KR20070029970A - Method for manufacturing rfid tag - Google Patents

Abstract

A method for manufacturing an RFID tag is provided to reduce antenna manufacturing time by simplifying a process, continuously advance a reel-to-reel process, and enable the antenna to have diverse patterns. A thin film is provided without disconnection and a receiving hole for receiving an RFID chip is formed to the thin film(S20). An antenna wire crossing the receiving hole is arranged on at least one side of the thin film(S30). The antenna wire is inserted to a constant depth of the thin film by thermally pressing and/or rolling the antenna wire(S40). The antenna wire is separated in an inner space of the receiving hole(S50). Each separated antenna wire is electrically connected to an electrode of the RFID chip(S60).

Description

RDF tag manufacturing method {Method for manufacturing RFID tag}

1 is a plan view illustrating a conventional RFID tag.

2 is a flowchart illustrating each step of a method of manufacturing an RFID tag according to an embodiment of the present invention.

3 to 8 are views showing each step of the manufacturing method of the RFID tag according to an embodiment of the present invention, Figure 3 is a cross-sectional view showing the step of forming the receiving hole in the thin film.

4 is a cross-sectional view illustrating a step of disposing an antenna conductive line on one side of a thin film.

5A is a perspective view illustrating a step of embedding an antenna conductive line into a thin film.

FIG. 5B is a cross-sectional view taken along the line VV of FIG. 5A.

6A is a perspective view illustrating a step of separating a conductive wire for an antenna.

FIG. 6B is a cross-sectional view taken along the VI-VI line of FIG. 6A.

7A and 7B are cross-sectional views sequentially illustrating bonding an antenna conductive line and an RFID chip.

8 is a diagram illustrating a step of applying an external bonding adhesive to one side of an RFID chip.

9 is a cross-sectional view illustrating a state in which a plurality of RFID chips are stored in a reel shape according to an exemplary embodiment of the present invention.

   <Description of Symbols for Major Parts of Drawings>

100: RFID tag 110: thin film

115: receiving hole 120: antenna conductive wire

130: chip fixing adhesive 140: RFID chip

145; RFID chip electrode 150: adhesive for external bonding

160: surface treatment layer

The present invention relates to a method for manufacturing an RFID tag (Radio Frequency IDentification tag), and more particularly, the surface quality of the antenna is homogeneous, the reel-to-reel process can be continuously performed, and the antenna can have various patterns. It relates to a method of manufacturing an RFID tag.

The RFID tag comprises an antenna forming a single antenna or at least one single closed loop, and an RFID chip electrically connected to the at least one antenna, through which the information from the outside is stored and updated in the RFID chip. Or a device in which information stored in an RFID chip is transmitted to the outside.

1 shows a typical RFID tag 10. Referring to FIG. 1, the RFID tag 10 includes a thin film 20, an antenna 30 formed on the thin film 20, and an RFID chip 40 bonded to the antenna 30. The RFID chip 40 and the antenna 30 may be embedded by a molding part 50. In this case, the molding part 50 is generally made of an epoxy molding compound (EMC) material and the RFID chip 40 And the RFID chip connecting portion of the antenna 30 is buried from above.

Conventionally, in order to manufacture such an RFID tag 10, by forming a copper foil layer or a thin aluminum layer on the thin film 20 and then etching to form an antenna 30, the antenna 30 and the RFID chip 40 ) Is bonded.

In particular, in order to form the antenna 30, the antenna is formed by printing a conductive ink on the thin film 20 or a so-called gravure printing method using a printing machine having a predetermined shape, or by attaching a conductive metal thin film on the thin film thin film. The pattern was exposed and developed to form a predetermined pattern, or a predetermined pattern was formed using ink, and then the metal thin film was etched, or the metal thin plate was stamped to form an antenna 30.

However, in the case of such an antenna forming process, there is a problem in that the manufacturing process is complicated and various manufacturing facilities including molds are designed to be suitable for the structure according to the shape, performance, and structure of the antenna, and the process time for each step is long. This has a problem that the overall manufacturing cost rises.

In addition, since the homogeneity and surface shape of the antenna material, which substantially affects the recognition distance of the antenna in the RFID tag, are changed for each RFID tag unit, deviations in the recognition rate between each RFID tag unit occur and the recognition distance is also relative. Decreases.

In addition, in the case of an etching method for easily forming various antenna patterns, a large portion of the conductive metal thin film coated on the thin film is patterned and removed, thereby increasing manufacturing costs.

In addition, in completing the RFID tag, the protective cover for protecting the adhesive from foreign matters is additionally formed outside the RFID tag, and there is a problem of completing the RFID tag through an additional process.

SUMMARY OF THE INVENTION The present invention has been made to solve various problems including the above problems, and an object of the present invention is to provide a method for manufacturing an RFID tag in which an antenna manufacturing process time is shortened and the manufacturing process is not complicated.

Another object of the present invention is to provide a method for manufacturing an RFID tag, in which various manufacturing facilities including a mold need not be designed to be suitable for the structure according to the shape, performance and structure of the antenna.

It is still another object of the present invention to provide a method for manufacturing an RFID tag having a uniform antenna material and a uniform surface shape for each RFID tag unit.

RFID tag manufacturing method according to a preferred embodiment of the present invention to achieve the above object is:

Providing a thin film;

Forming a receiving hole for receiving the RFID chip in the thin film;

Arranging a conductive wire for an antenna to cross the accommodation hole on at least one surface of the thin film;

Embedding the conductive wire for the antenna to a predetermined depth of the thin film;

Separating the conductive wire for the antenna from the inner space of the accommodation hole;

Electrically connecting the separated conductive wires for the antenna to the electrodes of the RFID chip.

The step of embedding the antenna conductive wire is preferably performed by thermally compressing the antenna conductive wire and / or by pressing the roller with the roller.

 In addition, the step of electrically connecting the conductive wires for the antenna with the electrode of the RFID chip, further comprising fixing the receiving hole, the electrode of the RFID chip, and the conductive wire for the antenna using a chip fixing adhesive. It is desirable to.

The separating of the conductive wires for the antenna may further include increasing an area in contact with the RFID chip at each end of the separated conductive wire.

In addition, the antenna conductive wire is preferably made of a copper material.

Meanwhile, the method may further include forming an adhesive for external bonding on at least one surface of the thin film, in which case the thin film is continuously provided corresponding to a plurality of RFID tags, and the outside of the thin film It is preferable to further include the step of surface-treating the surface on which the bonding adhesive is not formed so as not to adhere to the external bonding adhesive, and winding the finished RFID tags in a reel form.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

 2 is a flowchart illustrating a method of manufacturing an RFID tag according to an exemplary embodiment of the present invention, and FIGS. 3 to 10 are cross-sectional views illustrating each step of the method of manufacturing an RFID tag according to an exemplary embodiment of the present invention. Referring to FIG. 2, the method of manufacturing an RFID tag according to an exemplary embodiment of the present invention includes providing a thin film (S10), and forming a receiving hole for receiving an RFID chip in the thin film (S20); Disposing a conductive wire for an antenna to cross the receiving hole on at least one surface of the thin film (S30), embedding the conductive wire for the antenna to a predetermined depth of the thin film (S40), And separating (S50) the conductive wire for the antenna from the inner space of the accommodation hole, and electrically connecting each of the separated conductive wires for the antenna with an electrode of the RFID chip (S60).

Each step as described above will be described in detail with reference to FIGS. 3 to 10. First, as shown in FIG. 3, an accommodating hole 115 for accommodating an RFID chip is formed in the thin film 110. In this case, the thin film 110 may be formed of a polymer material such as polyimide (PI), polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyethylene (PE), or the like. In addition, the thin film 110 may be formed long so that a plurality of RFID tags may be continuously formed, and thus may be provided in a reel to reel method. In this case, the thin film 110 may be provided in a state where the receiving hole 115 is formed. Alternatively, the thin film 110 may be formed after providing the thin film 110.

 Thereafter, as shown in FIG. 4, an antenna conductive line 120 is disposed on at least one surface of the thin film 110. The antenna conductive line 120 is disposed to cross the accommodating hole 115, and in particular, includes a position corresponding to an electrode of an RFID chip to be accommodated in the accommodating hole 115. In this case, the antenna conductive wire 120 may be a copper wire, and the copper wire has the advantages of excellent conductivity and homogeneous materials. The copper wire may be unwound in a reel shape, deformed into a predetermined shape, and then positioned on the insulating film, or may be continuously positioned on the insulating film according to the shape of the antenna.

Subsequently, as shown in FIGS. 5A and 5B, the antenna conductive line 120 is embedded in a predetermined depth D of the thin film 110. Through this step, the antenna conductive line 120 is embedded in the thin film 110, so that the antenna conductive line 120 may not protrude onto the thin film 110 or may be minimally protruded. As a result, a process of forming a separate cover for protecting the antenna afterwards can be omitted, and the thickness of the entire RFID tag can be reduced. In addition, the completed RFID tag can be easily stored in the form of a reel, and even if attached to an external item when necessary, there is an advantage that can be easily released from the reel.

Various methods may be taken to embed the conductive wire 120 for the antenna, for example, by pressing the conductive wire 120 for the antenna with a roller 105 to be embedded in the thin film 110. Alternatively, the antenna conductive line 120 may be thermally compressed to the thin film 110 after being heated or while being heated. The present invention is not limited to this, and the roller and the thermocompression step may be performed at the same time, and other methods may be used.

Thereafter, as shown in FIG. 6A, a step of separating the antenna conductive line 120 from the inner space of the accommodation hole 115 is performed, whereby the separated conductive line 120 for the antenna is spaced apart. Having a distance K, the antenna is completed. This is for bonding between the electrode of the RFID chip and the conductive wire for the antenna, and each of the antenna conductive wires 120 thus separated serves to receive or transmit a predetermined operating frequency, for example, two-pole. It is formed of a pole type antenna. In this case, it is preferable that the separation distance K between the separated conductive wires 120 for the antenna is the same as or similar to the distance between the electrodes of the RFID chip.

On the other hand, as shown in Figure 6b, the antenna conductive wire 120 is arranged in a circular or elliptical cross section. Therefore, the area in contact with the electrode 145 of the RFID chip 140 is not large, and as a result, the electrical connection between the RFID chip 140 and the antenna may be poor or dropped due to external impact. Therefore, after separating the antenna conductor wire 120, it is preferable to further include increasing the area of the ends of the separated antenna conductor wire 120 in contact with the RFID chip. As one example, the contact area may be increased by pressing the portion 120a of the antenna conductive line 120 to which the RFID chip 140 contacts. It is preferable that the above-mentioned separation of the conductive lines and the process for partially facilitating contact of the conductive wire ends with the electrodes of the chip are performed by a mold at the same time.

Thereafter, each of the separated conductive wires 120 for the antenna is electrically connected to the electrodes 145 of the RFID chip 140. For this purpose, a bonding process adopted in a conventional semiconductor package, including a wire bonding method, may be used.

For example, as shown in FIG. 7A, the chip fixing adhesive 130, such as NCP, is applied to the receiving hole 115 including the separated antenna conductive line 120. Thereafter, as shown in FIG. 7B, the RFID chip 140 is coupled with an antenna conductive line 120 end embedded in the chip fixing adhesive 130. As a result, the antenna conductive line 120, the thin film 110, and the RFID chip 140 may be fixed by the chip fixing adhesive 130.

Thereafter, as shown in FIG. 8, the method may further include forming an external bonding adhesive 150 on at least one surface of the thin film 110. The surface formed by the external bonding adhesive 150 may be a surface in which the antenna conductive wire 120 is in contact with each other, as shown in FIG. 8, and on the contrary, a surface opposite to the surface on which the antenna conductive wire 120 is formed. It may be cotton.

In particular, the antenna conductive wire 120 is embedded in the thin film 110, unlike the prior art, the outer coupling adhesive 150 may be formed on the surface on which the antenna conductive wire 120 is formed. Dipping, spraying, dispensing, adhesive tape, or the like may be used to form the adhesive for external bonding.

On the other hand, on the outer bonding adhesive 150, in order to prevent the foreign matter is attached to the outer bonding adhesive may be added a process of attaching a protective cover. However, the present invention, on the other hand, may not need to attach a protective cover on the adhesive 150 for external bonding. That is, as shown in FIG. 9, the thin film 120 is continuously supplied corresponding to the plurality of RFID tags 100 so that the operations are performed, and the plurality of RFID tags 100 are reel 200. It may be completed in the form, in this case, the external bonding adhesive 150 of the thin film 110 and the outer bonding adhesive of the other RFID tag 100 in contact with the reel form is not formed The surface treatment may be performed so that the surface treatment layer 160 is formed so as not to adhere well. Thus, the process of attaching the protective cover on the external bonding adhesive may be omitted.

According to the present invention, in order to manufacture the antenna, it is embedded in the thin film using the same conductive line as the width of the antenna. Therefore, the upper surface is roughened by the etching process or the printing process, or the bevel phenomenon due to the etching does not occur on the side, so it is more homogeneous than the etching or printing method, and the performance difference between each RFID tag unit can be minimized, and the impedance performance This will be better.

In addition, the reel to reel process can continue the RFID tag manufacturing process, and the application and curing of the adhesive such as NCP is made in a few seconds, substantially does not need to set the buffer section in the continuous process.

In addition, in the case where the conductive wire for the antenna is inserted into the thin film, the antenna having various patterns may be manufactured by positioning it along a predetermined path.

In addition, the manufactured RFID tag can be stored in a reel shape, and when attached to an external article, it is easily released from the reel to be easily attached, and there is no need to attach a protective cover after forming an external bonding adhesive, thereby reducing the process. The overall thickness is reduced.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and any person skilled in the art to which the present invention pertains may have various modifications and equivalent other embodiments. Will understand. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (6)

Providing a thin film; Forming a receiving hole in the thin film to accommodate an RFID chip; Disposing a conductive wire for an antenna to cross the receiving hole on at least one surface of the thin film; Embedding the conductive wire for the antenna to a predetermined depth of the thin film; Separating the conductive wire for the antenna from the space inside the accommodation hole; And Electrically connecting the separated conductive wires for the antenna to the electrodes of the RFID chip, respectively. The method of claim 1, The embedding of the antenna conductive line may be performed by thermally compressing and / or pressing the antenna conductive line with a roller. The method of claim 1, wherein the electrically connecting the conductive wires for the antenna with the electrode of the RFID chip, And fixing the receiving hole, the electrode of the RFID chip, and the conductive wire for the antenna using a chip fixing adhesive. The method of claim 1, wherein the separating the conductive wire for the antenna comprises: And increasing an area in contact with an electrode of the RFID chip at each end of the separated conductive line. The method according to any one of claims 1 to 5, RFID tag manufacturing method further comprising the step of forming an outer bonding adhesive on at least one surface of the thin film. The method of claim 5, The thin film is continuously provided corresponding to a plurality of RFID tags, Surface-treating the surface of the thin film on which the adhesive for external bonding is not formed so as not to adhere to the adhesive for external bonding; And RFID tag manufacturing method further comprises the step of winding the completed RFID tag in the form of a reel.

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