KR101264713B1 - Method for Manufacturing Printing Plate and Method for Manufacturing Liquid Crystal Display Device Using the Same - Google Patents

Abstract

The present invention relates to a printing plate manufacturing method for preventing the transfer pattern from remaining in the trench by increasing the aspect ratio of the depth width of the trench formed in the printing plate, and a manufacturing method of the liquid crystal display device using the same. Forming a first metal layer pattern having a first open portion on the substrate, etching the substrate using the first metal layer pattern to form a first trench, and including a surface of the first trench; Forming a second metal layer on the substrate by an electroless plating method, and selectively removing the second metal layer to form a second metal layer pattern having a shape remaining in the first trench under the first metal layer pattern; And etching the substrate using the first metal layer pattern and the second metal layer pattern to form a second trench. It is characterized by including the.

Plate, Etch, Off-set Printing, High Aspect Ratio

Description

Method for manufacturing printing plate and method for manufacturing liquid crystal display device using the same}

1A to 1C are cross-sectional views illustrating a process of patterning a pattern material on a substrate using a printing roll.

2a to 2c are cross-sectional views schematically showing a printing plate manufacturing method according to the prior art

3 is a view showing a problem occurring when forming a pattern using a printing plate according to the prior art

4A to 4F are cross-sectional views illustrating an example of a method of manufacturing a printing plate for forming trenches having a predetermined depth.

5 is a cross-sectional view showing a printing plate formed by the manufacturing method of the printing plate of the present invention.

6A to 6C are cross-sectional views illustrating a method of manufacturing the printing plate of the present invention.

7A to 7C are cross-sectional views illustrating a method of manufacturing the liquid crystal display of the present invention.

Description of the Related Art [0002]

200 substrate 210 first metal layer pattern

220: first photosensitive film pattern 155: first trench

117: second metal layer pattern 119: second photosensitive film pattern

155: second trench 180: recessed pattern

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly, to a printing plate manufacturing method for preventing a transfer pattern from remaining in a trench by increasing an aspect ratio of a depth width of a trench formed in a printing plate, and a manufacturing method of a liquid crystal display device using the same.

Ultra-thin flat panel displays with a thickness of only a few centimeters (cm). Among them, liquid crystal displays have low operating voltages, which consume less power and can be used as portable devices. Applications range from ships to spacecraft to aircraft.

The liquid crystal display device includes a lower substrate, an upper substrate, and a liquid crystal layer formed between the two substrates.

Gate lines and data lines are formed on the lower substrate so as to cross each other vertically and horizontally to define pixel regions. A thin film transistor is formed as a switching device in the intersection region of the gate wiring and the data wiring. A pixel electrode is formed and connected to the thin film transistor.

In addition, a light shielding layer is formed on the upper substrate to block light leakage from the gate wiring, the data wiring, and the thin film transistor region, a color filter layer is formed on the light shielding layer, and a common electrode on the color filter layer. Is formed.

As such, the liquid crystal display includes various components, and numerous processes are repeatedly performed to form the components. In particular, conventional photo-lithography processes have been used to pattern various components in various forms.

The conventional photolithography process is a method of forming a pattern by forming a pattern material layer on a substrate, then placing a mask of a predetermined pattern on the pattern material layer and irradiating light on the entire surface of the substrate.

However, since the photolithography process requires the use of a mask having a predetermined pattern, the manufacturing cost increases accordingly. Furthermore, the photolithography process requires a process of developing a photoresist film using a mask. have.

Therefore, a new pattern forming method has been required to solve the disadvantages of the photolithography process, and a method of forming a pattern using a printing roll has been devised in accordance with such a request.

Hereinafter, a patterning method using a conventional printing roll will be described with reference to the accompanying drawings.

1A to 1C are cross-sectional views illustrating a process of patterning a pattern material layer on a substrate using a printing roll.

First, as shown in FIG. 1A, the pattern material 30 is applied to the printing roll 20 using the printing nozzle 10.

Thereafter, as shown in FIG. 1B, the printing roll 20 is rotated on the printing plate 40 on which the protrusion of the predetermined shape is formed, thereby transferring some of the pattern material 30b to the protrusion of the printing plate and remaining the pattern material ( A predetermined shape pattern is formed on the printing roll 20 by 30a).

Thereafter, as shown in FIG. 1C, the printing roll 20 is rotated on the transparent substrate 50 to transfer the pattern material 30a onto the substrate 50.

Thus, the method of forming a pattern using the said printing roll requires the printing plate of a predetermined shape.

Hereinafter, a conventional printing plate manufacturing method will be described with reference to the drawings.

First, as shown in FIG. 2A, a mask layer 60 of a predetermined pattern is formed on the substrate 45.

Thereafter, as shown in FIG. 2B, the substrate 45 is selectively etched using the mask layer 60 having the predetermined pattern to form the trench 70.

Thereafter, as shown in FIG. 2C, when the mask layer 60 of the predetermined pattern is removed from the substrate 45, the conventional printing plate 45 is completed.

However, it is impossible to form a precise pattern by a conventional printing plate manufacturing method.

As shown in FIG. 3, the inclination of the trench 70 is gently formed in the direction of the center of the trench 70, and the edge portion of the trench is transferred when the pattern material 30b is transferred onto the printing plate 45. This is because the pattern material 30b may be transferred.

In the conventional patterning method using a printing roll as described above, when the printed board is provided with a trench that is selectively etched to correspond to a predetermined opening, the trench is formed with a gentle inclination of the trench, There is a problem that the pattern material is transferred to the edge, and in the printing process using the same, an unintentional transfer pattern remains in the trench edge, thereby preventing accurate patterning.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, by increasing the aspect ratio of the depth width of the trench formed in the printing plate, to prevent the transfer pattern remains in the trench and a manufacturing method of the liquid crystal display device using the same The purpose is to provide.

Method of manufacturing a printing plate of the present invention for achieving the above object, the step of forming a first metal layer pattern having a first open portion on the substrate, by etching the substrate using the first metal layer pattern Forming a first trench, forming a second metal layer by an electroless plating method on the substrate including the surface of the first trench, and selectively removing the second metal layer below the first metal layer pattern Forming a second metal layer pattern having a shape remaining in the first trench located and etching the substrate using the first metal layer pattern and the second metal layer pattern to form a second trench. There is this.

The forming of the first metal layer pattern may include depositing a first metal layer on the substrate and etching the first metal layer by using a first photoresist pattern having an open portion corresponding to the first open portion as a mask. Is done.

After forming the first metal layer pattern, the first photosensitive film pattern remains upon formation of the second metal layer.

In the forming of the second metal layer, the second metal layer includes a surface of the first trench, the surface and the side surface of the first photoresist pattern, and the first metal layer pattern exposed on the upper portion of the first trench. Are formed together.

The second metal layer pattern is formed by a self-aligned photo process using the first metal layer pattern.

The self-aligned photo process using the first metal layer pattern may include forming a second photoresist film on the first metal layer pattern including the first trench, and using the first metal layer pattern as a mask to form the second photoresist film. Exposing and developing to form a second photoresist pattern in the first trench under the first metal layer pattern; and selectively removing the second metal layer by using the second photoresist pattern as a mask to remove the second metal layer pattern. It comprises the step of forming.

The forming of the second trench may be performed by etching the substrate using the second metal layer pattern, the second photoresist pattern, and the first metal layer pattern as a mask.

The first metal layer pattern is made of a metal that is more corrosion resistant than the substrate etchant.

The first metal layer pattern may include chromium, molybdenum, copper, indium tin oxide (ITO), indium zinc oxide (IZO), and indium tin-zinc-oxide (ITZO). Zinc oxide).

The second metal layer uses at least one of nickel (Ni), copper (Cu), nickel-phosphorus (Ni-P), and nickel-boron (Ni-B) alloy.

The etching of the substrate for forming the first and second trenches uses an etchant including hydrofluoric acid (HF).

The method may further include forming a third trench by etching the substrate using the third metal layer pattern formed by the electroless plating method corresponding to the lower side of the first metal layer pattern on the second trench.

The method may further include forming a trench having a predetermined depth on the surface of the second trench by repeating formation of a metal layer pattern corresponding to a lower side of the first metal layer pattern by an electroless plating method and etching of the substrate using the same.

The etching of the substrate may further include a photosensitive film pattern in the second trench corresponding to the lower side of the first metal layer pattern after the metal layer pattern is formed.

In addition, the manufacturing method of the liquid crystal display device of the present invention for achieving the same object comprises the steps of preparing a first, second substrate facing each other, and forming a light shielding layer and a plurality of color filter layer on the first substrate And forming a thin film transistor array on the first substrate and forming a liquid crystal layer between the first and second substrates, wherein at least one of the light blocking layer and the plurality of color filter layers is formed. It forms using the printing plate manufactured by the method mentioned above. Here, the process of forming a pattern using the printing plate is a process of applying a light-shielding material or color filter forming material to a printing roll, and the light-shielding material or color filter forming material is coated on a printing plate produced by the method described above Rotating a printing roll to transfer a part of the light shielding material or the color filter forming material onto the printing plate; And rotating the printing roll on the first substrate to transfer the light blocking material or the color filter forming material remaining on the printing roll onto the substrate.

Hereinafter, the printing plate manufacturing method of the present invention with reference to the accompanying drawings in detail as follows.

Hereinafter, first, a printing plate manufacturing method of forming trenches having a desired depth by forming a plurality of layers of trenches in a depth direction will be described.

4A to 4F are cross-sectional views illustrating a method of manufacturing a printing plate for forming trenches having a predetermined depth.

As shown in FIG. 4A, after depositing a first metal material layer 110 such as chromium (Cr) on the substrate 100 and then applying a photoresist film (not shown) thereon, a predetermined portion of the photoresist film may be formed. The photosensitive film is exposed and developed to remove the width W to form a first photoresist pattern (not shown). Subsequently, the exposed first metal material layer is etched using the first photoresist pattern as a mask to form a first metal layer pattern 110. Subsequently, the first photoresist pattern on the first metal layer pattern 110 is stripped and removed.

Subsequently, the surface of the exposed substrate 100 under the first metal layer pattern 110 is etched using the first metal layer pattern 110 as a mask to form a first trench 107 having a first depth D1. To form. In the process of etching the surface of the substrate 100, isotropic etching occurs, and at this time, in the open portion of the substrate 100 corresponding to the edge where the first metal layer pattern 110 is opened, the first An arc-shaped etch is performed with the edge of the metal layer pattern 110 as the center of the circle, and is etched into an undercut shape. Accordingly, a circular arc shape having a radius of about 'C' on both sides of the first metal layer pattern 110 is more etched than the width W of the region where the first metal layer pattern 110 is opened. 110 remains longer than the first trench 107 by about 'C' in width.

As shown in FIG. 4B, the second metal layer 117 of the transparent metal such as molybdenum (Mo) or indium tin oxide (ITO) or the like is formed on the surface of the first metal layer 110 including the surface of the first trench 107. Is deposited by sputtering, and then a second photosensitive film 115 and the same layer are coated on the surface of the second metal layer including the first trench 107.

Subsequently, the second photoresist layer is exposed and developed using the first metal layer pattern 110 as a mask by a self-align photo process, and the first trench covered by the first metal layer pattern 110 is covered. A second photosensitive film pattern 115 having a shape remaining at the edge of 107 is formed. That is, by using the first metal layer pattern 110 as a mask, an upper portion of the second metal layer and a second photosensitive layer in the first trench 107 in which the first metal layer pattern 110 is opened are removed to remove the second photoresist layer. A second photoresist pattern 115 having a shape remaining on the edge of the first trench 107 covered by the first metal layer pattern 110 is formed. In this case, the second photoresist layer is a negative photosensitive material, and a portion irradiated with light is removed by development. After the self-aligned photo process, the second photoresist layer pattern 115 is formed only at the edge of the first trench 107. ) Will remain.

Subsequently, the exposed second metal layer in the first trench 107 in which the first metal layer pattern 110 is not formed is etched and removed using the second photoresist pattern 115 as a mask to form a second metal layer. Pattern 117 is formed.

Here, the first metal layer pattern 110 at a portion where the edge of the first trench 107 and the first metal layer pattern 110 overlap each other is called a metal wing (A display portion). In this case, in the above-described self-align photo process, only the second metal layer pattern 117 on the surface of the first trench 107 corresponding to the lower side of the metal wing is patterned.

Subsequently, as shown in FIG. 4C, the substrate 100 may be formed using the second photoresist layer pattern 115, the first metal layer pattern 110, and the second metal layer pattern 117 in the first trench 107 as a mask. Is etched to form second trenches 120. In this case, an arc-shaped second trench 120 around the edge of the second metal layer pattern 117 is formed on the exposed substrate 100.

As shown in FIG. 4D, the third metal layer 127 of the transparent metal such as molybdenum (Mo) or indium tin oxide (ITO) or the like is formed on the surface of the first metal layer pattern 110 including the surface of the second trench 120. ), And then, a third photosensitive film is coated on the surfaces of the first and third metal layers 127 including the second trenches 120.

Subsequently, the third photoresist layer is exposed and developed by a self-align photo process to form a third shape having a shape remaining at the edge of the second trench 120 covered by the second metal layer pattern 117. The photosensitive film pattern 125 is formed. Similarly, the third photoresist layer is a negative photosensitive material, and a portion irradiated with light is removed by development. After the self-aligned photo process, the third photoresist pattern 125 is formed only at the edge of the second trench 120. Will remain.

Subsequently, the third metal layer is etched using the third photoresist layer pattern 125 as a mask to form a third metal layer pattern 127 under the first metal layer pattern 110 and the second metal layer pattern 117. .

Subsequently, as shown in FIG. 4E, the second photoresist layer pattern 115 and the second metal layer pattern 117 and the second trench 120 in the first metal layer pattern 110 and the first trench 107 may be formed. The third trench 130 is formed by etching the substrate 100 using the third photoresist pattern 125 and the third metal layer pattern 127 as a mask. In this case, an arc-shaped third trench 130 around the edge of the third metal layer pattern 127 is formed on the exposed substrate 100.

Subsequently, as illustrated in FIG. 4F, the first metal layer pattern 110 is etched and removed, and the second and third photoresist patterns 115 and 125 in the first and second trenches 107 and 120 are stripped. To remove it. Through this process, the substrate 100 includes a recess pattern 150 having a depth and a width of the sum of the first to third trenches 107, 120, and 130, and the recess pattern 150. The substrate 100 is used as a printing plate for forming a thin film of a liquid crystal display.

In the printing plate manufacturing method, the process of FIGS. 4B and 4C may be repeatedly performed until the final recess pattern 150 having a desired depth is formed by a plurality of trenches, as in the process of FIGS. 4D and 4E. Can be.

However, during this process, for example, in a state in which the first metal layer pattern 110 covers the first and second trenches 107 and 120, in the process of sputtering the second and third metal layers in each trench, Since the sputtered metal does not enter well under the metal wing of the first metal layer pattern 110, the deposition of the second metal layer pattern 117 may not occur normally. Accordingly, When etching the substrate using the second metal layer pattern 117 as a mask, the substrate of the portion where the second metal layer pattern 117 is not deposited may be etched together. Therefore, as the process of forming the trench proceeds, etching may occur in a portion covered by the first metal layer pattern 110, or the self-alignment of the metal layers may not be accurately performed. Therefore, as the etching using each trench is repeated, In this case, the deviation of the width of the trenches of each layer to be formed (CD bias: Critical Dimension Bias) is generated, and in this case, the etching of the substrate may increase laterally than the depth direction. The heights D2, D3, ... are relatively smaller than the first height D1 formed in the first trench. For example, the second and third heights D2 and D3 of the second and third trenches shown in FIGS. 4C and 4E are greater than the first height D1 of the first trench shown in FIG. 4A. It is as small as about 60-70%.

Hereinafter, the manufacturing method of the printing plate of this invention which is easy to adjust CD width of each said trench, and can form a high aspect ratio trench by this is demonstrated.

5 is a cross-sectional view showing a printing plate of the present invention.

As shown in FIG. 5, the recessed part pattern 180 of the printing plate of the present invention has a second depth greater than the first trench 155 and the second depth D2 ′ of the first depth D1 on the substrate 200. A second trench 165 is provided below the first trench 155. The first trench 155 having the first depth and the second trench 165 below the first trench 155 have the same width, and the widths of the first and second trenches 155 and 165 are the same. The width of the open portion of the first metal layer pattern 210 on the substrate 200 is relatively greater. This is because the first and second trenches may be etched in an arc shape around the edge of the first metal layer pattern 210 when the substrate 200 is etched using the first metal layer pattern 210. 155, 165) wider. Here, the second depth D2 ′ of the second trench 165 corresponds to a level of about 120 to 130% compared to the first depth D1 of the first trench 155.

Here, the first metal layer pattern 210 is a portion removed when the substrate 200 is used as a printing plate.

6A to 6C are cross-sectional views showing the printing plate manufacturing method of the present invention.

As shown in Figure 6a, the printing plate manufacturing method of the present invention first, depositing a metal layer on the substrate.

As shown in FIG. 6A, chromium (Cr), molybdenum (Mo), copper (Cu), indium tin oxide (ITO), and indium zinc oxide (IZO) are formed on the substrate 200. ) And an indium tin zinc oxide (ITZO) to form a first metal layer (the same layer as 210) in a single layer or a double layer. Here, the metal constituting the first metal layer is a metal that is resistant to an etchant used to etch the substrate 200.

Subsequently, after the photoresist layer 220 is coated on the first metal layer, the first photoresist layer is exposed and developed to remove a predetermined width of the first photoresist layer, thereby forming a first photoresist layer pattern 220. Subsequently, the first metal layer pattern 210 may be removed by removing a predetermined width W by using the first photoresist pattern 220 as a mask. In the illustrated figure, it is observed that the first photoresist layer pattern 220 has a smaller width than that of the first metal layer pattern 210, which relatively forms the first metal layer pattern 210. This is because, in the etching process, the first metal layer pattern 210 may be etched more than the width covered by the first photoresist pattern 220.

Subsequently, the surface of the exposed substrate 200 under the first metal layer pattern 210 is etched using the first metal layer pattern 210 and the first photoresist layer pattern 220 as a mask to form a first depth ( The first trench 155 of D1) is formed. In the process of etching the surface of the substrate 200, isotropic etching occurs. At this time, in the open portion of the substrate 200 corresponding to the edge where the first metal layer pattern 210 is opened, the first portion is formed. An arc-shaped etch is performed with the edge of the metal layer pattern 210 as the center of the circle, and is etched into an undercut shape. Therefore, a circular arc shape having a length of about 'C' as a radius is more etched on both sides of the first trench than the width W of the region where the first metal layer pattern 210 is opened. 155 is formed to further enter a width of about 'C' in the remaining portion of the first metal layer pattern 210.

Meanwhile, the first photoresist pattern 220 may be removed before etching the substrate 200.

Subsequently, as shown in FIG. 6B, a metal such as nickel (Ni) may be formed on the substrate 200 including the surface of the first trench 155 on the first metal layer pattern 210 by electroless plating. Thus, the second metal layer 117 and the same layer are formed. According to the electroless plating method, the second metal layer may be normally deposited even under the first metal layer pattern 210 inside the first trench 155, and thus the substrate using the second metal layer as a mask. Etch may be made in the desired shape.

The electroless plating method is performed by autocatalytically reducing metal ions in an aqueous metal salt solution by the force of a reducing agent without receiving electrical energy from the outside, thereby depositing a metal on the surface of the object to be treated. Examples of the metal to be formed include copper (Cu), nickel-phosphorus (Ni-P), nickel-boron (Ni-B) alloys, and the like, in addition to nickel (Ni) described above. The second metal layer by the electroless plating method is dense and may be formed to have a uniform thickness.

In this case, the formed second metal layer is formed together with the surface of the first trench 155, the exposed surfaces of the first metal layer pattern 210 (side and bottom surfaces positioned on the first trench), and the first metal layer. The photosensitive film pattern 220 is also formed together. If the first photoresist pattern 220 is removed in the process of FIG. 6A, the deposition of the second metal layer may be performed on the upper surface of the first metal layer pattern 210.

Subsequently, a second photoresist film is coated on the second metal layer, and the second photoresist film is selectively removed by exposure and development by using the first metal layer pattern 210 as a mask to form the inside of the first trench 155. The second photoresist layer pattern 119 is formed below the first metal layer pattern 210.

Subsequently, the second metal layer is selectively removed using the second photosensitive film pattern 119 as a mask to form a second metal layer pattern 117.

As illustrated in FIG. 6C, the substrate 200 is etched using the first metal layer pattern 210 and the second photoresist layer pattern 119 and the second metal layer pattern 117 at the edge of the first trench as a mask. To form a second trench 165.

As such, in the process of forming the second trench 165, the second photoresist layer pattern 119 together with the second metal layer pattern 117 formed by the electroless plating method is used as a mask. Due to the poor adhesion to the surface, only a photoresist film cannot be used as a single layer, and a thin metal layer alone causes a pattern defect caused by a single particle, micro pinhole, or erosion. This is because it cannot be used as a single film. Accordingly, the second metal layer pattern 117 having good adhesion is positioned under the second photosensitive film pattern 119. The second metal layer pattern 117 is formed by an electroless plating method, and a metal layer is deposited on the surface of the edge of the first trench 155 covered by the first metal layer pattern 210 by sputtering. This is to improve this because it is not supported.

By etching the exposed portion of the substrate 200 using the second photoresist layer pattern 119 and the second metal layer pattern 117 as a mask, the first height of the first trench 155 is relatively increased. A second trench 165 having a second height D2 ′ of up to about 120 to 130% as compared to D1 may be formed. Here, the second trench 165 may be formed in the first trench 155 in the same manner as the shape of the first trench 155, and the second photoresist layer pattern 119 and the second metal layer pattern 117 may be removed to expose the substrate 200. The substrate is exposed on the surface and is etched equally to the second height D2 ′ from the surface of the exposed substrate 200, and the second photoresist pattern 119 and the first metal layer pattern 210 and the exposed substrate are exposed. From this encountering corner, it is further etched into an arc shape having the same length as a radius to form an undercut shape.

Subsequently, the second photoresist pattern 119 and the first photoresist pattern 220 are removed through a photosensitive material stripper.

Subsequently, the first metal layer pattern 210 and the second metal layer pattern 117 in the first trench 155 on the surface of the substrate 200 are etched and removed by an etchant.

As described above, the first and second trenches 155 and 165 formed as described above together function as the recessed pattern 180 on the substrate 200, and thus, the substrate 200 having the recessed pattern 180. ) Serves as a printing plate.

Then, the formation of the metal layer pattern corresponding to the lower side of the first metal layer pattern 210 by the electroless plating method on the surface of the second trench 165, and the etching of the substrate 200 using the same are repeated. By forming a trench of a predetermined depth, it is possible to form a final recess pattern of the desired depth. In this case, etching of the substrate 200 may further include a photosensitive film pattern in the second trench corresponding to the lower side of the first metal layer pattern after the metal layer pattern is formed.

The etching solution for forming the first and second trenches 155 and 165 of the substrate 200 uses an etching solution including hydrofluoric acid (HF).

Next, what is applied to manufacture of a liquid crystal display device by applying the printing plate manufacturing method of this invention is demonstrated.

A preferred method of forming a pattern using the printing plate manufactured by the above-described printing plate manufacturing method will be described in detail with reference to FIGS. 7A to 7C.

First, as shown in FIG. 7A, the pattern material 330 is applied to the printing roll 320 through the printing nozzle 310.

Subsequently, as shown in FIG. 7B, the printing roll 320 coated with the pattern material 330 is rotated on the printing plate (see 200 of FIG. 5) manufactured by the above-described printing plate manufacturing method, thereby partially patterning material 330b. ) Is transferred onto the printing plate. In this case, the pattern material 330b is transferred to the remaining surfaces except for the recessed part pattern 180 of the printing plate (see 200 of FIG. 5). In this case, the pattern material 330a which is not transferred remains on the printing roll 320.

Subsequently, as illustrated in FIG. 7C, the printing roll 320 is rotated on the substrate 500 to be patterned to transfer the pattern material 330a remaining on the printing roll 320 onto the substrate 500.

As such, a predetermined pattern may be formed on the substrate 500 by transferring the remaining pattern material 330a of the printing roll 320 onto the substrate 500, as in FIGS. 7A to 7C. have.

Here, the substrate 500 may be, for example, a substrate forming a color filter array in a liquid crystal display device. In this case, the patterned material layer may be a black matrix layer, a plurality of color filter layers, or both of the color filter arrays.

In addition, the method of patterning the substrate 500 may be used in a method of forming an organic thin film including an organic light emitting layer of the organic light emitting device.

For example, a method of patterning the substrate 500 may be used to manufacture a liquid crystal display, although not illustrated as follows.

That is, the 1st, 2nd board | substrate is prepared.

The first substrate is a color filter array substrate including the above-described black matrix layer and a color filter layer, and the second substrate crosses each other with a gate wiring and a data wiring defining a pixel region, and an intersection of the gate wiring and the data wiring. A thin film transistor array substrate including a thin film transistor in a region and a pixel electrode connected to the thin film transistor. For example, patterning using a printing plate manufactured by the method described above is performed in an organic thin film forming process such as a black matrix layer or a color filter layer formed on the first and second substrates.

Next, a liquid crystal layer is formed between the first substrate and the second substrate. At this time, in the process of forming the liquid crystal layer, a sealing material without an injection hole is formed on any one of the first substrate and the second substrate, the liquid crystal is dropped on the substrate on which the sealing material is formed, and then the first and second substrates are bonded together. After forming the sealing material to form an injection hole in any one of the first substrate and the second substrate or the two substrates are bonded to each other, and then the liquid crystal is injected using the capillary phenomenon and the pressure difference through the injection hole Can be formed.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and it is common in the art that various substitutions, modifications, and changes can be made without departing from the technical spirit of the present invention. It will be evident to those who have knowledge of.

The manufacturing method of the printing plate of the present invention as described above and the manufacturing method of the liquid crystal display device using the same have the following effects.

In forming the recessed part pattern of the printing plate, when it is difficult to realize the recessed part pattern having a desired depth by one etching, a process of forming the recessed part pattern is performed by forming trenches of a plurality of laminated structures. At this time, after forming the trench, after forming the first trench, a second metal layer is formed in the edge of the first metal layer pattern remaining on the substrate surface and the lower portion of the first trench in the first trench by electroless plating. The substrate etching process is performed by filling the photoresist material in the remaining region, and bordering the first metal layer pattern. Through the electroless plating method, the metal layer is well deposited on the edge of the first trench covered by the first metal layer pattern on the surface of the substrate, and a photoresist film is formed on the surface of the first metal layer pattern. It is used as a mask, it is possible to stably etch the substrate in the depth direction so that pinholes or pattern defects do not occur.

In forming a plurality of trenches, it is possible to form trenches in the depth direction without variation in the width of the trenches in each layer. Therefore, the etching rate is improved in the depth direction without changing the width of the trench toward the lower trench toward the substrate surface, that is, the high aspect ratio can be realized, so that the desired depth recess pattern can be realized even if the number of trench formation is reduced. This is possible. Therefore, the process time and the number of times for manufacturing a printing plate can be reduced, and a yield improvement can be expected accordingly.

Claims (16)

Depositing a first metal layer and a first photoresist film on the substrate, and forming a first photoresist pattern by an exposure and development process; Using the first photoresist pattern as a mask and removing the first metal layer to form a first metal layer pattern having a first open portion on the substrate; Etching the substrate using the first photoresist pattern and the first metal layer pattern to form a first trench; Forming a second metal layer on the substrate including the surface of the first trench by an electroless plating method, and forming a second photosensitive film on the second metal layer; Exposing and developing the second photoresist layer using the first metal layer pattern as a mask to form a second photoresist pattern in the first trench below the first metal layer pattern; Forming a second metal layer pattern having a shape remaining in the first trench under the first metal layer pattern by using the second photoresist pattern as a mask and selectively removing the second metal layer; And And using the first metal layer pattern, the second photoresist pattern, and the second metal layer pattern as a mask and etching the substrate to form a second trench. delete The method of claim 1, And after forming the first metal layer pattern, the first photosensitive film pattern remains upon formation of the second metal layer. The method of claim 1, In the forming of the second metal layer, The second metal layer includes a surface of the first trench, and is formed together with the surface and side surfaces of the first photoresist pattern and the first metal layer pattern exposed on the upper portion of the first trench. Manufacturing method. delete delete delete The method of claim 1, The first metal layer pattern is a manufacturing method of the printing plate, characterized in that made of a metal with corrosion resistance compared to the substrate etching solution. 9. The method of claim 8, The first metal layer pattern may include chromium, molybdenum, copper, indium tin oxide (ITO), indium zinc oxide (IZO), and indium tin-zinc-oxide (ITZO). Zinc Oxide) is formed using at least one of the manufacturing method of the printing plate. The method of claim 1, The second metal layer is any one of nickel (Ni), copper (Cu), nickel-phosphorus (Ni-P), nickel-boron (Ni-B) alloy manufacturing method of the printing plate. The method of claim 1, And etching the substrate for forming the first and second trenches using an etching solution containing hydrofluoric acid (HF). The method of claim 1, The third photoresist pattern and the third metal layer pattern are formed under the first metal layer pattern on the second trench in the same manner as the second photoresist pattern and the second metal layer pattern formation method, and then the substrate is formed using the second photoresist pattern. And etching to form a third trench. 13. The method of claim 12, Forming a trench of a predetermined depth on the surface of the second trench by repeating formation of a metal layer pattern corresponding to a lower side of the first metal layer pattern by an electroless plating method and etching of the substrate using the same; The manufacturing method of the printing plate characterized by the above-mentioned. delete Preparing first and second substrates facing each other; Forming a light blocking layer and a plurality of color filter layers on the first substrate; Forming a thin film transistor array on the first substrate; And Forming a liquid crystal layer between the first and second substrates; At least one of the light blocking layer and the plurality of color filter layers is formed using a printing plate manufactured by any one of claims 1, 3, 4, and 8 to 13. The manufacturing method of the liquid crystal display device. 16. The method of claim 15, The step of forming a pattern using the printing plate produced by any one of claims 1, 3 to 4, 8 to 13 Applying a light blocking material or a color filter forming material to a printing roll; Rotating the printing roll coated with the light blocking material or the color filter forming material on the printing plate to transfer some of the light blocking material or the color filter forming material onto the printing plate; And And rotating the printing roll on the first substrate to transfer the light blocking material or the color filter forming material remaining on the printing roll onto the substrate.

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