KR20080009453A - Method of manufacturing printing plate and liquid crystal display device using the same - Google Patents

Abstract

A method of manufacturing a printing plate and a method of manufacturing an LCD(Liquid Crystal Display) using the printing plate manufacturing method are provided to form a trench using a mask layer and a photoresist film as a mask to prevent an etchant from infiltrating into a mask region so as to manufacture a printing plate having a desired aperture ratio. A mask layer(610) is formed on a substrate(450). A predetermined photoresist pattern(630) is formed on the mask layer. The mask layer is patterned by the photoresist pattern as a mask. A trench(700) is formed in the substrate using the mask layer and the photoresist pattern as a mask. The mask layer and the photoresist pattern are removed.

Description

Printing plate manufacturing method and liquid crystal display device manufacturing method using the same {Method of Manufacturing Printing Plate and Liquid Crystal Display Device Using the Same}

1A to 1C are process diagrams illustrating a process of patterning a pattern material layer on a substrate using a printing roll.

2a to 2c is a process diagram schematically showing a printing plate manufacturing method according to the prior art.

3 is a cross-sectional view schematically showing a defect of a printing plate according to the prior art.

4A to 4E are process diagrams schematically showing a printing plate manufacturing method according to a first embodiment of the present invention.

5A to 5F are process diagrams schematically showing a printing plate manufacturing method according to a second embodiment of the present invention.

FIG. 6 is a cross-sectional view schematically illustrating the occurrence of a pin hole in a mask layer during a printing plate manufacturing process according to a first embodiment of the present invention.

7 is a cross-sectional view schematically illustrating that pinholes are generated in a first mask layer and a second mask layer during a printing plate manufacturing process according to a second exemplary embodiment of the present invention.

8A through 8D are process diagrams schematically illustrating a method of manufacturing a liquid crystal display device according to an exemplary embodiment of the present invention.

9A to 9C are process diagrams schematically illustrating a process of patterning a pattern material using a printing plate according to an embodiment of the present invention.

<Description of Signs of Major Parts of Drawing>

450: substrate 610: mask layer

612: first mask layer 614: second mask layer

630 photoresist layer 700 trench

The present invention relates to a liquid crystal display device, and more particularly, to a printing plate used in a printing method which is one of the pattern forming methods of the liquid crystal display device.

Ultra-thin flat panel displays with a thickness of only a few centimeters (cm). Among them, liquid crystal displays have low operating voltages, which consume less power and can be used as portable devices. Applications range from ships to spacecraft to aircraft.

The liquid crystal display device includes a lower substrate, an upper substrate, and a liquid crystal layer formed between the two substrates.

Gate lines and data lines are formed on the lower substrate so as to cross each other vertically and horizontally to define pixel regions. A thin film transistor is formed as a switching element in an intersection region of the gate line and the data line. A pixel electrode is formed and connected to the thin film transistor.

In addition, a light blocking layer is formed on the upper substrate to block light leakage from the gate wiring, data wiring, and thin film transistor regions, and a color filter layer is formed on the light blocking layer, and a common electrode is formed on the color filter layer. Is formed.

As such, the liquid crystal display includes various components, and numerous processes are repeatedly performed to form the components. In particular, conventional photolithography processes have been used to pattern various components into various shapes.

The conventional photolithography process is a method of forming a pattern by forming a pattern material layer on a substrate, placing a mask of a predetermined pattern on the pattern material layer, and irradiating light onto the entire surface of the substrate.

However, since the photolithography process requires the use of a mask having a predetermined pattern, the manufacturing cost increases accordingly, and the process is complicated and the process takes a long time because the photolithography process requires a development process.

Therefore, a new pattern forming method has been required to solve the shortcomings of the photolithography process, and a method of forming a pattern using a printing roll has been devised in accordance with such a request.

1A to 1C are process diagrams illustrating a process of patterning a pattern material layer on a substrate using a printing roll.

First, as shown in FIG. 1A, the pattern material 30 is applied to the printing roll 20 using the printing nozzle 10.

Thereafter, as shown in FIG. 1B, the printing roll 20 is rotated on the printing plate 40 on which the protrusion of the predetermined shape is formed, thereby transferring some of the pattern material 30b to the protrusion of the printing plate and remaining the pattern material ( A predetermined shape pattern is formed on the printing roll 20 by 30a).

Thereafter, as shown in FIG. 1C, the printing material 20 is rotated on the substrate 50 to transfer the pattern material 30a onto the substrate 50.

Thus, the method of forming a pattern using the said printing roll requires the printing plate of a predetermined shape.

Hereinafter, a printing plate manufacturing method according to the prior art will be described with reference to the drawings.

2a to 2c is a process diagram schematically showing a printing plate manufacturing method according to the prior art.

First, as shown in FIG. 2A, a photoresist layer 60 having a predetermined pattern is formed on the substrate 45.

Thereafter, as illustrated in FIG. 2B, the substrate 45 is selectively etched using the photoresist layer 60 of the predetermined pattern to form the trench 70.

Thereafter, as shown in FIG. 2C, when the photoresist layer 60 of the predetermined pattern is removed from the substrate 45, the printing plate 45 is completed.

However, since the adhesive force with the substrate 45 is poor in the photoresist layer 60, the etching solution easily penetrates into the edge region (A of FIG. 2B) of the trench 70.

3 is a cross-sectional view schematically showing a defect of a printing plate according to the prior art.

As can be seen in FIG. 3, when the substrate 45 is etched using the photoresist layer 60 as a mask, an etchant penetrates into an edge region (A in FIG. 2B) of the trench 70, and the intended trench 70 is formed. The defect (B of FIG. 3) which becomes wider than the width | variety of) generate | occur | produces.

The present invention has been made to solve the above problems,

SUMMARY OF THE INVENTION An object of the present invention is to provide an accurate printing plate manufacturing method having a desired aperture ratio and a liquid crystal display device manufacturing method using the same by preventing etching liquid penetration into the mask region.

The present invention provides a process for forming a mask layer on a substrate in order to achieve the above object; Forming a photoresist layer of a predetermined pattern on the mask layer; Patterning the mask layer using the photoresist layer as a mask; Forming a trench in the substrate using the mask layer and the photoresist layer as a mask; And it provides a printing plate manufacturing method comprising the step of removing the mask layer and the photoresist layer.

The mask layer is made of one of chromium (Cr), molybdenum (Mo), copper (Cu), and phosphorus-tin-oxide (Indium-Tin-Oxide), the thickness may be made of 500 ~ 1500Å.

In the process of forming a trench in the substrate using the mask layer and the photoresist layer as a mask, the photoresist layer may have a thickness of 5000 GPa or more.

The forming of the mask layer on the substrate may include forming a first mask layer on the substrate; And forming a second mask layer on the substrate on which the first mask layer is formed, and the thicknesses of the first mask layer and the second mask layer may be 500 to 1500 mW, respectively.

In addition, the present invention, in order to achieve the above object, the step of forming a light shielding layer on the first substrate; Forming a color filter layer on the first substrate including the light blocking layer; Preparing a second substrate; And forming a liquid crystal layer between the first substrate and the second substrate, wherein at least one of forming a light blocking layer on the first substrate and forming the color filter layer includes: It provides a liquid crystal display device manufacturing method comprising the step of forming a pattern using a printing plate manufactured according to any one of claims 1 to 8.

The process of preparing the second substrate may include a gate wiring and a data wiring crossing the horizontal and horizontal crosses on the second substrate to define a pixel region, a thin film transistor, a thin film transistor and a thin film transistor at an intersection of the gate wiring and the data wiring. And forming a pixel electrode to be connected.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1. Printing plate manufacturing method

First embodiment

4A to 4E are process diagrams schematically showing a printing plate manufacturing method according to a first embodiment of the present invention.

First, as shown in FIG. 4A, a mask layer 610 is formed on the substrate 450.

The mask layer 610 is made of one of chromium (Cr), molybdenum (Mo), copper (Cu), and phosphorus-tin-oxide (Indium-Tin-Oxide), and has a thickness of about 500 to 1500Å.

Thereafter, as shown in FIG. 4B, a photoresist layer 630 having a predetermined pattern is formed on the mask layer 610.

The photoresist layer 630 of the predetermined pattern is formed using a photolithography process or a pattern forming method using a printing roll, the thickness of which is about 10000 kPa.

Thereafter, as shown in FIG. 4C, the mask layer 610 is patterned using the photoresist layer 630 having the predetermined pattern as a mask.

The process of patterning the mask layer 610 is performed by etching the mask layer 610 using an etchant capable of etching the mask layer 610.

In this case, the photoresist layer 630 also partially reacts with the etching solution of the mask layer 610, and the thickness thereof is reduced to about 5000 kPa.

Thereafter, as shown in FIG. 4D, the trench 700 is formed in the substrate 450 using the mask layer 610 and the photoresist layer 630 as a mask.

The process of forming the trench 700 in the substrate 450 is performed by etching the substrate 450 using an etchant of hydrofluoric acid (HF).

Since the adhesion between the mask layer 610 and the substrate 450 is excellent, the probability that the etchant penetrates into the edge region of the trench 700 to cause defects is significantly reduced.

In addition, the photoresist layer 630 prevents the thin mask layer 610 from being curled into the trench 700 due to stress during the trench 700 forming process, and masks the mask layer 610 on the mask layer 610. The layer 610 is pressed to further improve adhesion between the mask layer 610 and the substrate 450.

Thereafter, as shown in FIG. 4E, the mask layer 610 and the photoresist layer 630 are removed from the substrate 450 to complete the printing plate.

Second embodiment

5A to 5F are process diagrams schematically showing a printing plate manufacturing method according to a second embodiment of the present invention.

The printing plate manufacturing method according to the second embodiment of the present invention, except that the mask layer 610 of the first embodiment is formed of a first mask layer 612 and a second mask layer 614, that is, a double layer The configuration and method are the same as those of the printing plate manufacturing method according to the first embodiment.

When the mask layer 610 is formed as a single layer, as can be seen in FIG. 6, pin holes (D in FIG. 6), etc., are formed on the mask layer 610 by bubbles or foreign matters when the mask layer 610 is formed. May be formed, and an unwanted area of the substrate 450 may be etched by the pin hole or the like.

Although the photoresist layer 610 is formed on the mask layer 610, the substrate 450 in the region where the pin hole (D of FIG. 6) is formed may be etched to cause defects.

In contrast, when the mask layer 610 is formed as a double layer, as shown in FIG. 7, when the first mask layer 612 and the second mask layer 612 are formed, the first mask layer 612 and Even if a pin hole (E in FIG. 7, F in FIG. 7) or the like is formed on the second mask layer 614, the substrate 450 in the region where the pin hole is formed may be prevented from being etched.

This is because the pin holes (E in FIG. 7 and F in FIG. 7) of the first mask layer 612 and the second mask layer 614 are less likely to occur at the same position, and the pin holes (E in FIG. 7 and FIG. 7). If F) does not occur at the same position, the first mask layer 612 and the second mask layer 614 may serve as a mask for the pin holes of the different layers.

The first mask layer 612 and the second mask layer 614 are all made of any one of chromium (Cr), molybdenum (Mo), copper (Cu), and indium-tin-oxide (oxide). The thickness of each is about 500-1500 mm.

If the thickness of the first mask layer 612 and the second mask layer 614 exceeds 1500 kPa and the total thickness exceeds 3000 kPa, respectively, the mask layer region overlapped in the trench 700 due to its weight (C in FIG. 5E). ) May sit inside the trench 700.

In addition, after the first mask layer 612 is formed on the substrate 450 (FIG. 5A), the second mask layer 614 is formed on the substrate 450 on which the first mask layer 612 is formed (FIG. 5A). Before the process of FIG. 5B), the process of cleaning the substrate 450 on which the first mask layer 612 is formed is performed.

The process of cleaning the substrate 450 on which the first mask layer 612 is formed is performed using a brush.

By cleaning the substrate 450 on which the first mask layer 612 is formed, foreign matters that may occur when the first mask layer 612 is formed may be removed, and thus, the coating quality of the second mask layer 612 may be removed. Becomes higher.

2. Manufacturing method of liquid crystal display device

8A to 8D are cross-sectional views schematically illustrating a method of manufacturing a liquid crystal display device according to an exemplary embodiment of the present invention.

First, as shown in FIG. 8A, the light blocking layer 300 is formed on the first substrate 500.

Thereafter, as shown in FIG. 8B, the color filter layer 350 is formed on the first substrate 500 including the light blocking layer 300.

Here, at least one of the process of forming the light shielding layer 300 (see FIG. 8A) and the process of forming the color filter layer 350 (see FIG. 8B) may be performed by the embodiment of the printing plate manufacturing method described above. It may be made by a process of forming a pattern using the manufactured printing plate.

A preferred method of forming a pattern using a printing plate manufactured by the above-described printing plate manufacturing method will be described in detail with reference to FIGS. 9A to 9C.

First, as shown in FIG. 9A, the pattern material 300 is applied to the printing roll 200.

Then, as can be seen in Figure 9b, on the printing plate manufactured by the embodiment of the printing plate manufacturing method described above, by rotating the printing roll 200 is coated with the pattern material 300, a portion of the pattern material (300b) Is transferred onto the printing plate.

Thereafter, as shown in FIG. 9C, the printing roll 200 is rotated on the substrate 500 to transfer the pattern material 300a remaining on the printing roll 200 onto the substrate 500.

As described above, a predetermined pattern may be formed on the substrate 500 in the same manner as in FIGS. 9A to 9C.

Thereafter, as shown in FIG. 8C, the second substrate 550 is prepared.

Although not illustrated, a process of preparing the second substrate 550 may be performed on gate lines and data lines on the second substrate, which cross each other vertically and laterally to define pixel regions, and intersecting regions of the gate lines and data lines. And forming a thin film transistor and a pixel electrode connected to the thin film transistor.

Thereafter, as shown in FIG. 8D, the liquid crystal layer 900 is formed between the first substrate 500 and the second substrate 550.

In this case, the process of forming the liquid crystal layer 900 forms a sealing material without an injection hole on any one of the first substrate 500 and the second substrate 550, and the liquid crystal 900 on the substrate on which the sealing material is formed. After dropping, both substrates 500 and 550 may be bonded to each other.

In addition, in the process of forming the liquid crystal layer, a sealing material is formed to form an injection hole in any one of the first substrate 500 and the second substrate 550, and then both substrates are bonded to each other, and then through the injection hole. The liquid crystal 900 may be formed by using a capillary phenomenon and a pressure difference.

According to the present invention by the above configuration,

Since the trench is formed by using the mask layer and the photoresist layer together as a mask, penetration of the etchant into the mask region can be prevented, and a precise printing plate having a desired aperture ratio can be produced.

In addition, since the mask layer is formed as a double layer, even if a pin hole or the like occurs in one mask layer, the other mask layer can compensate for this, thereby preventing a defect that an unwanted area of the substrate is etched.

Claims (11)

Forming a mask layer on the substrate; Forming a photoresist layer of a predetermined pattern on the mask layer; Patterning the mask layer using the photoresist layer as a mask; Forming a trench in the substrate using the mask layer and the photoresist layer as a mask; And A printing plate manufacturing method comprising the step of removing the mask layer and the photoresist layer. The method of claim 1, The mask layer is a printing plate manufacturing method, characterized in that made of any one of chromium (Cr), molybdenum (Mo), copper (Cu) and phosphorus-tin-oxide (Indium-Tin-Oxide). The method of claim 1, The mask layer is a printing plate manufacturing method, characterized in that made of a thickness of 500 ~ 1500Å. The method of claim 1, And forming a trench in the substrate using the mask layer and the photoresist layer as a mask, wherein the photoresist layer has a thickness of 5000 GPa or more. The method of claim 1, The method of forming a trench on the substrate using the mask layer and the photoresist layer as a mask comprises etching the substrate using a hydrofluoric acid (HF) -based etching solution. The method of claim 1, The process of forming a mask layer on the substrate Forming a first mask layer on the substrate; And And a step of forming a second mask layer on the substrate on which the first mask layer is formed. The method of claim 6, And a step of cleaning the substrate on which the first mask layer is formed. The method of claim 6, The first mask layer and the second mask layer is a printing plate manufacturing method, characterized in that each made of a thickness of 500 ~ 1500Å. Forming a light shielding layer on the first substrate; Forming a color filter layer on the first substrate including the light blocking layer; Preparing a second substrate; And And forming a liquid crystal layer between the first substrate and the second substrate, At least one of the steps of forming the light shielding layer on the first substrate and the step of forming the color filter layer, the pattern is formed by using the printing plate manufactured by any one of claims 1 to 8. A liquid crystal display device manufacturing method comprising a step of making. The method of claim 9, The process of forming a pattern using the printing plate manufactured by any one of claims 1 to 8 is Applying a light shielding material or color filter material to a printing roll; A method of transferring a light shielding material or color filter material onto a printing plate by rotating a printing roll coated with the light blocking material or color filter material on the printing plate manufactured according to any one of claims 1 to 8; And And rotating the printing roll on the first substrate to transfer the light blocking material or color filter material remaining on the printing roll onto the substrate. The method of claim 9, The process of preparing the second substrate is A process of forming a thin film transistor and a pixel electrode connected to the thin film transistor at a cross region of the gate line and the data line, the gate line and the data line crossing each other horizontally and horizontally to define the pixel area; Liquid crystal display device manufacturing method comprising a.

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