KR100627054B1 - Head assembly for chip mounter - Google Patents

Abstract

The present invention comprises: a head frame; At least one head shaft coupled across the top and bottom of the head frame; At least one rotating housing having a plurality of nozzle receiving holes formed on the same circumference of the shaft accommodating hole and the head shaft for inserting the head shaft; A plurality of nozzle spindles inserted into and coupled to the nozzle accommodating holes to move up and down from a nozzle standby position to a nozzle insertion and mounting position, the nozzle having a hollow cylinder having an air flow path formed therein and adsorbing electronic components thereon; A constant pressure air supply unit for supplying a constant pressure air into the air passage and a negative pressure air supply unit for supplying negative pressure air into the air passage; A spool valve portion comprising a plurality of spool valves connecting and disconnecting the positive and negative pressure air supply portions and the air flow path while raising and lowering from the spool standby position corresponding to the nozzle standby position and the nozzle occlusion position; A clutch housing having a plurality of clutch accommodating holes corresponding to each nozzle accommodating hole, the clutch housing coupled to an upper side of the rotary housing and the spool valve portion of the head frame to enable rotation and vertical movement; And a plurality of clutch devices having a clutch plate coupled to a lower portion of the clutch shaft and a lower end of the clutch shaft, the clutch plate being capable of selectively lowering the nozzle and at least one spool valve corresponding to the nozzle. Provide a head assembly.

Description

 Head assembly for chip mounter

1 is a cross-sectional view showing a head assembly for a conventional component mounter,

2 is a plan view showing a component mounter having a head assembly according to a preferred embodiment of the present invention,

3 is a perspective view illustrating one side of the head assembly for a component mounter of FIG. 2;

4 is a front view illustrating the front part of FIG. 3;

FIG. 5 is a cross-sectional view of the part of FIG. 3, the constant pressure air supply unit, and respective components connected thereto;

6 is an enlarged perspective view of the clutch housing and the clutch device of FIG. 3;

7A and 7B are plan views showing the relationship between the position of the nozzle spindle and the spool valve positions when the clutch plate of Fig. 6 is in the first phase and the second phase, respectively;

8 is a perspective view showing the spool valve return device of FIG.

FIG. 9 is an exploded perspective view illustrating the head shaft of FIG. 3 and a spool valve unit mounted thereto; FIG.

10 is a perspective view illustrating the clutch housing and the vertical driving device of the clutch housing of FIG.

FIG. 11 is a perspective view illustrating the nozzle housing of FIG. 3 and a nozzle housing rotating mechanism for rotating the nozzle housing; FIG.

12 is a perspective view illustrating the clutch housing of FIG. 3 and a rotation driving device of the clutch housing;

FIG. 13 is a perspective view illustrating the other side of the head assembly for component mounter of FIG. 2;

14A to 14E are cross-sectional views illustrating the mounting and mounting steps of the electronic components of the head assembly for a component mounter according to the present invention.

Explanation of symbols on major parts of partial drawings

100: part mounter 110: head assembly

111: head frame 120: head shaft

130: rotating housing 140: nozzle spindle

140s: air flow path 142: nozzle

150: spool valve portion 151: negative pressure spool valve

151u: Negative pressure upper spool flow path 151b: Negative pressure lower spool flow path

156: constant pressure spool valve 156u: constant pressure upper spool flow path

156b: Positive pressure lower spool flow path 160: Clutch housing

170: clutch device 172: clutch plate

172a: base 172b: recessed portion

181: negative pressure air supply 186: constant pressure air supply

190: spool valve return device 193: air cylinder

195: Returning plate 260: Vertical drive of clutch housing

An: Nozzle Waiting Position As: Spool Waiting Position

Bn: nozzle mounting position Bs: spool mounting position

C: Electronic component P: Printed circuit board

Pc1: First Phase Pc2: Second Phase

The present invention relates to a head assembly for a component mounter, and more particularly, is provided in a component mounter for automatically mounting electronic components such as integrated circuits, diodes, capacitors, resistors, and the like on a printed circuit board. A head assembly for a component mounter, in which a nozzle spindle mounted on a substrate is formed.

The component mounter is a core equipment of the component mounting assembly equipment for mounting a component on a printed circuit board (PCB). The component mounting equipment receives various components from the component supply machine and transfers them to the mounting position of the printed circuit board, and then mounts them on the printed circuit board.

In general, a component mounter includes a component supply unit for supplying mounting components, a conveyor unit for conveying a printed circuit board to be worked on, a head assembly for picking up electronic components from the component supply unit and mounting them on a printed circuit board in order to include a nozzle spindle. It consists of.

Recently, a plurality of electronic components are sequentially or simultaneously adsorbed, the adsorbed plurality of electronic components are simultaneously moved to the conveyor unit, and the electronic components moved to the conveyor unit are sequentially or simultaneously mounted on a printed circuit board to increase the efficiency of component mounting. To this end a plurality of nozzle spindles are installed in the head assembly side by side.

However, the nozzle spindles installed side by side become larger in size, thereby increasing the overall size of the head assembly. Therefore, the number of nozzle spindles installed in the head assembly is limited.

In order to solve this problem, in the head assembly 10 provided in the component mounter disclosed in Japanese Patent Laid-Open No. 2003-273582, as shown in Fig. 1, the nozzle spindle 50 is formed on the same circumference with respect to the spline shaft 35. A plurality of phases are provided.

That is, the spline shaft 35 is formed in the head frame 20 provided in the head assembly 10 over the top and bottom. The nozzle holder 40 is coupled to the spline shaft 35, and the nozzle spindles 50 are disposed on the same circumference about the spline shaft 35 of the nozzle holder 40 so as to move upward and downward.

The nozzle spindle 50 is installed to be elevated. In addition, the spline shaft 35 rotates according to the driving of the nozzle rotation motor 60, and thus the nozzle holder 40 and the nozzle spindle 50 coupled to the spline shaft 35 are installed to rotate.

Meanwhile, in order for the nozzle spindles 50 to be separately selected and lowered, the head assembly 10 is provided with a nozzle selecting mechanism 70 and a nozzle raising mechanism 80. The nozzle selection mechanism 70 includes a compressed air supply chamber 71 and a nozzle selection valve 72, and injects compressed air into the pressurized air supply chamber 32 corresponding to the nozzle spindle 50 selected downward. In this case, the pressurized air supply chamber 32 may be coupled to the head frame and connected to the nozzle spindle 50 as a space in the air cylinder block 30 disposed above the nozzle holder 40, respectively.

Therefore, when the positive pressure air flows into the pressurized air supply chamber disposed above the selected nozzle spindle 50, the piston 52 formed in the pressurized supply chamber and the air cylinder shaft 53 coupled to the lower side of the piston descend, The lower end portion 53a of the air cylinder shaft 53, the upper end portion 50a of the nozzle spindle joined to the lower end portion 53a, and the upper surface portion 85a of the step portion 85a of the spline nut 85 are in the same height position. Thus, the air cylinder shaft 53, the nozzle spindle 50, and the spline nut 85 are integrated. Here, the spline nut 85 is moved up and down by being coupled with the nozzle lifting mechanism 80 having the cam follower 84, the eccentric cam 82, and the drive motor 81, and thus the spline nut 85. The nozzle spindle 50 coupled with the lowers.

In addition, in order to adsorb the electronic components, a vacuum suction device 90 is provided, in which negative pressure air from the outside is supplied with negative pressure air from the negative pressure air supply chamber 91 to the outside of the nozzle holder 40. The nozzle spindle 50 is individually sucked by the electronic component by being provided in the nozzle spindle 50 by the installed valves 92.

Such a revolver-type head assembly has a merit that it can mount a large number of electronic components while occupying a small size. However, the conventional head assembly 10 for a component mounter having such a structure has a nozzle raising mechanism provided with an eccentric cam 82, a cam follower 84, and a spline nut 85 to lower the nozzle spindle 50. By providing 80, the lifting mechanism becomes complicated, and the weight of the head assembly 10 becomes large, resulting in a high speed drop.

In addition, since the spline nut 85 is always raised and lowered to a constant height inside the head assembly 10, the flexibility of raising and lowering strokes with respect to the change in the part thickness is inferior.

In addition, since the suction valve 92 of the electronic component is attached to the nozzle holder by the number of the nozzle spindles 50, the total weight of the head assembly is excessive and occupies a lot of space, making it difficult to cope with various working environments.

The present invention is to solve a variety of problems including the above problems, a plurality of nozzle spindle is made of a revolver shape, and can absorb and mount the electronic components at high speed, and can absorb and mount a large number of electronic components An object of the present invention is to provide a head assembly for a component mounter.

It is still another object of the present invention to provide a head assembly for a component mounter having a structure in which a nozzle lifting mechanism for lowering a nozzle spindle is simple, and a small number of components are used to reduce the total weight and increase the speed. .

In order to achieve the above object, the head assembly for a component mounter according to a preferred embodiment of the present invention is a head frame, a head shaft, a rotating housing, a plurality of nozzle spindles, a constant pressure air supply, a negative pressure air supply And a spool valve portion, a clutch housing, and a clutch device.

The head shaft is coupled over the top and bottom of the head frame and at least one. In the rotary housing, a plurality of nozzle receiving holes are formed on the same circumference of the shaft accommodating hole for inserting the head shaft and the head shaft, and at least one or more are disposed in one head frame. The nozzle spindle is a hollow cylinder in which an air flow path is formed in the inner space, and a nozzle for adsorbing electronic components is coupled to the lower portion, and the nozzle spindle is inserted and coupled to the nozzle accommodating hole to enable vertical movement of the nozzle spindle from the nozzle standby position. A constant pressure air supply part supplies a constant pressure air into the said air flow path. A negative pressure air supply part supplies negative pressure air into the said air flow path. The spool valve portion includes a plurality of spool valves for connecting and disconnecting the positive and negative pressure air supply portions and the air flow path while raising and lowering from the spool standby position corresponding to the nozzle standby position and the nozzle suction position. Is done. The clutch housing has a plurality of clutch receiving holes corresponding to the respective nozzle accommodation holes, and is coupled to the upper side of the rotary housing and the spool valve portion of the head frame to enable rotation and vertical movement. The clutch device includes a plurality of clutch plates that are coupled to a lower end of the clutch shaft and the clutch plate accommodated in the clutch receiving hole so as to selectively lower the nozzle and at least one spool valve corresponding to the nozzle. Is done.

In this case, a piston inserted in contact with the clutch receiving hole is formed at the upper end of each of the clutch shafts, and an air inlet hole into which the constant pressure air flows into the clutch receiving hole at the upper side of the piston is formed at the upper end of the clutch receiving hole. It is preferable that the head frame is formed with a plurality of clutch valves for controlling whether or not the constant pressure air flowing into the respective air inlet hole.

In addition, the spool valve portion is composed of a positive pressure spool valve and a negative pressure spool valve formed with an upper spool flow path and a lower spool flow path, respectively, and the clutch plate selects at least one of the positive pressure spool valve and the negative pressure spool valve in the spool standby position. And the nozzle spindle to be lowered to the spool fitting position, and when the nozzle spindle and the negative pressure spool valve are lowered to the nozzle fitting position and the spool fitting position, respectively, upper spools of the positive and negative pressure spool valves. The positive and negative pressure spool valves when the flow paths or the lower spool flow paths connect the air flow path and the negative pressure air supply part, and the nozzle spindle and the positive and negative pressure spool valves are respectively lowered to the nozzle, spool and the spool suction and mounting positions. Lower spool flow paths or upper spool flow paths are provided with the air flow path and the constant pressure air supply. It is desirable to connect the liver.

In this case, when the nozzle spindle and the negative pressure spool valve are lowered to the nozzle suction position and the spool suction position, the upper spool flow paths of the positive and negative pressure spool valves are connected to the air flow path and the negative pressure air supply part, and the nozzle When the spindle and the positive and negative pressure spool valves are lowered to the nozzle suction position and the spool suction position, it is preferable that the lower spool flow paths of the positive and negative pressure spool valves connect between the air passage and the constant pressure air supply portion.

Here, the clutch plate comprises: a base disposed above the nozzle spindle and positive and negative pressure spool valves; And a concave portion formed concave at the base portion with a radius of curvature larger than that of the constant pressure spool valve, and disposed with a first phase and a second phase rotated at a predetermined angle from the first phase about an axis of rotation of the clutch housing. And when the clutch plate is disposed on the first phase, the recess is positioned above the positive pressure spool valve to press the nozzle and the negative pressure spool valve, and when the clutch plate is disposed on the second phase, the nozzle spindle and the positive Preferably, the negative pressure spool valve can be pressed.

On the other hand, it is preferable to further provide a nozzle return spring for arranging the nozzle spindle in the nozzle standby position when no force is applied from the clutch device.

On the other hand, the head frame is coupled to the head shaft drive motor for rotating the head shaft, the rotary housing is preferably rotated in conjunction with the rotation of the head shaft.

In addition, the head frame is provided with a clutch housing driving motor for rotating the clutch housing, the clutch housing driving motor is rotated at a predetermined angle from the first phase and the first phase and the same phase as the nozzle spindle corresponding to the clutch shaft. Preferably, the clutch housing can rotate in a second phase.

In addition, the head frame is coupled to the clutch housing vertical drive device for vertically moving the clutch housing, the clutch housing vertical drive device comprises: a Z-axis drive motor; Drive transmission means for changing the rotational driving force of the Z-axis driving motor to a vertical motion driving force; And a Z-axis housing moving up and down along the drive transmission means and coupled to the clutch housing.

On the other hand, a spool valve return device for raising the spool valve part to the spool standby position is formed below the spool valve part, and the spool valve return device is: below the spool valves corresponding to the one nozzle spindle as hollow. A plurality of air cylinders each formed and supplied with compressed air from an external compressed air supply unit; A return plate coupled to the upper side of the air cylinder and configured to raise the spool valves to the spool standby position when compressed air is supplied to the air cylinder; And an elastic member that is combined with the return plate and lowers the return plate to the spool storage position when compressed air is not supplied to the air cylinder.

Preferably, the head shaft has a hollow cylindrical shape, and the positive pressure air supply part and the negative pressure air supply part are respectively formed in the head shaft internal space and connected to the air flow path of the nozzle spindle.

Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings. A component mounter 100 having a component assembly head assembly 110 according to a preferred embodiment of the present invention is shown in FIG. 2.

Referring to FIG. 2, the component mounter 100 including the head assembly 110 according to an embodiment of the present invention includes a base 101, a head assembly 110, an X-axis actuator 103, Y-axis actuator 104 is provided. The base 101 includes a component supply unit 102 for supplying electronic components, and a conveyor 105 for transferring the printed circuit board P in the X-axis direction.

The head assembly 110 is mounted to the X-axis operating mechanism 103. The head assembly 110 includes a plurality of nozzle spindles 140, the nozzle spindles 140 picking up electronic components from the component supply unit 102, and a printed circuit board disposed on the conveyor 105. Mount on P).

The head assembly 110 is horizontally moved by the X and Y axis actuators 103 and 104. As an example, as shown in FIG. 2, the head assembly 110 may be coupled to the X-axis actuator 103 so as to be horizontally moved along the X-axis actuator 103. In this case, both ends of the X-axis actuating mechanism 103 are mounted to the Y-axis actuating mechanism 104 formed orthogonal to the X-axis actuating mechanism 103 so as to be movable horizontally. Therefore, when the X-axis operating mechanism 103 is moved along the Y-axis operating mechanism 104, the head assembly 110 mounted on the X-axis operating mechanism 103 is moved horizontally in the Y-axis direction. In addition, the head assembly 110 is horizontally moved in the X-axis direction along the X-axis operating mechanism 103.

3 shows a head assembly 110 according to a preferred embodiment of the present invention, which is provided in the component mounter 100 having such a structure, and FIG. 4 is a front view of the head assembly 110 shown in FIG. 3. It is. 3 and 4, the head assembly 110 according to the present invention includes a head frame 111, a head shaft 120, a rotation housing 130, a nozzle spindle 140, and a spool valve unit. 150, a clutch housing 160, and a plurality of clutch devices 170.

The head shaft 120 is mounted to the head frame 111. The head shaft 120 is disposed up and down.

A cylindrical rotary housing 130 is coupled to the lower side of the head shaft 120. A shaft accommodating hole 131 is formed in the center portion of the rotary housing 130 so that the lower side of the head shaft 120 is inserted into the shaft accommodating hole 131.

A plurality of nozzle accommodating holes 132 are formed on the same circumference around the shaft accommodating hole 131, and a nozzle spindle 140 capable of elevating is inserted into each of the nozzle accommodating holes 132. In this case, the nozzle spindle 140 is positioned at the nozzle standby position An except when the nozzle spindle 140 is lowered to adsorb or mount the electronic component C, and the nozzle insertion and mounting position Bn is a position at which the electronic component is adsorbed or mounted. Can descend to.

At least a lower inside of the nozzle spindle 140 has an empty cylindrical shape, and an air flow path 140s is formed in the hollow inner space, and a nozzle 142 for adsorbing the electronic component C is coupled to the lower portion of the nozzle spindle 140.

In this case, it is preferable that the nozzle return spring 145 is formed outside or inside the nozzle spindle 140, whereby the nozzle spindle 140 receives a force above the elastic force of the nozzle return spring 145 from above. This is because only the lowering, and the lowered nozzle spindle 140 can return to the nozzle standby position An when the force greater than the elastic force of the nozzle return spring 145 is removed.

On the other hand, the air flow path 140s of the nozzle spindle 140 is connected to the negative pressure air supply unit 181 and the constant pressure air supply unit 186. The negative pressure air supply unit 181 functions to supply negative pressure air into the air passage 140s of the nozzle spindle 140 so that the nozzle 142 sucks the electronic component C. The supply unit 186 supplies a constant pressure air into the air flow path 140s of the nozzle spindle to mount the electronic component C on the printed circuit board P (see FIG. 2) at the nozzle 142. Function

In this case, as shown in FIG. 5, the head shaft 120 is a hollow cylinder, and a negative pressure air supply part 181 and a constant pressure air supply part 186 are formed in the space inside the head shaft 120 so that the nozzle spindle It is formed to be connected to the air flow path (140s).

As a result, since the positive and negative air supply parts 181 and 186 are rotated close to the rotation shaft 130x of the rotary housing 130 without being exposed to the outside, the size of the parts exposed to the outside is reduced, so that the entire head assembly ( The weight and size of 110) is reduced. In addition, since the positive and negative pressure air supply units 181 and 186 do not interfere with other components of the head assembly 110, stable air supply is possible.

Corresponding to each nozzle spindle 140, a plurality of air passages 140s and a negative pressure air supply unit 181 in the nozzle spindle 140 and a plurality of air passages 140s and a constant pressure air supply unit 186 in the nozzle spindle. The spool valve portion 150 consisting of spool valves is disposed. The spool valve unit 150 connects or disconnects between the air passage 140s and the constant pressure air supply unit 186 or between the air passage 140s and the negative pressure air supply unit 181 while being elevated.

4 to 6, the clutch housing 160 is disposed above the rotary housing 130 and the spool valve unit 150. The clutch housing 160 is provided with a plurality of clutch receiving holes 162 corresponding to the nozzle spindles 140, respectively.

The clutch device 170 is accommodated in each of the clutch receiving holes 162. This clutch device 170 includes a clutch shaft 171 and a clutch plate 172. The clutch shaft 171 is accommodated in the clutch accommodating hole 162 so as to be lifted and lowered. A clutch plate 172 is formed below the clutch accommodating hole 162, and the clutch plate 172 is disposed above the spool valve unit 150 corresponding to the nozzle spindle 140 and the nozzle spindle 140. As a result, the upper end of the selected spool valve of the spool valve unit 150 together with the nozzle spindle 140 may be lowered.

Here, as shown in FIG. 5, an upper end of each clutch shaft 171 is formed with a clutch piston 173 inserted into contact with the clutch receiving hole 162, and the clutch housing 160 has the clutch. An air inlet hole 165 is formed between the upper end of the accommodating hole 162 and the air supply unit, and the air of the positive pressure flows into the clutch accommodating hole 162 above the piston through the air inlet hole 165. It is preferable to be.

In this case, a plurality of clutch valves 116 (see FIG. 13) are formed in the head frame 111 to control whether or not positive pressure air flowing into the respective air inlet holes 165 is introduced, and the clutch valve 116 is provided. One or more nozzle spindles 140 for adsorbing the electronic component C may be selected by precise control of.

Accordingly, the clutch plate 172 lowered by the clutch valve 116 is lowered to press the at least one or more spool valves of the spool valve unit 150 disposed below the clutch plate 172 so that the spool valve is sucked up. It descends to the mounting position Bs.

On the other hand, the air inlet hole 165 formed in the clutch housing 160 is preferably connected to the constant pressure air supply 181. That is, the positive pressure air supply unit 186 preferably serves to lower the clutch device 170 in addition to the function of mounting the electronic component (C) on the printed circuit board (P), thereby reducing the number of components This is because overall size and weight are reduced, and manufacturing costs are reduced.

In the head assembly 110 of the present invention, the spool valve unit 150 corresponding to one nozzle spindle is preferably composed of a negative pressure spool valve 151 and a constant pressure spool valve 156. That is, two spool valves of the negative pressure spool valve 151 and the positive pressure spool valve 156 may be connected to the air flow path 140s of the unit nozzle spindle 140. In this case, as shown in FIG. 5, The negative pressure spool valve 151 and the positive pressure spool valve 156 are respectively formed with upper spool flow paths 151u and 156u and lower spool flow paths 151b and 156b, in which case one clutch plate 172 has one nozzle spindle. The negative pressure spool valve 151 and the positive pressure spool valve 156 corresponding to the nozzle spindle 140 together with the 140 are preferably disposed to be selectively pushed downward.

That is, referring to FIGS. 5 and 6, when only the negative pressure spool valve 151 is lowered among the spool valves in the spool standby position As together with the nozzle spindle 140 in the nozzle standby position An, The upper spool flow passage 156u of the positive pressure spool valve and the upper spool flow passage 151u of the negative pressure spool valve connect the air flow passage 140s and the negative pressure air supply 181 to generate negative pressure in the nozzle spindle 140. Thus, the nozzle is attracted to the electronic component by the pressure difference between the lower air outside the nozzle 142 and the air in the nozzle.

On the contrary, when the nozzle spindle 140 is lowered to the nozzle suction position Bn, and together with the negative pressure spool valve 151, the positive pressure spool valves 156 are lowered to the spool suction position Bs. The lower spool flow path 156b of the positive pressure spool valve and the lower spool flow path 151b of the negative pressure spool valve are connected between the air flow path 140s and the constant pressure air supply 186 to thereby provide a positive pressure in the nozzle spindle 140. As a result, air flows out of the lower side of the nozzle 142 and as a result, the electronic component C adsorbed by the nozzle can be mounted on the printed circuit board P (see FIG. 2).

In this case, as shown in FIGS. 7A and 7B, the clutch plate 172 has a base 172a and a recess 172b to selectively press the negative pressure spool valve 151 and the constant pressure spool valve 156. It is formed to be. The base 172a is formed to press the parts corresponding to the nozzle spindle 140 and the positive pressure spool valves 151 and 156 together with the nozzle spindle 140. The concave portion 172b formed concave from the base portion 172a has a radius of curvature α greater than that of the positive pressure spool valve 156 and is formed to concave at the base portion 172a so that the negative pressure spool valve when the clutch plate descends. One of 151 and the constant pressure spool valve 156 is not pressed.

In addition, it is preferable that the clutch plate 172 has a first phase Pc1 and a second phase Pc2 about the rotation shaft of the clutch shaft 171 or the clutch housing 160.

When the clutch plate 172 is located in the first phase Pc1, as shown in FIG. 7A, the clutch plate 172 is arranged to press the nozzle spindle 140 and the negative pressure spool valve 151. That is, the recessed part 172b is formed in the upper part of the static pressure spool valve 156, and when the clutch device 170 descends, the positive pressure spool valve 156 does not become pressed by the base part 172a, and descends, You will not.

Alternatively, as shown in FIG. 7B, the clutch plate 172 rotates at an angle, for example, 5 ° to 15 °, about the rotation shaft of the clutch shaft 171 or the rotating housing in the first phase Pc1. When located in the second phase Pc2, the recess 172b is not disposed directly above the positive pressure spool valve 156, so that the base 172a is disposed in the nozzle spindle 140 and the negative pressure spool valve 151. And the positive pressure spool valve 156, the clutch plate 172 is arranged to press the nozzle spindle 140, the negative pressure spool valve 151 and the constant pressure spool valve 156.

Referring to FIG. 8, the spool valve unit 150 is disposed between the head shaft 120 and the nozzle spindle 140. In particular, the head shaft 120 and the rotary housing 130 are provided with a connecting passage Rc for connecting the air flow passage 140s in the nozzle spindle and the negative air supply portions 181 and 186, and the spool valve portion ( It is preferable that 150 is formed to cross the connecting passage (Rc), thereby opening and closing the connecting passage (Rc) while the spool valve unit 150 is raised and lowered, the constant pressure air supply (181, 186) and the nozzle spindle ( The air flow paths 140s in the 140 may be connected and blocked.

On the other hand, after the spool valve unit 150 is lowered and the electronic component adsorbed to the nozzle 142 is mounted on the printed circuit board, the spool valve unit 150 in the lowered state is moved by the spool valve return device 190. It is preferable to automatically return to the spool reference position As, because it is possible for the next electronic component adsorption step to proceed quickly.

In this case, the spool valve return device 190 preferably includes air cylinders 193, return plate members 195, and an elastic member 194. The air cylinders 193 are hollow and formed under the spool valve unit 150 corresponding to the one nozzle spindle 140, respectively, and have a structure in which compressed air can be supplied from the outside. In this case, the compressed air is introduced through the compressed air supply unit 191 formed in the head shaft inner space.

On the upper side of the air cylinder 193, the return plate 195 is coupled while contacting the air cylinder 193. When the return plate 195 is supplied with compressed air to the air cylinder 193, the return plate 195 is raised in contact with the spool valve unit 150 by the pressure from the air cylinder 193, and thus the spool valve unit ( 150) to the spool standby position As.

In this case, the return plate 195 is coupled to the elastic member 194. The elastic member 194 functions to lower and return the raised return plate 195, for example, the elastic member 194 is coupled to the lower side of the return plate 195 as a spring having a unidirectional elastic bias. While being inserted into the air cylinder 193. Therefore, when compressed air having a pressure greater than the elastic force of the spring is introduced into the air cylinder 193, the return plate 195 is raised. When the compressed air is not introduced into the air cylinder 193, the elevated return plate 195 is increased. ) Is lowered to the return position by the elastic force of the spring.

Here, as shown in FIG. 9, the negative and positive pressure spool valves 151 and 156 are connected to the head shaft 120 between the air passage 140s in the nozzle spindle and the negative and constant air supply lines 183 and 188. The head shaft 120 is formed to be inserted, and the spool valve holes 125 to which the sub-constant pressure spool valves 151 and 156 are inserted are preferably formed.

In this case, it is preferable that the friction member 126 is attached to the side surfaces of the spool valve holes 125. The friction member 126 is fixed to prevent the spool valve unit 150 from being lowered even by its own gravity when the pressing force from the clutch plate 172 does not occur. Therefore, the friction member 126, for example, may be made of a synthetic resin material excellent in friction, or may be made of a hard sponge material.

Meanwhile, as in FIG. 10, the clutch housing 160 is driven by the clutch housing vertical drive device 260. The clutch housing vertical drive device 260 includes a Z-axis drive motor 261, a drive transmission means 262, and a Z-axis housing 268. The Z-axis drive motor 261 fixed to the head frame 111 is connected to the drive transmission means 262.

The drive transmission means 262 changes the driving force of the Z-axis drive motor 261 to the vertical movement drive force. That is, the drive transmission means 262 is a drive gear 263 formed on the same axis as the Z-axis drive motor 261, the driven gear 265 is connected to the drive gear 263 and the timing belt 264 and It is preferable to have a ball screw 266 connected to the driven gear 265 and formed up and down, and an LM guide 267 disposed parallel to both sides of the ball screw 266. In this case, the Z-axis housing 268 is coupled to the clutch housing 160 and moves up and down along the ball screw 266 and the LM guide 267, thereby allowing the clutch housing 160 to be elevated. .

On the other hand, as shown in Figure 11, the head frame 111 (see Fig. 4) is coupled to the head shaft drive motor 221 for rotating the head shaft 120, the rotary housing 130 is the head shaft It is preferable to rotate in conjunction with the rotation of (120).

An example of the head shaft rotating structure 220 will be described in detail with reference to FIG. 11. The head shaft driving motor 221 is attached to the head frame 111 (see FIG. 4). The head drive gear 223 disposed on the same rotation shaft as the head shaft drive motor 221 and interlocks is connected to the head driven gear 225 by the timing belt 224. The head driven gear 225 is coupled to the upper end of the head shaft 120, so that the head shaft 120 rotates in conjunction with the rotation of the head driven gear 225.

The lower end of the head shaft 120 is coupled to the rotary housing 130. Therefore, the rotation housing 130 is rotated in conjunction with the rotation of the head shaft 120.

The head shaft 120 and the rotary housing 130 are preferably provided with a bearing 227 at a point in contact with the head frame 111 to enable a stable rotation.

In this case, the nozzle spindle 140 revolves in the nozzle accommodating hole 132, and in order to secure the degree of rotation of the head shaft 120 according to the error, the nozzle spindle 140 rotates outside the head shaft driving motor 221. An encoder (not shown) is preferably installed.

Meanwhile, as shown in FIG. 12, the clutch housing 160 should be rotated so that each clutch shaft 171 that cooperates with the clutch housing 160 has the same phase as the nozzle spindle 140. To this end, the clutch rotary driven gear 275 connected to the clutch rotary driving gear 273 which cooperates with the clutch rotary motor 271 is rotated in accordance with the driving of the clutch rotary motor 271. In this case, it is preferable that the clutch shaft 171 rotates in synchronism with the nozzle spindle 140 at the bottom thereof. For this purpose, the clutch rotation driving gear 273 and the clutch rotation driven gear 275 rotate. The ratio is properly adjusted, the clutch rotary drive gear 273 and the clutch rotary driven gear 275 are interlocked by the timing belt 274, and an AC motor can be used as the clutch rotary motor 271.

  Meanwhile, as shown in FIG. 13, the head frame 111 may further include an imaging device 115. The imaging device 115 is a line scan camera or an area camera, and functions to photograph an optical mark on a printed circuit board so that the electronic component is mounted at the correct position on the printed circuit board. In addition, the imaging device 115 may capture an image of the electronic component adsorbed by the nozzle using a mirror or the like.

Hereinafter, the operation of the head assembly of the component mounter having such a structure will be described with reference to FIGS. 14A to 14E. First, as shown in FIG. 14A, the negative, constant pressure spool valves 151 and 156 and the nozzle spindle 140 are respectively disposed at the spool standby position As and the nozzle standby position An, in this case, the constant pressure air. The supply part 186 and the negative pressure air supply part 181 and the air flow path 140s in the nozzle spindle 140 are not connected. In this case, the clutch plate 172 is disposed to be spaced apart from the nozzle spindle 140, the upper portion, the positive pressure spool valves 151, 156, the return plate 195 is the nozzle spindle 140 and , In the spool fitting position Bs below the spool valves.

Thereafter, as shown in FIGS. 5, 7A, and 14B, the recess 172b of the clutch plate 172 so that the nozzle 142 sucks the electronic component C disposed in the component supply part 102. The temporary pressure spool valve 156 is disposed to have a first phase Pc1 located above. Then, the positive pressure air is introduced into the clutch receiving hole 182 corresponding to the suction-selected nozzle spindle 140, and the clutch plate 172 inserted below the clutch receiving hole is lowered to lower the nozzle spindle 140 and the negative pressure spool. The valve 151 is pressed. In this case, since the recessed portion 172b is disposed outside the constant pressure spool valve 156 and lowered, the constant pressure spool valve 156 does not come into contact with the clutch plate 172 and does not fall.

When the clutch plate 172 lowers the nozzle spindle 140 and the negative pressure spool valve 151 to the nozzle suction position Bn and the spool suction position Bs, respectively, the upper spool flow path of the positive pressure spool valve 156 ( 156u and the upper spool flow path 151u of the negative pressure spool valve are connected to each other, and the upper spool flow paths 151u and 156u connect the negative pressure air supply 181 and the air flow path 140s in the nozzle spindle. Therefore, negative pressure air flows into the nozzle spindle 140, and the nozzle 142 adsorbs the electronic component C.

After the nozzle 142 has adsorbed the electronic component C, the clutch plate 172 is raised as shown in Fig. 14C. In this case, the nozzle spindle 140 is raised to the nozzle standby position An by the elastic force of the nozzle return spring 145. In contrast, the negative pressure spool valve 151 is not raised and is formed on the side of the spool valve receiving hole. The friction member 125 (see Fig. 9) is fixed to the spool storage mounting position Bs. Therefore, the nozzle spindle 140 is raised while the electronic component C is adsorbed, and is moved by the X and Y axis operating mechanisms to the mounting position of the printed circuit board. At this time, the imaging device photographs the physical mark on the printed circuit board and corrects it to the correct mounting position.

After the nozzle spindle 140 is moved on the printed circuit board P, the clutch plate 172 is lowered again, as shown in FIG. 14E. At this time, the clutch plate 172 is rotated from the first phase Pc1 to the second phase Pc2 point. Accordingly, the clutch plate 172 lowers the positive pressure spool valve 156 together with the nozzle spindle 140, which causes the positive pressure spool valve 156 and the negative pressure spool valve 151 to have the same spool storage position Bs. ).

At this time, the lower spool valve 156b of the positive pressure spool valve and the lower spool valve 151b of the negative pressure spool valve are connected to each other, and the lower spool valves 151b and 156b are connected to the constant pressure air supply 186 and the air in the nozzle spindle. The flow paths 140s are interconnected, so that a constant pressure air flows into the nozzle spindle 140. Therefore, the electronic component C absorbed by the nozzle is separated and mounted on the printed circuit board P. FIG.

Thereafter, as shown in FIG. 14E, the negative pressure spool valve 151 and the constant pressure spool valve 156 in contact with the upper side of the return plate 195 are driven by the spool valve returning device 190. ), And then the return plate 195 is returned to its original position by the elastic member 194.

According to the present invention having the above structure, a plurality of nozzle spindles are formed on the same circumference around the head shaft, and the nozzle spindle and the spool valves are brought into direct contact with the clutch plate to lower the plurality of electronic components at high speed. Can be adsorbed.

In addition, each of the clutch plates can be selectively lowered by the clutch regulating valve, so that the respective nozzle spindles can be selectively attached to the electronic component or mounted on the printed circuit board.

Furthermore, the air supply line is arranged inside the head shaft so that a plurality of valves corresponding to each nozzle do not need to be attached to the outside of the head assembly in order to introduce negative pressure air into the nozzles to attract the electronic components. The total weight of the assembly is reduced and its size is reduced, making it easy to cope with various working environments.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (13)

Head frame; At least one head shaft coupled over the top and bottom of the head frame; At least one rotating housing in which a plurality of nozzle receiving holes are formed on the same circumference of the shaft accommodating hole for inserting the head shaft and the head shaft, respectively; A plurality of nozzle spindles coupled to the nozzle accommodating holes such that a nozzle for adsorbing electronic components is coupled to the lower portion of the hollow cylindrical body having an air flow path formed therein and capable of moving up and down from the nozzle standby position to the nozzle suction and mounting position; A positive pressure air supply unit for supplying a constant pressure air into the air passage and a negative pressure air supply unit for supplying negative pressure air into the air passage; A spool valve comprising a plurality of spool valves for connecting and disconnecting the positive and negative pressure air supply units and the air flow path while raising and lowering from the spool standby position corresponding to the nozzle standby position and the nozzle suction position; part; A clutch housing having a plurality of clutch accommodation holes corresponding to the nozzle accommodation holes, the clutch housing being coupled to an upper side of the rotary housing and the spool valve of the head frame to enable rotation and vertical movement; And A plurality of clutches having a clutch shaft accommodated in the clutch accommodation hole and a clutch plate coupled to a lower end of the clutch shaft to selectively lower the nozzle spindle and at least one spool valve corresponding to the nozzle spindle; Head assembly for component mounter having devices. The method of claim 1, The upper end of each clutch shaft is formed with a piston inserted in contact with the clutch receiving hole, the upper end of the clutch receiving hole is formed with an air inlet hole in which constant pressure air flows into the clutch receiving hole above the piston, And a plurality of clutch valves are formed in the head frame to control whether or not the constant pressure air is introduced into each of the air inlet holes. The method of claim 1, The spool valve unit is composed of a positive pressure spool valve and a negative pressure spool valve formed with an upper spool flow path and a lower spool flow path, respectively, The clutch plate may press at least one of the positive pressure spool valve and the negative pressure spool valve to descend from the spool standby position to the spool suction position, optionally with the nozzle spindle, When the nozzle spindle and the negative pressure spool valve are lowered to the nozzle suction position and the spool suction position, respectively, upper and lower spool flow paths of the positive and negative pressure spool valves connect the air flow path and the negative pressure air supply part. and, When the nozzle spindle and the positive and negative pressure spool valves are lowered to the nozzle suction position and the spool suction position, respectively, the lower spool passages or the upper spool passages of the positive and negative pressure spool valves are disposed between the air passage and the constant pressure air supply part. Head assembly for component mounter, characterized in that for connecting. The method of claim 3, wherein When the nozzle spindle and the negative pressure spool valve are lowered to the nozzle suction position and the spool suction position, the upper spool flow paths of the positive and negative pressure spool valves are connected to the air flow path and the negative pressure air supply part, When the nozzle spindle and the positive and negative pressure spool valve is lowered to the nozzle suction position and the spool suction position, the lower spool flow paths of the positive and negative pressure spool valves connect between the air flow path and the constant pressure air supply. Head assembly for mounting parts. The method of claim 3, wherein The clutch plate includes: a base disposed above the nozzle spindle and positive and negative pressure spool valves; And a concave portion formed concave at the base portion with a radius of curvature larger than that of the constant pressure spool valve, and disposed with a first phase and a second phase rotated at a predetermined angle from the first phase about an axis of rotation of the clutch housing. , When the clutch plate is disposed on the first phase, the recess is located above the positive pressure spool valve to press the nozzle and the negative pressure spool valve, And the nozzle spindle and the positive and negative pressure spool valves can be pressed when the clutch plate is disposed on the second phase. The method of claim 1, And a nozzle return spring for placing the nozzle spindle in the nozzle standby position when no force is applied from the clutch device. The method of claim 1, The head frame is coupled to the head shaft drive motor for rotating the head shaft, The rotating housing is a head assembly for a component mounter, characterized in that the rotation in conjunction with the rotation of the head shaft. The method of claim 1, The head frame is provided with a clutch housing drive motor for rotating the clutch housing, The clutch housing driving motor may rotate the clutch housing in a first phase in which the clutch shaft is the same as the nozzle spindle corresponding thereto and in a second phase in which the clutch shaft rotates at an angle from the first phase. Head assembly. The method of claim 1, The head frame is coupled to the clutch housing vertical drive device for vertically moving the clutch housing, The clutch housing vertical drive device includes: a Z-axis drive motor; Drive transmission means for changing the rotational driving force of the Z-axis driving motor to a vertical motion driving force; And a Z-axis housing configured to move up and down along the driving transmission means and coupled to the clutch housing. The method of claim 1, A spool valve return device for raising the spool valve portion to the spool standby position is formed below the spool valve portion. The spool valve return device comprises: a plurality of air cylinders each formed under the spool valves corresponding to the one nozzle spindle as hollow and supplied with compressed air from an external compressed air supply; A return plate coupled to the upper side of the air cylinder and configured to raise the spool valves to the spool standby position when compressed air is supplied to the air cylinder; And an elastic member which is combined with the return plate and lowers the return plate to the spool storage position when compressed air is not supplied to the air cylinder. The method of claim 10, And the compressed air supply unit is disposed along an inner space on the head shaft. The method of claim 1, The head shaft is hollow cylindrical, And the positive pressure air supply unit and the negative pressure air supply unit are disposed in the head shaft internal space. The method of claim 1, The head shaft is formed with spool valve holes into which the spool valves are inserted, A part of the side of the spool valve holes, the head assembly for the component mounter, characterized in that the friction member is in contact with the side of the spool valves to prevent the spool valve is lowered by gravity.

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