KR20070016761A - Head module and chip mounter comprising the same - Google Patents

Abstract

The present invention provides a head module having a structure in which a plurality of nozzle spindles are formed in a revolver shape, absorbs and mounts electronic components at high speed, and can suck and mount a large number of electronic components, and a component mounter having the same. In order to achieve the object, the present invention provides a rotating housing and a vertical hole supported by the body and the body, the vertical housing group consisting of a plurality of vertical hole groups formed on the same radius from the central axis. The housing accommodated in each, coupled to the nozzle for sucking and mounting the electronic components in the lower portion, a plurality of nozzle spindles rotatable along the central axis corresponding to the rotation of the rotary housing and the housing is disposed to rotate the rotation housing about the central axis Each of the mechanisms, the nozzle lift drive and the nozzle lift drive, belong to separate vertical hole groups. Even provides at least one component mounting appointed head module comprising a clutch capable of lowering the two nozzles at the same time the spindle.

Description

Head module for component mounter and part mounter having same {Head module and chip mounter comprising the same}

1 is a perspective view showing a head assembly for a conventional component mounter.

FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1.

3 is a perspective view showing a head module according to the present invention.

4 is an exploded perspective view illustrating the nozzle raising and lowering mechanism of FIG. 3.

5A is a plan view illustrating a state in which a clutch unit provided in the head module of FIG. 3 picks up an electronic component by simultaneously lowering a plurality of nozzle spindles.

5B and 5C are plan views illustrating a state in which the clutch unit included in the head module of FIG. 3 picks up one nozzle spindle and picks up an electronic component.

FIG. 6 is a plan view illustrating an arrangement state between a rotary housing of the head module of FIG. 3 and a component supply unit. FIG.

7 is a side view of FIG. 3.

8 is a perspective view illustrating a housing rotating mechanism of the head module of FIG. 3.

9 is a perspective view illustrating a nozzle rotating mechanism provided in the head module of FIG. 3.

10 is a perspective view illustrating a modification of FIG. 8.

11 is a plan view illustrating a component mounter according to a preferred embodiment of the present invention.

12 is a plan view illustrating an arrangement state between a rotation housing of a plurality of head modules provided in the component mounter of FIG. 11 and a component supply unit.

FIG. 13 is an exploded perspective view illustrating the head module and the module mounting unit separated from each other in FIG. 14.

14 is a side view of FIG. 13.

Explanation of symbols on major parts of partial drawings

100: parts mounting machine 102: parts supply unit

103: horizontal moving mechanism 106: conveyor portion

130: module mounting portion 132: guide member insertion groove

140: toggle clamping device 201: head module

210: body 230: rotating housing

231: vertical hole group 231_a: first vertical hole group

231_b: second vertical hole group 232: vertical hole

240: nozzle spindle 245: nozzle return spring

250: housing rotation mechanism 252: rotation drive unit

253: housing drive transmission 254: housing drive gear

258: housing driven gear 260: nozzle rotating mechanism

262: nozzle rotation drive unit 264: nozzle drive gear

268: nozzle driven gear 270: nozzle lifting mechanism

272: nozzle lifting drive portion 273: clutch portion

276: clutch shaft 277: clutch plate

278: base 279: inlet

280: housing elevating mechanism 281: elevating control member

283: hanger 284: guide hole

288: linear guide portion 289: lowering stopper

B: printed circuit board O: center of rotation housing

The present invention relates to a head module for a component mounter and a component mounter having the same, and more particularly, to a component mounter for automatically mounting electronic components such as integrated circuits, diodes, capacitors, and resistors on a printed circuit board. A head module for a component mounter having a nozzle spindle for picking up an electronic component, and a component mounter having the same.

The component mounter is a core equipment of the component mounting assembly equipment for mounting a component on a printed circuit board (PCB). The component mounting equipment receives various components from a component supplier and transfers them to the mounting position of the printed circuit board, and then mounts them on the printed circuit board.

In general, a component mounter includes a component supply unit for supplying mounting components, a conveyor unit for conveying a printed circuit board to be worked on, a head assembly for picking up electronic components from the component supply unit and mounting them on a printed circuit board in order to include a nozzle spindle. It consists of.

Recently, a plurality of electronic components are adsorbed in turn or at the same time, the adsorbed plurality of electronic components are simultaneously moved to the conveyor unit, and the electronic components moved to the conveyor unit are sequentially or simultaneously mounted on a printed circuit board to increase the efficiency of component mounting. To this end a plurality of nozzle spindles are installed in the head assembly side by side.

However, the nozzle spindles installed side by side become larger in size, thereby increasing the overall size of the head assembly. Therefore, the number of nozzle spindles installed in the head assembly is limited.

In order to solve this problem, as shown in Fig. 1, three revolved head assemblies 11 are arranged in the head portion 10 provided in the component mounter disclosed in Japanese Patent Laid-Open No. 2003-273582. It is arranged. Each nozzle spindle 40 provided in each head assembly 11 is rotatable, and is formed to be rotatable on the circumference of the nozzle rotation center by the nozzle rotating mechanism 60, and the suction nozzle 50 is coupled to the lower side thereof. do. In addition, the nozzle spindles 40 provided in the head assemblies 11 are selected by the nozzle selector 70 to descend, and are lowered by the nozzle lifter 80. These head assemblies 11 are fixed by the head frame 12.

The head assembly 11 provided in the component mounter having such a structure will be described in detail with reference to FIG. 2, and one head assembly 11 has a plurality of nozzles installed on the same circumference based on the spline shaft 35. The spindle 40 is provided.

The nozzle holder 50 is coupled to the spline shaft 35, and the nozzle spindles 40 are disposed on the same circumference about the spline shaft 35 of the nozzle holder 50 so as to be movable upward and downward.

The nozzle spindle 40 is installed to be elevated. In addition, the spline shaft 35 rotates in accordance with the operation of the nozzle elevating mechanism 60, which is a motor for rotating the nozzle, and thus the nozzle holder 50 and the nozzle spindle 40 coupled to the spline shaft 35 rotate. To be installed.

Meanwhile, in order for the nozzle spindles 40 to be selected and lowered separately, the head assembly 11 is provided with a nozzle selecting mechanism 70 and a nozzle raising mechanism 80. The nozzle selection mechanism 70 includes a compressed air supply chamber 71 and a nozzle selection valve 72, and injects compressed air into the pressurized air supply chamber 32 corresponding to the nozzle spindle 40 selected downward. In this case, the pressurized air supply chamber 32 may be coupled to the head assembly 11 and connected to the nozzle spindle 40 as a space in the air cylinder block 30 disposed above the nozzle holder 50, respectively.

Therefore, when the positive pressure air flows into the pressurized air supply chamber disposed above the selected nozzle spindle 40 down, the piston 52 formed in the pressurized supply chamber and the air cylinder shaft 53 coupled to the lower side of the piston descend, The lower end portion 53a of the air cylinder shaft 53, the upper end portion 40a of the nozzle spindle joined to the lower end portion 53a, and the upper surface portion 85a of the step portion 85a of the spline nut 85 are in the same height position. Thus, the air cylinder shaft 53, the nozzle spindle 40, and the spline nut 85 are integrated. Here, the spline nut 85 is moved up and down by being coupled with the nozzle lifting mechanism 80 having the cam follower 84, the eccentric cam 82, and the drive motor 81, and thus the spline nut 85. The nozzle spindle 40 coupled with is lowered.

In addition, in order to adsorb the electronic components, a vacuum suction device 90 is provided, in which negative pressure air from the outside is supplied to the negative pressure air from the negative pressure air supply chamber 91 to the outside of the nozzle holder 40. The nozzle spindle 40 is individually sucked by the electronic component by being provided in the nozzle spindle 40 by the installed valves 92.

The revolver-type head portion has a merit of being able to mount a large number of electronic components while having a small size. However, the conventional head assembly 11 for each component mounter of this structure has a nozzle elevating mechanism provided with an eccentric cam 82, a cam follower 84, and a spline nut 85 to lower the nozzle spindle 40. FIG. By providing 80, the lifting mechanism becomes complicated, the weight becomes large, and the high speed accuracy falls.

In addition, since the spline nut 85 is always raised and lowered to a constant height inside the head assembly 11, the flexibility of the raising and lowering strokes with respect to the change in the part thickness is inferior.

In addition, since the suction valve 92 of the electronic component is attached to the nozzle holder 50 by the number of the nozzle spindles 40, the total weight of the head assembly becomes excessive and occupies a lot of space, making it difficult to cope with various working environments. This makes the head assembly difficult to modularize.

The present invention is to solve a variety of problems including the above problems, a plurality of nozzle spindle is made of a revolver shape, and can absorb and mount the electronic components at high speed, and can absorb and mount a large number of electronic components An object of the present invention is to provide a head module and a component mounter having the same.

Another object of the present invention is a nozzle module for lowering the nozzle spindle, the head module having a simple structure, a small number of components are used to reduce the total weight, increase the high-speed accuracy, modular structure and having the same It is to provide a component mounter.

Still another object of the present invention is to provide a head module having a structure in which a plurality of nozzle spindles provided in one or a plurality of head modules are simultaneously lowered to suck a part, and a component mounter having the same.

In order to achieve the above object, the head module for a component mounter according to a preferred embodiment of the present invention is supported by a body and the body, and a plurality of vertical hole groups including a plurality of vertical holes formed on the same radius from a central axis are arranged in plural numbers. A plurality of nozzle spindles accommodated in each of the rotating housing and the vertical hole, the nozzles for sucking and mounting the electronic components on the lower part, the nozzle spindles being rotatable along the central axis in response to the rotation of the rotating housing. At least one clutch unit capable of simultaneously lowering at least two nozzle spindles belonging to separate vertical hole groups by driving the housing rotating mechanism and the nozzle elevating drive unit and the nozzle elevating drive unit arranged to rotate the rotary housing. Equipped.

Preferably, the clutch portion is arranged to lower at least one nozzle spindle simultaneously.

Here, the clutch unit: disposed on one end of the clutch shaft and the clutch shaft to move up and down by the drive of the nozzle lifting drive unit, it is arranged so as to press a plurality of nozzle spindles belonging to a separate vertical hole group from the upper side at the same time Clutch plate may be provided.

In this case, the nozzle elevating drive unit rotates the clutch plate separately from the elevating driving of the clutch plate, and the clutch plate comprises: a base capable of simultaneously pressing the upper surfaces of two adjacent nozzle spindles and at least from the base. It is preferable to have an inlet portion drawn in a size larger than the nozzle spindle upper cross section.

On the other hand, further comprising a housing elevating mechanism for raising and lowering the rotary housing while lowering in conjunction with the nozzle elevating mechanism, the housing elevating mechanism is raised and lowered to raise and lower the rotary housing while raising and lowering in conjunction with the clutch portion The lowering control member can be provided.

In this case, the housing elevating mechanism includes at least one hook mounted on the rotary housing, and in the center of the hook is formed a guide hole extending up and down so that the lift control member is inserted and spans the upper side. When the elevating control member stops at a certain height, the locking stand is supported by the elevating control member to prevent the rotary housing from lowering, and when the elevating control member is lowered, the self-load of the rotary housing is lowered. It is preferable to descend by interlocking with the elevating control member.

On the other hand, the housing rotation mechanism may include: a housing drive gear that rotates by driving the housing rotation drive unit and the housing rotation drive unit, and a housing driven gear that is mounted to the rotation housing and connected to and interlocked with the housing drive gear.

Here, the interval between the nozzle spindles that can be lowered at the same time corresponding to the operation of the clutch unit is preferably an integer multiple of the pitch between the component supply unit for supplying the electronic component.

It is preferable to further provide a nozzle rotating mechanism for rotating the nozzle spindle. In this case, the nozzle rotating mechanism is connected to the nozzle rotating drive unit and the nozzle rotating drive unit, and rotates in conjunction with the rotation of the nozzle drive gear and the nozzle drive gear disposed at the center of the rotary housing, and along the nozzle spindle outer periphery. It may have a plurality of nozzle driven gears in combination.

On the other hand, the clutch portion is preferably disposed to face each other about the central axis. In this case, it is preferable that the interval between the nozzle spindles that can be lowered at the same time corresponding to the operation of the adjacent clutch parts is an integer multiple of the pitch between the part supply parts for supplying the parts.

On the other hand, according to another aspect of the present invention, the component mounter, having a structure as described above and having a plurality of head modules arranged side by side, each of which is disposed between the adjacent head modules and adjacent clutch parts The interval between the nozzle spindles that can be lowered at the same time corresponding to the operation of is an integer multiple of the pitch between the component supplying parts supplying the components.

In this case, the clutch parts provided in the one head module are preferably disposed to face each other with respect to the central axis of the head module.

In addition, the interval between the nozzle spindles that can be lowered at the same time corresponding to the operation of the separate clutch unit provided in the one head module is preferably an integer multiple of the pitch between the component supply unit for supplying the component.

Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a view showing a head module for a component mounter according to an embodiment of the present invention. Referring to FIG. 3, the head module 201 for a component mounter according to an exemplary embodiment of the present invention includes a body 210, a rotation housing 230, a plurality of nozzle spindles 240, and a nozzle lift. And a mechanism 270.

The body 210 is equipped with a rotatable rotating housing 230. In this case, as shown in FIG. 4, the rotary housing 230 includes a plurality of unit vertical hole groups 231 having a plurality of vertical holes 232 formed on the same radius about the central axis O. Is placed. That is, the rotary housing 230 has a center of the first vertical hole group 231_a and the central axis O of the rotary housing 230 at the first radial distance closest to the center axis O. As a result, a plurality of vertical hole groups 231 are provided, such as a second vertical hole group 231_b located at a second radius distance that is larger than the first radius.

3, the nozzle spindle 240 is inserted into each of the vertical holes 232 so as to be lifted and rotated. The nozzle spindles 240 may revolve in conjunction with the rotation of the rotary housing 230, and may rotate by itself. In this case, a nozzle 242 having an internal space formed therein is coupled to a lower portion of the nozzle spindle 240 to suck and mount the electronic component C. When negative pressure air flows into the internal space of the nozzle 242, the electronic component is attracted to the nozzle. When positive pressure air flows into the internal space of the nozzle, the electronic component is separated from the nozzle 242.

As a result, the nozzle 242 is supplied with a negative pressure thereon and at the same time descends to pick up the electronic component (C), ascends and moves horizontally, and then descends again to supply a positive pressure therein so as to supply the electronic component on the printed circuit board. Mount it.

The nozzle elevating mechanism 270 serves to elevate the nozzle spindle 242, and includes a nozzle elevating drive unit 272 and a clutch unit 273. The nozzle elevating driver 272 may be mounted on the body 210 to correspond to the nozzle spindles 240 disposed opposite to the center of the rotary housing 230 as described below.

The clutch portion 273 may include a clutch shaft 276 and a clutch plate 277. In this case, the clutch shaft 276 moves up and down by driving the nozzle lift driver 272, and the clutch plate 277 is disposed at one end of the clutch shaft 276, so that the nozzle lift driver ( 272 is arranged to press down on one or a plurality of nozzle spindles 240 selected.

The clutch shaft 276 provided in the nozzle lifting mechanism 270 may be coupled to the nozzle lifting driving unit 272 by a mechanical mechanism. As an example of this, as shown in FIGS. 3 and 4, the clutch shaft 276 may be connected to the nozzle lift driver 272 through the timing belt 274 and the ball screw 275. Therefore, when the nozzle elevating drive unit 272 is driven, the clutch shaft 276 receives the rotational motion by the timing belt 274, and the rotational motion is changed to the vertical motion by the ball screw 275, whereby the clutch shaft 276 drops in linear motion.

Alternatively, the nozzle lift driver 272 may be a voice coil motor, or the clutch shaft 276 may be connected to the voice coil motor to move up and down. A nozzle spindle 240 is disposed below the clutch shaft 276, so that the clutch spindle 276 depresses the nozzle spindle 240, resulting in the nozzle spindle 240 descending. In the present invention, the clutch shaft 276 and the nozzle elevating drive unit 272 are not limited to the timing belt 274 and the ball screw 275, in contrast, in the case of mechanical coupling such as gear coupling, cam coupling, etc. It is included in the present invention.

On the other hand, although the nozzle lift drive unit 272 is a valve for introducing air, the clutch shaft 276 may be a structure that is lifted by the hydraulic pressure through the valve, the nozzle lift drive unit 272 is a clutch shaft 276 It is more preferable because the combined with the mechanical mechanism has the advantage that the component is reduced, and the nozzle spindle 240 can be lowered quickly.

As described above, by lowering the nozzle spindle 240 by pressing the upper surface of the nozzle spindle 240, the lowering speed of the nozzle spindle 240 can be increased, and the accuracy of the lowering position is also increased. In addition, a plurality of valve portions are unnecessary to lower the nozzle spindle, thereby reducing the volume and weight of the head module 201.

In this case, it is preferable that the nozzle return spring 245 is formed outside or inside the nozzle spindle 240, and thus, only when the clutch shaft 276 exerts a force greater than or equal to the elastic force of the nozzle return spring 245. This is because the nozzle spindle 240 may be lowered and the nozzle spindle 240 may be raised again when a force higher than the elastic force of the nozzle return spring 245 is removed from the lower nozzle spindle 240.

On the other hand, the nozzle spindle 240 may simultaneously pick up the electronic component C from the component supply unit 102 (see FIG. 6) that supplies the electronic component C to the nozzle spindle of the head module. You can also pick up parts separately. To this end, the clutch unit 273 may not only lower the two nozzle spindles 240 at the same time, but may also lower only one nozzle spindle.

To this end, it is preferable that the clutch plate 277 can be raised and lowered and moved simultaneously and horizontally so that one and a plurality of nozzle spindles 240 can be selected and pressed. As an example of such a mechanism, as shown in FIGS. 4 and 5, the clutch plate 277 has a base 278 and an inlet 279 such that one nozzle spindle 240 and a plurality of nozzle spindles are provided. 240 may be selectively pressed. The base 278 has a size enough to simultaneously press a plurality of nozzle spindles 240 formed in separate vertical hole groups 231. In addition, the inlet portion 279 formed concave from the base portion 278 is formed with a groove larger than the upper end surface of the nozzle spindle 240, and if the inlet portion 279 is located directly above the nozzle spindle 240. When descending, the nozzle spindle 240 under the inlet portion 279 is not pressed.

In addition, the clutch plate 279 preferably has a plurality of phases around the rotation axis of the clutch shaft 276. That is, as illustrated in FIGS. 5A to 5C, the clutch plate may include a first phase Pc1, a second phase Pc2, and a second phase in order to selectively press two or one of the nozzle spindles 240. It is preferable to have three phases of three phases Pc3.

For example, as shown in FIG. 5A, when the clutch plate 277 is located in the first phase Pc1, the first nozzle spindle 240_a and the second nozzle inserted into the first vertical hole group 231_a and the second are arranged. The second nozzle spindle 240_b inserted into the vertical hole group 231_b may be simultaneously pressed. That is, the inlet portion 279 is not disposed directly above the first nozzle spindle 240_a and the second nozzle spindle 240_b, so that the clutch plate 277 simultaneously drives the first and second nozzle spindles 240_a and 240_b. Can be pressed.

Meanwhile, as shown in FIG. 5B, when the inlet portion 279 of the clutch plate 277 is horizontally moved to be disposed directly above the second nozzle spindle 240_b, the clutch plate 277 is in the second phase Pc2. ). In this case, the clutch plate 277 is lowered. The second nozzle spindle 240_b is disposed in the inner circumferential surface of the inlet portion 279 so that the second nozzle spindle 240_b is not lowered by the clutch plate 277 and only the first nozzle spindle 240_a may be lowered by the clutch plate 277.

Meanwhile, as illustrated in FIG. 5C, when the inlet portion 279 of the clutch plate 277 is horizontally moved to be disposed directly above the first nozzle spindle 240_a, the clutch plate 277 is in the third phase Pc3. ). In this case, the clutch plate 277 is lowered. The first nozzle spindle 240_a is disposed in the inner circumferential surface of the inlet portion 279 such that the first nozzle spindle 240_a is not lowered by the clutch plate 277, and only the second nozzle spindle 240_b may be lowered by the clutch plate 277.

In this case, the clutch plate 277 can be rotated to move horizontally in the first, second and third phases Pc1, Pc2 and Pc3. That is, when the clutch shaft 276 is rotated, the phase of the clutch plate 277 coupled thereto is changed. Therefore, the position of the lead portion 279 can be simply changed. For this purpose, although not shown in the drawing, the nozzle lifting drive unit 270 may include a clutch rotation driving unit for rotating the clutch shaft 276 and a clutch lifting driving unit for lifting and lowering the clutch shaft 276. . The clutch rotation driving unit and the clutch lift driving unit may include a separate driving motor to drive the clutch shaft, or alternatively, may include a driving motor.

However, the present invention is not limited thereto, and the clutch plate 277 may be linearly moved so that the inlet portion 279 may be positioned above the nozzle spindles 240_a and 240_b. It is also possible to change the position of the clutch plate while no clutch is formed and the clutch plate moves linearly.

On the other hand, as shown in Figure 6, in order to be able to lower at least two nozzle spindles 240 belonging to the separate vertical hole group 231 at the same time, the interval (K1) between the nozzle spindles 240 ) Is preferably an integer multiple of the distance P between the centers of neighboring component supply parts 102 seated to adsorb these electronic components. In this case, the first vertical hole 232_a provided in the first vertical hole group 231_a and the second vertical hole 232_b disposed in the second vertical hole group 231_b are the same from the center axis O. The first and second vertical holes 232_a and 232_b may be arranged side by side on the radial extension line L.

In addition, the nozzle elevating mechanisms 270 are disposed at least at both ends of the rotary housing 230 so as to simultaneously press the nozzle spindles 240 facing the center of the rotary housing O. Do. This is because the nozzle spindles 240 disposed to face each other from the center portion O of the rotary housing can be simultaneously lowered to suck the electronic component C from the component supply unit 102.

In this case, in particular, the distance K2 between the closest nozzle spindles 240 disposed opposite the center of the housing O is the distance P between the centers of the neighboring component supply parts 102 seated to adsorb these electronic components. In this case, the nozzle elevating mechanisms 270 are at least at both ends of the rotating housing 230 so as to simultaneously press the nozzle spindles 240 facing the center of the rotating housing O. It is preferable that they are arranged individually. Through this, if two vertical hole groups are disposed in the rotary housing 230, four electronic parts C may be simultaneously picked up or mounted as two clutch plates. In addition, since the rotating housing 230 is rotatable, after the four nozzle spindles 240 simultaneously pick up the component C, the rotating housing 240 is rotated at an angle (??) so that the next two nozzle spindles are rotated. 240 may be located on the component supply 102 such that the two nozzle spindles 240 may repeat the process of picking up the component C, thereby reducing the time to adsorb the component.

On the other hand, in order to improve the mounting efficiency for mounting the electronic component (C), it is preferable that the nozzle spindle 240 lowering movement distance to the component mounting position of the printed circuit board is short. To this end, it is preferable to lower the rotary housing 230 by a predetermined period, and then lower the selected nozzle spindle 240 to the component supply unit 102 or the upper surface of the printed circuit board.

Therefore, the present invention preferably has a housing elevating mechanism 280 for elevating the rotary housing, as shown in FIG. One example of the housing elevating mechanism 280 will be described with reference to FIG. 7. The housing elevating mechanism 280 includes a elevating control member 281, and the elevating control member 281 provides the nozzle elevating mechanism. 270, and more specifically, the lowering and raising in conjunction with the clutch portion 273.

To this end, the housing elevating mechanism 280 may include a hanger 283 together with the elevating control member 281. The hanger 283 is mounted on at least one side of the rotary housing 230 upwardly, and a guide hole 284 is formed on the inside of the rotary housing 230. The elevating control member 281 is inserted into the guide hole 284. In this case, the elevating control member 281 may be coupled in a protrusion shape protruding to the outer circumferential surface of the nozzle spindle 240 in order to descend and interlock with the nozzle elevating mechanism 270.

The elevating control member 281 stops at a predetermined height, and the upper portion 285 of the hanging stand 283 extends to prevent the hanging stand 283 from falling, and while lowering, the upper portion 285 of the hanging stand is lowered. Is lowered by the load of the rotary housing 230 in a state spanning the hanger (283).

Accordingly, the rotary housing 230 may be lowered by its own load, and the rotary housing 230 may be raised while contacting with the nozzle elevating mechanism 270.

In the present invention, the housing lifting mechanism 280 is moved in conjunction with the nozzle lifting mechanism 270. Therefore, by using the nozzle lifting drive unit 272 can be raised and lowered by the rotary housing 230, the lifting mechanism of the rotary housing 230 is simplified, and the weight of the head module is reduced. Become. In addition, the accuracy of the lowering degree is also excellent by using a mechanical method for lowering the rotary housing.

In this case, it is preferable that at least one linear guide portion 288 is mounted on the body 210 to guide the up and down movement of the rotary housing 230.

In detail, the rotary housing 230 is mounted to the body 210 to naturally move up and down in accordance with its own load and the guide of the linear guide 288. On at least one side of the rotary housing 230, a lifting control member 281 for controlling the lowering of the rotary housing 230 is inserted into the guide hole 284 of the hanger 283. Therefore, if the elevating control member 281 is fixedly stopped at a certain height, the lower surface of the hanger upper portion 285 is in contact with the upper surface of the elevating control member 281 so that the hanger 283 can be lowered further. As a result, the rotary housing 230 coupled with the hanger 283 does not lower.

In order for the rotary housing 230 to descend, the elevation control member 281 moves downward. Accordingly, the latch 283 is lowered in contact with the upper portion 285, and as a result, the rotary housing 230 coupled with the latch 283 is lowered by its own load.

In this case, it is preferable that the lowering stopper 289 is installed on the body 210 to prevent the rotary housing 230 from lowering over a predetermined section. As one example thereof, as shown in FIG. 7, a lowering stopper 289 is disposed below the rotary housing 230 of the body 210, and the lowering stopper 289 of the rotary housing 230 is disposed. It must be greater than the load and have a resistance to work upwards. Therefore, when the rotary housing 230 is lowered and is in contact with the lowering stopper 289, even if the elevating control member 281 is lowered, the rotary housing 230 is no longer caused by the resistance of the lowering stopper 289. It is fixed without falling.

In order to raise the rotary housing 230, the elevating control member 281 moves upward with a lifting force greater than the load of the rotary housing 230. Accordingly, the lifting and lowering control member 281 lifts the latch 283 in a state in contact with the upper portion 285 of the latch, and as a result, the rotary housing 230 is raised.

In this case, the elevating control member 281 is preferably coupled to the clutch shaft 276 to protrude. That is, when the clutch shaft 276 provided in the nozzle elevating mechanism 270 is lowered to lower the selected nozzle spindle 240, the elevating control member 281 coupled to the clutch shaft 276 is linked thereto. As a result, the nozzle spindle 240 and the rotary housing 230 are not relatively lowered, so that the entire rotary housing 230 including the nozzle spindle is lowered.

When the rotary housing 230 is lowered by the nozzle lifting mechanism 270 for a predetermined period, the lower surface of the rotary housing 230 is in contact with the lowering stopper 289. Therefore, even if the elevating control member 281 is further lowered, the rotary housing 230 is not lowered, the nozzle spindle 240 pressed by the clutch portion 273 is lowered. For this reason, it is possible to lower the rotary housing 230 at the same time by using one nozzle elevating mechanism 270.

On the other hand, the head module 201 may be provided with a housing rotation mechanism 250. The housing rotating mechanism rotates the rotating housing 230 to revolve the nozzle spindles 240 mounted to the rotating housing 230. Therefore, the plurality of nozzle spindles 240 revolve according to the positional deviation of the electronic component C seated in the component supply unit 102 (refer to FIG. 6) so that a plurality of electronic components may be simultaneously adsorbed. In addition, even when the electronic component is mounted on the printed circuit board, the nozzle spindle 240 is disposed at the correct mounting position while revolving, so that the electronic component can be absorbed at the correct position on the printed circuit board.

The housing rotation mechanism 250 includes a rotation drive 252 and a housing drive transmission 253. One example of this is described with reference to FIGS. 7 and 8. In general, the housing rotation driving unit 252 mounted to the body 210 is a servo motor, and the housing rotation transmission unit 253 drives the rotation housing 230. Rotate). The housing drive transmission 253 may be composed of a plurality of gear assemblies, or alternatively, may be a belt or a chain.

In this case, if the housing drive transmission unit 253 is formed of a gear assembly composed of a plurality of gears, the housing drive transmission unit 253 may include a housing drive gear 254 and a housing driven gear 258. The housing driving gear 254 is formed at one end of the housing rotation driving unit 252 so that the housing driving gear 254 rotates in association with the rotation of the housing rotation driving unit 252. In this case, the housing drive gear 254 may be coupled along the outer circumferential surface of the spline shaft 256 so as to freely move up and down in conjunction with the rotary housing. This spline shaft 256 may be coupled to the housing rotation drive 252 via a coupling device 255.

A housing driven gear 258 is coupled to the rotary housing 230, and the housing driven gear 258 is connected to the housing driving gear 254 to rotate. In this case, the housing driven gear 258 may be disposed along the outer circumferential surface of the rotary housing 230.

Although not shown in FIG. 8, at least one connecting gear may be disposed between the housing driving gear 254 and the housing driven gear 258. The connecting gears are arranged to be engaged with each other in one or a plurality according to the shape of the head module, thereby minimizing the size of the head module 201 and connecting the housing drive gear 254 and the housing driven gear 258 at the same time. Function

In this case, the housing driven gear 258 is preferably backlash (backlash) is prevented, and also to support the smooth rotational movement of the rotary housing 230 between the rotary housing 230 and the body 210. At least one bearing 235 is preferably arranged.

Referring to the operation of the housing rotation mechanism 250 having such a structure, when the housing rotation drive unit 252 is driven, the housing drive gear 254 disposed at one end of the housing rotation drive unit 252 is rotated, This causes the housing driven gear 258 which is engaged with the housing drive gear 254 to rotate. Since the housing driven gear 258 is coupled on the outer circumference of the rotary housing 230, the rotary housing 230 rotates as a result.

On the other hand, the nozzle spindle 240 is preferably able to rotate to mount the electronic component in the correct position according to the rotated angle of the printed circuit board. That is, when the printed circuit board is rotated at a predetermined angle, the rotating housing 230 is rotated about its center portion O to revolve the nozzle spindle 240 at a predetermined angle in accordance with the rotated angle of the printed circuit board. The position of the electronic component C can be corrected.

Meanwhile, as shown in FIGS. 3 and 9, the nozzle rotating mechanism 260 may be provided in the present invention. Due to the idle of the nozzle spindle 240, the electronic component C adsorbed on the nozzle spindle 240 is rotated at a predetermined angle so that the electronic components may not be positioned at the correct mounting position of the printed circuit board. Accordingly, the nozzle rotating mechanism 260 rotates the nozzle spindle 240 to correct the rotated angle of the electronic component, thereby accurately correcting the position of the electronic component that needs to be absorbed according to the rotated angle of the printed circuit board. . This is also necessary when mounting the electronic component C on two or more printed circuit boards B at the same time.

In this case, the nozzle rotating mechanism 260 includes a nozzle rotating drive 262, a nozzle driving gear 264, and a nozzle driven gear 268. The nozzle rotating driver 262 coupled to the body is typically connected to the nozzle driving gear 264 as a servo motor. In this case, the nozzle drive gear 264 is formed at one end of the nozzle rotation drive unit 262 and rotates in conjunction with the rotation of the nozzle rotation drive unit 262. In this case, the nozzle driving gear 264 is coupled along the outer circumferential surface of the spline shaft 266, and the spline shaft 266 is coupled to the nozzle rotating drive unit 262 through the coupling device 265. In addition, the nozzle drive gear 264 may be engaged with the nozzle driven gears 268 directly or indirectly to move up and down. The nozzle driven gear 268 is coupled to the outer circumferential surface of each nozzle spindle 240. Accordingly, the nozzle spindle 240 rotates as the nozzle driven gear 268 rotates.

In this case, first nozzle driven gears 268_a respectively formed on the outer circumferential surfaces of the first nozzle spindles 240_a inserted in the first vertical hole group 231_a located on a radial length close to the central axis of the rotary housing 230. Is directly engaged with the nozzle drive gear 264. In this case, the nozzle drive gear 264 is positioned at the central axis of the rotary housing 230, and is engaged with the plurality of first nozzle driven gears 268_a formed along the outer circumferential surfaces of the first nozzle spindles 240_a, respectively. do.

 Accordingly, when one nozzle driving gear 264 rotates, the first nozzle driven gears 268_a meshing with the nozzle driving gear 264 may rotate. In addition, the first coupled to the outer circumferential surface of each of the second nozzle spindle 240_b inserted into the second vertical hole group 231_b farther from the central axis of the rotary housing 230 than the first vertical hole group 231_a. The two nozzle driven gear 268_b is arranged to engage the first nozzle driven gear 268_a directly or indirectly, such that the first nozzle spindle 240_a and the second nozzle spindle 240_b may rotate in conjunction with each other. have. In this case, although not shown, a connecting gear connecting them between the first nozzle driven gear 268_a and the second nozzle driven gear 268_b may be disposed. On the other hand, the gears constituting the nozzle rotating mechanism 260 are preferably arranged such that backlash does not occur between them.

Alternatively, as shown in FIG. 10, the nozzle drive gear 264 may be connected to the nozzle driven gear 268 through the ring gear 269. That is, the nozzle driving gear 264 and the second nozzle driven gear 268_b are respectively connected to the ring gear 269 coupled to the rotary housing 230 to allow relative rotation. The ring gear 269 has a hollow cylinder shape and is formed along the outer circumferential surface of the rotary housing 230. An outer gear portion 269a formed on the outer circumferential surface of the ring gear 269 is connected to the nozzle driving gear 264. The inner gear part 269b formed on the inner circumferential surface of the ring gear 269 is connected to each of the second nozzle driven gears 268_b. Accordingly, the ring gear 269 rotates according to the rotation of the nozzle driving gear 264, and the second nozzle driven gears 268_b engaged with each other rotate with the second nozzle driven gear 268_b. The combined second nozzle spindle 240-b is rotated. In addition, the first nozzle driven gear 268_a is disposed to engage the second nozzle driven gear 268_b directly or indirectly, such that the first nozzle spindle 240_a is coupled to the first nozzle driven gear 268_a. And the second nozzle spindle 240_b coupled to the second nozzle driven gear 268_b may rotate in conjunction with each other.

Here, at least one connection gear 267 may be further provided to connect between the ring gear 269 and the nozzle driving gear 264. The connecting gear 267 is arranged in an appropriate number according to the structure of the head module, so that the rotational force of the nozzle drive gear 264 can be transmitted to the ring gear 269 while reducing the size of the entire head module. In this case, the nozzle driven gear 268, the ring gear 269 and the connecting gear are preferably formed so as to prevent backlash. In addition, although not shown in the drawings, a connecting gear connecting them between the first nozzle driven gear 268_a and the second nozzle driven gear 268_b may be disposed.

In such a structure, the nozzle drive gear 264 disposed at one end of the nozzle rotation drive part rotates in association with the driving of the nozzle rotation drive part 262. As a result, the ring gear 269 having the outer gear portion 269a engaged directly with the nozzle drive gear or the connecting gear rotates, and consequently the nozzle driven gear 268 engaged with the inner gear portion 269b of the ring gear. Will rotate. Since the nozzle driven gear 268 is fixed to the outer circumferential surface of the nozzle spindle 240, the nozzle spindle 240 rotates as a result.

As a result, the total weight and size of the head module 201 is reduced, and the components constituting the head module 201 are reduced, thereby reducing the manufacturing cost. As a result, the modularization of the head module 201 becomes possible, and thus, as described below, the body 210 is preferably mounted to be detachable to the horizontal moving mechanism.

That is, in another aspect of the present invention, as shown in FIG. 11, the component mounter 100, together with the plurality of head modules 201, the component supply part 102 and the horizontal moving mechanism ( 103). In this case, the component supply unit 102 for supplying electronic components and the conveyor unit 106 for transferring the printed circuit board B in the X-axis direction may be mounted on the bed 101.

The horizontal moving mechanism 103 is coupled to the bed 101. The horizontal moving mechanism 103 functions to horizontally move the at least one head module 201 from the component adsorption position of the component supply unit 102 to the printed circuit board B.

This horizontal movement mechanism 103 generally includes an X-axis feed mechanism 104 for horizontally moving the head module 201 to the X-axis and a Y-axis feed mechanism 105 for horizontally moving the head module 201 to the Y-axis. Equipped.

In this case, the head module 201 may be coupled to the X-axis transport mechanism 104 to be able to move horizontally along the X-axis transport mechanism (104). In this case, both ends of the X-axis feed mechanism 104 are mounted to the Y-axis feed mechanism 105 which is formed orthogonal to the X-axis feed mechanism 104 so as to be able to move horizontally. Therefore, when the X-axis feed mechanism 104 is moved along the Y-axis feed mechanism 105, the head module 201 mounted on the X-axis feed mechanism 104 is moved horizontally in the Y-axis direction. In addition, the head module 201 is horizontally moved along the X axis transport mechanism 104 in the X axis direction.

The one head module 201 includes a rotary housing 230 having a plurality of vertical hole groups 231 formed of vertical holes 232 having the same radial distance from the central axis O, and the vertical holes ( 232 each having nozzle spindles 240 inserted therein. In this case, the plurality of head modules 201 are detachably coupled to the horizontal transport mechanism 103, and the plurality of nozzle spindles 240 provided in the head module 201 are connected to the electronic component from the component supply unit 102. Is picked up and mounted on the printed circuit board (B) disposed on the conveyor section (106).

In this case, a first imaging unit 191 may be disposed between the component supply unit 102 and the conveyor unit 106. The first photographing unit 191 photographs the electronic component adsorbed to the nozzle spindle 240 from the component supply unit 102 and grasps the state thereof, thereby making it possible to obtain the electronic component according to the inclination angle of the printed circuit board B and the like. Correct the position of the part. In addition, although not shown in FIG. 11, the present invention may include a second photographing unit. The second photographing unit photographs a pick-up point of the electronic component seated on the component supply unit 102 and a fiducial mark of the printed circuit board transferred by the conveyor unit, thereby photographing the electronic component or the printed circuit board B. Function to acquire location information. Here, although the first photographing unit 191 is installed in the bed 101, the present invention is not limited thereto, and the second photographing unit may serve as the first photographing unit.

The horizontal movement mechanism 103 has a module mounting portion 130, the body 210 of the head module 201 is mounted to be detachable to the module mounting portion 130 of the horizontal movement mechanism 103.

In this case, as shown in FIG. 12, the spacing K3 between the nozzle spindles which are disposed between the adjacent head modules 201 and which can be simultaneously lowered in correspondence to the operation of the adjacent clutch parts is a component. It is preferable that it is an integer multiple of the pitch P between the supply parts 102. FIG. This is because the nozzle spindles 240 provided in the plurality of head modules 201 are simultaneously lowered to pick up the electronic component C from the component supply unit 102.

Even in this case, the clutch parts 273 provided in the one head module 201 are disposed to face each other with respect to the central axis O of the head module, and are provided in the one head module 201. The distance K2 between the nozzle spindles that can be lowered at the same time corresponding to the operation of the separate clutch units 273 is preferably an integer multiple of the pitch P between the component supply units 102. .

On the other hand, the head module 201 of this structure can be mounted detachably to the horizontal moving mechanism 103 (FIG. 11), and a module mounting for mounting the head module 201 and the horizontal moving mechanism 103 (FIG. 11). The instrument can also be used in a variety of ways. An example of the module mounting mechanism will be described with reference to FIGS. 13 and 14. The module mounting unit 130 is provided with a toggle clamping device 140, and the body 210 is driven by the toggle clamping device 140. The module mounting unit 130 may be clamped. The toggle clamping device 140 is excellent in mounting force even with a small force, and also easy to mount and detach.

The toggle clamping device 140 may include a clamping driver 141, a toggle mechanism 143, and an arm 147. The clamping driving unit 141 is mounted on the module mounting unit 130 and linearly displaces the rod member 142 installed therein. In this case, the clamping driving unit 141 is coupled to the upper side of the module mounting unit 130, thereby displacing the rod member 142 in the front, rear direction, which is substantially perpendicular to the upper side of the body 210.

The rod member 142 is connected to the toggle mechanism 143. The toggle mechanism 143 converts a linear motion of the rod member 142 into a rotational motion, and is connected to the rod member 142 to the rotary link member 145 and the link member 145 which move forward and backward. The linked support lever 144 and the fixed link member 146 is disposed on one side of the support lever 144, the rotary link member 145 is not disposed.

The arm portion 147 is connected to the support lever 144 of the toggle mechanism portion 143. The arm part 147 is rotated at a predetermined angle under the driving action of the clamping driving part 141, and a fixing pin 148 for fixing the body 210 is formed at one end thereof.

Therefore, in order to mount the head module 201 on the module mounting unit 140, the clamping driving unit 141 is first operated to displace the rod member 142 forward. When the rod member 142 is displaced forward, the fixed link member 146 of the toggle mechanism 143 is fixed, and the rotary rod member 145 is advanced. Accordingly, the support lever 144 is rotated. Therefore, the arm part 147 rotates at right angles as the support lever 144 rotates. As a result, the fixing pin 148 formed at one end of the arm part 147 is fixed by pressing the front surface of the body 210.

In this case, it is preferable that a fixing pin guide part 218 is formed at the position where the fixing pin 148 of the body 210 is accommodated to guide the fixing pin 148 to be seated. The fixing pin guide portion 218 may be formed to accommodate the fixing pin 148, and may also have a structure that is elastically biased toward the module mounting portion 130, thereby the fixing pin guide portion 218 The fixing pin 148 seated at the front side is securely fixed unless a certain force is operated forward.

On the contrary, in order to detach the head module 201 from the module mounting unit 130, the clamping driving unit 141 operates to displace the rod member 142 to the rear. As a result, the fixing pin 148 holding the front surface of the body 210 rotates in a direction opposite to the rotation direction at the time of fixing, and thus can be simply separated. However, the module mounting mechanism of the present invention is not limited thereto, and the module mounting mechanism is included in the present invention as long as the structure is detachable.

According to the present invention having the above structure has the following effects.

First, a plurality of nozzle spindles can be lowered as one clutch portion, and by placing two or more clutch portions in one head module, it is possible to pick up at least four or more electronic components at the same time, thus speeding up the mounting work.

Second, the components of the head module are reduced by elevating the rotary housing by using a mechanism for elevating the nozzle. This makes the lifting structure simple and reduces the manufacturing cost by reducing the total weight of the head module.

Third, by rotating the nozzle spindle and rotating at the same time, it is possible to mount one or a plurality of electronic components simultaneously or sequentially accurately and simply according to the positional deviation of the printed circuit board. Here, the structure for rotating the rotating housing and the mechanism for rotating the nozzle spindle are simple, and a small number of components are used to reduce the total weight and increase the high speed.

Fourth, as a mechanical means, by elevating the nozzle spindle and the rotating housing and rotating the rotary housing and the nozzle spindle, the accuracy of the elevating and rotating degree is increased.

Fifth, the head module can be modularized by such an effect, so that one component mounter may include a head module according to the type of each electronic component, thereby manufacturing a separate component mounter according to the type of electronic component. There is no need.

Sixth, the structure in which the head module is mounted on the horizontal moving mechanism is simple, but the mounting and detaching force is excellent. Therefore, the head module can be easily mounted and removed.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (15)

body; A rotating housing supported by the body and having a plurality of vertical hole groups having a plurality of vertical holes formed on the same radial distance from a central axis; A plurality of nozzle spindles accommodated in each of the vertical holes, coupled to nozzles for sucking and mounting electronic components, and rotatable along the central axis in response to rotation of the rotary housing; A housing rotating mechanism arranged to rotate the rotating housing about the central axis; And And at least one nozzle elevating mechanism having a clutch portion capable of simultaneously lowering at least two nozzle spindles belonging to separate vertical hole groups by driving the nozzle elevating drive unit and the nozzle elevating drive unit. The method of claim 1, And the clutch part is arranged to lower the at least one nozzle spindle at the same time. The method of claim 1, The clutch unit: A clutch shaft vertically moved by driving the nozzle lifting drive unit; And And a clutch plate disposed at one end of the clutch shaft, the clutch plate being arranged to simultaneously press from above a plurality of nozzle spindles belonging to separate vertical hole groups. The method of claim 3, wherein The nozzle lifting drive unit drives the clutch plate to rotate separately from the lifting and lowering of the clutch plate, The clutch plate is: A base capable of simultaneously pressing an upper surface of two adjacent nozzle spindles; And And an inlet portion drawn in from the base portion to a size larger than at least the nozzle spindle upper cross section. The method of claim 1, And a housing elevating mechanism for elevating and lowering the rotary housing while lowering and interlocking with the nozzle elevating mechanism. And said housing elevating mechanism is provided with a elevating control member for elevating and lowering said rotary housing while raising and lowering in association with said clutch portion. The method of claim 5, The housing lifting mechanism includes at least one hook mounted to the rotary housing, In the center of the hanger, a guide hole extending up and down is formed so that the elevating control member is inserted to cover the upper side portion, When the elevating control member stops at a certain height, the hanger is supported by the elevating control member to prevent the rotary housing from being lowered, and when the elevating control member is lowered by its own load of the rotary housing. Head module for component mounter, characterized in that the lowering in conjunction with the elevating control member. The method of claim 1, The housing rotating mechanism is: A housing rotation drive unit; A housing drive gear that rotates by driving the housing rotation driver; And And a housing driven gear mounted to the rotating housing and connected to the housing driving gear so as to be interlocked with each other. The method of claim 1, The interval between the nozzle spindles that can be lowered at the same time corresponding to the operation of the clutch unit, the component module head module, characterized in that an integer multiple of the pitch between the component supply unit for supplying the electronic component. The method of claim 1, And a nozzle rotating mechanism for rotating the nozzle spindle. The method of claim 9, The nozzle rotating mechanism is: Nozzle rotating drive unit; A nozzle drive gear connected to the nozzle rotating drive unit and disposed in a central portion of the rotary housing; And And a plurality of nozzle driven gears rotating along with rotation of the nozzle driving gear and coupled along a nozzle spindle outer periphery. The method according to any one of claims 1 to 10, And the clutch parts are arranged to face each other with respect to the central axis. The method of claim 11, The spacing between the nozzle spindles that can be lowered at the same time corresponding to the operation of the adjacent clutch portion is an integral multiple of the pitch between the component supply portion for supplying the component. Claims 1 to 10 having a structure of any one having a plurality of head modules arranged side by side, The spacing between the nozzle spindles respectively disposed between the adjacent head modules and capable of simultaneously lowering in response to the operation of the adjacent clutch parts is an integer multiple of the pitch between the parts supplying parts supplying the parts. Mounting machine. The method of claim 13, The clutch unit provided in the one head module is a component mounter, characterized in that arranged to face each other about the central axis of the head module. The method of claim 13, And a spacing between nozzle spindles capable of simultaneously lowering in response to the operation of the separate clutch units provided in the one head module is an integer multiple of the pitch between the component supplying parts supplying the components.

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