KR100627062B1 - Chip mounter, and method for mounting chip by the same - Google Patents

Abstract

The present invention provides a component mounting apparatus for absorbing an electronic component mounted on a component supply unit, moving as a horizontal moving mechanism, and mounted on a printed circuit board, so that the body portion mounted on the horizontal moving mechanism and the body portion are rotatable. A central shaft supported, a plurality of nozzle spindles arranged to be able to move up and down on the same circumference with respect to the central shaft, and a nozzle receiving hole for accommodating the nozzle spindles, are coupled to the lower side of the central shaft, A plurality of head assemblies arranged side by side with a rotatable rotatable housing interlocked therebetween, the spacing between the nozzle spindles arranged so as to be centered about the central shaft in one head assembly, and provided in and adjacent to each of the neighboring head assemblies, respectively. Spacing between adjacent nozzle spindles arranged in a row, supplying neighboring parts Provides an component mounting, characterized in that a multiple of the spacing between the centers.

Description

 Component Mounter and Electronic Component Mounting Method {Chip mounter, and method for mounting chip by the same}

1 is a perspective view showing a conventional component mounter,

2 is a cross-sectional view showing one head assembly provided in the component mounter of FIG. 1,

3 is a plan view showing a component mounter according to an embodiment of the present invention,

4 is a perspective view of the head assembly of FIG. 3, FIG.

5 is a cross-sectional view taken along the line VV of FIG. 4,

6 is an enlarged perspective view of the clutch housing and the clutch device of FIG. 4;

7A and 7B are plan views showing the relationship between the position of the nozzle spindle and the spool valve positions when the clutch plate of Fig. 6 is in the first phase and the second phase, respectively;

8 is a perspective view illustrating the clutch housing of FIG. 4 and a rotation driving device of the clutch housing;

FIG. 9 is a plan view illustrating a relationship between the head assemblies and the component supply unit of the component mounter of FIG. 4;

FIG. 10 is a block diagram illustrating an electronic component mounting method adopted in the component mounter of FIG. 3.

11A to 11D are plan views illustrating each step of the electronic component mounting method of FIG. 10.

12A to 12D are still another plan view illustrating each step of the electronic component mounting method of FIG. 10.

13 is a plan view showing a component mounter in another aspect of the invention,

FIG. 14 is a plan view illustrating a relationship between a photographing apparatus and a head assembly in the component mounter of FIG. 13;

FIG. 15 is a block diagram illustrating a relationship between the photographing apparatus and the controller of FIG. 14;

16 is a block diagram showing a method for mounting an electronic component in another aspect of the present invention.

Explanation of symbols on major parts of partial drawings

100, 200: component mounting machine 102: horizontal movement mechanism

105: conveyor section 109: parts supply section

111, 211: head assembly 112: body portion

120: center shaft 130: rotary housing

140, 240: nozzle spindle 140s: air flow path

142: nozzle 150: spool valve portion

151: negative pressure spool valve 151u: negative pressure upper spool flow path

151b: Negative pressure lower spool flow path 156: Positive pressure spool valve

156u: Positive pressure upper spool flow path 156b: Positive pressure lower spool flow path

160: clutch housing 170: clutch device

172: clutch plate 172a: base

172b: recess 181: negative pressure air supply

185: clutch valve 186: constant pressure air supply

260: clutch housing vertical drive device 261: Z axis drive device

262: drive transmission means 263: drive gear

291: imaging device 292: imaging device

296: control unit 297: storage unit

298: central processing unit

An: Nozzle Waiting Position As: Spool Waiting Position

Bn: nozzle mounting position Bs: spool mounting position

C: electronic component B: printed circuit board

K1: Spacing between nozzle spindles arranged opposite in head assembly

K2: Spacing between adjacently located nozzle spindles in neighboring head assemblies

Pc1: First Phase Pc2: Second Phase

M: recognition mark

The present invention relates to a component mounter and a method for mounting an electronic component by the component mounter, and more particularly, a component mounter for automatically mounting electronic components such as integrated circuits, diodes, capacitors, and resistors on a printed circuit board. An electronic component mounting method by a component mounting machine.

The component mounter is a core equipment of the component mounting assembly equipment for mounting a component on a printed circuit board (PCB). The component mounting equipment receives various components from a component supplier and transfers them to the mounting position of the printed circuit board, and then mounts them on the printed circuit board.

In general, a component mounter includes a component supply unit for supplying mounting components, a conveyor unit for conveying a printed circuit board to be worked on, a head assembly for picking up electronic components from the component supply unit and mounting them on a printed circuit board in order to include a nozzle spindle. It consists of.

Recently, a plurality of electronic components are sequentially or simultaneously adsorbed, the adsorbed plurality of electronic components are simultaneously moved to the conveyor unit, and the electronic components moved to the conveyor unit are sequentially or simultaneously mounted on a printed circuit board to increase the efficiency of component mounting. To this end a plurality of nozzle spindles are installed in the head assembly side by side.

However, the nozzle spindles installed side by side become larger in size, thereby increasing the overall size of the head assembly. Therefore, the number of nozzle spindles installed in the head assembly is limited.

In order to solve this problem, as shown in Fig. 1, three revolved head assemblies 11 are arranged in the head portion 10 provided in the component mounter disclosed in Japanese Patent Laid-Open No. 2003-273582. It is arranged. Each nozzle spindle 40 of each of the head assemblies 11 is rotatable, and is formed to be rotatable on the circumference of the nozzle rotation center by the nozzle rotating mechanism 60, and the suction nozzle 41 is coupled to the lower side thereof. do. In addition, the nozzle spindles 40 provided in the head assemblies 11 are selected by the nozzle selector 70 to descend, and are lowered by the nozzle lifter 80. These head assemblies 11 are fixed by the head frame 12.

The head assembly 11 provided in the component mounter having such a structure will be described in detail with reference to FIG. 2, and one head assembly 11 has a plurality of nozzles installed on the same circumference based on the spline shaft 35. The spindle 40 is provided.

The nozzle holder 50 is coupled to the spline shaft 35, and the nozzle spindles 40 are disposed on the same circumference about the spline shaft 35 of the nozzle holder 50 so as to be movable upward and downward.

The nozzle spindle 40 is installed to be elevated. In addition, the spline shaft 35 rotates in accordance with the operation of the nozzle elevating mechanism 60, which is a motor for rotating the nozzle, and thus the nozzle holder 50 and the nozzle spindle 40 coupled to the spline shaft 35 rotate. To be installed.

Meanwhile, in order for the nozzle spindles 40 to be selected and lowered separately, the head assembly 11 is provided with a nozzle selecting mechanism 70 and a nozzle raising mechanism 80. The nozzle selection mechanism 70 includes a compressed air supply chamber 71 and a nozzle selection valve 72, and injects compressed air into the pressurized air supply chamber 32 corresponding to the nozzle spindle 40 selected downward. In this case, the pressurized air supply chamber 32 may be coupled to the head assembly 11 and connected to the nozzle spindle 40 as a space in the air cylinder block 30 disposed above the nozzle holder 50, respectively.

Therefore, when the positive pressure air flows into the pressurized air supply chamber disposed above the selected nozzle spindle 40 down, the piston 52 formed in the pressurized supply chamber and the air cylinder shaft 53 coupled to the lower side of the piston descend, The lower end portion 53a of the air cylinder shaft 53, the upper end portion 50a of the nozzle spindle joined to the lower end portion 53a, and the upper surface portion 85a of the step portion 85a of the spline nut 85 are in the same height position. Thus, the air cylinder shaft 53, the nozzle spindle 40, and the spline nut 85 are integrated. Here, the spline nut 85 is moved up and down by being coupled with the nozzle lifting mechanism 80 having the cam follower 84, the eccentric cam 82, and the drive motor 81, and thus the spline nut 85. The nozzle spindle 40 coupled with is lowered.

In addition, in order to adsorb the electronic components, a vacuum suction device 90 is provided, in which negative pressure air from the outside is supplied with negative pressure air from the negative pressure air supply chamber 91 to the outside of the nozzle holder 50. The nozzle spindle 40 is individually sucked by the electronic component by being provided in the nozzle spindle 40 by the installed valves 92.

The revolver-type head portion has a merit of being able to mount a large number of electronic components while having a small size. However, the conventional head assembly 11 for each component mounter of this structure has a nozzle elevating mechanism provided with an eccentric cam 82, a cam follower 84, and a spline nut 85 to lower the nozzle spindle 40. FIG. By providing 80, the lifting mechanism becomes complicated, the weight becomes large, and the high-speed accuracy falls.

In addition, since the spline nut 85 is always raised and lowered to a constant height inside the head assembly 11, the flexibility of the raising and lowering strokes with respect to the change in the part thickness is inferior.

In addition, since the suction valve 92 of the electronic component is attached to the nozzle holder 50 by the number of the nozzle spindles 40, the total weight of the head assembly becomes excessive and occupies a lot of space, making it difficult to cope with various working environments. This makes the head assembly difficult to modularize.

The present invention is to solve a variety of problems including the above problems, a plurality of nozzle spindle is made of a revolver shape, and can absorb and mount the electronic components at high speed, and can absorb and mount a large number of electronic components It is an object of the present invention to provide a component mounter having a structure.

Another object of the present invention is to provide a nozzle lifting mechanism for lowering the nozzle spindle, the head assembly having a modular structure that is simple, a small number of components are used to reduce the total weight, increase the high-speed accuracy, It provides a mounter.

Still another object of the present invention is to provide a component mounter having a structure in which a plurality of nozzle spindles provided in one head assembly are simultaneously lowered to absorb a component, and a method for mounting the component.

Still another object of the present invention is to provide a method for mounting a component mounter capable of correcting a positional error of an electronic component adsorbed to a nozzle automatically according to the type of each head assembly.

In order to achieve the above object, a component mounter according to a preferred embodiment of the present invention is a component mounter for absorbing an electronic component seated on a component supply unit, moving as a horizontal moving mechanism, and mounting on a printed circuit board. ,

A body portion, a central shaft supported and rotatable by the body portion, a plurality of nozzle spindles arranged to be movable up and down on the same circumference with respect to the center shaft, and a nozzle accommodation hole accommodating the nozzle spindles; And a rotating housing rotatably coupled with the central shaft to be coupled to the lower side of the central shaft, the plurality of head assemblies arranged side by side,

The spacing between the nozzle spindles disposed so as to face the center shaft in one head assembly, and the spacing between the nozzle spindles provided in neighboring head assemblies and arranged in a row adjacent to each other, respectively, are provided in the neighboring part supply parts. It is characterized by an integer multiple of the interval between the centers.

In this case, a clutch device capable of selectively lowering the nozzle spindles is formed above the rotary housing corresponding to the one head assembly. In this case, the clutch device includes a clutch housing, a clutch shaft, and a clutch plate.

The clutch plate has a plurality of clutch receiving holes corresponding to the respective nozzle accommodation holes, and a shaft hole through which the central shaft penetrates in a central portion thereof, and is capable of rotating and vertical movement. The clutch shaft is accommodated in the clutch receiving hole to be elevated. A clutch plate may be coupled to the lower end of the clutch shaft to selectively lower the one or more nozzle spindles.

On the other hand, each head assembly is coupled to the horizontal moving mechanism to be detachable.

On the other hand, the electronic component mounting method according to another aspect of the present invention is an electronic component mounting that absorbs electronic components and mounts the electronic components on a printed circuit board as a component mounting apparatus having a head assembly having the above structure. A method comprising: a plurality of nozzle spindles descending simultaneously in the one head assembly to adsorb an electronic component from a component supply, to move the adsorbed electronic component onto a printed circuit board, and to print the adsorbed electronic component. Mounting on a circuit board.

In this case, in the step of adsorbing the electronic component, at least two head assemblies provided in one head assembly and installed to face each other with respect to the central shaft are simultaneously lowered to absorb the respective electronic components. It is preferable that the nozzle spindles installed at the same time are performed at the same time.

On the other hand, the component mounter according to still another aspect of the present invention includes a bed, a head assembly, a horizontal moving mechanism, an imaging device, and a controller.

The bed includes a component supply part for supplying electronic components and a conveyor part for transporting a printed circuit board. A horizontal moving mechanism is mounted on the bed to move the head assembly horizontally in the X and Y axes. The head assembly has a central shaft and a plurality of nozzle spindles disposed on the same circumference at the center shaft center and independently movable up and down. The imaging apparatus photographs all electronic components adsorbed on the nozzle spindles collectively. The controller acquires data of the electronic components photographed by the photographing apparatus, and corrects a position error of each electronic component based on the data.

In this case, the photographing apparatus is formed of the same number as the number of the head assemblies, and spaced apart from each other by the same distance between the head assemblies between the photographing apparatuses, and each photographing apparatus includes nozzle spindles provided in one head assembly. It is preferable to collectively image all the electronic components adsorbed on the substrate.

In addition, it is preferable that each head assembly is provided with a recognition mark photographed by the photographing apparatus having a specific shape according to the arrangement structure of the nozzle spindle.

On the other hand, the electronic component mounting method according to still another aspect of the present invention is an electronic component mounting method for absorbing an electronic component with a component mounting device having the above structure and mounting the electronic component on a printed circuit board. Adsorbing an electronic component from a supply unit, moving a head assembly which adsorbs the electronic component onto a photographing apparatus, and collectively photographing the adsorbed electronic component to correct the position of the electronic component; Moving the head assembly on which the electronic component is adsorbed onto the printed circuit board, and mounting the adsorbed electronic component on the printed circuit board.

Here, in the photographing step, one imaging apparatus collectively photographs all the electronic components adsorbed on the nozzle spindles provided in one head assembly corresponding thereto, and in this case, the imaging apparatus is for each head assembly. It is preferable to include the step of photographing the identification mark of a particular shape formed according to the arrangement structure of the nozzle spindle.

Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

A component mounter according to an embodiment of the present invention is an apparatus for absorbing an electronic component seated on a component supply unit, moving as a horizontal moving mechanism, and mounting on a printed circuit board. As shown in FIG. 3, the component mounter includes a bed 101 and a horizontal moving mechanism 103 together with the plurality of head assemblies 111. The bed 101 includes a component supply unit 102 for supplying electronic components, and a conveyor unit 106 for transferring the printed circuit board B in the X-axis direction.

The horizontal moving mechanism 103 is coupled to the bed 101. The horizontal moving mechanism 103 functions to horizontally move the plurality of head assemblies 111 from the component adsorption position of the component supply unit 102 to the printed circuit board B.

This horizontal moving mechanism 103 is generally an X-axis gantry 104 for horizontally moving the plurality of head assemblies 111 on the X-axis and a Y-axis gantry for horizontally moving the head assemblies 111 on the Y-axis ( 105).

In this case, the head assembly 111 may be coupled to the X-axis gantry 104 to be horizontally moved along the X-axis gantry 104. In this case, both ends of the X-axis gantry 104 are mounted to the Y-axis gantry 105 formed to be orthogonal to the X-axis gantry 104 so as to be horizontally movable. Therefore, when the X-axis gantry 104 is moved along the Y-axis gantry 105, the head assembly 111 mounted on the X-axis gantry 104 moves horizontally in the Y-axis direction. In addition, the head assembly 111 is horizontally moved along the X-axis gantry 104 in the X-axis direction.

A plurality of nozzle spindles 140 are disposed on the circumference of the head assembly 111. In this case, the plurality of head assemblies 111 may be detachably coupled to the head frame 108, and the plurality of nozzle spindles 140 provided in the head assembly 111 may draw electronic components from the component supply unit 102. It picks up and mounts to the printed circuit board B arrange | positioned on the conveyor part 106. FIG.

4 shows two head assemblies 111 provided in the component mounter 100 according to the preferred embodiment of the present invention, and FIG. 5 shows one cross section of the head assembly 111 shown in FIG. 4. It is. 4 and 5, one head assembly 111 includes a body portion 112, a central shaft 120, a rotation housing 130, and a plurality of nozzle spindles 140. The central shaft 120 is mounted to the body portion 112. The central shaft 120 is disposed up and down.

A cylindrical rotary housing 130 is coupled to the lower side of the central shaft 120. A shaft accommodating hole (not shown) is formed at the center of the rotary housing 130 so that the lower side of the central shaft 120 is inserted into the shaft accommodating hole.

A plurality of nozzle accommodation holes 132 are formed on the same circumference around the central shaft 120, and a nozzle spindle 140 capable of lifting and lowering is inserted into each of the nozzle accommodation holes 132. In this case, the nozzle spindle 140 is located at the nozzle standby position An except at the time of descending to adsorb or mount the electronic component C, and the nozzle insertion and mounting position Bn is a position at which the electronic component is adsorbed or mounted. Can descend to.

The nozzle spindle 140 has a hollow cylindrical shape, an air flow path 140s is formed in the hollow inner space, and a nozzle 142 for adsorbing the electronic component C is coupled to the lower portion of the nozzle spindle 140.

In this case, it is preferable that the nozzle return spring 145 is formed outside or inside the nozzle spindle 140, whereby the nozzle spindle 140 receives a force above the elastic force of the nozzle return spring 145 from above. This is because the lowering of the nozzle spindle 140 may return to the nozzle standby position An when a force higher than the elastic force of the nozzle return spring 145 is removed.

On the other hand, the component mounter according to the present invention may be the nozzle spindle 140 provided in each of the head assembly 111 independently descends to suck or mount the component (C). Taking the head assembly 111 having such a function as an example, the air flow path 140s of the nozzle spindle 140 is connected to the negative pressure air supply 181 and the constant pressure air supply 186. do. The negative pressure air supply unit 181 functions to supply negative pressure air into the air flow path 140s of the nozzle spindle 140 so that the nozzle 142 sucks the electronic component C. The supply unit 186 functions to supply a constant pressure air into the air flow path 140s of the nozzle spindle in order to mount the electronic component C on the printed circuit board B at the nozzle 142.

In this case, the central shaft 120 has a hollow cylindrical shape, and a negative pressure air supply unit 181 and a constant pressure air supply unit 186 are formed in the inner space of the central shaft 120 to connect with the air flow path 140s of the nozzle spindle. It is possibly formed.

As a result, since the negative and positive pressure air supply parts 181 and 186 are rotated close to the rotation shaft 130x of the rotary housing 130 without being exposed to the outside, the size of the parts exposed to the outside is reduced so that the head assembly 111 ) Weight and size decrease. In addition, since the negative-pressure air supply units 181 and 186 do not interfere with other components of the head assembly 111, stable air supply is possible.

Corresponding to each nozzle spindle 140, a plurality of air passages 140s and a negative pressure air supply unit 181 in the nozzle spindle 140 and a plurality of air passages 140s and a constant pressure air supply unit 186 in the nozzle spindle. The spool valve portion 150 consisting of spool valves is disposed. The spool valve unit 150 moves up or down and connects or disconnects between the air passage 140s and the constant pressure air supply unit 186 or between the air passage 140s and the negative pressure air supply unit 181.

5 and 6, the clutch housing 160 is disposed above the rotary housing 130 and the spool valve unit 150. The clutch housing 160 is provided with a plurality of clutch receiving holes 162 corresponding to the nozzle spindles 140, respectively.

The clutch device 170 is accommodated in each of the clutch receiving holes 162. This clutch device 170 includes a clutch shaft 171 and a clutch plate 172. The clutch shaft 171 is accommodated in the clutch accommodating hole 162 so as to be lifted and lowered. A clutch plate 172 is formed below the clutch accommodating hole 162, and the clutch plate 172 is disposed above the spool valve unit 150 corresponding to the nozzle spindle 140 and the nozzle spindle 140. As a result, the upper end of the selected spool valve of the spool valve unit 150 together with the nozzle spindle 140 may be lowered.

Here, as shown in FIG. 5, an upper end of each clutch shaft 171 is formed with a clutch piston 173 inserted into contact with the clutch receiving hole 162, and the clutch housing 160 has the clutch. An air inlet hole 165 is formed between the upper end of the accommodating hole 162 and the air supply unit, and the air of the positive pressure flows into the clutch accommodating hole 162 above the piston through the air inlet hole 165. It is preferable to be.

In this case, a plurality of clutch valves 185 (see FIG. 3) are formed in the head assembly 111 to control whether or not positive pressure air is introduced into the respective air inlet holes 165, and the clutch valve 185 is provided. One or more nozzle spindles 140 for adsorbing the electronic component C may be selected by precise control of.

Accordingly, the clutch plate 172 lowered by the clutch valve 185 is lowered to press the at least one or more spool valves of the spool valve unit 150 disposed below the clutch plate 172 so that the spool valve is sucked up. It descends to the mounting position Bs.

On the other hand, the air inlet hole 165 formed in the clutch housing 160 is preferably connected to the constant pressure air supply 186. That is, the positive pressure air supply unit 186 preferably serves to lower the clutch device 170 in addition to the function of mounting the electronic component (C) on the printed circuit board (B), thereby reducing the number of components This is because overall size and weight are reduced, and manufacturing costs are reduced.

The spool valve unit 150 is disposed between the central shaft 120 and the nozzle spindle 140. In particular, the central shaft 120 and the rotary housing 130 are provided with a connecting passage Rc for connecting the air flow passage 140s in the nozzle spindle and the negative air supply portions 181 and 186, and the spool valve portion ( It is preferable that 150 is formed to cross the connecting passage (Rc), thereby opening and closing the connecting passage (Rc) while the spool valve unit 150 is raised and lowered, the constant pressure air supply (181, 186) and the nozzle spindle ( The air flow paths 140s in the 140 may be connected and blocked.

In one head assembly 111 provided in the component mounter of the present invention, the spool valve unit 150 corresponding to one nozzle spindle may include a negative pressure spool valve 151 and a constant pressure spool valve 156. That is, two spool valves of the negative pressure spool valve 151 and the positive pressure spool valve 156 may be connected to the air flow path 140s of the unit nozzle spindle 140.

In this case, as shown in FIG. 6, the negative pressure spool valve 151 and the positive pressure spool valve 156 are formed with upper spool flow paths 151u and 156u and lower spool flow paths 151b and 156b, respectively. The clutch plate 172 is preferably arranged to selectively press the negative pressure spool valve 151 and the positive pressure spool valve 156 corresponding to the nozzle spindle 140 together with one nozzle spindle 140. Do.

That is, when only the negative pressure spool valve 151 is lowered among the spool valves at the spool standby position As with the nozzle spindle 140 at the nozzle standby position An, the upper spool flow path 156u of the positive pressure spool valve ) And the upper spool flow path 151u of the negative pressure spool valve connect between the air flow path 140s and the negative pressure air supply unit 181, so that negative pressure is generated in the nozzle spindle 140, so that the outside of the lower part of the nozzle 142 is lower. The pressure difference between the lower air and the air in the nozzle causes the nozzle to adsorb the electronic component.

On the contrary, when the nozzle spindle 140 is lowered to the nozzle suction position Bn, and together with the negative pressure spool valve 151, the positive pressure spool valves 156 are lowered to the spool suction position Bs. The lower spool flow path 156b of the positive pressure spool valve and the lower spool flow path 151b of the negative pressure spool valve are connected between the air flow path 140s and the constant pressure air supply 186 to thereby provide a positive pressure in the nozzle spindle 140. As a result, air flows out of the lower side of the nozzle 142 and as a result, the electronic component C adsorbed by the nozzle can be mounted on the printed circuit board B.

On the other hand, the clutch housing 160 is driven by the clutch housing vertical drive device 260. For example, as shown in FIG. 5, the clutch housing vertical drive device 260 includes a Z-axis drive motor 261 and a drive transmission means 262. do. The Z-axis drive motor 261 fixed to the head frame 111 is connected to the drive transmission means 262.

The drive transmission means 262 changes the driving force of the Z-axis drive motor 261 to the vertical movement drive force. That is, the drive transmission means 262 is driven by the drive gear 263 formed on the same axis as the Z-axis drive motor 261, the drive gear 263 and the power transmission means 264, such as a timing belt. It is preferable to have a gear 265, a ball screw 266 connected to the driven gear 265 and formed up and down, and an LM guide 267 disposed parallel to both sides of the ball screw 266. In this case, the Z-axis housing (not shown) is coupled with the clutch housing 160 and moves up and down along the ball screw 266 and the LM guide 267, thereby allowing the clutch housing 160 to be elevated. do.

In this case, as shown in FIGS. 7A and 7B, the clutch plate 172 has a base 172a and a recess 172b to selectively press the negative pressure spool valve 151 and the constant pressure spool valve 156. It is formed to be. The base 172a is formed to press the parts corresponding to the nozzle spindle 140 and the positive pressure spool valves 151 and 156 together with the nozzle spindle 140. The concave portion 172b formed concave from the base portion 172a has a radius of curvature α greater than that of the positive pressure spool valve 156 and is formed to concave at the base portion 172a so that the negative pressure spool valve when the clutch plate descends. One of 151 and the constant pressure spool valve 156 is not pressed.

In addition, it is preferable that the clutch plate 172 has a first phase Pc1 and a second phase Pc2 about the rotation shaft of the clutch shaft 171 or the clutch housing 160.

When the clutch plate 172 is located in the first phase Pc1, as shown in FIG. 7A, the clutch plate 172 is arranged to press the nozzle spindle 140 and the negative pressure spool valve 151. That is, the recessed part 172b is formed in the upper part of the static pressure spool valve 156, and when the clutch device 170 descends, the positive pressure spool valve 156 does not become pressed by the base part 172a, and descends, You will not.

Alternatively, as shown in FIG. 7B, the clutch plate 172 rotates at an angle, for example, 5 ° to 15 °, about the rotation shaft of the clutch shaft 171 or the rotating housing in the first phase Pc1. When located in the second phase Pc2, the recess 172b is not disposed directly above the positive pressure spool valve 156, so that the base 172a is disposed in the nozzle spindle 140 and the negative pressure spool valve 151. And the positive pressure spool valve 156, the clutch plate 172 is arranged to press the nozzle spindle 140, the negative pressure spool valve 151 and the constant pressure spool valve 156.

Meanwhile, as shown in FIG. 8, the clutch housing 160 should be rotated so that each clutch shaft 171 that cooperates with the clutch housing 160 has the same phase as the nozzle spindle 140. To this end, the clutch rotary driven gear 275 connected to the clutch rotary driving gear 273 which cooperates with the clutch rotary motor 271 is rotated in accordance with the driving of the clutch rotary motor 271. In this case, it is preferable that the clutch shaft 171 rotates in synchronism with the nozzle spindle 140 at the bottom thereof. For this purpose, the clutch rotation driving gear 273 and the clutch rotation driven gear 275 rotate. The ratio is properly adjusted, the clutch rotary drive gear 273 and the clutch rotary driven gear 275 are interlocked by the timing belt 274, and an AC motor can be used as the clutch rotary motor 271.

According to the head assembly 111 having such a configuration, each nozzle spindle 140 provided in one head assembly 111 can be lowered independently, and the size of the clutch device 170 is rotated in the housing 130. ) And simple operation. As a result, one head assembly 111 may be detachably coupled to the horizontal moving device, and thus one head assembly 111 may be modularized. That is, the locking jaw 115 (see FIG. 4) is formed at the position where the head frames 111 are coupled to the head frames, and the locking jaw accommodating grooves are formed in the head frame corresponding thereto. Can be coupled to the head frame.

4 to 8 are one embodiment of the present invention, and each nozzle spindle provided in one head assembly is included in the present invention if it can be lowered independently.

In the present invention, as shown in FIG. 9, the distance K1 between the nozzle spindles 140 arranged to face each other with respect to the center shaft center O in one head assembly 111 is the neighboring part. The integral multiple of the distance P between the centers of the supply parts 109 is configured, and accordingly, the clutch device 170 is also configured to correspond to the structure of the nozzle spindles 140. As a result, a plurality of nozzle spindles 140 provided in one head assembly 111 may be simultaneously lowered to absorb components.

That is, as described above, the clutch device 170 is configured to correspond to each nozzle spindle 140, and the clutch plate 172 disposed above the selected nozzle spindle 140 is lowered to lower the respective nozzle spindle ( By pressing 140, each nozzle spindle 140 independently adsorbs the component, such that the spacing K1 between the two nozzle spindles facing about the center O of the central shaft corresponds to the component supply 109 corresponding thereto. If the same as the distance (P) between the center of the center, or an integer multiple, such as 2 times, 3 times, the two nozzle spindles 140 can adsorb a plurality of parts (C) at the same time.

In addition, since the rotatable housing 130 is rotatable, after the two nozzle spindles 140 simultaneously adsorb the component C, the rotatable housing 140 rotates at an angle so that the next two nozzle spindles 140 are rotated. Being positioned on the component supply unit 109, the two nozzle spindles 140 can repeat the process of adsorbing the component (C), thereby reducing the time to adsorb the component. In this case, the distance between the nozzle spindle 140, which is formed in the one rotary housing 130, and the mutually adjacent nozzle spindle 140 may be the same, thereby allowing the rotation angle of the rotary housing to be constant.

In addition, the spacing K2 between the nozzle spindles provided in the neighboring head assemblies 111 and arranged in a row adjacent to each other is also arranged at an integer multiple of the spacing P between the centers of the neighboring component supply parts. This allows the plurality of head assemblies 111 to adsorb the components at the same time, it is possible to adsorb the components even faster.

In another aspect of the present invention, an electronic component mounting method for adsorbing an electronic component and mounting the electronic component on a printed circuit board as a component mounter having the head assembly 111 having the above structure is illustrated in FIG. 10. As shown in the drawing, a plurality of nozzle spindles are simultaneously lowered in the one head assembly to suck an electronic component from a component supply unit, and to move the sucked electronic component onto a printed circuit board (S2). And mounting the absorbed electronic component on a printed circuit board (S3).

In this case, the step of absorbing the electronic components, the two nozzle spindles 140 provided in one head assembly 111 and installed to face the center shaft center are simultaneously lowered to absorb the respective electronic components. Nozzle spindles 140 installed on at least two head assemblies are performed simultaneously.

One example of such an adsorption process is described with reference to FIGS. 11A-11D. In this case, the component mounter is provided with two head assemblies 111 and one head assembly 111 is provided with eight nozzle spindles 140.

In this case, between the nozzle heads respectively provided in the adjacent head assembly 111, and disposed between the nozzle spindles adjacent to each other, and the nozzle spindles provided in one head assembly and disposed to face the center O of the central shaft. For example, each of the intervals K1 is twice the distance P between the centers of the neighboring component supply units 109.

As shown in FIG. 11A, the first head assembly 111a is first disposed on the first component supply 109_1 and the third component supply 109_3, and the second head assembly 111b is the fifth component supply. 109_5 and over the seventh component supply part 109_7. The first a, 1e nozzle spindles of the first head assembly 111a and the second a, 2e nozzle spindles of the second head assembly 111b are simultaneously lowered to absorb four electronic components C at the same time.

Then, as in FIG. 11B, the rotary housing 130 (see FIG. 4) rotates at a 40 degree angle θ in the two head assemblies 111a and 111b, respectively, while the horizontal moving mechanism 103 (see FIG. 10). The first head assembly 111a is moved and disposed on the second component supply unit 109_2 and the fourth component supply unit 109_4, and the second head assembly 111b is disposed on the sixth component supply unit 109_6 and the eighth component. It is arranged to move on the supply unit 109_8. Thereafter, the first b, 1f nozzle spindles of the first head assembly 111a and the second b, 2f nozzle spindles of the second head assembly 111b are simultaneously lowered to simultaneously absorb four electronic components. During this time, the electronic components are moved to the adsorption positions on the first, third, fifth and seventh component supply units 109_1, 109_3, 109_5, and 109_7.

Then, as shown in FIG. 11C, in the two head assemblies 111a and 111b, the rotary housing rotates 40 degrees, respectively, and at the same time, the first head assembly 111a is again driven by the horizontal moving mechanism 103 (see FIG. 10). The components are disposed on the component supply unit 109_1 and the third component supply unit 109_3, and the second head assembly 111b is disposed on the fifth component supply unit 109_5 and the seventh component supply unit 109_7. Thereafter, the first c and 1 g nozzle spindles of the first head assembly 111 a and the second c and 2 g nozzle spindles of the second head assembly 111 b are simultaneously lowered to simultaneously adsorb four electronic components. In the meantime, the electronic components are moved to the suction positions in the second, fourth, sixth, and eightth component supply units 109_2, 109_4, 109_6, and 109_8.

Then, as shown in FIG. 11D, the rotational housing rotates 40 degrees in the two head assemblies 111a and 111b while the first head assembly 111a is again rotated by the horizontal moving mechanism 103 (see FIG. 10). The moving part is disposed on the supply part 109_2 and the fourth part supply part 109_4, and the second head assembly 111b is moved and disposed on the sixth part supply part 109_6 and the eighth part supply part 109_8. Thereafter, the first d, 1h nozzle spindles of the first head assembly 111a and the second d, 2h nozzle spindles of the second head assembly 111b are simultaneously lowered to simultaneously adsorb four electronic components. Accordingly, the electronic component can be sucked to the nozzle spindle in a short time, thereby shortening the component mounting time.

On the other hand, in order to simultaneously adsorb different size electronic components, the central shaft can be rotated at different speeds for each head assembly, so that the different size electronic components can be simultaneously adsorbed on the nozzle shaft provided in the separate head assembly. have.

That is, as illustrated in FIGS. 12A to 12D, the small electronic components C1 are disposed in the first, second, third, fourth, and sixth component supply units 109_1, 109_2, 109_3, 109_4, and 109_6, and the fifth component. For example, as illustrated in FIG. 12A, when the large electronic component C2 is adsorbed to the supply unit, the first head assembly 111a may first include the first component supply unit 109_1 and the third component supply unit 109_3. ) And a second head assembly 111b is disposed over the fifth component supply part 109_5. The first a and 1e nozzle spindles of the first head assembly 111a are lowered to adsorb the two small electronic components C1, and at the same time, the second a nozzle spindle of the second head assembly 111b is lowered to allow the large electronic components. (C2) One is adsorbed.

Then, as in FIG. 12B, the rotating housing rotates at a 40 degree angle θ in the first head assembly 111a and the rotating housing rotates at a 90 degree angle 2θ in the second head assembly 111b. The first head assembly 111a is moved and disposed on the second component supply part 109_2 and the fourth component supply part 109_4 by the horizontal moving mechanism 103 (see FIG. 10), and the second head assembly 111b is disposed. Is disposed on the sixth component supply part 109_6. Accordingly, the first and second nozzle spindles 1b and 1f of the first head assembly 111a and the 2c nozzle spindles of the second head assembly 111b are simultaneously lowered to simultaneously adsorb three small electronic components C1. In the meantime, the electronic components are moved to the suction positions in the first, third, and fifth component supply units 109_1, 109_3, and 109_5.

Then, as shown in FIG. 12C, the rotating housing rotates 40 degrees in the first head assembly 111a and the rotating housing rotates 90 degrees in the second head assembly 111b, while the horizontal moving mechanism 103 (see FIG. 10). ) Moves the first head assembly 111a onto the first component supply 109_1 and the third component supply 109_3, and moves the second head assembly 111b onto the fifth component supply 109_5. Is placed. Accordingly, the 1c and 1g nozzle spindles of the first head assembly 111a are lowered to adsorb the two small electronic components C1, and at the same time, the 2e nozzle spindle of the second head assembly 111b is lowered and one large The electronic component C2 is attracted. In the meantime, the electronic components are moved to the suction positions in the second, fourth, and sixth component supply units 109_2, 109_4, and 109_6.

Then, as shown in FIG. 12D, the rotating housing rotates 40 degrees in the first head assembly 111a and the rotating housing rotates 90 degrees in the second head assembly 111b, while the horizontal moving mechanism 103 (see FIG. 10). ) Moves the first head assembly 111a onto the second part supply part 109_2 and the fourth part supply part 109_4, and the second head assembly 111b moves on the sixth part supply part 109_6. Is placed. Accordingly, the 1d, 1h nozzle spindles of the first head assembly 111a and the 2e nozzle spindles of the second head assembly are simultaneously lowered to absorb the three small electronic components C1, thereby increasing the component adsorption speed. have.

Meanwhile, the component mounter 200 in still another aspect of the present invention is shown in FIG. Referring to FIG. 13, the component mounter 200 includes a bed 101, a plurality of head assemblies 111, a horizontal moving mechanism 102, an imaging device 291, and a controller 296; Reference). In this case, the plurality of head assemblies 211 are combined on the horizontal moving mechanism 102, and one head assembly 211 is disposed on the same circumference at the center shaft and the center shaft center O and independently A plurality of nozzle spindles 240 that can move up and down are provided.

The structure and function of the bed 101 and the horizontal moving mechanism 102 are the same as those of the bed, the head assembly and the horizontal moving mechanism shown in FIG.

The component mounter 200 of the present invention includes at least one imaging device 291 and a controller 296 (see FIG. 15). The photographing apparatus 291 collectively photographs all the electronic components adsorbed on the nozzle spindle 240, and the controller 296 (see FIG. 15) acquires data of the electronic components photographed by the photographing apparatus 291. The position error of each electronic component is corrected based on the data.

Each of the head assemblies 211 in this case can lower and lower the respective nozzle spindle 140 using the clutch device 170 as shown in FIGS. 3 and 7 to adsorb and mount the component C. FIG. However, the size of the clutch device 170 can be adjusted according to the part, and the clutch device 170 mechanically lowers the nozzle spindle 140. As a result, the response speed is high, so that the small parts can be simultaneously absorbed and I can attach it. As a result, the size of the head assembly 211 may be reduced, and accordingly, the photographing apparatus 291 may process the electronic components adsorbed, thereby reducing the photographing time and the position error correction time of the electronic component. As a result, the time for mounting the electronic component by the component mounter is shortened.

In this case, as shown in FIG. 14, each photographing apparatus 291 has the same number as the number of the head assemblies 211, and is connected to the nozzle spindles 240 provided in one head assembly 211. It is preferable that all of the absorbed electronic components C are collectively photographed, and the adjacent imaging apparatus 291 is spaced apart from each other by the same distance P between the head assemblies 211. That is, one imaging device 291 preferably has a field of view (FOV) capable of imaging one head assembly 211.

This is because, as described above, since each head assembly 211 can be modular, the nozzle spindle 240 may have a different arrangement structure in one head assembly 211, and thus will be described later. This is because if the imaging device 291 for collectively photographing the head assembly 211 is formed, it is possible to find the error of the part position accurately and simply according to the type of the head assembly 211.

In this case, as described below, each head assembly 211 has a specific mark according to the arrangement structure of the nozzle spindle 240 and a recognition mark M photographed by the photographing apparatus 291 is formed. Do.

In this case, as shown in FIG. 15, the photographing apparatus 291 includes a lens 292 and an imaging device 293 for recording component image information introduced and picked up through the lens 292. In addition, the control unit 296 may include a storage unit 297 and a central processing unit 298. Here, the storage unit 297 stores the arrangement structure of the nozzle spindle provided in the head assembly 211 and the set part image data at the reference position of the electronic component mounted on the nozzle spindle according to the arrangement structure. The central processing unit 198 compares the set part image data with the actual captured part image data, and accordingly moves and rotates the head assembly 211 with the horizontal moving device 102, thereby reducing the position error of the electronic component. Correct it.

On the other hand, as shown in Figure 14, each of the head assembly 211, a recognition mark (M) taken by the imaging device 291 having a specific shape in accordance with the arrangement structure of the nozzle spindle 240 It is preferable that is formed, because of this, the photographing apparatus 291 corresponding to the head assembly 211 can capture the image of the recognition mark (M) and thereby can determine the type of the head assembly 211. That is, the type of the head assembly 211 is determined by comparing the recognition mark M data photographed by the photographing apparatus 291 with the recognition mark data already stored in the storage unit.

In this case, the imaging device 291 is preferably a line scan camera. In this case, the head assembly 211 is moved to a plurality of photographing apparatuses installed on the bed, and in this state, the line scan camera may photograph an image of the part. It is also possible to photograph a plurality of sub heads provided in the head assembly.

According to still another aspect of the present invention, there is provided a method for mounting an electronic component in which an electronic component is mounted on an excitation component mounter (200) including an imaging device (291) and a control unit (296) having the above structure, and a printed circuit. An electronic component mounting method for mounting the electronic component on a substrate.

That is, as shown in FIG. 16, the electronic component mounting method includes: adsorbing an electronic component from a component supply unit (S10), and moving the head assembly that adsorbs the electronic component onto a photographing apparatus (S20); And collectively photographing the absorbed electronic components, correcting the position of the electronic components (S30), moving the head assembly on which the electronic components are adsorbed onto the printed circuit board (S40), and the adsorption. Mounting the electronic component on the printed circuit board (S50).

In this case, in the photographing step S30, one photographing apparatus may collectively photograph all the electronic components adsorbed on the nozzle spindles provided in the head assembly corresponding thereto. At the same time, the plurality of photographing apparatuses 291 are provided in the same manner as the distance between the head assemblies, and the electronic components mounted on the plurality of head assemblies can be simultaneously collectively imaged.

In this case, the photographing method may be line scanned with a line scan camera. As an example of a photographing method, the photographing apparatus can be fixed between the component supply part and the conveyor part on the bed, and the head assembly can be moved in parallel in the Y direction to be photographed by moving on the photographing apparatus.

Alternatively, the head assembly may be positioned on the same Y axis as the imaging device of the bed, and the imaging device may be photographed while moving on the X axis.

On the other hand, the photographing step (S30), it is preferable that the photographing apparatus includes a step (S31) for photographing the identification mark of a specific shape formed according to the arrangement structure of the nozzle spindle for each head assembly. That is, each head assembly provided in the component mounter according to the present invention can be modularized, and accordingly, the arrangement of the nozzle spindles disposed in one head assembly may be different. Therefore, in the control section, the component position error must be checked and corrected according to the head assembly type.

To this end, one imaging device collectively photographs the positions of the parts mounted on one head assembly, and the imaging apparatus photographs the identification marks located on the respective head assemblies, and each of the images stored in the storage unit is stored according to the identification marks. By using the reference suction position of the component as the reference data in the head assembly, the component position error can be checked and corrected according to the type of the head assembly in a simple and quick time.

Therefore, the photographing step (S30), comparing the set part image data storing the reference suction position of the electronic component according to the arrangement structure of the nozzle spindles provided in the one head assembly and the actual captured image part data, It is preferable to include the step (S32) of correcting the position error of the electronic component.

According to the present invention having the above structure, a plurality of nozzle spindles are formed on the same circumference around the central shaft and the nozzle spindle and the spool valves are brought into direct contact with the clutch plate to lower the plurality of electronic parts at high speed. Can be adsorbed.

It is also possible for each of the clutch plates to be selectively lowered by a clutch regulating valve, thereby allowing each nozzle spindle to selectively adsorb electronic components or to be mounted on a printed circuit board, and in one head assembly a plurality of Nozzle spindles can simultaneously adsorb parts.

In addition, the air supply line is disposed inside the central shaft without the need for a plurality of valves corresponding to each nozzle to be attached to the outside of the head assembly, thereby reducing the total weight of the head assembly and reducing the size of each head. Modularization of the assembly is possible.

In addition, the controller may correct the suction position error of the component according to the type of the head assembly.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (22)

In a component mounter that absorbs electronic components placed in the component supply unit, moves them to a horizontal moving mechanism, and mounts them on a printed circuit board, A body portion mounted to the horizontal moving mechanism, a central shaft rotatably supported to the body portion, a plurality of nozzle spindles arranged to be able to move up and down on the same circumference about the central shaft, and the nozzle A plurality of nozzle receiving holes for receiving the spindle is formed and coupled to the lower side of the central shaft having a plurality of head assemblies arranged side by side with a rotating housing rotatable in conjunction with the central shaft, In the one head assembly, the spacing between the nozzle spindles arranged to face the center shaft, and the spacing between the nozzle spindles provided in neighboring head assemblies and arranged in a row adjacent to each other, respectively, are the neighboring parts. Component mounting machine, characterized in that the integral multiple of the spacing between the supply center. The method of claim 1, And said head assembly is mounted to said horizontal moving mechanism to be detachable. The method of claim 1, The component mounter is formed in the one rotary housing, characterized in that the distance between the adjacent nozzle receiving holes are all the same. The method of claim 1, On the upper side of the rotary housing provided in the one head assembly is formed a clutch device for selectively lowering the nozzle spindles, The clutch device is: A clutch housing having a plurality of clutch receiving holes corresponding to the nozzle receiving holes, and a shaft hole through which the central shaft penetrates, and capable of rotating and vertically moving; A clutch shaft accommodated in the clutch accommodating hole to be elevated; And And a clutch plate coupled to a lower end of the clutch shaft to selectively lower the one or more nozzle spindles. The method of claim 4, wherein Pistons are inserted into the upper end of each clutch shaft to be in contact with the clutch receiving hole, the upper end of the clutch receiving hole is formed with an air inlet hole in which a constant pressure air flows into the clutch receiving hole above the piston , And a plurality of clutch valves are formed in the head assembly to control whether or not the constant pressure air is introduced into each of the air inlet holes. The method of claim 4, wherein The central shaft is hollow, and has a constant pressure air supply unit for supplying a constant pressure air into the air passage in the inner space, and a negative pressure air supply unit for supplying a negative pressure air into the air passage, Between the central shaft and each nozzle spindle, a positive pressure spool valve and a negative pressure spool valve are formed to connect and shut off the positive and negative pressure air supply units and the air flow path while raising and lowering a predetermined section. The clutch plate may press at least one of the positive pressure spool valve and the negative pressure spool valve to be lowered together with the nozzle spindle, and wherein the nozzle spindle and the negative pressure spool valve are lowered to the nozzle suction position and the spool suction position, respectively. And upper and lower spool flow paths of the positive and negative pressure spool valves connect between the air flow path and the negative pressure air supply unit, and the nozzle spindle and the positive and negative pressure spool valves respectively have the nozzle suction position and the spool suction position. And the lower spool flow paths or the upper spool flow paths of the positive and negative pressure spool valves connect between the air flow path and the constant pressure air supply part. The method of claim 6, The clutch plate includes: a base disposed above the nozzle spindle and positive and negative pressure spool valves; And a recess formed in the base portion to be concave with a radius of curvature greater than that of the constant pressure spool valve, the second phase being rotated at a predetermined angle from the first phase about a first phase and a rotation axis of the clutch housing. , When the clutch plate is disposed on the first phase, the recess is located above the positive pressure spool valve to press the nozzle and the negative pressure spool valve, and when the clutch plate is placed on the second phase, the nozzle spindle and the positive, Component mounting machine characterized in that the negative pressure spool valve can be pressed. The method of claim 7, wherein Each head assembly is provided with a clutch housing drive motor for rotating the clutch housing, The clutch housing driving motor is capable of rotating the clutch housing such that the clutch shaft is in the same first phase as the corresponding nozzle spindle and the second phase rotated at an angle from the first phase. Mounting machine. The method of claim 1, And the nozzle spindles provided in the different head assemblies are simultaneously lowered to simultaneously adsorb electronic components mounted on the component supply units. An electronic component mounting method for adsorbing an electronic component and mounting the electronic component on a printed circuit board as the component mounting apparatus having the structure of claim 1,  A plurality of nozzle spindles are simultaneously lowered in the one head assembly to suck the electronic component from the component supply unit; Moving the absorbed electronic component onto the printed circuit board; And Mounting the absorbed electronic component on a printed circuit board. The method of claim 10, In the step of absorbing the electronic components, the two nozzle spindles provided in one head assembly and installed to face each other with respect to the center shaft are simultaneously lowered to absorb the respective electronic components in at least two or more head assemblies simultaneously. An electronic component mounting method, characterized in that. The method of claim 10, And the center shaft is rotatable at a different speed for each head assembly, thereby simultaneously adsorbing electronic components of different sizes in a nozzle shaft provided in a separate head assembly. A bed having a component supply part for supplying electronic parts and a conveyor part for transporting a printed circuit board; A horizontal moving mechanism installed on the bed; A plurality of head assemblies coupled to the horizontal moving mechanism and having a central shaft and a plurality of nozzle spindles disposed on the same circumference at the center of the central shaft and independently movable up and down; At least one imaging device for collectively photographing all the electronic components adsorbed on the nozzle spindles; And And a controller for acquiring data of the electronic components photographed by the photographing apparatus and correcting a position error of each electronic component based on the data. The method of claim 13, The photographing apparatus is made up of the same number as the number of the head assemblies, and spaced apart from each other by the same distance between the head assemblies between the photographing apparatuses, and each photographing apparatus is attached to the nozzle spindles provided in one head assembly. A component mounter characterized by imaging all electronic components collectively. The method of claim 14, And each of the head assemblies has a recognition mark photographed by the photographing apparatus having a specific shape according to the arrangement of the nozzle spindles. The method of claim 13, The photographing apparatus includes a lens and an image pickup device for recording component image information introduced and picked up through the lens. The control unit may include a storage unit configured to store the set part image data at a reference position of the electronic component mounted on the nozzle spindle according to the arrangement structure of the nozzle spindle and the arrangement structure of the head assembly; And a central processor configured to compare component image data to correct positional errors of the electronic component. The method of claim 13, And the photographing apparatus is a line scan camera. The method of claim 13, And the photographing apparatus is provided on a bed between the parts supply part and the conveyor part. An electronic component mounting method for absorbing an electronic component with a component mounter having the structure of claim 13 and mounting the electronic component on a printed circuit board, Absorbing the electronic component from the component supply unit; Moving the head assembly on which the electronic component is adsorbed onto a photographing apparatus; Photographing the absorbed electronic components in a batch to correct the position of the electronic components; Moving the head assembly absorbing the electronic component onto a printed circuit board; And Mounting the absorbed electronic component on a printed circuit board. The method of claim 19, In the photographing step, the electronic device mounting method characterized in that the one imaging device collectively photographs all the electronic components adsorbed on the nozzle spindles provided in the corresponding head assembly. The method of claim 20, The photographing step includes the step of photographing, by the photographing apparatus, a recognition mark having a specific shape formed according to the arrangement structure of the nozzle spindle for each head assembly. The method of claim 20, The photographing step may include comparing the set part image data storing the reference suction position of the electronic component according to the arrangement structure of the nozzle spindles provided in the one head assembly with the actual captured image data of the electronic component, thereby determining the position of the electronic component. Electronic component mounting method comprising the step of correcting the error.

Images