KR101182308B1 - Patterning Method and Method of Manufacturing Liquid Crystal Display Device using the same - Google Patents

Abstract

The present invention provides a process for forming a photoresist layer on a substrate; Placing a mask having a predetermined pattern including a transmissive portion, a transflective portion, and a light shielding portion on a rear surface of the substrate; Irradiating light on the back surface of the substrate; Developing and patterning the photoresist layer; Forming a patterned material layer on the patterned photoresist layer; A pattern forming method comprising the step of removing the photoresist layer,

According to the present invention, after the photoresist is patterned by back exposure, a pattern material layer is formed thereon, thereby eliminating the need for patterning the pattern material layer separately, which simplifies the process and makes patterning of the inorganic material difficult to pattern on the substrate possible. It becomes possible.

Back exposure, transflective part

Description

Pattern Forming Method and Method of Manufacturing Liquid Crystal Display Device Using the Same {Patterning Method and Method of Manufacturing Liquid Crystal Display Device using the same}

1A to 1G are process cross-sectional views schematically showing a pattern forming method according to the prior art.

2A to 2E are schematic cross-sectional views of a pattern forming method according to the present invention.

3A to 3D are cross-sectional views schematically illustrating a method of manufacturing a liquid crystal display device according to the present invention.

DESCRIPTION OF THE REFERENCE NUMERALS OF THE DRAWINGS FIG.

100 substrate 300 photoresist layer

400: mask 500: pattern material

The present invention relates to a liquid crystal display device, and more particularly, to a pattern forming method of a liquid crystal display device.

The present invention relates to a liquid crystal display device, and more particularly, to a pattern forming method of a liquid crystal display device and a method of manufacturing a liquid crystal display device using the same.

Ultra-thin flat panel displays with a thickness of only a few centimeters (cm). Among them, liquid crystal displays have low operating voltages, which consume less power and can be used as portable devices. Applications range from ships to spacecraft to aircraft.

The liquid crystal display device includes a lower substrate, an upper substrate, and a liquid crystal layer formed between the two substrates, and a gate wiring and a data wiring are formed on the lower substrate so as to cross each other longitudinally and define a pixel region. A thin film transistor is formed as a switching element in an intersection region of the gate line and the data line.

In addition, a light blocking layer is formed on the upper substrate to block light leakage from the gate wiring, data wiring, and thin film transistor regions, and a color filter layer is formed on the light blocking layer, and a common electrode is formed on the color filter layer. Is formed.

As such, the liquid crystal display includes various components, and numerous processes are repeatedly performed to form the components. In particular, photolithography processes are used to pattern various components in various forms.

In the case of an organic material, a pattern can be formed by a simple photolithography process. However, in the case of an inorganic material such as a metal, it is difficult to form a pattern, thereby forming a pattern through a method different from the organic material.

Hereinafter, a method of forming an inorganic material through a conventional photolithography process will be described with reference to the drawings.

First, as shown in FIG. 1A, an insulating film 20 is formed on the substrate 10.

As the insulating film 20, a silicon nitride (SiN) -based material is used.

Thereafter, as shown in FIG. 1B, a photoresist layer 30 is formed on the insulating film 20.

Thereafter, as shown in FIG. 1C, a mask 40 having a predetermined pattern is positioned on the photoresist layer 30 and then irradiated with light through a light irradiation apparatus.

Thereafter, as shown in FIG. 1D, the photoresist layer 30 is patterned through a developing process.

Thereafter, as shown in FIG. 1E, the insulating layer 20 is etched using the patterned photoresist layer 30a as a mask.

At this time, since the pattern 20a of the insulating film is formed to be narrower than the pattern of the photoresist layer 30a to form a space, an etching solution penetrates into the space after the pattern is formed, and thus the photoresist layer 30a and the insulating film ( 20a can be easily separated from the substrate 10.

Thereafter, as shown in FIG. 1F, the pattern material 50 is coated on the patterned photoresist layer 30a.

Since the photoresist layer 30a and the insulating film 20a are not formed in the portion where the pattern is to be formed, the pattern material layer 50a is formed on the substrate 10, and the photoresist layer 30a is formed in the remaining portion. And an insulating film 20a, and a pattern material layer 50b is formed on the photoresist layer 30a.

Thereafter, as shown in FIG. 1G, when the patterned photoresist layer 30a and the insulating film 20a are removed, an inorganic pattern 50a is formed on the substrate 10.

Unlike pattern formation of an organic material, an insulating film is required for pattern formation of an inorganic material.

However, since the process of forming and patterning an insulating film is necessary, the process becomes complicated and the process time becomes long.

However, when the photoresist layer is patterned without forming an insulating film and then a pattern material layer is formed thereon, there is no space for the photoresist stripper to penetrate under the photoresist layer, thereby removing the photoresist layer. Hard.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems,

A first object of the present invention is to provide a method of forming a pattern without forming an insulating film by back exposure using a mask having a transflective portion.

A second object of the present invention is to provide a method of manufacturing a liquid crystal display device using the pattern forming method.

The present invention provides a process for forming a photoresist layer on a substrate in order to achieve the first object as described above (first process); Positioning a mask having a predetermined pattern including a transmissive portion, a transflective portion, and a light shielding portion on a rear surface of the substrate (second step); Irradiating light on the back surface of the substrate; Developing and patterning the photoresist layer (third step); Forming a patterned material layer on the patterned photoresist layer (fourth step); It provides a pattern forming method comprising a step (a fifth step) of removing the photoresist layer.

A feature of the present invention is that the photoresist layer can be patterned in the shape of a trapezoid having a narrower width than the upper surface of the photoresist layer by exposing from the back side of the substrate using a mask having a predetermined pattern having a transflective portion. Therefore, the photoresist layer can be easily removed even without forming the insulating film.

In this case, the transflective portion provided in the mask of the predetermined pattern may include a plurality of slits.

When light is irradiated onto a plurality of slits formed in the transflective portion, the light is diffracted, so that the bottom surface of the photoresist can be patterned in a trapezoidal shape having a narrower width than the top surface.

In addition, the transflective portion provided in the mask of the predetermined pattern may be formed of a transflective film.

Since the transflective film passes only a part of the incident light, a portion of the light entering the transflective film reaches less amount of light than a portion of the light incident on the transmissive portion, so that the lower surface is narrower than the upper surface. It is possible to pattern the photoresist in a trapezoidal form having a.

In this case, a positive photoresist may be used as the photoresist layer.

In addition, the present invention is a process for forming a light shielding layer on a first substrate in order to achieve the second object; Forming a color filter layer on the first substrate including the light blocking layer; Preparing a second substrate; And forming a liquid crystal layer between the first substrate and the second substrate.

At least one of the steps of forming the light blocking layer on the first substrate and the step of forming the color filter layer may be performed according to the pattern forming method described above.

The process of preparing the second substrate may include a gate wiring and a data wiring that cross each other on the second substrate vertically and horizontally to define a pixel region by using the pattern forming method described above, and the gate wiring and the data wiring. And forming a thin film transistor and a pixel electrode connected to the thin film transistor at an intersection region of the thin film transistor.

At this time, the step of forming a liquid crystal layer between the first substrate and the second substrate, forming a sealing material without the injection hole on any one of the first substrate or the second substrate, the liquid crystal on the substrate formed with the seal material After the addition of the two substrates may be bonded to each other.

In addition, the process of forming a liquid crystal layer between the first substrate and the second substrate, after forming a sealing material to form an injection hole in any one of the first substrate or the second substrate, and then bonded both substrates, Thereafter, the liquid crystal may be injected and formed through the injection hole.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1. Pattern formation method

2A to 2E are schematic cross-sectional views of a pattern forming method according to the present invention.

First, as shown in FIG. 2A, a photoresist layer 300 is formed on the substrate 100.

A positive photoresist is used as a material constituting the photoresist layer 300.

In this case, the process of forming the photoresist layer 300 may be performed by dropping the photoresist 300 on the substrate 100 and then rotating the substrate 100.

In addition, the process of forming the photoresist layer 300 may include a process of discharging the photoresist 300 from the printing nozzle and moving the substrate 100.

In addition, the process of forming the photoresist layer 300 consists of applying the photoresist 300 to a printing roll, and then rotating the printing roll to transfer the photoresist 300 onto the substrate 100. Can be.

Thereafter, as shown in FIG. 2B, a mask having a predetermined pattern having a transmissive portion 400c, a semi-transmissive portion 400b, and a light shielding portion 400a is formed on the back surface of the substrate 100 on which the photoresist layer 300 is formed. 400) and the light is irradiated using a light irradiation device.

In this case, the transflective portion 400b provided in the mask 400 of the predetermined pattern may include a plurality of slits.

The plurality of slits formed in the transflective portion 400b of the mask 400 allow the incident light to diffract, thereby controlling the amount of light reaching the photoresist layer 300.

Thereafter, as shown in FIG. 2C, the photoresist layer 300 is patterned through a developing process.

According to the diffraction phenomenon, since the light reaches a small portion at the edge, the smallest amount of light reaches the boundary area between the light shielding portion 400a and the semi-transmissive portion 400b, and the photoresist has a trapezoidal shape having a lower width than the upper surface. Layer 300 is patterned.

Thereafter, as shown in FIG. 2D, the pattern material 500 is coated on the patterned photoresist layer 300a.

A portion 500a of the pattern material is applied to a portion where the photoresist layer 300a is not formed, and the rest 500a is applied on the photoresist layer 300a.

Since the lower surface of the photoresist layer 300a is patterned in a trapezoidal shape having a width smaller than that of the upper surface, the photoresist stripper may penetrate into the lower surface of the photoresist layer 300a even when the pattern material 500 is applied. This is secured.

According to the prior art, it is not possible to secure a space for the photoresist stripper to penetrate without forming the insulating film. However, in the present invention, the lower surface of the photoresist layer 300a is patterned in a trapezoidal shape having a width smaller than that of the upper surface, whereby the insulating film is formed. It is possible to secure a space for the photoresist stripper to penetrate without the formation of.

Thereafter, as shown in FIG. 2E, when the photoresist layer 300a is removed from the substrate 100 using a photoresist stripper, the pattern is completed.

2. Manufacturing method of liquid crystal display device

3A to 3D are cross-sectional views schematically illustrating a method of manufacturing a substrate for a liquid crystal display device according to an exemplary embodiment of the present invention.

First, as shown in FIG. 3A, the light blocking layer 230 is formed on the first substrate 130.

Thereafter, as shown in FIG. 3B, the color filter layer 260 is formed on the first substrate 130 including the light blocking layer 230.

Here, at least one of the process of forming the light shielding layer (see FIG. 3A) and the process of forming the color filter layer (see FIG. 3B) is formed by the process according to the embodiment of the pattern forming method described above.

Thereafter, as shown in FIG. 3C, the second substrate 160 is prepared.

Although not illustrated, a process of preparing the second substrate may be performed by using a process according to the embodiment of the pattern forming method described above, and the gate wiring and the data defining the pixel area by crossing vertically and horizontally on the second substrate. Forming a passivation layer on a wiring, a thin film transistor at an intersection region of the gate line and the data line, a protective film on a first substrate including the thin film transistor, and a pixel electrode connected to the drain electrode of the thin film transistor on the passivation layer. It may be made, including.

Thereafter, as shown in FIG. 3D, the liquid crystal layer 700 is formed between the first substrate 130 and the second substrate 160.

In this case, the process of forming the liquid crystal layer 700 forms a sealing material without an injection hole in any one of the first substrate 130 and the second substrate 160, and dropping the liquid crystal onto the substrate on which the sealing material is formed. After that, both substrates may be bonded to each other.

In addition, in the process of forming the liquid crystal layer 700, the sealing material is formed to form an injection hole in any one of the first substrate 130 and the second substrate 160, and then both substrates are bonded to each other. The liquid crystal may be formed by using a capillary phenomenon and a pressure difference through the injection hole.

According to the present invention,

By back exposure using a mask having a transflective portion, the bottom surface of the photoresist layer is patterned in a trapezoidal shape having a width smaller than that of the upper surface, thereby easily patterning materials such as metals and inorganic materials that are difficult to pattern without forming an insulating film. Can be.

Since the process of forming and patterning an insulating film is not necessary, the process is simplified and the process time is shortened.

In addition, since the cost of forming and patterning the insulating layer is reduced, the manufacturing cost can also be reduced.

Claims (8)

Forming a photoresist layer on the substrate; Placing a mask having a predetermined pattern including a transmissive portion, a transflective portion, and a light shielding portion on a rear surface of the substrate; Irradiating light on the back surface of the substrate; Developing and patterning the photoresist layer; Forming a patterned material layer on the patterned photoresist layer; And a step of removing the photoresist layer. The method of claim 1, The transflective portion of the mask Pattern forming method comprising a plurality of slits. The method of claim 1, The semi-transmissive portion of the mask pattern forming method, characterized in that consisting of a semi-transmissive film. The method of claim 1, And the photoresist uses a positive photoresist. Forming a light shielding layer on the first substrate; Forming a color filter layer on the first substrate including the light blocking layer; Preparing a second substrate; And And forming a liquid crystal layer between the first substrate and the second substrate, The method of forming the light shielding layer on the first substrate is a process of forming a pattern according to any one of claims 1 to 4, characterized in that the liquid crystal display device manufacturing method. The method of claim 5, The process of preparing the second substrate, Forming a gate wiring on the second substrate using a process of forming a pattern according to any one of claims 1 to 4, A data line intersecting the gate line vertically and defining a pixel region, a thin film transistor at an intersection area of the gate line and the data line, a passivation layer on a second substrate including the thin film transistor, and an upper portion of the passivation layer. And forming a pixel electrode connected to the drain electrode of the thin film transistor. The method of claim 5, The process of forming a liquid crystal layer between the first substrate and the second substrate is Forming a sealing material without an injection hole on any one of the first substrate and the second substrate, And dropping the liquid crystal onto the substrate on which the seal material is formed, and then bonding the first substrate and the second substrate to each other. The method of claim 5, The process of forming a liquid crystal layer between the first substrate and the second substrate is Sealing material is formed so that the injection hole is formed in any one of the first substrate or the second substrate, And a process of injecting liquid crystal into the injection hole after bonding the first substrate and the second substrate together.

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