The method of claim 1, The driving device 300 is installed at the lower part of the main body, receives the electrical signal of the control unit 400, the transfer unit 512 and the entrance and exit doors (520a, 520b), the separation door 531a of the transfer device 510. , 531b) to drive the opening and closing door 710, The driving device 300 moves the magazine M to the transfer part 512, and each of the first chamber part 540a, the second chamber part 540b, the third chamber part 540c and the cooling chamber. A plurality of first moving cylinders 310a, 310b, 310c, 310e, and 310f provided with a pusher member 311 for moving to 700; First operating cylinders 320a, 320b, and 320c connected to the support rods 512c to move the transfer part 512 back and forth; A first lift cylinder (330a, 330b, 330c) installed below the first working cylinder (320a, 320b, 320c) to move the first working cylinder (320a, 320b, 320c) up and down; A set of first door cylinders 340a and 340b for opening and closing the entrance and exit doors 520a and 530b; A set of second door cylinders 350a and 350b for opening and closing the separation doors 531a and 531b; A set of second operation cylinders 360 installed in the second chamber part 540b to move the transfer part 512 back and forth; A second moving cylinder 370 having a pusher member 371 at one end thereof to move the magazine M disposed in the loading unit 600; A pair of second lift cylinders 380 for moving the second operation cylinder 370 up and down; And Automatic cure oven, characterized in that consisting of a third operation cylinder (390) having a pusher member (391) for aligning the magazine (M) moved to the cooling chamber 700 in sequence.

Images