JP3635957B2 - Constant temperature chamber passage opening and closing device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
For example, in a test apparatus that measures the electrical characteristics of an IC device (integrated circuit element) heated or cooled to a predetermined temperature, the inside and outside of a constant temperature chamber in which the IC device is located is partitioned. The present invention relates to a passage opening and closing device for a constant temperature chamber provided in a heat insulating wall or the like and attached to a passage for taking in and out a transfer board.
[0002]
[Description of Related Art]
A test apparatus for testing and measuring the electrical characteristics of an IC device is generally composed of an IC tester and an IC handler. The IC handler is composed of a loader unit, a test measurement unit, and an unloader unit. The The loader unit is provided with a mechanism for supplying an IC device. The test measurement unit has a test head of an IC tester, and a mechanism for positioning the IC device at a predetermined position and a mechanism for contacting and separating the IC device from the test head. Is included. Further, the unloader unit includes means for classifying the IC devices that have been tested and measured.
[0003]
Here, the IC device is not only tested in a normal temperature state, but is also subjected to a test in which a constant temperature condition is given to the IC device and current is passed between the IC device and the test head in a heated or cooled state. Here, as the test temperature condition given to the IC device, the IC device is heated to 100 to 150 ° C. during the high temperature test, and the temperature of the IC device is cooled to −50 ° C. or lower during the low temperature test. . Therefore, in the test measurement unit described above, in order to keep the IC device at the set temperature, the test measurement unit is arranged in a thermostat controlled at the set temperature during energization. Since the IC device supplied from the loader unit is in a temperature state of room temperature or in the vicinity thereof, it is necessary to heat or cool the IC device to a set temperature prior to the test measurement. Provided. Since the preheating part and the test measurement part are placed in substantially the same temperature state, they are generally configured as an integral thermostat. In the preheating part, a wide space is required to efficiently heat or cool as many IC devices as possible, and the test and measurement part has different functions such as extremely strict temperature control. In some cases, the preheating portion and the test measurement portion are partitioned by a partition wall and formed as independent thermostats.
[0004]
Therefore, the IC device supplied from the loader unit in the IC handler is first carried into the preheating unit, heated or cooled until reaching the set temperature in the preheating unit, and then connected to the IC tester after setting the set temperature. Thus, a test measurement of electrical characteristics is performed. When the test measurement of the IC device is completed, the IC device moves to the unloader unit, and is classified by the unloader unit based on the test result. Of course, temperature management is not performed in the unloader section, and therefore the IC device reaches approximately room temperature in the unloader section.
[0005]
In particular, if the IC device is subjected to a low temperature test at a temperature of −50 ° C. or lower and then immediately transferred to the unloader part, the temperature difference between the IC device and the outside air temperature causes the package part and the outer surface part of the lead, etc. Condensation will occur. Therefore, after the test measurement is completed, the IC device is not immediately transferred to the unloader unit, but a defroster chamber having a temperature approximately halfway between the measurement temperature and the room temperature is provided, and the temperature of the IC device is once set in the defroster chamber. Is increased to a temperature at which the condensation does not occur at room temperature, that is, after the temperature is raised to the unloader section. On the other hand, in the high temperature test, the above-mentioned condensation does not occur, but in order to prevent the IC device from being subjected to heat shock as much as possible, the IC device is again carried into the defroster chamber maintained at a temperature between the constant temperature bath and the room temperature. However, it is desirable to lower the temperature to some extent in the defroster chamber and then shift to the unloader section. Therefore, the thermostatic chamber and the defroster chamber are constant temperature chambers that are maintained at a constant temperature state, although there is a difference in accuracy.
[0006]
From the above, the thermostatic chamber consisting of a thermostatic bath and a defroster chamber, and between one thermostatic chamber and another thermostatic chamber are kept thermally isolated by a heat insulating wall, and a part of this heat insulating wall is An opening is provided to provide a path for the IC device. Therefore, the IC device is carried into the thermostatic chamber through this passage, then moves through the defroster chamber, and is carried out of the defroster chamber. Here, the temperature control of the thermostatic chamber is very strictly controlled, and the defroster chamber is not as hot as the thermostatic bath, but it must be maintained within a certain temperature range. The passage is opened only when the IC device passes. A shutter device is provided to open and close the passage. As the shutter device, a shutter plate made of a plate-like member capable of closing the passage, and the shutter plate are slid along the surface of the heat insulating wall. A configuration including a shutter driving unit has been widely used.
[0007]
[Problems to be solved by the invention]
When IC devices are put into and out of the thermostat chamber consisting of a thermostatic bath and a defroster chamber one by one, the opening area of the passage formed in the heat insulating wall is small, so that the thermostatic chamber can be opened or closed by the shutter plate described above. The temperature inside hardly changes. However, in recent years, in order to perform test measurement of IC devices at high speed and efficiently, a test board as a transfer board is used, and a large number of IC devices are mounted on the test board, and the IC mounted on the test board. A device in which each IC device is simultaneously tested and measured by contacting and separating the device from the test head is used. Then, the number of IC devices mounted on the test board tends to increase, and accordingly, the size of the test board increases accordingly. As a result, the opening area of the passage provided with the shutter device inside and outside the constant temperature chamber or between the plurality of constant temperature chambers is widened.
[0008]
Since the shutter plate used as the opening / closing means of the passage slides on one side surface of the heat insulating wall, it is difficult to give the shutter plate a heat insulating effect, and the sliding between the shutter plate and the heat insulating wall is difficult. Since it is difficult to completely seal the contact portion, heat is dissipated through the mounting portion of the shutter plate, and there is a high possibility that the temperature will change in the constant temperature chamber. Furthermore, since the shutter plate is reciprocated, the time required to open and close the shutter plate becomes longer, and the heat dissipation in the constant temperature chamber is further increased as the shutter opening time becomes longer.
[0009]
The present invention has been made in view of the above points, and an object of the present invention is to provide a constant temperature chamber shutter device that is excellent in heat insulation when the passage is closed by the shutter member and can be opened and closed at high speed. Is to provide.
[0010]
[Means for Solving the Problems]
  In order to achieve the above-mentioned object, the present invention is for transferring a transfer board into and out of the thermostatic chamber through a passage formed in a heat insulating wall constituting the thermostatic chamber in which temperature management is performed. ,It is mounted at a position between the side plate portions on both sides constituting the passage,A shutter member made of a cylindrical member, and formed as a board insertion path through which the transport board can pass by forming a through-hole penetrating in a position including the central axis in the peripheral body part,SaidThe shutter member is rotated around the axis in the passage, and the board insertion passage is rotated and displaced between a shutter open position where the board insertion passage opens inside and outside the constant temperature chamber and a shutter closed position where the board insertion passage is closed. Shutter driving means for causingThe elastic seal portion having a substantially uniform thickness is provided on the outer periphery of the round rod-like support rod, and the elastic seal portion is in close contact with the both side plate portions and the outer peripheral surface of the shutter member, and is provided by the shutter driving means. A rod-shaped seal member that rotates following the rotation of the shutter member;And both outer peripheral wall portions constituting the board insertion passage of the shutter member when the shutter member is in the shutter closed position.And the rod-shaped sealing member provided between the outer peripheral wall portions and the side plate portions.This is characterized in that the passage is closed.
[0011]
Here, a pair of seal members that are in contact with the outer peripheral wall when the shutter member is in the shutter closed position are disposed on the end walls that define the passage of the heat insulating wall, respectively, at portions facing the inside and outside of the thermostatic chamber. In addition, it is desirable that the seal member is formed by providing an elastic seal portion having a substantially uniform thickness on the outer periphery of a circular support rod. Further, when the constant temperature chamber is in a low temperature state, a gas supply unit that supplies dry gas into the space of the board insertion passage when the shutter member is in the shutter closed position is provided on the end wall of the heat insulating wall. Is more desirable. Here, the thermostatic chamber is, for example, a thermostatic chamber in which a test measurement unit for measuring the electrical characteristics of the IC device in a predetermined temperature state is arranged. A passage of a test board on which a large number of IC devices are mounted as a transfer board is formed in a heat insulating wall provided between the defroster chamber, which is another constant temperature chamber held in the chamber, and a shutter member is provided in this passage.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In this embodiment, in the IC device test apparatus, a test board on which a large number of IC devices are mounted is configured as a shutter device provided at a transition portion from the thermostatic chamber to the defroster chamber. For example, the same shutter device for the inside and outside of the constant temperature chamber and the transfer board transfer portion between one constant temperature chamber and another constant temperature chamber, such as a transition portion from the loader portion to the constant temperature bath or a transition portion from the defroster chamber to the unloader portion Can be provided.
[0013]
First, FIG. 1 shows a schematic configuration of an IC device test apparatus. In the figure, 1 is a loader unit, 2 is a thermostatic chamber, 3 is an unloader unit, and these constitute an IC handler. The thermostatic chamber 2 includes a preheating part 2a and a test measurement part 2b. A wall surface of the test measurement part 2b is opened, and a test head 4 of an IC tester faces the opening. In addition, the constant temperature bath 2 is provided with a defroster chamber 5. And the thermostat and defroster chamber 5 are thermostat chambers in which the interior is at a constant temperature.
[0014]
In the test apparatus having the above configuration, the electrical characteristics of the IC device D (hereinafter simply referred to as device D) shown in FIGS. 2 and 3 are measured and measured. In order to test many devices D at the same time, The test board 6 is used as a transport board for transporting the device D. The test board 6 has a number of recesses formed on the surface of a flat plate member, and each of the recesses is provided with device clamp means 7 for positioning and clamping the device D at a predetermined position. Therefore, a large number of recesses provided with the device clamping means 7 become the device accommodating portion 8.
[0015]
In the loader unit 1, means for transferring the device D from the pallet 9 to each device storage unit 8 of the test board 6 and a transport unit for the test board 6 are provided. And a means for bringing the test board 6 into and out of contact with the test head 4 are provided. Further, a means for transporting the test board 6 from the thermostatic chamber 2 to the unloader section 3 through the defroster chamber 5, and the device D is taken out from the test board 6 in the unloader section 3 and classified into pallets 9 based on the test results. A means for transferring is installed. However, since the structures of these transport means and transfer means are well known, illustration and explanation thereof are omitted, and the direction of movement of the test board 6 is indicated by an arrow in FIG. Although the test board 6 can be transported in a horizontal state, the test board 6 is transported so that the test board 6 is vertical and its long side faces the transport direction in the illustrated configuration. Therefore, when the test board 6 is transported from the loader unit 1 to the thermostatic chamber 2 and when it is transported from the defroster chamber 5 to the unloader unit 3, the posture of the test board 6 is changed.
[0016]
Since the test board 6 is conveyed in a vertical state, the test board 6 is guided from the loader unit 1 to the constant temperature bath 2 by being lowered from the upper side or raised from the lower side. The opening area of the passage when the test board 6 is carried into the thermostat 2 is minimized. In addition, the transition from the thermostat 2 to the defroster chamber 5 is horizontally moved, so that the opening area of the passage is also minimized. Further, when the test board 6 is transferred from the defroster chamber 5 to the unloader unit 3, the posture is changed to a horizontal state in the defroster chamber 5 or after exiting from the defroster chamber 5.
[0017]
At least the inside of the thermostatic chamber 2 requires strict temperature management for both the preheating part 2a and the test measurement part 2b. Therefore, the inside of the thermostat 2 must be severely thermally shut off from the outside including the defroster chamber 5, and for this purpose, the entire thermostat 2 is partitioned by a heat insulating wall. This heat insulating wall is a thick wall having a structure in which a porous member or the like is disposed inside a pair of plates. As described above, the constant temperature bath 2 is provided with a passage through which the test board 6 is carried from the loader unit 1 and carried out toward the defroster chamber 5, and a shutter device that opens and closes the passage. Is provided. 4 to 9 show the configuration of the passage component frame 11 attached to the heat insulating wall 10 at the connection portion of the thermostatic chamber 2 to the defroster chamber 5 and the shutter device 20 attached to the passage component frame 11. Show.
[0018]
As shown in FIG. 4, the heat insulating wall 10 is composed of an inner surface plate 10a, an outer surface plate 10b, and a porous heat insulating material 10c disposed between the inner surface plate 10a and the outer surface plate 10b, and the porous heat insulating material 10c. Although a high heat insulating effect is provided by increasing the thickness of the slab, a predetermined position is opened in order to secure a passage for moving the test board 6 from the inside of the thermostatic chamber 2 toward the defroster chamber 5. The passage constituting frame 11 is fixed to the opening by means such as a screw.
[0019]
As shown in FIGS. 5 to 7, the passage configuration frame 11 includes left and right side plate portions 11 a and 11 b and upper and lower end plate portions 11 c and 11 d, and a shutter device 20 is provided therein. Yes. The shutter device 20 has a shutter member 21 made of a cylindrical member, and the outer diameter of the shutter member 21 has a dimension approximately the same as the thickness dimension of the heat insulating wall 10. And the board insertion path opened in the slit body longer than the thickness dimension of the test board 6 in the circumference body part of the shutter member 21 at the position containing the center axis line and longer than the length dimension of the short side direction. 22 is formed. Here, the opening area of the board insertion passage 22 is made as small as possible on the condition that it does not hinder the passage of the test board 6. A shaft portion 23 extends on the upper end surface of the shutter member 21, and this shaft portion 23 is rotatably inserted into a bearing 12 provided on the end plate portion 11 c of the passage constituting frame 11. A circular recess 21 a is formed in the lower part of the shutter member 21, and a rotation shaft 24 is inserted into the recess, and a tip portion inserted into the recess 21 a of the rotation shaft 24. A notch 24a is formed in the. The recess 21 a is provided with a rotation restricting pin 25. When the notch 24 a of the rotation shaft 24 is engaged with the rotation restricting pin 25, the shutter member 21 rotates relative to the rotation shaft 24. It will be connected impossible.
[0020]
The rotating shaft 24 penetrates the bearing 13 provided on the lower end plate portion 11d of the passage constituting frame 11, protrudes from the lower surface of the heat insulating wall 10, and is further supported by the bearing block 15 in the machine frame 14. A lever 26 is connected to the end of the rotating shaft 24 extending from the machine casing 14. In order to reciprocate the lever 26 by approximately 90 °, a cylinder 27 is provided. The end of the tube 27a of the cylinder 27 is pivotally attached to a predetermined position of the heat insulating wall 10, and the tube 27a The tip of the rod 27 b protruding from the lever 26 is pivotally attached to a drive pin 26 a provided on the lever 26. Accordingly, the rotation of the lever 26 by the cylinder 27 causes the board insertion passage 22 provided in the shutter member 21 to be rotationally displaced between the shutter open position shown in FIG. 8 and the shutter closed position shown in FIG. ing.
[0021]
  8, both ends of the board insertion passage 22 formed in the shutter member 21 are opened to the temperature-controlled room 2 and the defroster chamber 5, respectively, so that the test board 6 can pass through the board insertion passage 22. become. Further, in the shutter closed position of FIG. 9, the space between the temperature-controlled room 2 and the defroster chamber 5 is sealed by the outer peripheral wall portion of the shutter member 21. For this purpose, four rod-shaped seal members 16 are erected between the upper and lower end plate portions 11c and 11d of the passage constituting frame 11. This rod-shaped seal member 16 is obtained by attaching a seal 16b as an elastic seal member formed of a heat-resistant rubber having a uniform thickness on the outer peripheral surface of a round bar 16a made of hard resin, metal or the like. Composed. A pair of rod-like seal members 16 are provided on the left and right sides of the constant temperature bath 2 side and the defroster chamber 5 side, that is, on the side plate portions 11a and 11b side in the passage frame structure 11. And the seal | sticker of each rod-shaped seal member 1616bIs in close contact with the side plate portions 11a and 11b of the passage constituting frame 11, and is also in close contact with the outer peripheral surface of the shutter member 21 when the shutter member 21 is at least in the shutter closed position.
[0022]
As a result, the board insertion passage 22 for transferring the test board 6 from the thermostat 2 to the defroster chamber 5 is such that when the shutter is in the shutter closed position, the open portions at both ends thereof are the both side plate portions 11a and 11b of the passage constitution frame 11. Since it faces and sticks to the rod-shaped seal member 16, it becomes a sealed space. As a result, the thermostatic chamber 2 and the defroster chamber 5 are sealed by the outer peripheral surfaces on both sides of the board insertion path 22 of the shutter member 21. Moreover, the board insertion path 22 is also a sealed space.
[0023]
  Here, when the shutter member 21 is rotationally displaced between the shutter open position and the shutter close position, it comes into sliding contact with the rod-shaped seal member 16, but the contact portion is close to line contact. Since the contact area is small, the sliding resistance against the movement of the shutter member 21 can be minimized.AndThis rod-shaped seal member 16IsIt can also be configured to rotate according to the rotation of the cutter member 21. As a result, when the shutter member 21 is operated, the rod-shaped seal member 16 rolls relative to the shutter member 21 and the side plate portions 11a and 11b of the passage component frame 11, so that the resistance during operation is further reduced. Moreover, sticking between the seal b and the side plate portions 11a and 11b of the passage frame 11 can be prevented by rotating the rod-shaped seal member 16 in accordance with the shutter opening and closing operations.The
[0024]
Further, dry air flow passages 28 a and 28 b are formed in the side plate portions 11 a and 11 b constituting the passage constitution frame 11. Then, dry air pipes 29a and 29b are connected to the flow passages 28a and 28b, and the dry air pipes 29a and 29b extend to the lower surface through the inside of the heat insulating wall 10 to connect the coupling members 30a and 30b. Dry air supply pipes 31a and 31b are connected to each other. The coupling member and the dry air supply pipe can be integrated. The side plates 11a and 11b are provided with cover plates 31a and 31b so as to close the flow passages 28a and 28b, and communication holes 33a and 33b are formed in the cover plates 32a and 32b. When the member 21 is in the shutter closed position, dry air can be supplied to the sealed board insertion passage 22 with a predetermined pressure. Here, the supply of the dry air is for preventing the wall from condensing due to the cold air entering the board insertion passage 22 when the thermostatic chamber 2 as the thermostatic chamber is in a low temperature state. When the tank 2 is in a high temperature state where there is no risk of condensation, it is not always necessary to supply dry air.
[0025]
Although the present embodiment is configured as described above, the operation of the shutter device 20 in this embodiment will be described next. The shutter member 21 constituting the shutter device 20 is always in the shutter closed position, and is opened only when the test board 6 on which the device D is mounted moves from the thermostat 2 to the defroster chamber 5. .
[0026]
Thus, when the test board 6 introduced into the thermostatic chamber 2 is placed in the test measurement unit 2b, the device D mounted on the test board 6 is connected to the test head 4 to perform an energization test. When this energization test is completed, the process proceeds to the portion of the passage in which the shutter member 21 is provided in the heat insulating wall 10 of the thermostat 2. Although the shutter member 21 is in the shutter closed position of FIG. 9, when the test board 6 is conveyed to a predetermined position, it is detected by a sensor or the like, the cylinder 27 is operated, and the lever 26 is moved approximately 90 °. Rotate. As a result, the shutter member 21 rotates, the board insertion passage 22 is displaced to the shutter opening position of FIG. 8, and the constant temperature bath 2 and the defroster chamber 5 communicate with each other through the board insertion passage 22. The test board 6 moves into the defroster chamber 5 through the board insertion passage 22. When it is detected by a sensor or the like that the transition of the test board 6 is completed, the cylinder 27 is actuated again, the shutter member 21 is displaced to the shutter closed position, and between the thermostat 2 and the defroster chamber 5. Is completely blocked.
[0027]
Thus, since the shutter member 21 is rotated by 90 ° and displaced between the shutter open position and the shutter close position, the shutter member 21 can be opened and closed at high speed, and the thermostatic chamber 2 communicates with the defroster chamber 5. Time is shortened, and heat dissipation from the thermostat 2 can be minimized. Further, at the shutter closed position, the outer peripheral surface of the shutter member 21 and the rod-shaped seal member 16 can be completely sealed, and the board insertion path 22 becomes a sealed space and functions as a heat insulation chamber. Heat dissipation from the passage portion is prevented. Therefore, the temperature change due to the passage provided in the thermostat 2 is suppressed, and the temperature control of the thermostat 2 can be performed very strictly. Further, in the shutter closed position as described above, since the space between the thermostatic chamber 2 and the defroster chamber 5 is completely sealed, there is little resistance to the movement of the shutter member 21, so that the driving means for the shutter member 21 is provided. Thus, the load on the cylinder 27 can be suppressed to a minimum, and can be rotated and displaced between the shutter open position and the shutter closed position quickly and smoothly with a light load.
[0028]
In addition, since the shutter member 21 is located within the thickness range of the heat insulating wall 10 and the driving means is located outside the heat insulating wall 10, the shutter member 21 is separated from the wall surface on the constant temperature bath 2 side and the defroster chamber 5 side. No member protrudes. Therefore, the space inside the thermostatic chamber 2 and the defroster chamber 5 can be used effectively, and the miniaturization and downsizing thereof can be achieved.
[0029]
By the way, when the test performed in the thermostatic chamber 2 is performed at a low temperature such as −55 ° C., when the shutter member 21 is opened to move the test board 6, the internal temperature of the thermostatic chamber 2 is set in the board insertion path 22. Cold air will enter. As a result, when the shutter member 21 is closed again, this cool air stays in the board insertion passage 22. If it does so, dew condensation will arise in the inner wall surface which faces the defroster chamber 5 side which is a higher temperature among the inner wall surfaces which comprise the board insertion path 22. Accordingly, in conjunction with the opening operation of the shutter member 21, simultaneously with the beginning of the movement of the shutter member 21, the dry air is caused to flow into the board insertion passage 22 from the flow passages 28a and 28b through the communication holes 33a and 33b. Can be prevented from entering the board insertion passage 22. Then, by continuing the supply of the dry air until immediately after the shutter member 21 is opened and immediately after the shutter member 21 is displaced to the closed position, the cold air is purged even if the cold air slightly enters the board insertion path 22. Therefore, it is possible to reliably prevent the occurrence of condensation on the inner wall surface of the board insertion passage 22.
[0030]
In the above configuration, the shutter device 20 is provided between the constant temperature bath 2 and the defroster chamber 5, but the loading portion of the test board 6 into the constant temperature bath 2 or the test board 6 from the defroster chamber 5. A similar shutter device can also be provided in the carry-out portion.
[0031]
【The invention's effect】
  Since the present invention is configured as described above, it has an excellent heat insulating effect when the passage is closed by the shutter member, and at a high speed.With minimal sliding resistanceOpening and closing operations can be performed, and effects such as suppression of heat dissipation from the constant temperature chamber can be achieved.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of an IC handler constituting an IC device test apparatus as an example of a mechanism provided with a shutter device of the present invention.
FIG. 2 is an external view of a test board.
FIG. 3 is a configuration explanatory diagram of a device housing portion in a test board.
4 is a cross-sectional view taken along the line XX in FIG.
5 is a YY cross-sectional view of FIG. 4;
6 is a cross-sectional view at the ZZ position in FIG. 5;
FIG. 7 is an external view of a shutter member.
FIG. 8 is a cross-sectional view of the shutter member at a shutter open position.
FIG. 9 is a cross-sectional view of the shutter member at the shutter closed position.
[Explanation of symbols]
2 Thermostatic bath 2a Preheating part
2b Test measurement section 5 Defroster room
6 Test board 10 Insulation wall
11 passage frame 16 rod-shaped seal member
16a round bar 16b seal
20 Shutter device 21 Shutter member
22 Board insertion path 27 Cylinder
28a, 28b Flow path

Claims (4)

In order to transfer the transfer board into and out of the constant temperature chamber through a passage formed in a heat insulating wall constituting the constant temperature chamber in which temperature management is performed,
A board insertion passage which is mounted at a position between the side plate portions on both sides constituting the passage and is formed of a cylindrical member, and through which the transport board can pass by forming a through-hole penetrating in a position including the central axis in the peripheral body portion. A shutter member,
The shutter member is rotated about the axis in the passage, and the board insertion passage is rotated to a shutter open position where the board insertion passage opens inside and outside the constant temperature chamber and a shutter closed position where the board insertion passage is closed. Shutter driving means for displacing ;
An elastic seal portion having a substantially uniform thickness is provided on the outer periphery of the round rod-shaped support rod, and the elastic seal portion is in close contact with the both side plate portions and the outer peripheral surface of the shutter member, and the shutter driving means performs the A rod-shaped seal member that rotates following the rotation of the shutter member ,
When the shutter member is in the shutter closed position, both outer peripheral wall portions constituting the board insertion path of the shutter member, and the rod-shaped seal member provided between the both outer peripheral wall portions and the both side plate portions. A passage opening and closing device for a constant temperature chamber, wherein the passage is closed. The constant temperature chamber passage opening and closing device according to claim 1, wherein each pair of the rod-shaped seal members is arranged at a portion facing the inside and outside of the constant temperature chamber. Wherein the end wall of the heat insulating wall, wherein said shutter member is a shutter closing position, characterized in that a configuration in which a gas supply unit for supplying dry gas in the space of the board insertion path in the closed state Item 2. The constant temperature chamber passage opening and closing device according to Item 1 .   The thermostatic chamber is a thermostatic bath in which a test measurement unit for measuring the electrical characteristics of the IC device in a predetermined temperature state is disposed, and between the defroster chamber in a temperature state different from the temperature chamber. The constant temperature chamber according to claim 1, wherein a passage in which the shutter member is mounted is formed in the heat insulating wall provided so that a test board on which a large number of IC devices are mounted as the transfer board is passed. Passage opening and closing device.

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