CN104465484B - A kind of solidify afterwards fixture external member structure - Google Patents
A kind of solidify afterwards fixture external member structure Download PDFInfo
- Publication number
- CN104465484B CN104465484B CN201410823543.3A CN201410823543A CN104465484B CN 104465484 B CN104465484 B CN 104465484B CN 201410823543 A CN201410823543 A CN 201410823543A CN 104465484 B CN104465484 B CN 104465484B
- Authority
- CN
- China
- Prior art keywords
- magazine
- upper cover
- fixture
- cover plate
- pressfitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The present invention relates to a kind of solidify afterwards fixture external member structure, belong to technical field of semiconductor encapsulation.It includes loading magazine（1）, the loading magazine（1）Inside it is provided with multiple pressfitting fixtures（2）, the loading magazine（1）Including magazine body（1.1）, the magazine body（1.1）The interior left and right sides is provided with multiple rows of load and separated（1.2）, the pressfitting fixture（2）It is positioned over loading cut-off（1.2）On, the pressfitting fixture（2）Including upper cover plate（2.1）With lower support plate（2.2）, the upper cover plate（2.1）With lower support plate（2.2）Pass on left the second articulated elements（2.4）It is connected, the upper cover plate（2.1）Right side is provided with fixed buckle（2.3）.A kind of solidify afterwards fixture external member structure of the present invention, it can make substrate or the metal lead wire frame abundant release stress in HTHP, so as to reach certain smooth ability, be to provide steady, conveniently, safely and automated production ability in subsequent handling work.
Description
Technical field
The present invention relates to a kind of solidify afterwards fixture external member structure, it is primarily used to fix substrate or metal lead wire frame exists
Stress release is completed in baking makes its smooth, belongs to technical field of semiconductor encapsulation.
Background technology
Substrate class or die-attach area the class (After after encapsulating in factory (Assembly house) are encapsulated at present
Molding solidify afterwards), can be because the shrinkage stress after encapsulating discharges and produces plastic-sealed body warpage issues, so as to influence plastic packaging
The injury and subsequent handling operation of internal electronic chip, the wound got stuck is caused because of the warpage of substrate or die-attach area
Evil and can not the defect such as automated production.
Encapsulation factory is in processing substrate or the method for die-attach area warpage at present, mainly by the substrate of many pieces or
The die-attach area of many pieces, the whole folded Hanging Basket (Stack magazine) that is placed on is interior, then additional weight block attempts to release with high temperature
While putting stress, the method for work of substrate or die-attach area is flattened；
And use and place pouring weight suppression on whole laminated substrate or lead frame in Hanging Basket (Stack magazine), then be subject to
The Working Means of high temperature release stress but have the shortcomings that following：
1st, substrate or die-attach area are adopted multi-disc and overlayed under HTHP suppression, be difficult to make per a piece of substrate or
The warpage of die-attach area, is attained by certain flatness；
2nd, because being that multi-piece substrate or die-attach area storehouse are put, easily in substrate or metal during storehouse
It has been mingled with dirt between the piece and piece of lead frame, and during the HTHP of release stress, has easily produced plastic-sealed body micro-
Gap especially Ultrathin packaging body；Plastic-sealed body ruptures when serious；
3rd, different warpage situations are corresponded at present comparatively laborious from the briquetting of different weight, easily obscure more than model.
The content of the invention
It is an object of the invention to overcome above-mentioned deficiency there is provided a kind of solidify afterwards fixture external member structure, it can be rear solid
Each plate base or metal lead wire frame are fixed in chemical industry sequence, stress is fully discharged in HTHP, makes substrate or metal
Lead frame reaches certain smooth ability, is to provide steady, conveniently, safely and automated production ability in subsequent handling work.
The object of the present invention is achieved like this：A kind of solidify afterwards fixture external member structure, it includes loading magazine, the dress
Multiple pressfitting fixtures are provided with material containing box, the loading magazine includes the left and right sides in magazine body, the magazine body and set
It is equipped with multiple rows of load to separate, the pressfitting fixture is positioned on loading cut-off, and the pressfitting fixture includes upper cover plate and lower support plate,
The upper cover plate passes on left the second articulated elements with lower support plate and is connected, and fixed buckle is provided with the right side of the upper cover plate.
Left and right two is provided with front side of the magazine body and fans leakproof door, the leakproof door passes through the first articulated elements and magazine sheet
Body phase is connected.
Compared with prior art, the invention has the advantages that：
1st, solidify afterwards fixture of the invention carries out the pressure under HTHP for single substrate or die-attach area encapsulation
Release, pressure that each bar substrate or die-attach area are subject to is balanced, flatness more preferably, can effectively solution framework warpage and produce
Subsequent handling be difficult carry out the problem of；
2nd, solidify afterwards external member of the invention utilizes the traditional briquetting of clamp instead, it is not necessary to pressed for different angularities
The adjustment of block, applicability is more flexible；
3rd, this single substrate or die-attach area carry out solidify afterwards by fixture, it is to avoid traditional multi-disc stacking substrates or metal
The particulate that is mingled between lead frame causes the plastic-sealed body under high pressure to destroy.
Brief description of the drawings
Fig. 1 is a kind of schematic diagram of solidify afterwards fixture external member structure of the invention.
Fig. 2 is the structural representation of loading magazine in Fig. 1.
Fig. 3 is the structural representation of pressfitting fixture in Fig. 1.
Wherein：
Load magazine 1
Magazine body 1.1
Load cut-off 1.2
Leakproof door 1.3
First articulated elements 1.4
Pressfitting fixture 2
Upper cover plate 2.1
Lower support plate 2.2
Fixed buckle 2.3
Second articulated elements 2.4.
Embodiment
Referring to Fig. 1, a kind of solidify afterwards fixture external member structure of the invention, it includes loading in magazine 1, the loading magazine 1
Multiple pressfitting fixtures 2 are provided with, the loading magazine 1 includes the left and right sides in magazine body 1.1, the magazine body 1.1 and set
It is equipped with multiple rows of load and separates 1.2, the pressfitting fixture 2 is positioned on loading cut-off 1.2, and the front side of magazine body 1.1 is set
There is left and right two to fan leakproof door 1.3, the leakproof door 1.3 is connected by the first articulated elements 1.4 with magazine body 1.1, works as pressing
Fixture is all placed finish after by leakproof door 1.3 by the rotating close of the first articulated elements 1.4, preventing pressfitting fixture from falling because of inclination
Go out and load magazine, the pressfitting fixture 2 includes upper cover plate 2.1 and lower support plate 2.2, the upper cover plate 2.1 and the left side of lower support plate 2.2
It is connected by the second articulated elements 2.4, upper cover plate 2.1 and lower support plate 2.2 are described by the rotatable folding of the second articulated elements 2.4
The right side of upper cover plate 2.1 is provided with fixed buckle 2.3, can pass through fixed buckle 2.3 when upper cover plate 2.1 closes with lower support plate 2.2
It is fixed, fixture is not upspring because of framework warpage deformation.
Claims (1)
1. a kind of solidify afterwards fixture external member structure, it is characterised in that：It includes loading magazine（1）, the loading magazine（1）Inside set
It is equipped with multiple pressfitting fixtures（2）, the loading magazine（1）Including magazine body（1.1）, the magazine body（1.1）Interior left and right
Both sides are provided with multiple rows of load and separated（1.2）, the pressfitting fixture（2）It is positioned over loading cut-off（1.2）On, the pressfitting fixture
（2）Including upper cover plate（2.1）With lower support plate（2.2）, the upper cover plate（2.1）With lower support plate（2.2）Second is passed on left to be hinged
Part（2.4）It is connected, the upper cover plate（2.1）Right side is provided with fixed buckle（2.3）；The magazine body（1.1）Front side is set
It is equipped with left and right two and fans leakproof door（1.3）, the leakproof door（1.3）Pass through the first articulated elements（1.4）With magazine body（1.1）It is connected
Connect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410823543.3A CN104465484B (en) | 2014-12-26 | 2014-12-26 | A kind of solidify afterwards fixture external member structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410823543.3A CN104465484B (en) | 2014-12-26 | 2014-12-26 | A kind of solidify afterwards fixture external member structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104465484A CN104465484A (en) | 2015-03-25 |
| CN104465484B true CN104465484B (en) | 2017-09-26 |
Family
ID=52911326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410823543.3A Active CN104465484B (en) | 2014-12-26 | 2014-12-26 | A kind of solidify afterwards fixture external member structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104465484B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112652568B (en) * | 2020-12-17 | 2023-11-03 | 苏州远创达科技有限公司 | Automatic mass production type clamp for microelectronic device packaging |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204375718U (en) * | 2014-12-26 | 2015-06-03 | 江苏长电科技股份有限公司 | A kind of Post RDBMS fixture external member structure |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100676314B1 (en) * | 1999-12-17 | 2007-01-31 | 삼성전자주식회사 | Apparatus for curing semiconductor package having presser and curing method using the same |
| US7172927B2 (en) * | 2003-12-18 | 2007-02-06 | Freescale Semiconductor, Inc. | Warpage control of array packaging |
| KR100848283B1 (en) * | 2006-08-11 | 2008-07-25 | 주식회사 피앤드엠 | Auto cure oven |
| CN101944489B (en) * | 2009-07-07 | 2012-06-20 | 株式会社村田制作所 | Manufacturing method of composite substrate |
| CN204335166U (en) * | 2014-11-24 | 2015-05-13 | 北京半导体照明科技促进中心 | A kind of soft base plate fixture |
-
2014
- 2014-12-26 CN CN201410823543.3A patent/CN104465484B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204375718U (en) * | 2014-12-26 | 2015-06-03 | 江苏长电科技股份有限公司 | A kind of Post RDBMS fixture external member structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104465484A (en) | 2015-03-25 |
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