JP2000331135A - Non-contact data carrier and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily and inexpensively obtain a large quantity of early printable non-contact data carriers. SOLUTION: In one resin sheet 11 composed of a thermoplastic resin, bag-like sections 12 which become housing sections are formed by vacuum molding, hot pressing, pressure forming, etc. After internal parts are housed in the sections 12, the sections 12 are sealed with a resin material. Then a thermoplastic resin sheet 13 on the surface of which data are printed and on the rear face of which adhesive is laminated is stuck to the sheet 11 and the combined body is cut into pieces at prescribed positions with cutter. Thus a plurality of non-contact data carriers 1 each containing the internal parts sealed in its exterior case composed of the resin sheet 11 with a resin and provided with a sheet-like matter 13, such as the resin sheet can be obtained at once.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a method for manufacturing a contactless data carrier. The present invention relates to a method for manufacturing a non-contact data carrier which has an IC chip as a main internal component and transmits and receives signals to and from an external device in a non-contact manner.

[0002]

2. Description of the Related Art In a non-contact data carrier system, a transponder called a non-contact data carrier is attached to various articles, and information about a person or an article possessed by the transponder is read remotely by an interrogator and provided to a host. Implements information processing for people and articles. The transponder (non-contact data carrier) used in this system is mainly composed of antennas and circuit components for transmitting and receiving signals to and from the interrogator.In consideration of durability and environmental resistance, It has a structure in which internal components such as transmission / reception antennas and circuit components are hermetically sealed with resin or the like.

[0003] This non-contact data carrier is usually obtained by storing these internal parts in a resin outer case made by injection molding or the like, and then injecting and curing a thermosetting resin into the outer case. Can be

[0004]

However, according to this method, it is necessary to perform the work of storing the internal parts in the outer case and the work of injecting the resin into the individual outer cases, so that the non-contact data carrier can be efficiently performed. Could not be prepared. As a result, it is not suitable for producing a large amount of non-contact data carriers, and the production cost has been high.

Further, it is not easy to apply printing or the like to the surface of a resin outer case, and it is extremely difficult to display stored tag information or to display a product name of an article to be attached.

The present invention has been made in view of the above problems, and has as its object to provide a large number of non-contact data carriers that can be easily printed and that are easy and inexpensive.

[0007]

According to the present invention, there is provided a contactless data carrier comprising: a circuit component including a storage element for storing information;
An internal component having an antenna for transmitting and receiving signals to and from an external device in a non-contact manner; an external case having a bag-shaped storage portion for storing the internal component made of a resin sheet; and an internal portion stored in the storage portion. It is characterized by including a sealing resin layer for sealing the component and a sealing portion made of a sheet-like material for covering the outer case.

[0008] In this non-contact data carrier, a bag-shaped storage section can be easily formed from a resin sheet, and the manufacturing cost can be reduced. Further, since a seal portion for covering the outer case is formed from the sheet-like material, printing can be performed on the seal portion, and display on the non-contact data carrier is facilitated.

Further, in the non-contact data carrier according to the second aspect, since the brim-shaped bonding portion is provided on the periphery of the upper end of the outer case, the bonding strength with the seal portion can be increased.

Further, in the non-contact data carrier according to the third aspect, the resin sheet forming the outer case is made of a thermoplastic resin sheet. Therefore, the housing portion can be formed by heating the resin sheet.

According to a fourth aspect of the present invention, in the non-contact data carrier, the sheet material forming the seal portion is a thermoplastic resin sheet or a laminate of a thermoplastic resin, or a laminate of a thermoplastic resin sheet and paper. It is made by either. Therefore, printing can be easily performed on the sheet.

Further, in the non-contact data carrier according to the fifth aspect, the seal portion is bonded with a pressure-sensitive adhesive or a hot-melt type adhesive, so that the sheet-like material and the resin sheet serving as an outer case are provided. It can be easily bonded to the sealing resin layer.

Further, in the non-contact data carrier according to the present invention, the seal portion is bonded by thermocompression bonding. The lamination with the layer can be easily performed.

According to the method of manufacturing a non-contact data carrier of the present invention, a circuit component including a storage element for storing information and an internal component having an antenna for transmitting and receiving signals without contact with an external device are resin-sealed. A method for manufacturing a non-contact data carrier, wherein a step of forming a bag-shaped portion in a resin sheet, and a step of resin-sealing the internal component contained in the bag-shaped portion,
The method includes a step of bonding a sheet material to the resin sheet on which the bag-shaped portion is formed, and a step of cutting the bonded resin sheet and the sheet material.

According to this method, the bag-shaped portion can be easily formed from the resin sheet, and the manufacturing cost can be reduced. Further, since a seal portion for covering the outer case is formed from the sheet-like material, printing can be performed on the seal portion, and display on the non-contact data carrier is facilitated. Further, a large number of non-contact data carriers can be simultaneously obtained from one resin sheet.

In this case, in the method of manufacturing a non-contact data carrier according to the present invention, a resin sheet is placed on the upper surface of the mold having the concave portion formed therein, and the pressure in the concave portion is reduced to form a bag-like portion. In the method for manufacturing a non-contact data carrier according to the ninth aspect, the resin sheet placed on the upper surface of the mold having the concave portion is pressed to form the bag-shaped portion. Further, in the method of manufacturing a non-contact data carrier according to the tenth aspect, a compressed gas is blown onto the resin sheet placed on the upper surface of the mold having the concave portion to form a bag-shaped portion. According to these methods, many bag-like portions can be easily formed on one resin sheet.

In the method for manufacturing a non-contact data carrier according to the eleventh aspect, the sheet-like material on which the pressure-sensitive adhesive is laminated is bonded to a resin sheet. Further, in the method for manufacturing a non-contact data carrier according to the twelfth aspect, the sheet material on which the hot melt adhesive is laminated is bonded to a resin sheet by thermocompression bonding. According to these methods, many storage portions can be covered at once, and the seal portion can be easily provided.

[0018]

FIG. 1 is a perspective view of a non-contact data carrier according to an embodiment of the present invention, FIG. 2 is a sectional structural view of the non-contact data carrier of FIG. 1, and FIG. FIGS. 4 to 9 are schematic explanatory views showing a method of manufacturing a contact data carrier, and FIGS. 4 to 9 are more detailed explanatory views showing the manufacturing method. FIGS. 7 is a view showing a method for forming a sealing resin layer, FIG. 8 is a view showing the attachment of a sheet-like material serving as a seal portion, FIG. 9 is a view showing a method for cutting and separating a non-contact data carrier, and FIG. FIG. 11 is a perspective view of a non-contact data carrier according to another embodiment, and FIG. 11 is a sectional structural view of the non-contact data carrier of FIG. Hereinafter, the present invention will be described in detail with reference to the drawings.

The non-contact data carrier 1 shown in FIG. 1 seals an outer case 6 for housing an internal component 4 including a circuit component 2 and a transmitting / receiving antenna 3 and an inner component 4 housed in the outer case 6. A sealing resin portion 5 and a sealing portion 7 that covers the resin sealing portion 5 are provided.

The circuit component 2 has, for example, a copper circuit pattern and terminals formed on the surface of an epoxy board 2b,
A soldered C chip 2a is used. IC
The chip 2a includes the transmitting / receiving antenna 3 in the configuration of the transponder.
Except for the above, each has a built-in functional circuit section. The transmission / reception antenna 3 is formed of a coil made of a conductive copper wire having conductivity, and two end wires (conductive wire portions) of the coil are connected to terminal portions of the epoxy board 2b by welding or soldering.

As shown in FIG. 1, the outer case 6 is formed, for example, in a substantially elliptical shape in plan view. The outer case 6 is made of the resin sheet 11 and the resin sheet 1
1 is formed into a bag-like shape, and a storage portion 6a in which the internal component 4 is stored is provided. The size and shape of the outer case 6 are appropriately designed according to the internal components 4 used, the strength, size, design, and the like required as a product.

[0022] The resin sheet 11 is
Is processed to form the storage portion 6a, and therefore, those easily processed by heat treatment or the like are preferably used. Examples of the material of the resin sheet 11 include polyethylene terephthalate (PET) and polypropylene resin (PP),
Polyethylene resin (PE), polystyrene resin (PS)
And various thermoplastic resins such as ABS resin and polyimide resin. The resin sheet 11 is for holding the sealing resin portion 5, and its thickness and the like are appropriately set depending on the material used so as to obtain sufficient strength.

The sealing resin portion 5 is for protecting the internal component 4 from a force such as an impact applied from the outside. The resin material 5a used for the sealing resin portion is not particularly limited as long as it can reduce the force applied from the outside. For example, vinyl resin, polyethylene terephthalate resin, acrylonitrile / butadiene / styrene copolymer Examples thereof include thermoplastic resins such as resins, thermosetting resins such as epoxy resins, phenol resins, and silicone resins, and ultraviolet-curable acrylic resins and epoxy resins that are cured by ultraviolet rays. In addition, a buffer material such as a silicone gel may be used.

The sealing portion 7 covers the sealing resin portion 5 and functions as a lid of the outer case 6. The seal portion 7 is made of various sheet-like materials 13 such as a resin sheet and paper. Examples of the resin sheet include polyethylene terephthalate (PET), polypropylene resin (PP), and polyethylene resin (P
E), thermoplastic resins such as polystyrene resin (PS), ABS resin, and polyimide resin. Examples of paper include those made of natural fibers such as pulp and synthetic fibers such as rayon. Various composite sheets such as a laminate of a resin sheet and paper or a laminate of a resin sheet can also be used. These thicknesses are appropriately set according to their strength and the like.

The sealing portion 7 is sealed with various kinds of adhesives 8 such as a pressure-sensitive adhesive or a hot melt adhesive.
And the sealing resin portion 5 and the outer case 6
Fixed to Here, the hot melt adhesive is
It means a material that melts at a temperature lower than the softening point of the sheet material 13 and solidifies when cooled to exhibit adhesiveness. These adhesives 8 are preliminarily laminated on one surface of the sheet 13. Even without using an adhesive, the resin layer can be melted and joined at a higher temperature.

Further, on the resin sheet 11, patterns and characters such as characters, logo marks, names of articles to be pasted, and tag information stored in the IC chip 2a can be printed in advance. As a result, display on the non-contact data carrier 1 can be facilitated. Furthermore, the resin sheet 1
The non-contact data carrier 1 is colored in advance by coloring the non-contact data carrier 1 so that the non-contact data carrier 1 can be distinguished at a glance.

Next, a method of manufacturing the non-contact data carrier 1 will be described in detail. First, as shown in FIG. 3 (a), a resin sheet 11 serving as an outer case 6 is prepared, and a bag-shaped portion 12 serving as a storage portion 6a is formed on the resin sheet 11 by vacuum forming, hot pressing or air pressure forming. To (
FIG. 3 (b)).

FIGS. 4A and 4B are explanatory views of the vacuum forming method, in which the bag-like portion 12 is formed by using reduced pressure. In the vacuum forming method, a mold 21 such as a mold having a concave portion 22 and a vacuum pump (not shown) are used. The recess 22 formed in the mold 21 is
Is formed and held in a predetermined shape. Formwork 21
Is provided with an exhaust passage 23 opened in the recess 22 and connected to a vacuum pump. Also, the resin sheet 11
Is provided inside the mold 21 and / or above the recess 22.

In this method, first, the resin sheet 11 is placed on the upper surface of the mold 21, and the resin sheet 11 is heated and softened (FIG. 4A). Next, the inside of the concave portion 22 is depressurized by a vacuum pump, and the bag-like portion 12 is formed so that the resin sheet 11 is attached to the inner wall of the concave portion 22 (FIG. 4B).

FIGS. 5 (a) and 5 (b) are views for explaining the hot pressing method.
2 is formed. In the hot press method, a press device including a lower die 31 having a concave portion 32 formed therein and an upper die 33 having a press portion 34 insertable into the concave portion 32 is used. The recess 32 is for holding the bag-like portion 12 in a predetermined shape. Further, a heater for softening the resin sheet 11 is provided in the lower mold 31 and / or the upper mold 33.

In this method, for example, the resin sheet 11 is placed on the upper surface of the lower mold 31, and the resin sheet 11 is heated and softened (FIG. 5 (a)). Or heated upper mold 33
Is pressed against the resin sheet 11 to soften the resin sheet 11. Next, the upper die 33 is lowered and the resin sheet 11 is pressed to form the bag-like portion 12 (FIG. 5).
(b)).

FIGS. 6 (a) and 6 (b) are views for explaining the compressed air forming method, in which heated air is blown from above the resin sheet 11 to form the bag-like portion 12. FIG.
In the pneumatic molding method, the frame mold 41 in which the concave portion 42 is formed is formed.
And an injection device (not shown) that blows a heated compressed gas to the resin sheet 11.

In this method, the resin sheet 11 is placed on the upper surface of the frame die 41 (FIG. 6A), and the compressed gas heated from the nozzle portion of the injection device positioned above the concave portion 42 toward the resin sheet 11 is heated. To form the bag-like portion 12 such that the resin sheet 11 is attached to the inner wall of the concave portion 42 (FIG. 6 (
b)). In addition, in this method, it is possible to form the bag-shaped portion 12 by blowing compressed gas from above in a state where the resin sheet 11 is heated while the frame mold 41 is provided with a heater. As the compressed gas, a nonflammable or slightly flammable gas such as air or nitrogen is preferably used.

Thus, the bag-like portion 12 is formed on the resin sheet 11. At this time, a large number of recesses 22 are formed in the frame mold 21.
By providing the above, as shown in FIG. 3B, a plurality of bag-like portions 12 can be formed at one time.

Next, as shown in FIG. 7A, the IC chip 2a mounted on the circuit board 2b in advance is placed on the bag-like portion 12.
Then, the internal component 4 connected with the antenna coil is placed, and then the above-described resin material 5a is injected into the bag-like portion 12 from the injection nozzle 51 as shown in FIG. 7 (b). Then, the internal component 4 is sealed with the resin by curing the resin material 5a.

Thereafter, as shown in FIG. 8, another resin sheet (sheet-like material) 13 serving as the seal portion 7 is placed on the bag-like portion 12.
The internal component 4 is superimposed on the resin sheet 11 in which the resin is sealed, and the two resin sheets 11 and 13 are adhered (FIG. 3).
(c)). At this time, by bonding an adhesive 8 such as a pressure-sensitive adhesive or a hot-melt adhesive on the entire back surface of the resin sheet 13 in advance on the resin sheets 13 to be overlapped, the two resin sheets 11 and 13 can be easily bonded. it can.

By printing tag information and the like on the surface of the resin sheet (sheet-like material) 13 in advance, necessary information on the obtained non-contact data carrier 1 can be easily displayed.

Thereafter, as shown in FIG.
Is a resin sheet 11 sealed by a sheet material 13
Is cut at a predetermined position by a cutter 52 or the like.

In this way, as shown in FIG. 3D, a large number of non-contact data carriers 1 according to the present invention in which the sealing resin portion 5 is sealed by the sheet-shaped sealing portion 7 can be simultaneously manufactured. Further, since the manufacturing process is very simple, the non-contact data carrier 1 can be provided at low cost.

The present invention is not limited to the above embodiment, but various embodiments can be considered. For example, in the non-contact data carrier 1 shown in FIG. 10, a brim-shaped bonding portion 6b is provided integrally with the storage portion 6a on the peripheral edge of the upper end of the outer case 6, and the sealing portion 7 is formed at the bonding portion 6b.
And is glued.

In this non-contact data carrier 1,
For example, the two resin sheets 11 and 13 can be bonded together by heat fusion, and the seal portion 7 can be provided without using the adhesive 8 or the like. In addition, the adhesive portion 6b extending around the upper edge of the outer case 6 is
The sealing portion 7 is hardly peeled off from the outer case 6, which is more convenient.

[0042]

Next, the present invention will be described in more detail with reference to the following examples.

First, a plurality of storage portions having a diameter of 20 mm and a depth of 2 mm were formed on a 100 μm-thick PET resin sheet by a vacuum forming method using a mold having a concave portion.
Next, after the internal components connecting the IC chip and the antenna coil were placed in each storage section, a liquid ultraviolet curable acrylic resin was injected. Thereafter, the acrylic resin was cured by irradiating ultraviolet rays, and the internal components were sealed with resin.

Then, tag information is printed on the front surface, and a pressure-sensitive adhesive having a thickness of 5 μm is laminated on the back surface to a thickness of 100 μm.
PET resin sheets were laminated and pressed to bond the two resin sheets. And it cut | disconnected by the cutter in the outer peripheral position of the storage part, and obtained several non-contact data carriers simultaneously as shown in FIG.

[0045]

According to the present invention, a non-contact data carrier in which internal parts are sealed with resin can be easily manufactured. In particular,
Since the outer case for housing the internal parts can be formed from the resin sheet, the material cost can be reduced. Further, since the seal portion serving as the lid of the outer case is also made of a sheet-like material such as a resin sheet, it is possible to easily display by printing on the non-contact data carrier.

In addition, a plurality of non-contact data carriers can be obtained at the same time because a single pressing step can form a large number of storage portions in one resin sheet. In this way, a non-contact data carrier can be provided easily and at low cost.

[Brief description of the drawings]

FIG. 1 is a perspective view of a non-contact data carrier according to an embodiment of the present invention.

FIG. 2 is a sectional structural view of the contactless data carrier of FIG. 1;

FIGS. 3A to 3D are schematic explanatory views showing a method for manufacturing a non-contact data carrier according to the present invention.

FIG. 4 is a more detailed explanatory view showing a method of manufacturing the non-contact data carrier of FIG. 3, showing an example of a method of forming a storage section.

FIG. 5 is a more detailed explanatory view showing a method for manufacturing the non-contact data carrier shown in FIG. 3, showing another example of a method for forming a storage section.

FIG. 6 is a more detailed explanatory view showing the method of manufacturing the non-contact data carrier of FIG. 4, showing still another example of the method of forming the storage section.

FIGS. 7A and 7B are diagrams showing a method of forming a sealing resin portion.

FIG. 8 is a view showing sticking of a sheet-like material serving as a seal portion.

9A and 9B are diagrams showing a method of cutting and separating a non-contact data carrier.

FIG. 10 is a perspective view of a contactless data carrier according to another embodiment of the present invention.

11 is a sectional structural view of the non-contact data carrier of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Non-contact data carrier 2 ... Circuit parts 3 ... Transmission / reception antenna 4 ... Internal parts 5 ... Sealing resin part 6 ... Exterior case 6a ... Storage part 6b ... Adhesive part 7 ... Seal part 8 ... Adhesive 11 ... Resin sheet 12 ... Bag-shaped part 13 ... Sheet-shaped material 21, 41 ... Formwork 22 ... Depression 23 ... Exhaust path 31 ... Lower mold 33 ... Upper mold 52 ... Cutting machine

Claims (12)

[Claims] 1. A circuit component including a storage element for storing information, an internal component having an antenna for transmitting / receiving a signal without contacting an external device, and a bag-shaped housing for storing the internal component made of a resin sheet An exterior case having a storage portion, a sealing resin layer for sealing internal components stored in the storage portion, and a seal portion made of a sheet-like material for covering the exterior case is provided. Contact data carrier. 2. The non-contact data carrier according to claim 1, further comprising a brim-shaped bonding portion provided on a peripheral edge of an upper end of the outer case. 3. The non-contact data carrier according to claim 1, wherein the resin sheet forming the outer case is a thermoplastic resin sheet. 4. A sheet-like material forming the seal portion,
A laminate of thermoplastic resin sheets or thermoplastic resin sheets,
3. The non-contact data carrier according to claim 1, wherein the non-contact data carrier is a laminate of a thermoplastic resin sheet and paper. 5. The non-contact data carrier according to claim 1, wherein the seal portion is bonded with a pressure-sensitive adhesive or a hot-melt type adhesive. 6. The non-contact data carrier according to claim 1, wherein said seal portion is bonded by thermocompression bonding. 7. A method for manufacturing a non-contact data carrier in which a circuit component including a storage element for storing information and an internal component having an antenna for transmitting and receiving signals without contact with an external device are resin-sealed. Forming a bag-shaped portion on the resin sheet; sealing the internal component contained in the bag-shaped portion with a resin; bonding a sheet-shaped material to the resin sheet on which the bag-shaped portion is formed. And a step of cutting the bonded resin sheet and the sheet-like material. 8. The method for manufacturing a non-contact data carrier according to claim 7, wherein a resin sheet is placed on the upper surface of the mold in which the concave portion is formed, and the inside of the concave portion is reduced in pressure to form a bag-like portion. 9. The method for manufacturing a non-contact data carrier according to claim 7, wherein the resin sheet placed on the upper surface of the mold having the concave portion is pressed to form a bag-like portion. 10. The method for manufacturing a non-contact data carrier according to claim 7, wherein a compressed gas is blown onto the resin sheet placed on the upper surface of the mold having the concave portion to form a bag-like portion. 11. The method for manufacturing a non-contact data carrier according to claim 7, wherein the sheet-like material on which the pressure-sensitive adhesive is laminated is attached to a resin sheet. 12. The method for manufacturing a non-contact data carrier according to claim 7, wherein the sheet material on which the hot melt adhesive is laminated is bonded to a resin sheet by thermocompression bonding.