JPH09197965A - Manufacture of electronic tag - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make a resin-sealed electronic tag thin and improve the manufacture yield. SOLUTION: An electronic tag component group 43 including a circuit part and an antenna part is stacked and sandwiched between two thermoplastic resin plates 41 and 42, and those are set in a metallic mold fixed on a heat press machine and pressed under specific heating conditions to fuse and integrate the thermoplastic resin plates 41 and 41 with the component group 43, thereby molding the electronic tag.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a system for automatically identifying tag information attached to an article or the like, and to a method of manufacturing an electronic tag which stores the tag information and is attached to the article or the like.

[0002]

2. Description of the Related Art In recent years, as a system for automatically reading and identifying tag information attached to articles and the like,
An RFID tag identification system called a data carrier system, which is capable of handling a larger amount of information, has excellent environment resistance, and is capable of remote reading, has been actively developed in place of the barcode system known from the past.

This electronic tag identification system is composed of a transponder called an electronic tag attached to an article or the like and an interrogator connected to the host side, and magnetic and induction are provided between the transponder and the interrogator. The feature is that contactless communication is performed via a transmission medium such as an electromagnetic field and a microwave (radio wave).

The information transmission system of the electronic tag identification system includes an electromagnetic coupling system, an electromagnetic induction system, a microwave system, an optical communication system and the like. Among these methods, the electromagnetic coupling method and the microwave method can use the energy of the transmission signal from the interrogator as the driving power for the responder. For this reason, there is a further advantage that there is no fear that the response performance is degraded or the use limit is reduced due to the approaching life of the battery as in the case where the battery is used as a drive source.

[0005]

The transponder (electronic tag) in such an electronic tag identification system comprises an antenna section and a circuit section for transmitting and receiving signals to and from the interrogator. In consideration of environmental resistance, it is essential for an electronic tag to hermetically seal a group of electronic tag components such as an antenna section and a circuit section with resin or the like. Usually, an injection molding method is used as a sealing method of the electronic tag.

However, according to this molding method, it is necessary to take extra resin thickness above and below the electronic tag component group so that the resin injected into the mold evenly spreads around the electronic tag component group during molding. However, there is a problem that it is difficult to obtain a thin electronic tag. Further, there is a possibility that the circuit connecting portion may be broken due to the flow of resin during molding.
The present invention is intended to solve such a problem, and an object of the present invention is to provide a method for manufacturing an electronic tag capable of reducing the thickness of a resin-sealed electronic tag and improving the manufacturing yield. To provide.

[0007]

In order to achieve the above object, a method of manufacturing an electronic tag according to the present invention provides a non-contact signal between a circuit component including a storage element for storing tag information and an external device. In a method of manufacturing an electronic tag having an antenna component for transmitting and receiving, a group of components constituting an electronic tag including a circuit component and an antenna component and a plate material made of a thermoplastic resin are superposed, and these are heated under heating conditions. It is characterized by being pressed and integrally molded.

In order to achieve the above object, the method of manufacturing an electronic tag of the invention is an antenna for transmitting and receiving a signal in a non-contact manner between a circuit component including a storage element for storing tag information and an external device. In a method of manufacturing an electronic tag having a component, a component group that constitutes an electronic tag including a circuit component and an antenna component, and a base material formed by forming a resin layer on one surface are in contact with the component group and the resin layer. As described above, and these are integrally molded by pressurizing them under heating conditions.

According to the method of manufacturing an electronic tag of the present invention, unlike the injection molding method or the like, it is not necessary to take extra resin thickness above and below the electronic tag component group in order to improve the circumference of the resin at the time of molding. As a result, a thin electronic tag can be obtained, and the probability of disconnection of the circuit connecting portion can be greatly reduced because the total amount of resin flowing during molding is small.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing the overall configuration of an electronic tag identification system according to the present invention. As shown in the figure,
This electronic tag identification system comprises an interrogator 10 and a responder (hereinafter referred to as an electronic tag) 20.

The interrogator 10 stores a main control unit 11 that controls the interrogator 10 as a whole, an interface unit 12 that controls input / output of data to / from a host device, and tag information received from the electronic tag 20. A storage unit 13 such as a readable / writable RAM, a signal conversion unit 14 that converts transmission information from a parallel signal to a serial signal, and a reception signal from the electronic tag 20 from a serial signal to a parallel signal, and a transmission signal For example, ASK (Amplitude Shift
Keying) system, a FSK (Frequency Shift Keying) system, or the like, and a modulation unit 15 for modulating a signal for transmission, a demodulation unit 16 for demodulating a received signal, a transmission antenna 17, and a reception antenna 18. .

The electronic tag 20 includes a main control unit 21 that controls the entire electronic tag 20 and an EEP that stores tag information.
A storage unit 22 such as a ROM that does not require a power supply backup, a signal conversion unit 23 that converts transmission information from a parallel signal to a serial signal, and converts a reception signal from the interrogator 10 from a serial signal to a parallel signal, Modulation unit 24 that modulates a signal for transmission by ASK method, FSK method, etc.
And a demodulation unit 25 for demodulating a received signal, and a transmission antenna 2
6 and a receiving antenna 27. next,
A basic communication procedure of the electronic tag identification system will be described.

The interrogator 10 first transmits an interrogation signal to the electronic tag 20 for reading the tag information. When the electronic tag 20 enters the receivable range of the interrogation signal, it receives the interrogation signal and transmits the tag information stored in the storage unit 22 as a response signal. The interrogator 10 receives and decodes this response signal, and sends it to the host device as tag identification information.

FIG. 2 is a perspective view showing the electronic tag 20.

In the figure, 31 is a circuit portion, 32 is an antenna portion, and 33 is a thermoplastic resin. As described above, the electronic tag is configured by sealing the component group 43 that constitutes the electronic tag including the circuit unit 31 and the antenna unit 32 with the thermoplastic resin 33.

The first embodiment of the method of manufacturing the electronic tag will be described below with reference to FIG.

In this embodiment, as shown in FIG. 3, the electronic tag component group 43 is sandwiched between two thermoplastic resin plates 41 and 42, and these are fixed to a heat press. By setting in a mold (not shown) and pressurizing it under predetermined heating conditions, the respective thermoplastic resin plates 41, 42 are melted and integrated with the above-mentioned parts group 43, as shown in FIG. A flexible electronic tag.

According to this method, unlike the injection molding method or the like, it is not necessary to take an extra resin thickness above and below the electronic tag component group in order to improve the surrounding of the resin at the time of molding, so that a thin electronic tag is provided. In addition, since the total flow amount of the resin at the time of molding is small, the probability of disconnection of the circuit connecting portion can be greatly reduced.

As the thermoplastic resin plate, a plate obtained by molding a mixture containing a thermoplastic resin and inorganic filler particles as main components is used.

As the thermoplastic resin therein, ABS,
Vinyl chloride, PPS, etc. are preferred. These resins may be used alone or, if necessary, may be mixed with other resins and used.

Any inorganic filler particles may be used as long as they satisfy the environmental characteristics in the usage environment of the transponder, the flow characteristics of the entire resin at the time of molding, and the like. Silica used as a semiconductor sealing resin, Alumina, carbon black and the like are particularly suitable in the present invention. These inorganic-filled particles are subjected to necessary treatment in advance, adjusted to a predetermined particle size, and then mixed with resin in a powder state by stirring or kneading in a heat-melted state, pulverized, and then adjusted in particle size again. Is preferably used.

The amount of the inorganic filler particles used is preferably in the range of 1 to 90% based on the total weight of the resin component. If it is less than 1%, the effect of the inorganic filler particles cannot be obtained, and if it exceeds 90%, the fluidity of the resin is impaired and the strength of the resin after molding is significantly deteriorated.

The thermoplastic resin plate may be produced by extruding a molten resin composition from a nozzle onto a temporary support in a thin layer, or by spraying the resin composition in a powder form onto the temporary support and then heating and melting the resin composition. And a method of dispersing the resin composition in a solvent, applying it on a temporary support, and then drying it.

The present invention is not necessarily required to dispose the circuit part and the antenna part of the electronic tag between the two thermoplastic resin plates. A thermoplastic resin plate is placed above or below the circuit part and the antenna part of the electronic tag so that they overlap each other.
Molding may be performed by applying pressure under predetermined heating conditions. In this case, the surfaces of the circuit part and the antenna part on the side where the thermoplastic resin plate is not arranged may be in direct contact with the mold surface, but if necessary, a plate-like base material etc. may be contacted with the surfaces. Alternatively, the molding may be performed.

The method of arranging the thermoplastic resin plate on either the upper side or the lower side of the circuit portion and the antenna portion of the electronic tag is as follows.
The preparatory step before molding can be simplified as compared with the former method, and the productivity can be further enhanced.

Examples of the hot press molding method include commonly used heat press, vacuum press, laminator, vacuum laminator and the like. Here, the vacuum press molding method is particularly preferable in the present invention in that the generation of voids in the resin can be suppressed. The laminator and the vacuum laminator are devices that perform heating and pressurization using heated twin rollers. With this device, continuous production is possible and cost reduction can be realized.

Next, a second embodiment according to the present invention will be described.

FIG. 4 is a perspective view showing a completed electronic tag obtained by the manufacturing method of the present embodiment. In the figure, 51 is a circuit part, 52 is an antenna part, 53 is a thermoplastic resin, and 54 and 55 are base materials. As described above, in the electronic tag, the component group 56 that constitutes the electronic tag including the circuit section 51 and the antenna section 52 is sealed with the thermoplastic resin 53,
In addition, the upper and lower surfaces of the thermoplastic resin 53 are covered with the base materials 54 and 55.

The method of manufacturing this electronic tag will be described below with reference to FIG.

As shown in the figure, in this embodiment, the component group 56 of the electronic tag is sandwiched between two base materials 54 and 55 each having a thermoplastic resin layer 61 or 62 formed on one surface thereof. The parts are stacked, set in a mold fixed to a heat press, and pressed under a predetermined heating condition to melt the thermoplastic resin layers 61 and 62 between the base materials, thereby allowing the parts group 5 described above.
6 and the electronic tag as shown in FIG. 4 are molded.

The base materials 54 and 55 may be peeled off after molding the electronic tag.

As the base material, a plastic film, a plastic plate or the like is used. Plastic film,
The material of the plastic plate is PET, PPS, PE
Examples thereof include N, PP, vinyl chloride and the like. Moreover, as the thermoplastic resin, the same ones as those mentioned in the first embodiment can be used.

As the method for forming the thermoplastic resin layer on the surface of the base material, the molten resin composition is extruded from the nozzle in a thin layer on the base material, or the resin composition is powdered on the base material. Examples include a method of spraying and then heating and melting, a method of dispersing a resin composition in a solvent, applying the resin composition on a substrate, and then drying.

The present invention is not necessarily required to dispose the circuit part and the antenna part of the electronic tag between the two base materials having the thermoplastic resin layer. As described in the first embodiment, the base material having the thermoplastic resin layer is arranged on one of the upper and lower sides of the circuit section and the antenna section of the electronic tag, and the molding is performed by applying pressure under a predetermined heating condition. May be. Again,
The surfaces of the circuit part and the antenna part of the electronic tag on the side where the base material having the thermoplastic resin layer is not arranged may be in direct contact with the mold surface, but if necessary, a plate-shaped base may be provided on the surface. The material may be brought into contact with each other to perform the molding. Further, a thermosetting resin plate may be used instead of the thermoplastic resin plate.

As for the hot press molding method, the method described in the first embodiment can be used in the same manner.

[0037]

As described above, according to the method of manufacturing an electronic tag of the present invention, a group of parts constituting the electronic tag and a plate material made of a thermoplastic resin are superposed, and they are pressed together under a heating condition to be integrated. By performing chemical molding, it is not necessary to take extra resin thickness above and below the electronic tag component group to improve the resin surroundings during molding, as in the injection molding method, and thus a thin electronic tag can be obtained. At the same time, since the total flow rate of the resin during molding is small, it is possible to significantly reduce the probability of disconnection of the circuit connecting portion.

[Brief description of drawings]

FIG. 1 is a diagram showing an overall configuration of an electronic tag identification system according to the present invention.

FIG. 2 is a perspective view showing the electronic tag of FIG.

FIG. 3 is a diagram illustrating a method of manufacturing the electronic tag according to the first embodiment of the present invention.

FIG. 4 is a perspective view showing a finished product of an electronic tag obtained by a manufacturing method according to a second embodiment of the present invention.

FIG. 5 is a diagram illustrating a method of manufacturing an electronic tag according to a second embodiment of the present invention.

[Explanation of symbols]

 10 ... Interrogator 20 ... Responder (electronic tag) 31 ... Circuit part 32 ... Antenna part 41, 42 ... Thermoplastic resin plate 43 .... ... antenna part 54, 55 ... base material 56 ... component group 61, 62 constituting the electronic tag ... thermoplastic resin layer

Claims (2)

[Claims] 1. A method of manufacturing an electronic tag, comprising: a circuit component including a storage element that stores tag information; and an antenna component for transmitting and receiving a signal to and from an external device in a non-contact manner. A method of manufacturing an electronic tag, comprising: stacking a component group that constitutes the electronic tag including an antenna component and a plate material made of a thermoplastic resin, and pressurizing these components under a heating condition to integrally mold them. 2. A method of manufacturing an electronic tag, comprising: a circuit component including a storage element that stores tag information; and an antenna component for transmitting and receiving a signal to and from an external device in a non-contact manner. A group of parts constituting the electronic tag including an antenna part and a base material having a resin layer formed on one surface thereof are stacked so that the part group and the resin layer are in contact with each other, and these are heated under heating conditions. A method for manufacturing an electronic tag, which comprises pressurizing and integrally molding.