KR20070011735A - Plasma display device - Google Patents

Abstract

A plasma display device is provided to suppress deformation of a cover plate due to external shock by reinforcing a structure of the cover plate. A plasma display panel(11) is attached to one side of a chassis base(17). A printed circuit board assembly is installed at the other side of the chassis base. A driver IC package includes a driver IC for generating a pulse which is selectively supplied to an electrode of the plasma display panel. The driver IC package is connected with the printed circuit board assembly. The driver IC package is installed in the chassis base. A cover plate(31) is installed at the chassis base in order to cover the driver IC package. The cover plate includes a projection(33) which is projected to an end of the chassis base.

Description

Plasma display device {PLASMA DISPLAY DEVICE}

1 is a perspective view of a plasma display device according to an embodiment of the present invention.

2 is a cross-sectional view taken along the line A-A of FIG.

3 is a cross-sectional view taken along the line B-B of FIG. 1.

Figure 4 is a partial perspective view showing the inner side of the cover plate according to an embodiment of the present invention.

5 is a partially exploded perspective view illustrating a coupling relationship between a chassis base, a reinforcing member, a driver IC package, and a cover plate according to an exemplary embodiment of the present invention.

FIG. 6 is a partially exploded perspective view illustrating a combined relationship between the chassis base, the reinforcing member, the driver IC package, and the cover plate in FIG. 5.

FIG. 7 is a cross-sectional view taken along the line C-C of FIG. 3.

The present invention relates to a plasma display device.

In general, a plasma display device is an apparatus for displaying an image on a plasma display panel (hereinafter, referred to as a 'PDP') using plasma generated by gas discharge.

The plasma display device includes a PDP for realizing an image, a chassis base for supporting the PDP, and a display electrode or address disposed inside the PDP through a flexible printed circuit and a connector installed on the chassis base facing the PDP. And a case surrounding the PDP, the chassis base, and the circuit board assembly to form an exterior of the plasma display device.

The PDP generally seals two glass substrates face to face and forms discharge cells therein.

PDP is a display panel that realizes an image by exciting phosphors by vacuum ultraviolet rays caused by gas discharge in a discharge cell, and has excellent display capacity, brightness, contrast, viewing angle, and the like. .

In addition, since the PDP generates heat during driving, the PDP is provided with a thermally conductive sheet on its rear surface.

The thermally conductive sheet functions to rapidly conduct and diffuse heat generated in the PDP in the planar direction.

The case includes a front cover positioned at the front of the PDP and a back cover positioned at the rear of the PDP.

Here, the front cover and the back cover generally form a coupling structure that can be decomposed and bonded to each other.

The chassis base is made of metal with high mechanical rigidity to support the PDP and is supported by attaching the PDP through the double-sided tape.

In addition to maintaining the rigidity of the PDP, the chassis base is equipped with support for mounting the circuit board assembly, grounding the heat sink of the PDP, and grounding the Electro Magnetic Interference (EMI). do.

The PDP supported on the chassis base addresses the discharge cells by the address electrodes and the display electrodes provided therein, and sustains and discharges the discharge cells to implement an image.

To this end, the PDP draws out the electrodes provided therein to the outside through a flexible printed circuit (FPC), and is connected to the circuit board assembly through the FPC and controlled according to the control signal of the circuit board assembly. do.

The address electrode is connected to the circuit board assembly via a driver IC package (for example, a tape carrier package; TCP) and an FPC provided with the driver IC.

The address pulse is supplied to the address electrode through the driver IC.

The driver IC generates a lot of heat and EMI by repeatedly supplying an address voltage pulse to the address electrode in a short time to express gray scales in the PDP.

Therefore, the driver IC has a heat dissipation structure and is provided at the tip of the chassis base.

That is, the driver IC provided in the driver IC package is disposed at the front end of the chassis base via thermal grease, and a cover plate is provided on the other side of the driver IC via a heat dissipation pad.

By fixing the cover plate to the chassis base with a set screw, the driver IC package and the driver IC provided therein are mounted at the tip of the chassis base.

When the above method is used, the cover plate according to the prior art does not have a separate reinforcing structure at the bottom thereof, thereby preventing the driver IC package from protecting.

For example, if an impact is applied to the lower end of the cover plate, the lower end of the cover plate is easily deformed and damages the driver IC package.

Damage to the driver IC package has a problem that leads to a bad vertical line of the PDP screen.

An object of the present invention is to provide a plasma display device that can effectively protect the circuit damage of the driver IC package by reinforcing the structure of the cover plate so that the impact of the lower end of the cover plate is not transmitted to the driver IC package.

In order to achieve the above object, the present invention provides a plasma display panel, a chassis base for attaching and supporting a plasma display panel to one side, a circuit board assembly mounted on the other side of the chassis base, and a pulse to be selectively supplied to electrodes of the plasma display panel. And a cover plate mounted to the chassis base while covering the driver IC package and the driver IC package provided in the chassis base, the cover plate being connected to the circuit board assembly having a driver IC to generate a cover plate. It is preferable to have the protrusion which protrudes toward.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. While many specific details, such as the following description and the annexed drawings, are shown to provide a more general understanding of the invention, these specific details are illustrated for the purpose of explanation of the invention and are not meant to limit the invention thereto. And a detailed description of known functions and configurations that may unnecessarily obscure the subject matter of the present invention will be omitted.

1 is a perspective view of a plasma display device according to an exemplary embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line A-A of FIG. 1, and FIG. 3 is a cross-sectional view taken along the line B-B of FIG.

4 is a partial perspective view showing the inner surface of the cover plate (31, 31-1) according to an embodiment of the present invention, Figure 5 is a chassis base 17, reinforcing member (29a) according to an embodiment of the present invention Is a partially exploded perspective view showing the coupling relationship between the driver IC package 27 and the cover plates 31 and 31-1.

FIG. 6 is a partially exploded perspective view illustrating a coupling relationship between the chassis base 17, the reinforcing member 29a, the driver IC package 27, and the cover plates 31 and 31-1 in FIG. 5. It is sectional drawing along the line CC of FIG.

The plasma display apparatus is attached to the back surface of the PDP 11 and the PDP 11 that display an image by using gas discharge, and conducts heat conduction to conduct and diffuse heat generated in the PDP 11 in the planar direction (x, y-direction). Generates a sheet 13, a circuit board assembly 15 (PBA) electrically connected to the PDP 11 to drive the PDP 11, and a pulse to selectively supply the electrodes of the PDP 11 A driver IC package 27 having a driver IC 25 connected to the circuit board assembly 15, and a PDP 11 attached to and supported by a double-sided tape 16 on its front surface. 15) includes a chassis base 17 for mounting and supporting the backs thereof.

The driver IC package 27 according to the embodiment of the present invention is composed of a tape carrier package (TCP).

First, the PDP 11 includes a front panel and a rear panel which are integrally bonded by a sealing material. The PDP 11 includes discharge cells therein so that any light can be emitted through plasma generation. Implement color images.

The PDP 11 is configured to display an image by using gas discharge. Since the present invention relates to the coupling relationship between the PDP 11 and other components, a detailed description of the configuration of the PDP 11 will be omitted.

Therefore, PDP 11 according to an embodiment of the present invention may be applied to a PDP of various configurations and methods.

The thermally conductive sheet 13 is interposed between the PDP 11 and the chassis base 17 to conduct heat generated by the PDP 11 to cause gas discharge in the plane direction (x, y direction) of the PDP 11. To diverge.

The heat conduction sheet 13 may be provided as one sheet for heat dissipation balance of the PDP 11, but may be attached to the back surface of the PDP 11, but the heat conduction sheet may be strengthened by strengthening the bonding force between the PDP 11 and the chassis base 17. 13) and the PDP 11 can be configured in plural (for example, three) so as to maintain close contact.

When the thermally conductive sheet 13 is divided into a plurality of parts and attached to the PDP 11, the double-sided tape can be provided between the divided thermally conductive sheets 13, and the double-sided tape is formed of the PDP 11 and the chassis base ( 17) are attached to each other to increase the bonding force of both.

However, since the adhesion area of the heat conductive sheet 13 to the back surface of the PDP 11 is reduced, which may cause heat dissipation imbalance, the number of heat conductive sheets 13 is appropriate within the range that does not cause heat dissipation imbalance of the PDP 11. Is preferably set to.

In addition, the material of the heat conductive sheet 13 can be comprised with various materials.

For example, the material of the thermal conductive sheet 13 may be composed of an acrylic thermal conductive sheet, a graphite thermal conductive sheet, a metallic thermal conductive sheet, a carbon nanotube thermal conductive sheet, or the like.

The circuit board assemblies 15 are mounted with a set screw 19 to the boss 18 of the chassis base 17.

Among the circuit board assemblies 15, the image processing / control board assembly 15a receives an image signal from the outside to control signals necessary for driving the address electrode 21 and control signals for driving the display electrode (not shown). Are generated and supplied to the address driving board assembly 15b, the scan driving board assembly 15c, and the sustain driving board assembly 15d, respectively.

The power board assembly 15e supplies the power required for driving the plasma display device as a whole.

Among the circuit board assemblies 15, the address drive board assembly 15b, the scan drive board assembly 15c, and the sustain drive board assembly 15d are each connected to the FPC 23 by the PPC 23 to drive the PDP 11 described above. 11).

An embodiment of the present invention exemplifies a structure in which the address drive board assembly 15b and the PDP 11 are connected to the FPC 23, which will be described for convenience.

Although not specifically shown in the drawings, an embodiment of the present invention includes a structure connecting the scan drive board assembly 15c and the sustain drive board assembly 15d to the FPC 23 and the PDP 11.

That is, the address driving board assembly 15b described below is an embodiment of the circuit board assembly 15, and the address electrode 21 means an embodiment of the electrode of the PDP 11.

The driver IC 25 is interposed between the address driving board assembly 15b and the address electrode 21 of the PDP 11.

The driver IC 25 selectively supplies an address voltage pulse to the address electrode 21 of the PDP 11 in accordance with the control signal of the address drive board assembly 15b.

The discharge cell of the PDP 11 is selected by the address voltage pulse supplied to the address electrode 21 and the scan voltage pulse supplied to the scan electrode.

The driver IC 25 for supplying the address voltage pulse in this manner is provided in the driver IC package 27 in a packaged state.

The driver IC package 27 has an input side connected to the address driving board assembly 15b and an output side connected to the address electrode 21 of the PDP 11 through the FPC 23.

The address electrode 21 of the PDP 11 is drawn out to the outside through the FPC 23, and the address driving is performed through the driver IC package 27 and the driver IC 25 disposed at the rear end of the rear surface of the chassis base 17. It is connected to the board assembly 15b.

The chassis base 17 may be formed by pressing a thin metal plate, and in this case, the upper end of the letter “L” may be formed as shown in FIG. It is preferable to bend in shape or to have the reinforcing member 29a.

Of course, as shown in Fig. 2, it is more preferable for the chassis base 17 to bend its tip and include a reinforcing member 29a in order to secure rigidity.

The reinforcing member 29a may be appropriately formed at a position to avoid interference with the circuit board assembly 15 installed on the rear surface of the chassis base 17 as shown in FIG. 1.

In addition, the reinforcing member 29a includes the driver IC 25 and the driver IC package 27 in which the address electrode 21 of the PDP 11 provided on the front surface of the chassis base 17 is provided on the rear surface of the chassis base 17. For the sake of brevity, it may be provided at the rear end of the chassis base 17.

In other words, the reinforcing member 29a has a long side (x axis direction) and a short side (y axis direction) of the rectangular chassis base 17, and its long side direction (x axis) at the rear side long side tip of the chassis base 17. Direction) can be formed long.

The cover plates 31 and 31-1 are attached to the front end of the chassis base 17 with the driver IC package 27 and the driver IC 25 interposed therebetween.

The cover plates 31 and 31-1 are fixed to the front end of the chassis base 17, that is, the reinforcing member 29a by a set screw, thereby fixing the driver IC 25 provided at the front end of the chassis base 17. It dissipates heat generated during operation.

The cover plates 31 and 31-1 and the reinforcing member 29a are provided with through-holes and screw holes through which the set screw is fastened.

The cover plates 31 and 31-1 are independently configured to correspond to the driver IC package 27 and the driver IC 25, each of which is provided at the front end of the chassis base 17 along a long side thereof (x-axis direction). As shown, it may be formed long in the long side direction (x-axis direction) of the chassis base 17 so as to cover a plurality dog.

In this case, the cover plates 31 and 31-1 are convenient to be mounted on the cover plates 31 and 31-1, and the close contact force is concentrated only on the specific driver IC 25 as compared with the independent ones. You can prevent it.

Meanwhile, the cover plates 31 and 31-1 may be formed by pressing a thin metal material, and in this case, as shown in FIGS. 2 to 6 to have mechanical rigidity that can withstand torsional and bending forces. It is preferable that the tip is bent into an English capital letter "L" shape or provided with projections 33 and 33-1.

Of course, as shown in Figs. 2 to 6, it is more preferable for the cover plates 31 and 31-1 to be bent at their ends and to have protrusions 33 and 33-1 to secure rigidity.

The protrusions 33 and 33-1 are formed on the first plate 31-1 corresponding to the driver IC package positions, and the second plate 31 corresponding to the driver IC package positions. And a second protrusion 33 formed on the bottom face.

At least one protrusion 33 or 33-1 is formed in the first plate 31-1 and the second plate 31, and the first plate 31-1 and the second plate 31 in order to secure rigidity. It is preferable to form all in ().

In the case of forming a plurality of protrusions 33 and 33-1, it is preferable to form the intervals between the respective protrusions 33 and 33-1 at equal intervals.

As shown in FIG. 2, the protrusions 33 and 33-1 according to the embodiment of the present invention form side cross-sections in a semicircular shape.

In this case, the protrusions 33 and 33-1 are preferably formed so that the protruding surfaces face toward the chassis base 17 side.

For example, the first protrusion 33-1 is formed such that the protruding surface is adjacent to the bottom surface of the chassis base 17, and an adjacent distance between the bottom surface of the first protrusion 33-1 and the chassis base 17 is provided. Silver is preferably included in the elastic region of the cover plate (31, 31-1).

The second protrusion 33 is formed such that the protruding surface is adjacent to one surface of the reinforcing member 29a coupled to the chassis base 17, and is coupled to the protruding surface of the second protrusion 33 and the chassis base 17. Adjacent intervals of the reinforcing members 29a to be included are preferably included in the elastic regions of the cover plates 31 and 31-1.

For reference, the protruding surfaces of the protrusions 33 and 33-1 protruding into the cover plates 31 and 31-1 do not firmly contact the lower end of the chassis base 17 (or one surface of the reinforcing member 29a). If there is a gap (a gap of about 1 mm) from the protruding surfaces of the 33 and 33-1, the first plate 31-1 is placed in the elastic region of the cover plates 31 and 31-1, as shown in FIG. Even if the external force F is applied from the lower side of the lower surface of the first protrusion 33-1 and the bottom surface of the chassis base 17, the cover plate 31, 31-1 may be returned to its original state. After deformation, the appearance is not significantly different.

As shown in FIG. 7, even when the external force F is applied from the lower portion of the first plate 31-1, the protruding surface of the first protrusion 33-1 and the bottom surface of the chassis base 17 come into contact with each other. It is possible to reduce the deformation of the plate and to protect the driver IC package 27.

In other words, an appropriately shaped protrusion 33-1 is formed on the inner side surface of the first plate 31-1, and one surface and the chassis of the protrusion 33-1 are spaced enough to protect the driver IC package 27. One surface of the base 17 is configured to be in contact with each other.

In this configuration, even if an external shock is transmitted to the chassis base 17 through the first plate 31-1, the circuit damage of the driver IC package 27 can be prevented, thereby improving the vertical streaks of the PDP screen. have.

2 to 6, the long side end of the chassis base 17 includes a reinforcing member 29a, and cover plates 31 and 31-1 are mounted on the reinforcing member 29a, and the cover plate ( The driver IC 25 is disposed between 31 and 31-1 and the reinforcing member 29a.

A thermal grease 34 is interposed between the driver IC 25 and the reinforcing member 29a, and a heat dissipation pad 35 is interposed between the driver IC 25 and the cover plates 31 and 31-1. The heat generated when the 25 is driven is rapidly radiated to the reinforcing member 29a and the cover plates 31 and 31-1 through the thermal grease 34 and the heat dissipation pad 35.

When the reinforcing member 29a is not present, the thermal grease 34 may be interposed between the driver IC 25 and the chassis base 17.

On the other hand, the detailed description of the present invention has been described with reference to specific embodiments, of course, various modifications are possible without departing from the scope of the invention.

In the above-described embodiment, the cover plates 31 and 31-1 have been formed on the cover plates 31 and 31-1 to form semicircular protrusions 33 and 33-1 to protect the driver IC circuit. If it grows, the shape of the projections 33 and 33-1 formed in the cover plates 31 and 31-1 can be improved.

That is, the shapes of the protrusions 33 and 33-1 may be formed differently according to various embodiments.

For example, in the embodiment of the present invention has been described that the shape of the projections 33 and 33-1 in a semicircle, it can be formed in a square or trapezoidal shape.

In addition, although the protrusions 33 and 33-1 are formed on the cover plates 31 and 31-1, the end portions of the chassis base 17 protrude in a horizontal direction extending in the plane of the chassis base 17. Can be formed on.

That is, the projections 33 and 33-1 may not be formed on the cover plates 31 and 31-1, but may be formed at the end portions of the chassis base 17 adjacent to the cover plates 31 and 31-1. have.

Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined not only by the claims below but also by the equivalents of the claims.

As described above, the plasma display apparatus according to the present invention may prevent the cover plate unit from being easily deformed due to external impact by reinforcing the structure of the cover plate.

In addition, it is possible to protect the circuit of the driver IC package by blocking the shock transmitted to the driver IC package through the lower end of the cover plate.

In addition, it is possible to prevent the circuit damage of the driver IC package due to an external impact to improve the vertical streaks of the PDP screen.

In addition, there is an effect that it is possible to maintain a good assembly state of the product during the work related to the packaging of the finished product of the plasma display device.

Claims (8)

A plasma display panel; A chassis base to attach and support the plasma display panel to one side; A circuit board assembly mounted on the other side of the chassis base; A driver IC package having a driver IC for generating a pulse to be selectively supplied to an electrode of the plasma display panel, connected to the circuit board assembly, and provided in the chassis base; And A cover plate mounted to the chassis base while covering the driver IC package; And the cover plate has a protrusion protruding toward an end of the chassis base. The method of claim 1, And the protrusions protrude in a horizontal direction extending in a plane of the chassis base to approach an end portion of the chassis base. The method of claim 2, And the protrusion protrudes larger than a thickness of the driver IC package. The method of claim 1, And the protrusion is in close contact with an end portion of the chassis base. The method of claim 1, And the protrusions form a predetermined distance from an end portion of the chassis base. The method of claim 3, And the driver IC package comprises a tape carrier package. The method according to any one of the preceding claims, The chassis base includes a reinforcing member provided in the long side direction at the long side end. The method of claim 7, wherein And the cover plate is formed in a long side direction of the chassis base corresponding to the driver IC package.

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