KR20070094607A - 연성 회로 및 이의 제조 방법 - Google Patents

연성 회로 및 이의 제조 방법 Download PDF

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Publication number
KR20070094607A
KR20070094607A KR1020077013939A KR20077013939A KR20070094607A KR 20070094607 A KR20070094607 A KR 20070094607A KR 1020077013939 A KR1020077013939 A KR 1020077013939A KR 20077013939 A KR20077013939 A KR 20077013939A KR 20070094607 A KR20070094607 A KR 20070094607A
Authority
KR
South Korea
Prior art keywords
metal layer
dielectric
dielectric substrate
etchant
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020077013939A
Other languages
English (en)
Korean (ko)
Inventor
스리드하르 브이. 다사라타
제임스 에스. 므카티에
제임스 알. 쉬르크
히데오 야마자끼
유지 히로시게
마꼬또 세끼구치
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20070094607A publication Critical patent/KR20070094607A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020077013939A 2004-12-21 2005-12-13 연성 회로 및 이의 제조 방법 Withdrawn KR20070094607A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US63779704P 2004-12-21 2004-12-21
US60/637,797 2004-12-21
US11/294,828 US7364666B2 (en) 2004-12-21 2005-12-06 Flexible circuits and method of making same
US11/294,828 2005-12-06

Publications (1)

Publication Number Publication Date
KR20070094607A true KR20070094607A (ko) 2007-09-20

Family

ID=36596526

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077013939A Withdrawn KR20070094607A (ko) 2004-12-21 2005-12-13 연성 회로 및 이의 제조 방법

Country Status (6)

Country Link
US (1) US7364666B2 (enrdf_load_stackoverflow)
EP (1) EP1829439A1 (enrdf_load_stackoverflow)
JP (1) JP2008524871A (enrdf_load_stackoverflow)
KR (1) KR20070094607A (enrdf_load_stackoverflow)
TW (1) TW200638824A (enrdf_load_stackoverflow)
WO (1) WO2006068903A1 (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050023098A1 (en) * 2003-07-01 2005-02-03 Imad Mahawili Energy recovery system
US20090057084A1 (en) * 2004-06-30 2009-03-05 Energy Recovery Technology, Llc Energy recovery system
WO2006016473A1 (ja) * 2004-08-10 2006-02-16 Nippon Mining & Metals Co., Ltd. フレキシブル銅基板用バリア膜及びバリア膜形成用スパッタリングターゲット
US20070138153A1 (en) * 2005-12-20 2007-06-21 Redman Dean E Wide web laser ablation
US20080048817A1 (en) * 2006-07-26 2008-02-28 Energy Recovery Technology, Llc Circuit module
JP2009004588A (ja) * 2007-06-22 2009-01-08 Sumitomo Metal Mining Co Ltd 銅被覆ポリイミド基板
US7829794B2 (en) * 2007-09-13 2010-11-09 3M Innovative Properties Company Partially rigid flexible circuits and method of making same
US20090153099A1 (en) * 2007-12-17 2009-06-18 Energy Recovery Technology, Llc Method of electric energy transfer between a vehicle and a stationary collector
KR100939550B1 (ko) * 2007-12-27 2010-01-29 엘지전자 주식회사 연성 필름
WO2010036914A2 (en) * 2008-09-25 2010-04-01 Energy Recovery Technology, Llc. Vehicle energy recovery system
WO2010112375A1 (en) * 2009-03-31 2010-10-07 Dsm Ip Assets B.V. Polymer composition containing polybutylene terephthalate and flame retardant additives
US10798817B2 (en) * 2015-12-11 2020-10-06 Intel Corporation Method for making a flexible wearable circuit

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4425380A (en) * 1982-11-19 1984-01-10 Kollmorgen Technologies Corporation Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions
US5322976A (en) * 1987-02-24 1994-06-21 Polyonics Corporation Process for forming polyimide-metal laminates
JPH02144987A (ja) * 1988-11-26 1990-06-04 Sumitomo Metal Mining Co Ltd プリント配線板の製造方法
US4978422A (en) * 1990-03-20 1990-12-18 Macdermid, Incorporated Method for improving insulation resistance of printed circuits
EP0582411A3 (en) * 1992-07-31 1995-02-22 Gen Electric Chemical metallization processes.
JP2760952B2 (ja) * 1994-12-27 1998-06-04 インターナショナル・ビジネス・マシーンズ・コーポレイション 回路板の製造方法
US20020084248A1 (en) * 2000-08-01 2002-07-04 Kong Bobwen Zhont Wet etch process and composition for forming openings in a polymer substrate
KR100870221B1 (ko) * 2002-11-19 2008-11-24 우베 고산 가부시키가이샤 전도성 금속 도금 폴리이미드 기판
JP4081052B2 (ja) 2003-12-05 2008-04-23 三井金属鉱業株式会社 プリント配線基板の製造法

Also Published As

Publication number Publication date
WO2006068903A1 (en) 2006-06-29
JP2008524871A (ja) 2008-07-10
US7364666B2 (en) 2008-04-29
US20060134914A1 (en) 2006-06-22
TW200638824A (en) 2006-11-01
EP1829439A1 (en) 2007-09-05

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20070620

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid