KR20070064383A - 기판 캐리어의 개방 및 폐쇄 방법 및 장치 - Google Patents

기판 캐리어의 개방 및 폐쇄 방법 및 장치 Download PDF

Info

Publication number
KR20070064383A
KR20070064383A KR1020060106187A KR20060106187A KR20070064383A KR 20070064383 A KR20070064383 A KR 20070064383A KR 1020060106187 A KR1020060106187 A KR 1020060106187A KR 20060106187 A KR20060106187 A KR 20060106187A KR 20070064383 A KR20070064383 A KR 20070064383A
Authority
KR
South Korea
Prior art keywords
door
substrate carrier
opening mechanism
substrate
door opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020060106187A
Other languages
English (en)
Korean (ko)
Inventor
마틴 알. 엘리엇
제프리 씨. 후드겐스
비네이 케이. 샤
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20070064383A publication Critical patent/KR20070064383A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020060106187A 2005-12-16 2006-10-31 기판 캐리어의 개방 및 폐쇄 방법 및 장치 Withdrawn KR20070064383A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US75108505P 2005-12-16 2005-12-16
US60/751,085 2005-12-16

Publications (1)

Publication Number Publication Date
KR20070064383A true KR20070064383A (ko) 2007-06-20

Family

ID=38228680

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060106187A Withdrawn KR20070064383A (ko) 2005-12-16 2006-10-31 기판 캐리어의 개방 및 폐쇄 방법 및 장치

Country Status (5)

Country Link
JP (1) JP2009520352A (enExample)
KR (1) KR20070064383A (enExample)
CN (1) CN101000882B (enExample)
TW (1) TW200730412A (enExample)
WO (1) WO2007078406A2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4488255B2 (ja) * 2008-05-27 2010-06-23 Ｔｄｋ株式会社 密閉容器の蓋開閉システム、当該蓋開閉システムを含む収容物挿脱システム、及び当該蓋開閉システムを用いた基板処理方法
JP5324231B2 (ja) * 2009-01-08 2013-10-23 日東電工株式会社 半導体ウエハのアライメント装置
US10453726B2 (en) * 2016-11-10 2019-10-22 Applied Materials, Inc. Electronic device manufacturing load port apparatus, systems, and methods

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5674123A (en) * 1995-07-18 1997-10-07 Semifab Docking and environmental purging system for integrated circuit wafer transport assemblies
US5772388A (en) * 1996-05-28 1998-06-30 Clark; Richard J. Combination hauler for vehicle and trailered boat
US6261044B1 (en) * 1998-08-06 2001-07-17 Asyst Technologies, Inc. Pod to port door retention and evacuation system

Also Published As

Publication number Publication date
CN101000882B (zh) 2011-04-20
TW200730412A (en) 2007-08-16
WO2007078406A2 (en) 2007-07-12
WO2007078406A3 (en) 2007-10-25
CN101000882A (zh) 2007-07-18
JP2009520352A (ja) 2009-05-21

Similar Documents

Publication Publication Date Title
US6955197B2 (en) Substrate carrier having door latching and substrate clamping mechanisms
US11837486B2 (en) Reticle transportation container
US7258520B2 (en) Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing
CN1320626C (zh) 被处理体的收存容器体
EP0684631B1 (en) Standardized mechanical interface (SMIF) pod.
KR102400424B1 (ko) 로드 포트 및 로드 포트의 분위기 치환 방법
US6817822B2 (en) Load port, wafer processing apparatus, and method of replacing atmosphere
US5810062A (en) Two stage valve for charging and/or vacuum relief of pods
US4995430A (en) Sealable transportable container having improved latch mechanism
JP3391623B2 (ja) 半導体加工装置のためのローディング及びアンローディング用ステーション
US11398395B2 (en) Substrate container with latching mechanism having two cam profiles
KR100403663B1 (ko) 피처리체 수용 박스의 개폐 덮개의 개폐 장치 및피처리체의 처리 시스템
US20070140822A1 (en) Methods and apparatus for opening and closing substrate carriers
US20090250374A1 (en) Semiconductor wafer container
US20040206304A1 (en) Pressurized chuck for controlling backside wafer contamination
KR20070064383A (ko) 기판 캐리어의 개방 및 폐쇄 방법 및 장치
US6772612B2 (en) Door-in-door front opening unified pod
JP2009170726A (ja) ロードポートおよびカセット位置調整方法
KR100717990B1 (ko) 반도체 자재 처리를 위한 이송 시스템
KR100717988B1 (ko) 반도체 자재 반출 기능을 갖는 로더장치
KR100902614B1 (ko) 반도체 제조 장치
JP2001102438A (ja) 精密基板収納容器
KR101050632B1 (ko) 도어 래칭 및 기판 클램핑 매커니즘들을 갖는 기판 캐리어
US20250218854A1 (en) Substrate processing apparatus
KR20250162039A (ko) 이종 캐리어가 탑재 가능한 로드포트의 도어개방장치

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20061031

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid