KR20100072969A - Method of fabricating cliche for roll print and method of fabricating liquid crystal display device using thereof - Google Patents

Abstract

PURPOSE: A method of manufacturing a printing plate of roll print and a method for manufacturing a liquid crystal display device using the same are provided to prevent loss of a resist ink pattern by printing pressure. CONSTITUTION: A fixed mask pattern made of metal is formed on a glass. An edge part of a pattern is defined within a printing plate(200) by performing the first wet etching on the mask pattern shallowly. The second groove(h2) whose width is narrower and depth is deeper than the first groove by the second layer process in the pattern including the first groove(h1). The laser includes ND-YAG laser, Co2 laser, semiconductor laser, pico laser, and femto laser.

Description

Manufacturing method of printing plate for roll printing and manufacturing method of liquid crystal display device using the same {METHOD OF FABRICATING CLICHE FOR ROLL PRINT AND METHOD OF FABRICATING LIQUID CRYSTAL DISPLAY DEVICE USING THEREOF}

The present invention relates to a method of manufacturing a printing plate for roll printing and a method of manufacturing a liquid crystal display device using the same, and more particularly, a roll capable of preventing the loss of a resist ink pattern in manufacturing a printing plate for a roll offset printing method. A manufacturing method of a printing plate for printing and a method of manufacturing a liquid crystal display device using the same.

Recently, with increasing interest in information display and increasing demand for using a portable information carrier, a lightweight flat panel display (FPD), which replaces a conventional display device, a cathode ray tube (CRT), is used. The research and commercialization of Korea is focused on. In particular, the liquid crystal display of the flat panel display device is an image representing the image using the optical anisotropy of the liquid crystal, and has been actively applied to notebooks and desktop monitors because of its excellent resolution, color display and image quality.

The liquid crystal display is largely composed of a color filter substrate and an array substrate, and a liquid crystal layer formed between the color filter substrate and the array substrate.

The active matrix (AM) method, which is a driving method mainly used in the liquid crystal display device, is a method of driving a liquid crystal of a pixel part using an amorphous silicon thin film transistor (a-Si TFT) as a switching element. to be.

Hereinafter, a structure of a general liquid crystal display device will be described in detail with reference to FIG. 1.

1 is an exploded perspective view schematically illustrating a general liquid crystal display.

As shown in the figure, the liquid crystal display device is largely a liquid crystal layer (liquid crystal layer) formed between the color filter substrate 5 and the array substrate 10 and the color filter substrate 5 and the array substrate 10 ( 30).

The color filter substrate 5 includes a color filter C composed of a plurality of sub-color filters 7 for implementing colors of red (R), green (G), and blue (B); A black matrix 6 that separates the sub-color filters 7 and blocks light passing through the liquid crystal layer 30, and a transparent common electrode that applies a voltage to the liquid crystal layer 30. 8)

In addition, the array substrate 10 may be arranged vertically and horizontally to define a plurality of gate lines 16 and data lines 17 and a plurality of gate lines 16 and data lines 17 that define a plurality of pixel regions P. A thin film transistor T, which is a switching element formed in the cross region, and a pixel electrode 18 formed on the pixel region P are included.

The color filter substrate 5 and the array substrate 10 configured as described above are joined to face each other by sealants (not shown) formed on the outer side of the image display area to form a liquid crystal display panel. 5) and the array substrate 10 are bonded through a bonding key (not shown) formed in the color filter substrate 5 or the array substrate 10.

The manufacturing process of the liquid crystal display device basically requires a plurality of photolithography processes to manufacture an array substrate and a color filter substrate including a thin film transistor.

In addition, in order to form a predetermined pattern generally applied to information storage, a small sensor, a photonic crystal and an optical element, a microelectromechanical element, a display element, a display, and a semiconductor, the above-mentioned photo-forming pattern is formed using light. The lithography process is used.

The photolithography process is a series of processes in which a pattern drawn on a mask is transferred onto a substrate on which a thin film is deposited to form a desired pattern as one of photolithography processes. It consists of a process.

First, a photoresist as a photosensitive material is applied onto a thin film to form a predetermined pattern, and then the photomask on which the pattern is formed is aligned and an exposure process is performed. In this case, the photomask to be used is composed of a predetermined transmission region and a blocking region, and light passing through the transmission region chemically changes the photoresist.

The chemical change of the photoresist varies depending on the type of photoresist. The positive type photoresist is changed to a property in which the lighted part is dissolved by the developer, and the negative type photoresist is opposite to the developer. It is changed to a property that does not dissolve. Here, the case where the positive type photoresist is used is demonstrated as an example.

When the exposed portion of the photoresist is removed using a developer following the exposure process, a predetermined photoresist pattern is formed on the thin film.

Thereafter, the thin film is etched in the form of the photoresist pattern, and the remaining photoresist pattern is removed to form a thin film pattern of a predetermined shape.

In this case, as the ultrafine pattern progresses, the initial investment cost is increased due to the expensive exposure equipment, and a high resolution mask is required. In addition, each time the pattern is formed, complex processes such as exposure, post-exposure bake, development, post-development bake, etching process, and cleaning process must be performed, resulting in a long process time and repeated photo processes. There is a problem of this deterioration.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a method of manufacturing a printing plate for roll printing and a method of manufacturing a liquid crystal display device using the same by replacing photolithography technology.

Another object of the present invention is to provide a method of manufacturing a printing plate for roll printing and a method of manufacturing a liquid crystal display device using the same so as to prevent the loss of a resist ink pattern in manufacturing a printing plate for a reverse offset roll printing.

Other objects and features of the present invention will be described in the configuration and claims of the invention described below.

In order to achieve the above object, the manufacturing method of the printing plate for roll printing of the present invention comprises the steps of forming a predetermined mask pattern made of metal on the glass; Performing first wet etching to a low depth using the mask pattern as a mask to define edge portions of the pattern in the printing plate; And forming a secondary groove having a narrower width and a deeper depth than the primary groove by performing secondary processing with a laser in the pattern including the primary groove.

A method of manufacturing a liquid crystal display device according to the present invention includes providing a color filter substrate and an array substrate on which an etching target layer is formed; Applying a predetermined resist ink to a roll; Forming a predetermined mask pattern made of metal on glass, performing primary wet etching to a low depth with the mask pattern as a mask, defining an edge portion of the pattern in the printing plate, and in the pattern including primary grooves. Preparing a printing plate having a convex pattern, including forming a secondary groove having a width narrower and deeper than the primary groove by performing secondary processing with a laser; Forming a predetermined resist pattern on the surface of the roll by rotating the resist ink-coated roll in contact with the printing plate on which the convex pattern is formed to remove the resist ink in contact with the convex pattern from the roll; Transferring the roll onto the color filter substrate and the array substrate to transfer the resist pattern onto the etching target layer; Etching the etching target layer using the transferred resist pattern to form a thin film transistor array on the array substrate, and forming a black matrix on the color filter substrate; And bonding the color filter substrate and the array substrate.

As described above, the manufacturing method of the printing plate for roll printing according to the present invention and the manufacturing method of the liquid crystal display device using the same in manufacturing a reverse offset roll printing printing plate, by first performing wet etching to a low depth first After the line width is realized, the inside of the pattern is processed secondly with a laser to secure the pattern depth, thereby preventing the loss of the resist ink pattern due to the printing pressure. As a result, roll printing pattern defects are reduced, and fine patterns can be formed precisely and uniformly, thereby providing an effect of improving yield. In addition, the process margin of the printing pressure is widened to provide an effect of improving the efficiency of the process.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the manufacturing method of the printing plate for roll printing according to the present invention and the manufacturing method of the liquid crystal display device using the same.

2A to 2E are cross-sectional views sequentially illustrating a pattern forming method using a roll print according to an embodiment of the present invention.

As shown in FIG. 2A, first, a blanket 155 is formed on the surface of the cylindrical roll 150, and then the resist ink is applied to the surface of the blanket 155 through a resist ink supply device 170. The resist ink film 160 is formed.

Here, the roll printing method according to the embodiment of the present invention is a method for solving the problem of the conventional photolithography technology, and instead of the high-resolution mask used when forming a pattern in the conventional photolithography process, a silicone polymer and a cliché ( Using a cliche) to form a fine pattern through a direct pattern transfer to the substrate to form a fine pattern.

In this case, the roll printing method includes a gravure offset method of intaglio printing in which an image to be printed is cut into the printing plate surface and a reverse offset for removing unnecessary portions by using a convex pattern of the printing plate. There is a method, but the embodiment of the present invention uses the reverse offset method as an example. However, the present invention is not limited to the reverse offset roll print method.

Subsequently, as shown in FIG. 2B, after preparing a printing plate 100 having a plurality of convex patterns formed on the surface thereof, the roll 150 having the resist ink film 160 formed on the surface of the printing plate 100 is brought into contact with each other. As it rotates, the resist ink in contact with the convex pattern 101 of the printing plate 100 is removed from the blanket 155 and does not contact the convex pattern 101 of the printing plate 100. A predetermined resist ink pattern 165 is formed on the surface.

Next, as shown in FIG. 2C, a predetermined etching target layer 140a is formed on the surface of the substrate 110 on which the predetermined pattern is to be formed.

In this case, the etching target layer 140a may be a metal layer, a semiconductor layer, or an insulating layer. In the case of the metal layer, a metal material is deposited on the substrate 110 by sputtering, and in the case of the semiconductor layer, plasma chemical vapor deposition. An amorphous semiconductor such as silicon or a crystalline semiconductor is deposited on the substrate 110 by a Plasma Enhanced Chemical Vapor Deposition (PECVD) method. In the case of the insulating layer, an inorganic material is laminated by chemical vapor deposition or an organic material is coated by spin coating or the like.

Subsequently, the resist ink pattern 165 remaining on the roll 150 is rotated by rotating the roll 150 in which the resist ink pattern 165 remains on the surface in contact with the etching target layer 140a of the substrate 110. The resist pattern 180 is transferred onto the etching target layer 140a by heating the resist ink pattern 165 transferred to the etching target layer 140a at a temperature of about 150 ° C. Will form.

After that, as shown in FIG. 2D, the etching target layer 140a is selectively etched by applying an etchant to the etching target layer 140a while blocking a part of the etching target layer 140a with the resist pattern 180. As a result, a predetermined pattern 140 is formed under the resist pattern 180.

In this case, when the etching target layer 140a is a metal layer, an acidic etching solution such as hydrofluoric acid (HF) is applied to etch the etching target layer 140a. In the case of a semiconductor layer or an insulating layer, the etching target layer 140a is etched using an etching gas. Will be etched.

Subsequently, as shown in FIG. 2E, the resist pattern 180 is removed to form the pattern 140 on the substrate 110.

In general, the printing plate used in the roll printing method is made of glass, and in this case, in order to manufacture the printing plate, a pattern is formed of metal on the glass, and then a wet etching method using HF is applied. do.

At this time, the wet etching method has an isotropy characteristic, so that the deeper the depth of the printing plate is, the larger the CD (Critical Dimension) becomes and the width of the concave pattern formed on the printing plate becomes wider.

Here, as described above, the reverse offset roll printing method is a method of transferring the resist ink pattern remaining on the roll to the substrate by finally removing the unnecessary portion of the resist ink film using the convex portion of the printing plate, that is, the convex pattern. . At this time, the convex portions of the printing plate touch the roll surface, and the concave portions between the convex portions do not touch the roll surface so that the resist ink pattern is formed accurately.

At this time, referring to Figure 3, the width of the pattern to be patterned on the substrate by the roll printing method, and thus the convex pattern formed on the printing plate 100 has a variety of widths. In addition, concave patterns (eg, A and B) of the printing plate 100 formed between the convex patterns also have various widths.

Here, in the roll printing method, since the rubber-based elastic body 155 of the silicon series is printed on the surface of the roll 150, the rubber is printed on the concave patterns A and B of the printing plate 100 by the printing pressure. May cause some of the resist ink patterns to be lost.

Thus, even if the silicone rubber is crushed by the printing pressure, the narrow width pattern (B) does not reach the bottom even if the depth of the printing plate 100 is shallow, but in the case of the wide pattern (A), the silicone rubber A part of the resist ink pattern may be lost by touching the bottom.

In this case, when the depth of the printing plate 100 is deep or the widths of the concave patterns A and B are narrow, there is no problem in that the silicone rubber reaches the bottom and the pattern is lost. However, as described above, the pattern to be patterned on the substrate coexists with a narrow pattern and a wide pattern. Accordingly, the concave patterns A and B of the printing plate 100 also have a narrow pattern B and a narrow pattern. A wide pattern (A) coexists, and in this case, the wide plate (A) has to form a printing plate deeper than the narrow pattern (B).

Accordingly, in the embodiment of the present invention, the wet etching is first performed at a low depth to realize a fine line width, and then the groove is second processed using a laser to secure the depth while maintaining the shape of the edge portion of the internal pattern of the printing plate. The present invention will be described in detail with reference to the accompanying drawings.

4A to 4D are cross-sectional views sequentially illustrating a method of manufacturing a roll offset printing plate for printing according to an embodiment of the present invention, wherein patterns having line widths of W1 μm and W2 μm (W1 <W2) are formed on the printing plate. The process of doing this is shown as an example.

As shown in FIG. 4A, a predetermined mask pattern 300 is formed of metal on the surface of the printing plate 200 made of glass.

At this time, the mask pattern 300 is wet etching having the same distance as the distance etched in the vertical direction and the distance etched in the horizontal direction when the line width of the pattern to be formed in the printing plate 200 is W1 μm and W2 μm (W1 <W2). In consideration of the isotropy of W1 '탆 and W2' 탆, a permeable portion is formed.

In the case of etching to a depth of d1 based on the narrow line width W1, the W1 'mu m and the W2' mu m may be selected as (W1-2d1) mu m and (W2-2d2) mu m, respectively. For example, when W1 and W2 are 7 µm and 20 µm, and d1 is 2 µm, respectively, W1 'and W2' may be 3 µm and 16 µm, respectively.

Next, when first etching to the depth of the d1 by the wet etching method using HF, etc., as shown in Figure 4b, the first concave pattern (B) having a width of W1 and a depth of d1 in the printing plate 200 ) And a second concave pattern A 'having a width of W2 and a depth of d1.

At this time, the first concave pattern (B) having a width of W1 has a narrow width of the pattern so that silicone rubber does not touch the bottom, but in the second concave pattern (A ') having a width of W2 of 20 μm or more, There is a possibility that the rubber will reach the bottom and the pattern will be lost.

Therefore, as shown in FIG. 4C, the bottom of the second concave pattern A 'having a wide width is subjected to a second process using a laser, so that a third having a width of W2 and a depth of d2 (10-100 μm) is obtained. The concave pattern A is formed.

At this time, since the edge portion of the second concave pattern (A ') has excellent straightness by the wet etching, the inside of the second concave pattern (A') is processed with a laser so as not to damage the edge portion. .

In addition, an ND-YAG laser, a Co ₂ laser, a semiconductor laser, a pico laser and a femto laser may be used as the laser.

Accordingly, as shown in FIG. 4D, the third concave pattern A has a width narrower than the primary groove h1 by the primary groove h1 formed by wet etching and a laser and has a depth d2. The deep groove (h2) is to be processed.

For reference, FIG. 5 is a photograph showing a cross section of a glass processed using a laser, and referring to the drawing, it can be seen that the straightness of the glass edge portion is poor.

Therefore, it is difficult to form a fine pattern on the printing plate directly by using a laser, it is necessary to define the edge portion of the pattern by wet etching, and then to etch the inside of the pattern, that is, the center portion using a laser to secure the desired depth.

Hereinafter, a method of manufacturing an actual liquid crystal display using the roll printing plate as described above will be described in detail.

6A to 6H are cross-sectional views sequentially illustrating a method of manufacturing a liquid crystal display using a roll printing plate according to an embodiment of the present invention.

First, as shown in FIG. 6A, the first etching target layer 240a including the first conductive layer is formed on the entire surface of the array substrate 210 made of a transparent material such as glass.

In this case, the first conductive layer may be formed of aluminum (Al), aluminum alloy, tungsten (W), copper (Cu), chromium (Cr), and molybdenum (Al) to form a gate electrode. Low resistance opaque conductive materials such as molybdenum (Mo), molybdenum alloy (Mo alloy) and the like can be used. In addition, the first conductive film may be formed in a multilayer structure in which two or more low-resistance conductive materials are stacked.

Subsequently, a predetermined resist ink is applied to the roll surface, as shown in FIGS. 2A and 2B, and a portion is removed by a printing plate according to an embodiment of the present invention to form a resist ink pattern. By rotating in contact with the first etching target layer 240a, the resist ink pattern is transferred onto the first etching target layer 240a to form a first resist pattern 280a.

Thereafter, the first etching target layer 240a is selectively etched with the first resist pattern 280a as a mask and a part of the first etching target layer 240a is blocked, as shown in FIG. 6B. The gate electrode 211 including the first conductive layer is formed on the array substrate 210.

A gate insulating layer 215a made of a silicon nitride film or a silicon oxide film is formed on the entire array substrate 210 on which the gate electrode 211 is formed. In this case, the gate insulating layer 215a may be formed of an organic insulating layer such as photoacryl or benzocyclobutene (BCB).

Next, as shown in FIG. 6C, after depositing an amorphous silicon thin film or the like on the entire surface of the array substrate 210 on which the gate electrode 211 is formed, the array substrate 210 is selectively etched through a photolithography process. A predetermined semiconductor layer 224 is formed over the gate electrode 221 of the gate.

In this case, the semiconductor layer 224 may be formed using the roll printing method of the present invention.

Thereafter, a second etching target layer 240b including a second conductive layer is formed on the entire surface of the array substrate 210 on which the semiconductor layer 224 is formed.

In this case, the second conductive layer may use a low resistance opaque conductive material such as aluminum, aluminum alloy, tungsten, copper, chromium, molybdenum, molybdenum alloy, etc. to form the source electrode and the drain electrode. In addition, the second conductive layer may be formed in a multilayer structure in which two or more low-resistance conductive materials are stacked.

Subsequently, a predetermined resist ink is applied to the roll surface, as shown in FIGS. 2A and 2B, and a portion is removed by a printing plate according to an embodiment of the present invention to form a resist ink pattern. By rotating in contact with the second etching target layer 240b, the resist ink pattern is transferred onto the second etching target layer 240b to form a second resist pattern 280b.

Thereafter, the second etching target layer 240b is selectively etched with the second resist pattern 280b as a mask and a part of the second etching target layer 240b is blocked, as shown in FIG. 6D. Likewise, a source electrode 222 and a drain electrode 223 formed of the second conductive layer are formed on the array substrate 210.

The protective layer 215b made of an inorganic insulating film or an organic insulating film is formed on the entire surface of the array substrate 210 on which the source / drain electrodes 222 and 223 are formed, and then a portion of the protective layer 215b is etched. A contact hole exposing a part of the drain electrode 223 is formed.

In this case, the contact hole may be formed using the roll printing method of the present invention.

Thereafter, a third etching target layer 240c including a third conductive layer is formed on the entire surface of the array substrate 210 on which the protective layer 215b is formed.

In this case, the third conductive layer may use a transparent conductive material such as indium tin oxide or indium zinc oxide to form a pixel electrode.

Subsequently, a predetermined resist ink is applied to the roll surface, as shown in FIGS. 2A and 2B, and a portion is removed by a printing plate according to an embodiment of the present invention to form a resist ink pattern. By rotating in contact with the third etching target layer 240c, the resist ink pattern is transferred onto the third etching target layer 240c to form a third resist pattern 280c.

Subsequently, the third etching target layer 240c is selectively etched with a portion of the third etching target layer 240c blocked using the third resist pattern 280c as a mask, as shown in FIG. 6E. The pixel electrode 218 is formed to be electrically connected to the drain electrode 223 through the contact hole.

On the other hand, as shown in Figure 6f to manufacture a color filter substrate, a fourth etching consisting of a single layer of Cr, a double layer of Cr / CrO ₂ or an organic film on the color filter substrate 205 made of a transparent material such as glass The target layer 240d is formed.

Then, a predetermined resist ink is applied thereon, as shown in Figs. 2A and 2B, and after removing a portion by a printing plate according to an embodiment of the present invention to form a resist ink pattern, the roll Is rotated in contact with the fourth etching target layer 240d to transfer the resist ink pattern onto the fourth etching target layer 240d to form a fourth resist pattern 280d.

Thereafter, the fourth etching target layer 240d is selectively etched while the fourth etching target layer 240d is partially blocked using the fourth resist pattern 280d as a mask, as shown in FIG. 6G. The black matrix 206 is formed on the color filter substrate 205.

Subsequently, a color filter layer 207 including a red (R), green (G), and blue (B) color sub-color filter on the color filter substrate 205 on which the black matrix 206 is formed. Next, a common electrode 208 made of indium tin oxide or indium zinc oxide is formed thereon.

Next, as shown in FIG. 6H, after the color filter substrate 205 and the array substrate 210 are bonded together, the liquid crystal layer 230 is disposed between the color filter substrate 205 and the array substrate 210. By forming, a liquid crystal display device is manufactured.

In this case, the liquid crystal layer 230 may be formed by bonding the color filter substrate 205 and the array substrate 210 and then injecting liquid crystal therebetween, but on the color filter substrate 205 or the array substrate 210. After dispensing the liquid crystal, the color filter substrate 205 and the array substrate 210 are bonded together and a pressure is applied to the entire liquid crystal between the bonded color filter substrate 205 and the array substrate 210. It can form by distributing uniformly over.

The printing plate for roll printing according to the embodiment of the present invention having the above characteristics can be used to form a fine pattern applied to information storage, small sensor, photonic crystal and optical element, microelectromechanical element, display element, display and semiconductor. have.

Many details are set forth in the foregoing description but should be construed as illustrative of preferred embodiments rather than to limit the scope of the invention. Therefore, the invention should not be defined by the described embodiments, but should be defined by the claims and their equivalents.

1 is an exploded perspective view schematically showing a general liquid crystal display device.

2A to 2E are cross-sectional views sequentially illustrating a pattern forming method using a roll print according to an embodiment of the present invention.

3 is a cross-sectional view showing a phenomenon in which a resist ink pattern is lost due to printing pressure in producing a roll offset printing plate.

4A to 4D are cross-sectional views sequentially showing a manufacturing method of a roll offset printing plate of a reverse offset method according to an embodiment of the present invention.

5 is a photograph showing a cross section of a glass processed using a laser.

6A through 6H are cross-sectional views sequentially illustrating a method of manufacturing a liquid crystal display device using a printing plate for roll printing according to an embodiment of the present invention.

DESCRIPTION OF REFERENCE NUMERALS

100,200: printing plate 110,210: substrate

140a, 240a ~ 240d: Etch target layer 140: Pattern

150: roll 155: blanket

160: resist ink film 165: resist ink pattern

180: resist pattern

Claims (11)

Forming a predetermined mask pattern made of metal on the glass; Performing first wet etching to a low depth using the mask pattern as a mask to define edge portions of the pattern in the printing plate; And And forming a secondary groove having a narrower depth and a deeper depth than the primary groove by performing secondary processing with a laser in the pattern including the primary groove. The method of claim 1, wherein the laser comprises an ND-YAG laser, a Co ₂ laser, a semiconductor laser, a pico laser, a femto laser, or the like. According to claim 1, wherein the mask pattern has a line width of the pattern to be formed in the printing plate, for example, W1 ㎛ and W2 ㎛ (W1 <W2) the distance etched in the vertical direction and the distance etched in the horizontal direction A transmissive part is formed in the width of W1'micrometer and W2'micrometer respectively, considering the isotropy of the same wet etching, The manufacturing method of the printing plate for roll printing characterized by the above-mentioned. The method of claim 3, wherein when etching to a depth of d1 based on a narrow line width W1, the W1 ′ μm and the W2 ′ μm are selected to be (W1-2d1) μm and (W2-2d2) μm, respectively. The manufacturing method of the printing plate for roll printing. The method of claim 4, wherein the first etching is performed to the depth of d1 to form a first concave pattern having a width of W1 and a depth of d1 and a second concave pattern having a width of W2 and a depth of d1 in the printing plate. The manufacturing method of the printing plate for roll printing which uses to be. The method of claim 5, wherein the bottom of the second wide concave pattern having a second width using a laser to form a third concave pattern having a width of W2 and a depth of d2 (10 ~ 100㎛). The manufacturing method of the printing plate for roll printing which uses to be. The method of claim 1, wherein the secondary groove processed by the laser is formed inside the pattern so as not to damage the edge portion of the primary groove formed by wet etching. . Providing a color filter substrate and an array substrate on which an etching target layer is formed; Applying a predetermined resist ink to a roll; Forming a predetermined mask pattern made of metal on glass, performing first wet etching to a low depth using the mask pattern as a mask, defining an edge portion of the pattern in the printing plate, and the pattern including a first groove Preparing a printing plate having a convex pattern, including forming a secondary groove having a width narrower and deeper than the primary groove by performing secondary processing with a laser in the laser beam; Forming a predetermined resist pattern on the surface of the roll by rotating the resist ink-coated roll in contact with the printing plate on which the convex pattern is formed to remove the resist ink in contact with the convex pattern from the roll; Transferring the roll onto the color filter substrate and the array substrate to transfer the resist pattern onto the etching target layer; Etching the etching target layer using the transferred resist pattern to form a thin film transistor array on the array substrate, and forming a black matrix on the color filter substrate; And And attaching the color filter substrate and the array substrate to each other. The method of claim 8, wherein the etching target layer comprises a metal layer, a semiconductor layer, and an insulating layer. The method of claim 8, further comprising forming a color filter layer on the color filter substrate by etching the etching target layer using the transferred resist pattern. 9. The method of claim 8, further comprising: applying a predetermined color ink to a roll; Preparing a printing plate including a convex pattern having a shape substantially the same as a color filter pattern to be formed; Forming a sub-color filter pattern on the surface of the roll by rotating the color ink-coated roll in contact with the printing plate on which the convex pattern is formed to remove the color ink in contact with the convex pattern from the roll; And And applying the roll to the color filter substrate having the black matrix formed thereon, thereby transferring the sub-color filter onto the color filter substrate to form a color filter layer.

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