KR20070071577A - Heater and electrostatic chuck - Google Patents

Abstract

A heater is provided to improve the reliability of electrical connection between a connector and a conductive member and between a connector and an electrode by including a connector receiving physical force in a plate direction and by completely sealing a connection portion between the connector and the conductive member from the external surroundings. An opening(112) is formed in an insulation plate(110). A conductive member(115) is built in the insulation plate, partially exposed through the opening. A connector(130) is inserted into the insulation plate through the opening so as to transfer power to the conductive member wherein a pressurizing part(135) is formed in the outer circumferential surface of the connector. A casing(140) is inserted into the outer circumferential surface of the connector, closely attaching the connector to the conductive member while pressurizing the pressurizing part in the direction of the conductive member. Adhesive(150,260) is formed between the inner surface of the opening and the connector, between the inner surface of the opening and the casing and between the connector and the casing so as to seal the inside of the opening.

Description

Heater and Electrostatic Chuck {HEATER AND ELECTROSTATIC CHUCK}

1 is a cross-sectional view illustrating a heater including a connector disclosed in the related art.

2 is a cross-sectional view illustrating a heater according to an embodiment of the present invention.

3 is a cross-sectional view illustrating a heater according to another embodiment of the present invention.

4 is a cross-sectional view illustrating a heater according to still another embodiment of the present invention.

5 is a cross-sectional view illustrating a heater according to still another embodiment of the present invention.

6 is a cross-sectional view for describing an electrostatic chuck according to still another embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

100, 200, 300, 400: Heater 110: Insulation plate

112: opening 115: conductive member

120,520 ： Conductive pads 130, 530 ： Connector

135, 535: Pressure part 140, 540: Casing

150: 1st adhesive agent 260: 2nd adhesive agent

425 and 525: auxiliary conductive member 500: electrostatic chuck

510: chucking plate 515: electrode

The present invention relates to a heater and a corrective chuck. More particularly, the present invention relates to a heater for generating heat for heating an object such as a wafer or a surface light source, and an electrostatic chuck for generating an electrostatic force for chucking a wafer located inside a processing chamber.

In general, a semiconductor device includes a Fab process for forming an electrical circuit on a wafer used as a semiconductor substrate, an electrical die sorting (EDS) process for inspecting electrical characteristics of semiconductor devices formed in the fab process, and Each semiconductor device is manufactured through a package assembly process for encapsulating and individualizing the epoxy resin.

The fab process includes a deposition process for forming a film on a wafer, a chemical mechanical polishing process for planarizing the film, a photolithography process for forming a photoresist pattern on the film, and the photoresist pattern using the photoresist pattern. An etching process for forming the film into a pattern having electrical characteristics, an ion implantation process for implanting specific ions into a predetermined region of the wafer, a cleaning process for removing impurities on the wafer, and a process for drying the cleaned wafer And a drying step and an inspection step for inspecting the defect of the film or pattern.

In various fab processes as described above, a heater for heating the semiconductor substrate and an electrostatic chuck for fixing the semiconductor substrate are almost used.

Heaters and electrostatic chucks used in semiconductor manufacturing processes have similar configurations. The heater may largely consist of a heating plate, a heating element, and a power supply unit, and the electrostatic chuck may largely consist of a chucking plate, an electrode, and a power supply unit. Therefore, in recent years, an electrostatic chuck heater having both a heater and an electrostatic chuck has been developed.

In order for the heater and the electrostatic chuck to function properly, they must be supplied with electrical power. This electrical power is supplied through a connector connecting the power supply unit and the plate. Hereinafter, a heater and an electrostatic chuck including a connector disclosed in the related art will be described in detail with reference to the accompanying drawings.

1 is a schematic cross-sectional view for explaining a heater including a connector disclosed in the prior art.

Referring to FIG. 1, the heater 10 includes a heating element 15, a heating plate 20 connector 30, and a casing 40.

The heating element 15 and the conductive pad 20 are embedded in the heating plate 20, and the conductive pad 20 is exposed through the opening 12 formed in the lower surface of the heating plate 20. The conductive pad 20 is electrically connected to the heating element 15 to indirectly expose the heating element 15.

The connector 30 is inserted into the heating plate 20 through the opening 12. The connector 30 is a member for receiving power from the power supply unit and transferring the power to the conductive pad 20, and is electrically connected to the conductive pad 20. To this end, the connector 30 is physically bonded to the conductive pad 20.

In order to bond the connector 30 to the conductive pad 20, a brazing method is generally used. In more detail, the filler 52 is inserted between the conductive pad 20 and the connector 30, that is, the bottom surface of the opening 12, and then the filler 52 is heated to a high temperature. The filler 52 melted by the heating is spread between the conductive pad 20 and the connector 30, and then the connector 30 is bonded to the conductive pad 20 through a cooling process. This is called brazing bonding.

The brazing method is also used to join the connector 30 and the casing 40 disposed around the connector 30. In more detail, the cylindrical casing 40 is fitted to the outer peripheral surface of the connector 30. The casing 40 is inserted into the opening 12 like the connector 30 to partially fill the empty space of the opening 12.

The casing 40 is longer than the depth of the opening 12 and protrudes into the bottom surface of the heating plate 20, and the flange of the connector 30 is brazed to the end of the protruding casing 40.

The filler 52 mostly consists of a gold or copper component and has a high melting temperature. The melting temperature of the general filler 52 is 700-1000 degreeC. That is, in order to perform the bonding process using the filler 52, high temperature heating equipment is essentially required. For this reason, the brazing joining process is subject to many spatial limitations.

In addition, when the heater 10 is locally or totally heated to a high temperature of 700 to 1000 ° C. for the brazing bonding process, the heater 10 is subjected to thermal stress, and components constituting the heater 10 are deformed. Or may be altered.

In addition, the filler 52 heated to such a high temperature may cause a problem such as a shrinkage cavity. In more detail, the filler 52 of the quasi-melt state or more tries to move to the conductive pad 20, the connector 30, and the casing 40 having good water ability by capillary action. As a result, the amount of the filler 52 to be present between the conductive pad 20 and the connector 30 is reduced, and voids 60 are generated between the conductive pad 20 and the connector 30.

The actual heater 10 is used with the heating plate 20 positioned on the connector 30 as opposed to that shown in FIG. 1. The connector 30 is mainly added in the opposite direction of the heating plate 20 including its own load, and the void 60, which was not large at the time of joining, also becomes larger as time passes.

The void 60 not only reduces the bonding force of the conductive pad 20 and the connector 30 but may also electrically short the conductive pad 20 and the connector 30. In more detail, generation of the void 60 in the filler 52 means a reduction in the bonding area of the conductive pad 20 and the connector 30, and the reduction in the bonding area results in a reduction in the bonding force. When the bonding force of the conductive pad 20 and the connector 30 decreases, the conductive pad 20 and the connector 30 are easily separated even by small force or stress.

When the short circuit problem described above occurs, it is common to completely disconnect the connector 30 from the heating plate 20 and then perform the bonding process again. Of course, this takes a lot of time, effort and money, the operation reliability of the heater 10 is not guaranteed.

In the heater 10 as described above, a short circuit accident of the conductive pad 20 and the connector 30 due to oxidation often occurs. The heating element 15, the conductive pad 20 and the casing 40 are generally made of metal and have relatively low oxidation resistance. However, since the opening 12 is not completely sealed in the conventional heater 10, a process gas used for a machining process may easily flow into the opening 12. The process gas oxidizes the heating element 15, the conductive pad 20, and the casing 40 to electrically short the conductive pad 20 and the connector 30. In this case, of course, the connector 30 must be replaced as described above.

As described above, the electric short circuit problem is almost identically occurring in the electrostatic chuck having a structure similar to that of the heater 10.

In addition, in the process of mounting the heater 10 or the electrostatic chuck on the semiconductor manufacturing equipment, various physical forces are applied to the connector 30, thereby causing an accident in which the conductive pad 20 and the connector 30 are physically shorted. It often happens. This conventional connector 30 structure is further considered that this problem occurs because the casing 40 does not physically fix the connector 30.

Currently, semiconductor devices are being developed in the direction of high integration and high performance, and surface light source devices such as LCDs are being developed in the direction of larger size, and the value of semiconductor devices and surface light source devices is rapidly increasing. However, due to the problems described above, expensive semiconductor devices and surface light source devices are poorly processed and reprocessed, so it is urgent to prepare countermeasures.

The present invention has been made to solve the problems described above, and an object of the present invention is to provide a heater capable of improving the electrical connection reliability of the conductive member and the power supply unit.

Another object of the present invention is to provide an electrostatic chuck which can improve the electrical connection reliability of the electrode and the power supply unit.

In order to achieve the above object of the present invention, a heater according to a preferred embodiment of the present invention, an insulation plate formed with an opening, a conductive member embedded in the insulation plate and partially exposed through the opening, transmits power to the conductive member. The connector includes a connector inserted into the insulating plate through the opening and having a pressing portion formed on the outer circumferential surface thereof, and a casing fitted to the outer circumferential surface of the connector and pressing the pressing portion toward the conductive member to closely contact the connector to the conductive member.

In this case, a first adhesive may be further formed between the inner surface of the opening and the connector, between the inner surface of the opening and the casing, and between the connector and the casing. A second adhesive for sealing the opening may be further formed on one surface of the insulating plate to which the connector is exposed. An auxiliary conductive member may be further formed between the inner surface of the opening and the end of the connector to improve the electrical connection between the conductive member and the connector.

In order to achieve the above object of the present invention, an electrostatic chuck according to an exemplary embodiment of the present invention includes a chucking plate in which an opening is formed, and is embedded in the chucking plate to generate an electrostatic field on the chucking plate and partially through the opening. The electrode is exposed, the connector is inserted into the insulating plate through the opening to deliver the power to the electrode, the connector is formed on the outer peripheral surface and the casing is fitted to the outer peripheral surface of the connector and press the pressing portion toward the electrode to close the connector to the electrode do.

According to the present invention, the connector and the conductive member or the connector and the electrode can be easily electrically connected, and the electrical connection reliability can be improved. Furthermore, the oxidation problem of the conductive member, the electrode and the connector can be effectively solved. As a result, excellent semiconductor devices and surface light source devices can be manufactured.

Hereinafter, a heater and an electrostatic chuck according to various embodiments of the present invention will be described in detail, but the present invention is not limited to the following embodiments and may be implemented in other forms. The embodiments introduced herein are provided to make the disclosure more complete and to fully convey the spirit and features of the invention to those skilled in the art. In the drawings, the thickness of each device or film (layer) and regions has been exaggerated for clarity of the invention, and each device may have various additional devices not described herein.

2 is a schematic cross-sectional view for describing a heater according to an embodiment of the present invention.

Referring to FIG. 2, the heater 100 is an apparatus for heating an object such as a wafer or an LCD panel, and includes an insulating plate 110, a conductive member 115, a connector 130, and a casing 140.

The insulating plate 110 is a member in which the heating body is disposed, and may have a shape corresponding to the shape of the heating body. For example, the insulating plate 110 for heating the surface light source panel may have a rectangular parallelepiped shape, and the insulating plate 110 for heating the wafer may have a disk shape.

The insulating plate 110 may be disposed on the supporting member (not shown). In more detail with respect to the supporting member, the supporting member has a rod shape as a whole and is disposed under the insulating plate 110 to support the insulating plate 110 so as not to be tilted or to support the insulating plate 110 in a horizontal direction. Rotate The supporting member may be made of a stainless alloy, an aluminum alloy, or a copper alloy, and a refrigerant transport passage for cooling the insulating plate 110 may be formed therein.

The insulation plate 110 may be made of ceramic. For example, the insulating plate 110 may be made of alumina (Al ₂ O ₃ ), yttrium oxide (Y ₂ O ₃ ), aluminum nitride, or the like. In addition, the insulating plate 110 may be manufactured by anodizing, sintering, or the like. In addition, a dielectric layer (not shown) may be further formed on the upper surface of the insulating plate 110.

The opening 112 is formed at a predetermined depth on the lower surface of the insulating plate 110. The opening 112 has a cylindrical groove shape as a whole, and threads are formed on the inner circumferential surface thereof. The opening 112 is formed to a depth at which the conductive member 115 is embedded to partially expose the conductive member 115.

The conductive member 115 is made of a metal having a heat generating property. For example, the conductive member 115 may be made of a metal including tungsten, titanium, rhodium, niobium, iridium, rhenium, tantalum, molybdenum, or a combination thereof.

The conductive member 115 may have various shapes. For example, the conductive member 115 may have a bar type, a rod type, a ring type, a disk type, or a mesh type.

The conductive member 115 may be variously disposed in the insulating plate 110. For example, the conductive members 115 may be arranged side by side in a horizontal direction, bent in a serpentine, or may be disposed in a vertical direction. The conductive member 115 is preferably disposed evenly at equal intervals in the insulating plate 110 so that uniform heat is emitted over the entire surface of the insulating plate 110.

The conductive member 115 may be formed on the insulating plate 110 in various ways. For example, the conductive member 115 may be formed by forming an accommodating groove in the insulating plate 110 and then spraying the metal powder at high temperature and high pressure, by screen printing the metal mesh, or by patterning the metal film with a mask. Can be.

The conductive member 115 as described above is primarily used for a heating element for heating the insulating plate 110. However, the conductive member 115 may be used as an electrode for generating electrostatic force or an electrode for generating high frequency. In more detail, the heating element, the electrostatic force generating electrode, and the high frequency generating electrode are made of a conductive metal. Depending on the type of power supplied to the conductive metal, the conductive metal may be used as a heating element, a constant power generating electrode, or a high frequency generating electrode. That is, when a plurality of conductive members 115 are disposed on the insulating plate 110 and different power is supplied to each of the conductive members 115, the conductive members 115 may be formed of the heating element, the electrostatic force generating electrode, and the high frequency generating electrode. You can do all the functions.

The conductive pad 120 is formed between the bottom of the opening 112 and the conductive member 115. The conductive pad 120 is electrically connected to the conductive member 115. The conductive pad 120 is made of a metal having low contact resistance with the conductive member 115 and excellent electrical conductivity. For example, the conductive pad 120 may be formed of a thin metal plate to be disposed inside the insulating plate 110 together with the conductive member 115 when the insulating plate 110 is sintered.

The conductive pad 120 is used to indirectly expose the conductive member 115. Accordingly, it is noted that the conductive pad 120 is not necessarily required, and the conductive member 115 may be directly exposed through the opening 112.

The connector 130 is inserted into the opening 112 where the conductive pad 120 is exposed. The connector 130 has a rod shape as a whole, and is inserted into the opening 112 to be electrically connected to the conductive pad 120.

The connector 130 is a member for transmitting power to the conductive member 115, one end of which is electrically connected to the conductive member 115 through the conductive pad 120, and the other end of which is electrically connected to the power supply unit (not shown). Is connected.

The power delivered by the connector 130 depends on the type of the power supply unit. For example, when a general AC voltage supply unit is connected to the connector 130, the connector 130 transmits a general AC voltage, and when the DC chucking voltage supply unit is connected to the connector 130, the connector 130 is It delivers a DC chucking voltage. Alternatively, when the high frequency bias power supply unit is connected to the connector 130, the connector 130 delivers the high frequency bias power.

The connector 130 is made of a metal having a relatively low contact resistance and excellent electrical conductivity. For example, the connector 130 may be made of a metal including gold (Au), silver (Ag), copper (Cu), titanium (Ti), tungsten (W) nickel (Ni), or a combination thereof. The pressing unit 135 is formed on the outer circumferential surface of the connector 130 inserted into the opening 112.

The pressing unit 135 is formed to protrude from the circumference of the connector 130 and is inserted into the opening 112 together with the connector 130. The pressing unit 135 may be formed at the end or the middle of the connector 130 inserted into the opening 112. Preferably, the pressing portion 135 is inserted into the opening 112 and is formed in a ring shape around the one end of the connector 130 facing the conductive member 115. In this case, the connector 130 having the pressing portion 135 has a 'T' shaped cross section as shown in FIG. 2. The pressing unit 135 may be made of substantially the same material as the connector 130.

The casing 140 is fitted to the outer circumferential surface of the connector 130 on which the pressing part 135 is formed. The casing 140 is inserted into the opening 112 together with the connector 130.

The casing 140 has a cylindrical frame shape as a whole. The outer circumferential surface of the casing 140 is formed with a thread corresponding to the thread formed on the inner circumferential surface of the opening 112. The casing 140 is inserted into the opening 112 and screwed to the insulating plate 110. The degree of insertion of the casing 140 into the opening 112 varies depending on the degree of screwing with the insulating plate 110. The casing 140 inserted into the opening 112 at a predetermined depth or more presses the pressing unit 135 in the direction of the conductive member 115 to bring the connector 130 into close contact with the conductive pad 120.

Adhesive 150 is formed between the inner surface of the opening 112 and the connector 130, between the inner surface of the opening 112 and the casing 140, and between the connector 130 and the casing 140.

The adhesive 150 may be made of a metallic material and an organic epoxy including silver (Ag), platinum (Pt), gold (Au), nickel (Ni), or copper (Cu). Preferably, the adhesive 150 is made of a metallic material and an organic epoxy, which are mostly silver (Ag) or nickel (Ni). In this case, the adhesive 150 preferably contains about 50% or more of the metallic material.

The adhesive 150 has an adhesive temperature of about 100 to 200 ° C. The adhesion temperature is different from the melting temperature. The adhesion temperature refers to a temperature at which the adhesive 150 has adhesive properties, and the melting temperature refers to a temperature at which all of the metal materials forming the adhesive 150 are melted. For example, the adhesive 150 containing silver (Ag) will have adhesive properties at about 150 ° C., but the melting point of the adhesive 150 is 960 ° C.

The bonding process using such an adhesive 150 is performed at a temperature of about 300 ° C., preferably at a temperature of about 100 ° C. to 200 ° C., which is much lower than that of the prior art. The 300 ° C is a temperature at which the physical properties of the adhesive 150 do not substantially change. Therefore, changes in physical properties such as an increase in internal stress of the heater 100 may be minimized. Furthermore, the shorting problem of other connection sites can be effectively solved when performing a rejoining process that may be necessary.

More developmentally, the adhesive 150 formed between the inner surface of the opening 112 and the connector 130, between the inner surface of the opening 112 and the casing 140, and between the connector 130 and the casing 140 is an organic epoxy resin. It may be heated to a predetermined temperature to volatilize. For example, the adhesive 150 may be heated to a temperature of about 150 ° C. for at least about 1 hour.

The adhesive 150 fixes the connector 130 and the casing 140 in the opening 112. The connector 130 and the casing 140 are restricted in flow in the adhesive 150 by the adhesive 150. Therefore, an electrical short between the connector 130 and the conductive member 115 due to the flow is prevented.

In addition, the adhesive 150 seals the inside of the opening 112 into which the connector 130 and the casing 140 are inserted. Air flow into and out of the opening 112 is restricted, and oxidation of the conductive member 115, the conductive pad 120, the connector 130, and the casing 140 is suppressed. Therefore, an electrical short between the connector 130 and the conductive member 115 due to the oxidation is prevented.

Furthermore, the adhesive 150 electrically connects the connector 130 and the conductive member 115. For this purpose, the adhesive 150 does not necessarily have conductive properties over the entire area. For example, the adhesive 150 may have conductive properties only partially between the inner surface of the opening 112 and the connector 130.

According to the present invention as described above, the connector 130 is pressed in the direction of the conductive member 115 by the casing 140. Therefore, even when a void occurs in the adhesive 150 or a part of the adhesive 150 moves, the connector 130 is continuously in close contact with the adhesive 150. As a result, the electrical connection between the connector 130 and the conductive member 115 is maintained substantially constant. In addition, the electrical connection between the connector 130 and the conductive member 115 is better maintained by the adhesive 150.

3 is a schematic cross-sectional view for describing a heater according to another embodiment of the present invention.

Referring to FIG. 3, the heater 200 according to the present exemplary embodiment is substantially the same as the heater 100 illustrated in FIG. 2 except for the second adhesive 260. Therefore, in the present embodiment, the description of the same reference numerals as in FIG. 2 will be omitted in order to omit duplicate description, but will be readily understood by those skilled in the art.

Adhesive 150 formed between the inner surface of the opening 112 and the connector 130, between the inner surface of the opening 112 and the casing 140, and between the connector 130 and the casing 140 is hereinafter referred to as 'first adhesive'. ) Fills the empty space in the opening 112. The opening 112 is primarily sealed by the first adhesive 150, but is also secondarily sealed by the second adhesive 260.

The second adhesive 260 is formed along the circumference of the connector 130 on one surface of the insulating plate 110 to which the connector 130 is exposed to seal the opening 112. In this case, the second adhesive 260 is formed to surround the casing 140 exposed to the outside of the opening 112. The second adhesive 260 seals the periphery of the opening 112 to more firmly shield the air inflow into the opening 112.

The second adhesive 260 seals the opening 112 outside the insulating plate 110 to shield the inflow and outflow of air into the opening 112, as well as the connector 130 inserted into the opening 112. Fix more firmly. The second adhesive 260 is formed at the connection portion between the insulating plate 110 and the connector 130, thereby increasing the bonding force between the insulating plate 110 and the connector 130. Therefore, even when a repetitive load is applied to the connector 130, the flow of the connector 130 is limited by the second adhesive 260. Naturally, the inflow and outflow of air into the opening 112 due to the flow of the connector 130 is more effectively suppressed.

The second adhesive 260 may be made of a ceramic material made of silicon dioxide (SiO ₂ ), titanium dioxide (TiO ₂ ) or alumina (Al ₂ O ₃ ) and an organic epoxy resin. In this case, the second adhesive 260 preferably contains about 50% or more of the ceramic material. The second adhesive 260 does not have to have a conductive property even partially, like the first adhesive 150. This does not necessarily mean that the second adhesive 260 is made of a non-conductive material, and may be made of a conductive material in some cases.

The second adhesive 260, which consists mostly of ceramic material, has a melting point of about 1500 ° C. The second adhesive 260 has an adhesion temperature of about 600 ° C, preferably about 100 to 200 ° C. The temperature at 600 ° C. is a temperature at which the physical properties of the second adhesive 260 do not substantially change. Accordingly, the second adhesive 260 may maintain stable bonding and sealing performance even when exposed to a high temperature atmosphere. Accordingly, the oxidation problem of the connector 130, the casing 140, the conductive member 115, and the conductive pad 120 may be more effectively suppressed.

In further development, the second adhesive 260 may be heated to a predetermined temperature to volatilize the organic epoxy resin. For example, the second adhesive 260 may be heated to a temperature of about 150 ° C. for about 2 to 3 hours.

According to the present invention as described above, the conductive member 115, the conductive pad 120, the connector 130 and the casing 140 by sealing the inside of the opening 112 using the first and second adhesive (150,260). Oxidation can be effectively suppressed. As a result, the electrical connection reliability of the connector 130 and the conductive member 115 is further improved.

Figure 4 shows a schematic cross-sectional view for explaining a heater according to another embodiment of the present invention.

Referring to FIG. 4, the heater 300 according to the present exemplary embodiment is substantially the same as the heater 200 illustrated in FIG. 3 except for the first adhesive 150. Therefore, in the present embodiment, the description of the same reference numerals as in FIG. 3 will be omitted in order to omit duplicate description, but will be readily understood by those skilled in the art.

The opening 112 is formed at a predetermined depth on the lower surface of the insulating plate 110. Threads are formed on the inner circumferential surface of the opening 112. The opening 112 is formed to a depth where the conductive pad 120 is embedded to indirectly expose the conductive member 115.

The connector 130 is inserted into the opening 112 and electrically connected to the conductive pad 120. The pressing unit 135 is formed on the outer circumferential surface of the connector 130 inserted into the opening 112.

The casing 140 is fitted to the outer circumferential surface of the connector 130 on which the pressing part 135 is formed. The casing 140 is inserted into the opening 112 together with the connector 130.

The casing 140 is screwed to the insulating plate 110 through the opening 112. The casing 140 presses the pressing unit 135 in the direction of the conductive member 115 to bring the connector 130 into close contact with the conductive pad 120. In this case, the connector 130 is directly connected to the conductive pad 120.

Although the connector 130 is directly connected to the conductive pad 120 without the first adhesive 150 as shown in FIG. 3, the electrical connection reliability of the connector 130 and the conductive member 115 does not substantially change. Do not. This is because the connector 130 is continuously pressed toward the conductive member 115 by the casing 140.

The second adhesive 260 is formed along the circumference of the connector 130 on one surface of the insulating plate 110 through which the connector 130 is exposed. In this case, the second adhesive 260 is formed to surround the casing 140 exposed to the outside of the opening 112. The second adhesive 260 seals the periphery of the opening 112 to tightly shield the air inflow into the opening 112.

The second adhesive 260 not only shields the inflow and outflow of air into the opening 112, but also suppresses the flow of the connector 130 inserted into the opening 112. The second adhesive 260 is formed at the connection portion between the insulating plate 110 and the connector 130, thereby increasing the bonding force between the insulating plate 110 and the connector 130. Therefore, even when a repetitive load is applied to the connector 130, the flow of the connector 130 is limited by the second adhesive 260.

In the heater 300 according to the present exemplary embodiment, air flow into and out of the opening 112 is restricted by the second adhesive 260. The amount of air present between the inner surface of the opening 112 and the connector 130, between the inner surface of the opening 112 and the casing 140, and between the connector 130 and the casing 140 is relatively small. In addition, when the manufacturing process of the heater 300 until forming the second adhesive 260 is performed in a clean environment in which the vacuum state is maintained, the amount of air existing in the opening 112 is only a very small amount. Therefore, even if the first adhesive 150 is not formed between the inner surface of the opening 112 and the connector 130, between the inner surface of the opening 112 and the casing 140, and between the connector 130 and the casing 140, the second adhesive 150 is not formed. The adhesive 260 may be used to effectively suppress oxidation of the connector 130, the casing 140, the conductive member 115, and the conductive pad 120.

5 is a schematic cross-sectional view for describing a heater according to another embodiment of the present invention.

Referring to FIG. 5, the heater 400 according to the present exemplary embodiment is substantially the same as the heater 200 illustrated in FIG. 3 except for the auxiliary conductive member 425. Therefore, in the present embodiment, the description of the same reference numerals as in FIG. 3 will be omitted in order to omit duplicate description, but will be readily understood by those skilled in the art.

A first adhesive 150 is formed between the inner surface of the opening 112 and the connector 130, between the inner surface of the opening 112 and the casing 140, and between the connector 130 and the casing 140. An auxiliary conductive member 425 is interposed in the first adhesive 150 between the inner surface of the opening 112 and the end of the connector 130.

The auxiliary conductive member 425 is used to improve the electrical connection with the connector 130 and the conductive member 115. The auxiliary conductive member 425 is made of metal. For example, the auxiliary conductive member 425 is iron, cobalt, nickel. Metal, including tungsten, titanium, rhodium, niobium, iridium, rhenium, tantalum, molybdenum or combinations thereof.

The auxiliary conductive member 425 may have various shapes and may be variously disposed. For example, the auxiliary conductive member 425 may have a bar type, a rod type, a ring type, a disk type, or a mesh type. In addition, the auxiliary conductive member 425 may be disposed in a coil shape, bent in a meandering structure (serpentine), side by side in a horizontal direction, or may be disposed in a vertical direction.

The auxiliary conductive member 425 may improve current connectivity between the conductive pad 120 and the conductive member 115 by assisting current movement between the conductive pad 120 and the conductive member 115. In addition, the auxiliary conductive member 425 also serves to cushion problems caused by different thermal expansions in the opening 112. Furthermore, the auxiliary conductive member 425 also improves the cohesive force of the first adhesive 150. As a result, the auxiliary conductive member 425 further improves electrical connectivity with the connector 130 and the conductive member 115.

In the present embodiment, a case in which the auxiliary conductive member 425 is disposed on the interposed first adhesive 150 between the inner surface of the opening 112 and the connector 130 has been described. However, the first adhesive 150 is not present. In this case, the auxiliary conductive member 425 may be disposed directly between the inner surface of the opening 112 and the end of the connector 130. That is, the auxiliary conductive member 425 may be disposed in the heater 300 shown in FIG. 4.

According to various embodiments of the present invention as described above, by first contact the connector 130 in the direction of the conductive member 115 using the casing 140, the electrical connection of the connector 130 and the conductive member 115 Improved connectivity In addition, the connector 130, the casing 140, the conductive member 115, and the conductive pad 120 are oxidized by sealing the opening 112 using at least one of the first and second adhesives 150 and 260. Can be suppressed effectively. In addition, the electrical connection between the connector 130 and the conductive member 115 may be maximized using the auxiliary conductive member 425. As a result, the electrical connection between the connector 130 and the conductive member 115 is improved, so that objects such as a semiconductor substrate or an LCD panel can be excellently processed.

The present invention can be applied to the heaters 100, 200, 300, and 400 as well as to the electrostatic chuck substantially the same.

6 is a schematic cross-sectional view for describing an electrostatic chuck according to another embodiment of the present invention.

Referring to FIG. 6, the electrostatic chuck 500 is an apparatus for fixing a semiconductor substrate such as a wafer and includes a chucking plate 510, an electrode 515, a connector 130, and a casing 140.

The chucking plate 510 is a member in direct contact with the semiconductor substrate and is made of a material having excellent insulation and dielectric properties. For example, the chucking plate 510 may be formed of a ceramic plate on which a dielectric film is formed.

The lower surface of the chucking plate 510 is formed with an opening 512 to a predetermined depth. The opening 512 is used to connect the connector 530 by partially exposing the electrode 515 to be described below.

The electrode 515 is made of a metal having excellent conductive characteristics. For example, the electrode 515 may be made of a metal including tungsten, titanium, rhodium, niobium, iridium, rhenium, tantalum, molybdenum, or a combination thereof.

The electrode 515 may have various shapes. For example, the electrode 515 may have a coil shape, a rod type, a ring type, a mesh type, or a disk type.

A conductive pad 520 electrically connected to the electrode 515 is formed under the electrode 515. The conductive pad 520 indirectly exposes the electrode 515. However, it is noted that the conductive pad 520 is not necessarily required in the present invention, and the electrode 515 may be directly exposed through the opening 512. The connector 530 is inserted into the opening 512.

The pressing portion 535 is formed on the outer circumferential surface of the connector 530. The pressing part 535 is formed to protrude from the circumference of the connector 530, and is inserted into the opening 512 together with the connector 530. The pressing unit 535 may be formed at the end or the middle of the connector 530 inserted into the opening 512. Preferably, the pressing portion 535 is inserted into the opening 512 is formed in a ring shape around the one end of the connector 530 facing the conductive member 515.

A casing 540 is fitted to the outer circumferential surface of the connector 530. The casing 540 is in close contact with the pressing portion 535 of the connector 530 to press the connector 530 toward the electrode 515.

A first adhesive 550 is formed between the inner surface of the opening 512 and the connector 530, between the inner surface of the opening 512 and the casing 540, and between the connector 530 and the casing 540.

The auxiliary conductive member 525 is used to improve the electrical connection between the connector 530 and the electrode 515. The auxiliary conductive member 525 is made of metal. For example, the auxiliary conductive member 525 may be made of a metal including iron, cobalt, nickel, tungsten, titanium, rhodium, niobium, iridium, rhenium, tantalum, molybdenum, or a combination thereof.

A power supply unit (not shown) is connected to the connector 530 inserted into the opening 512. The connector 530 receives power from the power supply unit and transfers the power to the conductive pad 520, and the conductive pad 520 transfers the power to the electrode 515. The power supply unit may be a direct current chucking voltage supply unit or a high frequency bias power supply unit.

The second adhesive 560 is formed along the circumference of the connector 530 on one surface of the chucking plate 510 to which the connector 530 is exposed. The second adhesive 560 seals the periphery of the opening 512 to more tightly shield the air inflow into the opening 512.

According to the present embodiment as described above, the electrical connection reliability of the connector 530 and the electrode 515 is improved by pressing the connector 530 toward the electrode 515 and restricting the air inflow into the opening 512. Can be improved. Therefore, the semiconductor substrate disposed on the chucking plate 510 can be chucked excellently. Although not shown in the drawings, the connection structure of the chucking plate 510 and the connector 530 according to the present embodiment, it will be understood that can be changed as the connection structure of the insulating plate and the connector shown in Figs. . A description thereof will be omitted, but those skilled in the art will readily understand the description of FIGS. 2 and 4.

According to the present invention as described above, the connector is subjected to a physical force in the plate direction, the connecting portion of the connector and the conductive member is completely sealed from the external environment. Therefore, the electrical connection reliability of the connector and the conductive member, the connector and the electrode is improved, and power can be stably supplied to the heater and the electrostatic chuck. That is, the heating process using the heater and the semiconductor substrate processing process using the electrostatic chuck can be effectively performed. Finally, an excellent semiconductor device, a surface light source, and the like can be manufactured.

Although described above with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and changed within the scope of the invention without departing from the spirit and scope of the invention described in the claims below I can understand that you can.

Claims (14)

An insulating plate having an opening formed therein; A conductive member embedded in the insulating plate and partially exposed through the opening; A connector inserted into the insulating plate through the opening to transmit power to the conductive member and having a pressing portion formed on an outer circumferential surface thereof; And And a casing fitted to an outer circumferential surface of the connector and pressurizing the pressing portion toward the conductive member to bring the connector into close contact with the conductive member. The heater according to claim 1, further comprising an adhesive formed between the inner surface of the opening and the connector, between the inner surface of the opening and the casing, and between the connector and the casing to seal the inside of the opening. 3. The organic adhesive of claim 2, wherein the adhesive comprises at least one metal material selected from the group consisting of silver (Ag), platinum (Pt), gold (Au), nickel (Ni), and copper (Cu) and an organic epoxy resin. Heater characterized in that. The heater of claim 1, further comprising an adhesive formed on one surface of the insulating plate to which the connector is exposed to seal the opening. The method of claim 4, wherein the adhesive comprises at least one ceramic material selected from the group consisting of silicon dioxide (SiO ₂ ), titanium dioxide (TiO ₂ ) and alumina (Al ₂ O ₃ ) and an organic epoxy resin. Heater. The heater of claim 1, wherein the pressing part is formed in a ring shape along an end portion of the connector inserted into the opening to face the conductive member. The heater according to claim 1, wherein threads are formed on the inner circumferential surface of the opening and the outer circumferential surface of the casing so that the casing is screwed to the opening. The heater of claim 1, further comprising an auxiliary conductive member interposed between an inner surface of the opening and an end of the connector to improve electrical connection between the conductive member and the connector. The heater of claim 1, further comprising a conductive pad formed between an inner surface of the opening and the conductive member and electrically connected to the conductive member. A chucking plate having an opening formed therein; An electrode embedded in the chucking plate and partially exposed through the opening to create an electrostatic field on the chucking plate; A connector inserted into the chucking plate through the opening to transmit power to the electrode and having a pressing portion formed on an outer circumferential surface thereof; And And a casing which is fitted to an outer circumferential surface of the connector and presses the pressing portion toward the electrode to bring the connector into close contact with the electrode. The electrostatic chuck of claim 10, further comprising an adhesive formed between the inner surface of the opening and the connector, between the inner surface of the opening and the casing, and between the connector and the casing to seal the inside of the opening. . The electrostatic chuck of claim 10, further comprising an adhesive formed on one surface of the chucking plate to which the connector is exposed to seal the opening. 2. The electrostatic chuck of claim 1, wherein the pressing portion is formed in a ring shape around an end portion of the connector inserted into the opening and facing the electrode. The electrostatic chuck of claim 1, wherein threads are formed on the inner circumferential surface of the opening and the outer circumferential surface of the casing so that the casing is screwed to the opening.

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