KR20070055406A - 화상 결함 검사 장치, 화상 결함 검사 시스템 및 화상 결함검사 방법 - Google Patents
화상 결함 검사 장치, 화상 결함 검사 시스템 및 화상 결함검사 방법 Download PDFInfo
- Publication number
- KR20070055406A KR20070055406A KR1020060117165A KR20060117165A KR20070055406A KR 20070055406 A KR20070055406 A KR 20070055406A KR 1020060117165 A KR1020060117165 A KR 1020060117165A KR 20060117165 A KR20060117165 A KR 20060117165A KR 20070055406 A KR20070055406 A KR 20070055406A
- Authority
- KR
- South Korea
- Prior art keywords
- image
- defect
- inspection
- value
- defect detection
- Prior art date
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Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Health & Medical Sciences (AREA)
- Theoretical Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Image Processing (AREA)
- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005340248A JP2007149837A (ja) | 2005-11-25 | 2005-11-25 | 画像欠陥検査装置、画像欠陥検査システム及び画像欠陥検査方法 |
JPJP-P-2005-00340248 | 2005-11-25 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080072428A Division KR20080073281A (ko) | 2005-11-25 | 2008-07-24 | 화상 결함 검사 장치, 화상 결함 검사 시스템 및 화상 결함검사 방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20070055406A true KR20070055406A (ko) | 2007-05-30 |
Family
ID=38210904
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060117165A KR20070055406A (ko) | 2005-11-25 | 2006-11-24 | 화상 결함 검사 장치, 화상 결함 검사 시스템 및 화상 결함검사 방법 |
KR1020080072428A KR20080073281A (ko) | 2005-11-25 | 2008-07-24 | 화상 결함 검사 장치, 화상 결함 검사 시스템 및 화상 결함검사 방법 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080072428A KR20080073281A (ko) | 2005-11-25 | 2008-07-24 | 화상 결함 검사 장치, 화상 결함 검사 시스템 및 화상 결함검사 방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2007149837A (ja) |
KR (2) | KR20070055406A (ja) |
TW (1) | TWI336778B (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG164292A1 (en) * | 2009-01-13 | 2010-09-29 | Semiconductor Technologies & Instruments Pte | System and method for inspecting a wafer |
EP2394295A2 (en) * | 2009-02-06 | 2011-12-14 | KLA-Tencor Corporation | Selecting one or more parameters for inspection of a wafer |
TWI413021B (zh) * | 2009-04-10 | 2013-10-21 | Hon Hai Prec Ind Co Ltd | 圖像比較系統及方法 |
US8754972B2 (en) * | 2012-02-01 | 2014-06-17 | Kla-Tencor Corporation | Integrated multi-channel analog front end and digitizer for high speed imaging applications |
JP2013250225A (ja) * | 2012-06-04 | 2013-12-12 | Toray Eng Co Ltd | 外観検査装置及び外観検査方法 |
JP5717711B2 (ja) * | 2012-12-07 | 2015-05-13 | 東京エレクトロン株式会社 | 基板の基準画像作成方法、基板の欠陥検査方法、基板の基準画像作成装置、基板の欠陥検査ユニット、プログラム及びコンピュータ記憶媒体 |
JP6329397B2 (ja) * | 2014-03-07 | 2018-05-23 | 株式会社ダイヘン | 画像検査装置及び画像検査方法 |
KR101702752B1 (ko) * | 2015-05-29 | 2017-02-03 | 세메스 주식회사 | 전자 부품 검사 방법 |
JP6546826B2 (ja) * | 2015-10-08 | 2019-07-17 | 株式会社日立パワーソリューションズ | 欠陥検査方法、及びその装置 |
JP2018128406A (ja) * | 2017-02-10 | 2018-08-16 | 東レエンジニアリング株式会社 | 外観検査装置 |
KR102576277B1 (ko) * | 2018-05-02 | 2023-09-08 | 삼성디스플레이 주식회사 | 불량 검출 장치 및 방법 |
KR102196396B1 (ko) * | 2019-10-21 | 2020-12-30 | (주)에스비네트워크 | 유동적인 디스플레이 패널 글래스의 표면 결함 검사 방법 |
JP7087221B2 (ja) * | 2019-10-30 | 2022-06-21 | Alitecs株式会社 | 検査装置、方法、及び、プログラム |
WO2022091380A1 (ja) * | 2020-10-30 | 2022-05-05 | 株式会社日立ハイテク | 欠陥検査装置 |
TWI746320B (zh) | 2020-12-18 | 2021-11-11 | 財團法人工業技術研究院 | 產生及更新定位分布圖的方法及其系統 |
TWI790591B (zh) * | 2021-04-12 | 2023-01-21 | 環球晶圓股份有限公司 | 晶圓加工系統及其重工方法 |
CN114266773B (zh) * | 2022-03-02 | 2022-05-20 | 成都数联云算科技有限公司 | 显示面板缺陷定位方法、装置、设备及存储介质 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3566589B2 (ja) * | 1998-07-28 | 2004-09-15 | 株式会社日立製作所 | 欠陥検査装置およびその方法 |
JP4233397B2 (ja) * | 2002-10-01 | 2009-03-04 | 株式会社東京精密 | 画像欠陥検査方法、画像欠陥検査装置及び外観検査装置 |
-
2005
- 2005-11-25 JP JP2005340248A patent/JP2007149837A/ja active Pending
-
2006
- 2006-08-30 TW TW095131901A patent/TWI336778B/zh not_active IP Right Cessation
- 2006-11-24 KR KR1020060117165A patent/KR20070055406A/ko active Application Filing
-
2008
- 2008-07-24 KR KR1020080072428A patent/KR20080073281A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
TWI336778B (en) | 2011-02-01 |
TW200722740A (en) | 2007-06-16 |
JP2007149837A (ja) | 2007-06-14 |
KR20080073281A (ko) | 2008-08-08 |
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