KR20070021474A - Test handler for semiconductor device - Google Patents

Abstract

The semiconductor device test handler according to the present invention includes a first chamber for maintaining an internal temperature at a predetermined first temperature, and an internal temperature at a second temperature, which is located inside the first chamber and is selectively different from the first temperature. And a second chamber to be held, and a mechanism at least partially positioned inside the second chamber, wherein the apparatus can be a test tray feeder or the like. The semiconductor device test handler having such a configuration has an advantage of preventing the mechanism from malfunctioning or deteriorating durability in the cryogenic or high temperature state by protecting the apparatus from the temperature environment in the first chamber. have.

Handlers, test handlers, semiconductors, test trays, chambers

Description

Semiconductor Device Test Handler {TEST HANDLER FOR SEMICONDUCTOR DEVICE}

1 is a perspective view schematically showing the structure of a conventional test handler;

2 is a perspective view of a second chamber installed in a first chamber constituting a semiconductor device test handler as a first embodiment of the present invention;

3A is a side cross-sectional view illustrating a portion of a test tray feeder located in a second chamber located inside a test chamber;

3B is a perspective view of FIG. 3A,

3c is a view showing that most of the power transmission unit is located inside the second chamber;

Figure 4 is a schematic diagram showing the connection of the second chamber and the temperature control device,

5A is a perspective view illustrating a portion of a power transmission unit located in a second chamber located inside a test chamber according to a second embodiment of the present invention;

5B is a perspective view of FIG. 5A.

<Description of Symbols for Main Parts of Drawings>

205: test chamber (first chamber) 210: base plate (constitution of second chamber)

215: cover (constitution of second chamber) 220: first opening

305: motor 310: drive shaft

315: drive pulley 320: first belt

325: power transmission pulley 3 30: transmission shaft

335: first driven pulley 340: second belt

345: second driven pulley 350: moving block

355: cylinder block 360: holding part

365: test tray mounting portion 370: second opening

405: temperature controller 410: duct or pipe

505: coupling member

The present invention relates to a semiconductor device test handler, and more particularly, to a semiconductor device test handler having a chamber for maintaining a low temperature or a high temperature.

In the semiconductor device manufacturing process, a device manufactured through a predetermined assembly process is finally subjected to a test process for testing whether a specific function is performed. The test handler is used in the above test process, and the device contained in the test tray is tested by contacting an external test head in the test chamber, and the devices are classified and loaded according to the test results.

1 is a perspective view schematically showing the structure of a test handler disclosed in the Republic of Korea Patent Publication No. 2003-29622 (published date: 2003.4.14) of the present applicant.

Referring to FIG. 1, a process in which a test tray 110 containing a device in a test handler moves each chamber is described as follows.

First, the device under test contained in the customer tray 105 is loaded into the test tray 110 by a pick and place device (not shown).

Then, the test tray 110 containing the device under test is drawn into the soak chamber 115 and transferred by a step by a test tray feeder (not shown), so that the temperature suitable for the test, that is, the device is Heated to the temperature generated during operation in the state applied to, or cooled to low temperature to determine whether it operates normally under low temperature environment.

At this time, the temperature in the inner chamber 115 is maintained at a cryogenic temperature of less than -40 ℃ using a liquid nitrogen (LN ₂ ) or the like, or maintained at a high temperature of 125 ℃ or more by a heating device.

Then, the device cooled or heated in the inner chamber 115 is transferred to the test chamber 120 by a separate test tray transfer device (not shown) contained in the test tray 110.

In this case, the temperature in the test chamber 120 is also generally maintained at the same or similar to the temperature in the inner chamber 115.

Then, the device contained in the test tray 110 is in contact with the contact socket (not shown) of the test head in contact with one surface of the test chamber 120, a predetermined test is performed.

Then, the test tray 110 containing the device after the predetermined test is transferred to the desoak chamber 125 by a separate test tray feeder.

At this time, the device contained in the test tray 110 is gradually reduced to an external ambient temperature by heating or cooling while being transferred by one step in the de-chamber chamber 125.

Finally, the test tray 110 containing the device reduced to an external ambient temperature is withdrawn from the de-chamber 125 to the unloading unit 130, and then the device is unloaded from the unloading unit 130. The loading completes the test process.

However, the various chambers constituting the test handler, in particular, the inside chamber 115, the test chamber 120, and the inside of the descheduling chamber 125 are maintained at a high temperature or a cryogenic temperature for the test environment, and thus, the inside chamber 115 is used. In addition, various apparatuses provided in the test chamber 120 and the de-chamber chamber 125 may be exposed to high temperature or cryogenic internal air as it is, causing malfunction or deteriorating durability.

In particular, in the transfer device for transferring the test tray 110 from the inner chamber 115 to the test chamber 120, such malfunction and degradation of durability were serious. The internal components and / or drive belts of the drive cylinders that make up the transfer device are caused by extreme shrinkage and tension in the cryogenic and high temperature chambers.

The present invention is to overcome the problems of the conventional semiconductor device test handler described above, an object of the present invention is to provide a semiconductor device test handler for protecting the apparatus provided in the chamber constituting the test handler from the cryogenic or high temperature internal air. It is done.

In order to achieve the above object, according to an embodiment of the present invention, the first chamber for maintaining the internal temperature at a predetermined first temperature; A second chamber located inside the first chamber to maintain an internal temperature at a second temperature, the second temperature being selectively different from the first temperature; A semiconductor device test handler is provided that includes an instrument at least partially located within the second chamber.

In the above embodiment, a separate second chamber is provided in the first chamber, and the main part of the apparatus is located in the second chamber, thereby protecting the apparatus from cryogenic or hot internal air in the first chamber. Can be.

According to an aspect of the present invention, there is provided a semiconductor device test handler comprising: a first chamber for maintaining an internal temperature at a predetermined first temperature, and optionally different from the first temperature in an interior of the first chamber; And a second chamber for maintaining an internal temperature at a second temperature, and a mechanism at least partially located inside the second chamber.

The first chamber may be any one of a soak chamber, a test chamber, and a desoak chamber.

The at least one outer wall of the second chamber is formed of a resin material, and the resin material is epoxy.

In addition, the instrument is provided with a base plate, the base plate is characterized in that used as one of the outer wall of the second chamber, wherein the base plate is characterized in that the aluminum-based metal.

In addition, the first chamber is a test chamber, and the instrument is characterized in that the test tray transfer device used to transfer the test tray in the test chamber.

Here, the test tray conveying apparatus includes a test tray attaching portion for attaching at least one test tray, a power transmission portion for moving the test tray attaching portion in at least one direction, and driving means for driving the power transmitting portion. It characterized by having a.

In this case, the test tray mounting portion is located inside the first chamber and outside the second chamber, at least a portion of the power transmission portion is located inside the second chamber, and the driving means is located outside the first chamber. It is characterized by.

On the other hand, the test tray mounting portion has a holding portion for mounting the test tray and a cylinder block for driving the holding portion, the holding portion is located inside the first chamber and outside the second chamber, the cylinder block and the At least a portion of the power transmission unit is located inside the second chamber, and the driving means is characterized in that it is located outside the first chamber.

In addition, the second chamber is characterized in that it comprises a separate temperature control device, wherein the temperature control device is characterized in that located inside the second chamber or located outside of the first chamber.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings, and a redundant description will be omitted for the sake of brevity.

<First Embodiment>

2 is a perspective view illustrating a combination of second chambers 210 and 215 installed in a first chamber 205 constituting a semiconductor device test handler according to a first exemplary embodiment of the present invention.

As shown in FIG. 2, in the semiconductor device test handler according to the present invention, the second chambers 210 and 215 are located in the first chamber 205, and the second chambers 210 and 215 are formed of the first chamber 205. A base plate 210 which forms one outer wall of the two chambers 210 and 215, and a cover which is combined with the base plate 210 to form another inner space different from the inner space of the first chamber 205 ( 215).

Here, the first chamber 205 may be various chambers constituting the semiconductor device test handler. For example, the first chamber 205 may be an inner chamber, a test chamber, or a desorption chamber that maintains a cryogenic or high temperature.

Although not shown in FIG. 2, in order to be isolated from the influence of the internal temperature of the first chamber 205, inside the second chambers 210 and 215, main parts of various apparatuses constituting the semiconductor device test handlers are provided. Located.

Therefore, the first opening 220 which can be opened and closed by a predetermined opening and closing device (not shown) is formed in the cover 215 of the second chambers 210 and 215, thereby allowing the first opening 220 to be opened. It is desirable to be able to maintain various instruments located in the second chamber (210, 215).

In the present embodiment, a test chamber 205 is described as the first chamber 205 as an example, and a test tray for transferring a test tray (not shown) containing a device in the test chamber 205 as the apparatus. Although a transfer apparatus (also referred to as a 'feeder') is described as an example, the present invention is not limited thereto.

3A is a side cross-sectional view illustrating a portion of the test tray feeder located in the second chambers 210 and 215 located in the test chamber 205, and FIG. 3B is a perspective view of FIG. 3A.

3A and 3B, the semiconductor device test handler according to the present invention is connected to a motor 305 located outside the test chamber 205 and a drive shaft 310 of the motor 305. A driving pulley 315 which rotates and is mounted outside the outer wall of the test chamber 205, and is connected to the driving pulley 315 and the first belt 320 to rotate together with the driving pulley 315 and the test chamber ( A power transmission pulley 325 mounted outside the outer wall of the 205, a base plate 210 installed inside the outer wall of the test chamber 205 and constituting one outer wall of the second chambers 210 and 215, and A first driven pulley 335 installed on the base plate 210 and connected to the power transmission pulley 325 and the transmission shaft 330 to rotate together with the power transmission pulley 325, and the first driven pulley ( 335 and the second belt 340 are rotated together with the first driven pulley 335 and the base plate 210. A second driven pulley 345 installed thereon and coupled to the second belt 340 to move between the first and second driven pulleys 335 and 345 along the second belt 340. Block 350, the cylinder block 355 is coupled to the moving block 350 to move together with the moving block 350, and the driving cylinder of the cylinder block 355 is coupled to the cylinder block 355 By the forward and backward by the forward and backward action of the holding unit 360 is coupled to the coupling groove of the test tray (not shown) located in the front of the second chamber (210, 215) and the test tray, and A second opening 370 protruding the holding part 360 into the inner space of the first chamber 205 is formed on one surface, and the cylinder block 355, the first driven pulley 335, and the second driven pulley ( 345, a cover 215 that blocks the second belt 340, the moving block 350, and the like from the inner space of the first chamber 205. It is configured to include.

Here, since the cylinder block 355 and the holding unit 360 mount and move the test tray, the cylinder block 355 and the holding unit 360 may be collectively referred to as a test tray mounting unit 365. .

In addition, the driving pulley 315, the power transmission pulley 325, the first driven pulley 335, the second driven pulley 345, the first belt 320, the second belt 340, the moving block 350 ), The driving shaft 310 and the transmission shaft 330 transmit the power of the motor 305 to the test tray mounting portion 365, so that the driving pulley 315 to the transmission shaft 330 is a power transmission portion. Can be called as (unsigned).

In addition, the second chambers 210 and 215 are formed by the combination of the base plate 210 and the cover 215.

Referring to the operation of the semiconductor device test handler including the above configuration, when the motor 305 is operated, the driving force is transmitted to the power transmission unit, the test tray mounting unit 365 is coupled to the power transmission unit Moves from side to side in the second chambers 210 and 215 along the second openings 370 formed on one surface of the cover 215 of the second chambers 210 and 215, and the test tray is taken. A portion of the couple 365, that is to say more precisely, the holding portion 360 or a portion of the holding portion 360 protrudes out of the opening 370 to open a test tray located in the first chamber 205. By mounting, the test tray can be transported.

In the present exemplary embodiment, two holding parts 360 are formed up and down to transfer two test trays, but are formed on one surface of the second chambers 210 and 215 according to various modifications of the holding part 360. There may be a deformation of the shape and number of the second openings 370.

At this time, the temperature inside the test chamber 205 is a cryogenic temperature of less than -40 ℃ or a high temperature of more than 100 ℃, while the second chamber (210, 215) blocks most of the internal air of the test chamber 205 As a result, the second belt 340 and the cylinder block 355 located in the second chambers 210 and 215 may be protected from the test chamber 205, resulting in malfunction of the test tray feeder. Will be prevented. In particular, since the components such as the driving cylinders in the second belt 340 and the cylinder block 355 are very sensitive to cryogenic or high temperature, the second belt 340 and the cylinder block 355 are the test chambers. It is very advantageous to be located inside the second chambers 210 and 215 that are isolated from the interior space of 205.

On the other hand, the cryogenic temperature in the test chamber 205 through the second opening 370 formed on one surface of the second chamber (210, 215: more precisely, the cover 215 constituting the second chamber) or In order to prevent internal air in a high temperature state from flowing into the second chambers 210 and 215, an opening and closing device (not shown) may be formed in the second opening 370.

The opening and closing device is not described with reference to a separate drawing, but is formed of a comb-shaped soft protrusion formed densely on the upper and / or lower surface of the second opening 370, and the second protrusion is formed by the soft protrusion. The opening 370 may be sealed, but the opening and closing device may be opened so that only a part of the holding part 360 and the soft protrusion contact each other.

In addition, the opening and closing device is formed of a flexible member such as a rubber plate formed on the upper and / or lower surface of the second opening 370, so that the second opening 370 is sealed by the flexible member, the holding unit It may be an opening and closing device so that only a portion of the portion 360 and the flexible member contact each other.

In addition, the opening and closing device may be a sliding type opening and closing device that is opened when the test tray mounting portion 365 is moved and closed when the test tray mounting portion 365 is stopped under the control of a separate controller.

In addition, in the above-described embodiment, only a part of the power transmission unit is located inside the second chamber, but in some cases, according to a design change of the test tray transfer device, as shown in FIG. 3C, the power transmission unit Most may be located inside the second chambers 210 and 215.

The cover 215 and / or the base plate 210 constituting the second chambers 210 and 215 may be formed of a resin material having low cost and excellent heat insulation. to be.

However, when a predetermined mechanism, for example, the first and second driven pulleys 335, 345, and the like are installed on the base plate 210, the base plate 210 is secured to securely install the mechanism. It is preferable to form from an aluminum metal.

Meanwhile, in order to maintain the temperature inside the second chambers 210 and 215 clearly from the temperature inside the test chamber 205, the second chambers 210 and 215 are separate temperature controllers 405. It may be provided.

4 is a block diagram illustrating a connection between the second chambers 210 and 215 and the temperature control device 405.

As shown in FIG. 4, the temperature control device 405 is located outside the test chamber 205, and the second chambers 210 and 215 and the temperature control device are located inside the test chamber 205. 405 is connected to a duct or tube 410. Heating or cooling gas supplied from the temperature control device 405, or air at room temperature in the atmosphere is supplied to the second chamber (210, 215) through the duct or pipe 410, the second chamber ( The internal spaces of the 210 and 215 may be maintained at a temperature that is different from the internal space of the test chamber 205, that is, a mechanism in which an apparatus located in the second chambers 210 and 215 does not malfunction.

In some cases, the temperature control device 405 may be located inside the second chambers 210 and 215. In this case, the temperature control device 405 may be a small heater and / or cooling fan. Can be.

As such, by placing a separate second chamber in a first chamber that maintains an internal temperature of cryogenic or high temperature, and by placing a major portion of the test tray feeder inside the second chamber, the main portion of the test tray feeder This is protected from the extreme temperature environment of the first chamber, and as a result, malfunction of the test tray feeder can be prevented. In addition, by providing a separate temperature control device for adjusting the temperature inside the second chamber, the malfunction of the test tray feeder is further prevented.

Second Embodiment

In the first embodiment described above, the test tray mounting portion and the power transmission portion constituting the test tray feeder are positioned inside the second chamber. However, the test tray mounting portion may be provided with a separate temperature compensation device. The tray mounting part may be located inside the test chamber, and only the power transmission part or a part of the power transmission part may be located inside the second chamber.

In the present embodiment, the same configuration as the above-described first embodiment will be described with the same reference numerals.

FIG. 5A is a side cross-sectional view illustrating a portion of the power transmission unit located in the second chambers 210 and 215 located in the test chamber 205 as the second embodiment, and FIG. 5B is a perspective view of FIG. 5A. .

5A and 5B, the first and second driven pulleys 335 and 345, the second belt 340 and the moving block 350 are positioned inside the second chambers 210 and 215. The test tray mounting portion 365 is located outside the second chambers 210 and 215 and inside the test chamber 205.

Here, the movable block 350 and the test tray mounting portion 365 are coupled by a coupling member 505, wherein the coupling member 505 is formed on one surface of the second chambers 210 and 215. It protrudes from the inside of the second chambers 210 and 215 into the test chamber 205 through the second opening 370.

In addition, the shape and number of the second openings 370 may be variously changed according to the shape of the portion coupled by the coupling member 505.

On the other hand, the material of the second chamber (210, 215) is the same as the first embodiment described above, the second chamber (210, 215) is provided with a temperature control device 405 similar to the first embodiment described above can do.

In the above description of the present invention, as a specific embodiment, the test chamber as a first chamber has been described, and a test tray transfer apparatus for transferring a test tray containing a device in the chamber has been described. However, the present invention is limited to the above-described embodiment. For example, as the first chamber and the first chamber or the second chamber may be configured in the same manner as in the above-described embodiment, those of ordinary skill in the art to which the present invention pertains should also apply to the following claims. Various modifications may be made without departing from the spirit of the invention as described.

The present invention has a separate second chamber having an internal temperature distinct from the temperature in the first chamber in a first chamber in which a cryogenic or high temperature state is maintained, and a predetermined mechanism such as a transfer device in the second chamber. By positioning the device, there is an effect of protecting the apparatus from the temperature environment in the first chamber.

Therefore, according to the present invention, there is an advantage that can prevent the phenomenon that the mechanism is malfunctioned or the durability is degraded in the state of cryogenic or high temperature.

Claims (13)

A first chamber for maintaining an internal temperature at a predetermined first temperature, A second chamber located inside the first chamber to maintain an internal temperature at a second temperature, the second temperature being selectively different from the first temperature; At least a portion of the instrument is located within the second chamber; Semiconductor device test handler. The method of claim 1, The first chamber may be any one of a soak chamber, a test chamber, and a desoak chamber. Semiconductor device test handler. The method of claim 1, At least one outer wall of the second chamber is formed of a resin material Semiconductor device test handler. The method of claim 3, wherein The resin material is characterized in that the epoxy Semiconductor device test handler. The method of claim 1, The appliance has a base plate, The base plate is used as one of the outer walls of the second chamber Semiconductor device test handler. The method of claim 5, wherein The base plate is characterized in that the aluminum-based metal Semiconductor device test handler. The method of claim 1, The first chamber is a test chamber, The instrument is a test tray conveying device used to convey a test tray within the test chamber Semiconductor device test handler. The method of claim 7, wherein The test tray feeder, A test tray mount for attaching at least one test tray, A power transmission unit for moving the test tray mounting unit in at least one direction; And a driving means for driving the power transmission unit. Semiconductor device test handler. The method of claim 8, The test tray mount is located inside the first chamber and outside the second chamber, At least a portion of the power transmission unit is located inside the second chamber, The driving means is located outside the first chamber Semiconductor device test handler. The method of claim 8, The test tray mounting portion and the holding portion for mounting the test tray, Having a cylinder block for driving the holding portion, The holding portion is located inside the first chamber and outside the second chamber, At least a portion of the cylinder block and the power transmission unit are located inside the second chamber, The driving means is located outside the first chamber Semiconductor device test handler. The method of claim 1, The second chamber is characterized in that it comprises a separate temperature control device Semiconductor device test handler. The method of claim 11, The temperature control device of the second chamber is located inside the second chamber. Semiconductor device test handler. The method of claim 11, The temperature control device of the second chamber is located outside the first chamber, characterized in that Semiconductor device test handler.

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