KR20070006183A - Multiple apparatus for disposing a polluted gas - Google Patents

Abstract

A multiple apparatus for disposing a polluted gas is provided to improve purification of gas exhausted to air by thermally oxidizing the polluted gas to pass through various purifying equipment. Plural burners(100) burn and oxidize polluted gas. The burner generates a flame that is not sensitive to an outer pressure. Flame generating ends(110) of the plural burners are connected toward a burning reaction chamber(350). A polluted gas inlet hole(210) is formed on a side of a burner unit(200). The burner unit is coupled to the burning reaction chamber. An air layer(320) is formed on a sidewall of the burning reaction chamber of the burning reacting unit(300). A wet reacting unit purifies the thermal oxidized gas in the burning reacting unit. A storing water chamber is installed on a lower side of the wet reacting unit to collect the used cooling water and a dust collecting material.

Description

MULTIPLE APPARATUS FOR DISPOSING A POLLUTED GAS}

1 is a cross-sectional view of a waste gas treatment apparatus according to the prior art,

2 is a schematic diagram of an apparatus for treating waste gas according to an embodiment of the present invention;

3 is an enlarged cross-sectional view of the burner part and the combustion reaction part of FIG. 2;

4 is a cross-sectional view of the first cooling unit of FIG. 2;

5 is a cross-sectional view illustrating a second cooling unit of FIG. 2, and

6 is a cross-sectional view illustrating a third cooling unit of FIG. 2.

<Description of Symbols for Main Parts of Drawings>

100: burner 110: flame generating end

200: burner unit 210: waste gas inlet

220: nitrogen injection nozzle 221: mold hole

300: combustion reaction unit 310: porous cylinder

320: gas layer 330: gas inlet

340 case 350 combustion chamber

400: wet reaction part 410: first cooling part

411: nozzle 412: circulation passage

413: inlet 420: second cooling unit

421: injection nozzle 422: dust collection pipe

423 gas piping 430 third cooling unit

431 injection nozzle 432 neutralizing agent

434: U-shaped pipe 500: water storage chamber

510: level sensor 600: bypass valve

700 drain

The present invention relates to a waste gas treatment apparatus, and more particularly, to a multiple waste gas treatment apparatus for improving the combustion reaction efficiency of waste gas and multi-processing thermally oxidized and decomposed gas.

In general, a silicon wafer is manufactured as a semiconductor device by repeatedly performing processes such as photographing, diffusion, etching, chemical vapor deposition, and metal deposition, and processes such as diffusion, etching, and chemical vapor deposition are closed processes in the manufacturing process of these semiconductor devices. The process gases required in the chamber are supplied to cause these process gases to react on the wafer.

The waste gas using the process gas is generally toxic, flammable and corrosive, and has high toxicity, and when these waste gases are leaked to the outside without any separate purification process, they cause serious environmental pollution and safety accidents.

For example, the waste gas mentioned is a large amount of silane, dichloro silane, ammonia, nitric oxide, arsine, phosphorus, diboron, boron, There are toxic gases such as trichloride, and these are consumed only in trace amounts during the semiconductor process and are mostly emitted from the process equipment in the form of waste gases. Thus, the waste gases generated after the semiconductor process are very toxic as mentioned above.

In addition, various semiconductor processes such as plasma enhanced CVD, plasma nicking, epitaxy deposition, etc. generate similar toxic waste gases.

Therefore, a scrubber system for disassembling or purifying the waste gas discharged to a safe state is installed on the waste gas discharge line connected at each manufacturing facility.

The waste gas decomposition method of such a scrubber system is a combustion method using the properties of the waste gas, that is, explosive reaction when it comes into contact with general air, a property of burning by heating, a wet method using a property of dissolving in water, or It is divided into the dry method using the property which reacts with a gas treating agent, and the method of combining dry and wet with the said combustion type.

Here, the prior art of the scrubber system which performs the above-described combustion method and the dry method using a gas treating agent will be described with reference to FIG. 1.

As shown in FIG. 1, when the conventional configuration of the above-described scrubber system is described, the pipe 1 extending from the process chamber is installed in communication with the inside of the cabinet in which the inside is partitioned, and the end of the pipe 1 is predetermined. It is connected to the combustion apparatus 2 of the shape.

Inside the combustion device 2, a heater 3 is provided to provide heat to burn and decompose the waste gas induced through the pipe 1, and the waste gas combusted by the heating of the heater 3 Induction discharged through the other pipe (4) extending to one side of the combustion device (2). In addition, the oxide produced while being oxidized in the combustion device 2 is stored away in the dust collecting chamber 5 provided under the combustion device 2.

On the other hand, the end of the pipe (4) described above is connected to the cartridge chamber (6) in which a plurality of gas treating agent is embedded, the powder of the secondary product flows into the cartridge chamber (6) cartridge chamber It sticks on the gas treating agent surface of (6), or it collects below it.

In addition, the unburned or unreacted waste gas flows into the exhaust duct through a pipe (7) that reacts with, and is converted to, the gas treating agent filled therein in communication with the other side of the cartridge chamber in the course of passing through the cartridge chamber. To achieve the configuration.

In the scrubber system having such a configuration, the waste gas introduced into the combustion apparatus through the pipe is burned in the process of passing through the portion where the heat amount is provided by the heater 3.

However, the waste gas generated in the semiconductor manufacturing process contains a fluorine-based gas having a strong corrosion force. The fluorine-based gas is decomposed at a high temperature of 1000 degrees Celsius or more to form a harmless gas, which is inappropriate to generate and maintain 1000 degrees Celsius by a heater according to the prior art. For this reason, the fluorine-based gas in the waste gas which is not completely burned has a high corrosive force, and when the waste gas combustion device is used for a long time, there is a problem of damaging the inside of the combustion device 2.

In addition, the ignition zone generated by the heater (3) has a problem that the efficiency is low to burn the waste gas continuously introduced at a high density to a high efficiency.

The gas thermally decomposed by the combustion device 2 communicates with the cartridge chamber 6 and adheres to the surface of the gas treating agent in the cartridge chamber 6 to discharge the purified gas to the outside. Through such a process, excessively many adhesives are collected in the gas treating agent, and the gas treating agent in which excessive dust is accumulated is not easy to function, and there is a problem in that its purity is not excellent to discharge to the atmosphere.

Therefore, the present invention was created to solve the above problems, and an object of the present invention is to improve the thermal efficiency of the combustion reaction chamber and to purify the thermally decomposed gas in the combustion reaction chamber by multiple purification, thereby improving the combustion efficiency of the waste gas. It is to provide a multiple waste gas treatment device for improving the degree of purification of the gas discharged to the atmosphere.

In order to achieve the above object, the present invention provides a plurality of burners for oxidatively decomposing waste gas and generating a flame which is not sensitive to external pressure, and a flame generating end of the plurality of burners is connected toward the combustion reaction chamber, and waste gas is disposed at one side. A burner part having an inlet formed therein, the burner part communicating with the combustion reaction chamber to be coupled to each other, a combustion reaction part having a gas layer on the side wall of the combustion reaction chamber, and multi-purifying the gas thermally decomposed in the combustion reaction part It includes a wet reaction unit and a water storage chamber for collecting the cooling water and the dust used to be installed below the wet reactor.

Preferably, the plurality of burners are characterized in that one stable flame is formed to form a high-density flame.

Preferably, the burner part is a flame-producing end of the plurality of burners are combined to protrude to the inside of the burner portion, the mold hole is injected nitrogen for rapid flow of the waste gas flowing through the waste gas inlet to the combustion reaction chamber It is characterized by being formed around a plurality of burners.

Preferably, the combustion reaction unit is spaced apart from the porous cylinder forming the side wall of the combustion reaction chamber and the porous cylinder by a predetermined interval to form an empty space and a gas inlet at a predetermined position, the outer side of the combustion reaction unit It is characterized by including a case to form.

Preferably, the gas inlet is a multiple waste gas processing apparatus, characterized in that a predetermined gas is introduced to concentrate the waste gas flowing into the combustion reaction chamber to the ignition zone formed by the flame of the plurality of burners.

Preferably, the wet reaction unit is configured to wet-cool the high temperature oxide and the by-product gas passing through the first cooling unit and the first cooling unit to wet-cool the outer wall and the inlet gas while cooling water flowing into the outer wall is circulated. A second cooling unit having an injection nozzle for discharging and a neutralizing agent for removing the by-product of the water-soluble gas passing through the second cooling unit on the tubular passage, and having a spray nozzle for re-wet cooling the water-soluble gas. It includes 3 cooling parts.

Preferably, the third cooling unit comprises a U-shaped pipe in which a plurality of neutralizing agents are disposed to repeatedly purify the incoming secondary gas.

More preferably, the neutralizing agent is a fluorine-based neutralizing agent for neutralizing the fluorine-based gas.

Hereinafter, a preferred embodiment of the waste gas treatment apparatus according to the present invention with reference to the accompanying drawings in more detail.

2 is a view schematically showing a waste gas treatment apparatus according to an embodiment of the present invention.

As shown in FIG. 2, the waste gas treating apparatus includes a plurality of burners 100 and a plurality of burners 100 for combusting waste gas generated in a semiconductor process, and a burner part having a waste gas inlet 210 formed at at least one side thereof. 200, a combustion reaction unit 300 in which the incoming waste gas is burned and oxidatively decomposed by a flame generated by a plurality of burners 100, a wet reaction unit 400 for multiple purifying thermally oxidized gas and oxide, and a wet type. It is installed below the reaction unit 400 includes a water storage chamber 500 for collecting used wastewater and dust.

In addition, the waste gas treatment device is connected to the waste gas supply pipe 601 for supplying the waste gas to the waste gas inlet 210 of the burner unit 200, the waste gas supply pipe 601 is a wafer manufacturing and circuit design, wafer processing, assembly And a pipe 601 for discharging the waste gas generated from each process line for various semiconductor manufacturing processes, such as inspection and the like, to the processing apparatus, whereby the process line is expanded to facilitate further connection of the waste gas supply pipe 601. It is preferable to further include a bypass valve 600 which is convenient to supply and shut off the waste gas supplied from the process line.

The plurality of burners 100 decomposes the fluorine-based gas in the waste gas generated in the semiconductor process at 1000 degrees Celsius or more, and becomes a gas having high corrosion force at a temperature close to 600 degrees Celsius to corrode the outer wall of the combustion reaction chamber 350. There is a characteristic to the bar, it is provided with a plurality of burners 100 to form a temperature inside the combustion reaction chamber 350 to 1200 degrees Celsius to 1500 degrees Celsius.

In order to maintain the temperature inside the combustion reaction chamber 350 at the same temperature as above, it is preferable to provide a stable flame with three burners 100 having a relatively low cost to the burner 100 that emits a high speed flame.

In addition, the reason that the stable flame should be radiated from the burner 100 mounted on the waste gas treatment device is to prevent the radiated flame from being completely burned by the gap due to the low density of the waste gas which is introduced into the unstable low density flame and burned. In order to prevent the flame emitted by the pressure generated in the combustion reaction chamber 350 from being unstable, it becomes an obstacle to burning the waste gas.

Therefore, in order to radiate a high-density and stable flame from three burners 100 according to the present embodiment, each burner 100 is disposed in a triangular shape and installed so that the flame generating end of each burner 100 faces one point. When the burner 100 is ignited, the flames of each burner 100 are radiated together to form a stable flame, and are not sensitive to the pressure of the combustion reaction chamber 350 to form a high temperature of 1200 degrees Celsius to 1500 degrees Celsius. Flames may be emitted.

In addition, by detecting the flame formed by the UV sensor is provided in the combustion reaction chamber 350, it is possible to grasp the temperature of the flame formed inside the combustion reaction chamber 350 and to maintain a high temperature of the flame formed, UV The sensor is more preferably installed in a predetermined place of each burner 100 protruding and coupled to the burner unit 200.

3 is an enlarged cross-sectional view of the burner unit 200 and the combustion reaction unit 300 of FIG. 2.

As shown in FIG. 3, the burner unit 200 is coupled to the flame generating end 110 of the plurality of burners 100 by protruding inward, and the combustion reaction chamber 350 by the flame radiated from the plurality of burners 100. In order to form a ignition zone in the) may be a structure in which a portion symmetrical to the coupling portion of the plurality of burners 100 is in communication.

In detail, by allowing the waste gas introduced through the waste gas inlet 210 formed at one side of the burner unit 200 to be rapidly introduced into the combustion reaction chamber 350, the waste gas introduced into the waste gas inlet 210 again waste gas inlet ( It is possible to prevent the backflow through the 210 and to flow the introduced waste gas into the combustion reaction chamber 350 to treat the waste gas with high efficiency.

Therefore, in order to concentrate the waste gas into the combustion reaction chamber 350, by forming a mold hole 221 around the coupling that the plurality of burners 100 are coupled to the burner unit 200 and by introducing nitrogen through the mold hole 221 Nitrogen not combusted flows with a predetermined pressure into the combustion reaction chamber 350 along the outside of the flame generating end 110 of the plurality of burners 100 protruding into the burner unit 200 to the waste gas inlet 210. The incoming waste gas flows into the combustion reaction chamber 350.

Combustion reaction unit 300 has a side wall to form a combustion reaction chamber 350, the porous cylinder 310, porous cylinder 310 made of a flame-resistant material that can withstand the flame generated in the combustion reaction chamber 350 ) Is spaced apart by a predetermined interval to form an empty space, and the combustion reaction unit 300 includes a case 340 forming the outside.

The gas inlet 330 is formed at a predetermined position of the case 340, and the gas is filled in the empty space formed between the case 340 and the porous cylinder 310 while a predetermined gas is introduced into the gas inlet 330. The heat inside the combustion reaction chamber 350 is prevented from leaking out.

In addition, the gas filled in the empty space passes through the hole 221 formed in the cylinder again and flows at a predetermined pressure into the combustion reaction chamber 350 to apply pressure to the ignition zone formed by the flame of the plurality of burners 100. By expanding the ignition zone, most of the waste gas flowing into the combustion reaction chamber 350 is concentrated in the ignition zone.

In more detail, nitrogen is added to the gas inlet 330 of the case 340 so as not to activate the combustion reaction to fill the empty space between the case 340 and the porous cylinder 310 so that the nitrogen layer 320 is filled. This is formed, the nitrogen in the nitrogen layer 320 is penetrated through the hole 221 of the porous cylinder 310 is introduced into the combustion reaction chamber 350 at a predetermined pressure is formed by the flame of the plurality of burners 100 By applying pressure to the ignition zone, the waste gas flowing from the burner 200 is concentrated in the ignition zone.

In addition, a gas layer 320 filled with oxygen is formed in the empty space between the case 340 and the porous form by injecting oxygen activating a combustion reaction into the gas inlet 330 of the case 340, and the oxygen cylinder is porous. Through the hole 221 of the 310, the combustion reaction of the generated flame is amplified by flowing into the combustion reaction chamber 350 at a predetermined pressure to expand the ignition zone of the combustion reaction chamber 350 to burner 200. It is also preferable to combust the waste gas flowing from).

Then, by mixing a mixture of nitrogen and oxygen into the gas inlet 330 of the case 340, the mixed gas is filled in the gas layer 320 and the mixed gas flows into the combustion reaction chamber 350 at a predetermined pressure to burn In addition to the ignition zone in the reaction chamber 350, it is more preferable that nitrogen is filled, and the ignition zone is expanded by oxygen to form a constant ignition zone so that the incoming waste gas is concentrated in the ignition zone.

In addition, the porous cylinder 310 of the combustion reaction unit 300 is made of a ceramic material, the case 340 may be made of stainless steel material.

By the above configuration, the wet reaction unit 400 for multiple purifying the thermally oxidized gas and the oxide is connected to the combustion reaction unit 300.

The wet reaction unit 400 is connected to the lower end of the combustion reaction unit 300 to firstly cool the oxidatively-produced secondary gas generated in the combustion reaction unit 300 by wet cooling. 1 The second cooling unit 420, the second cooling unit 420 for the re-wet cooling process to the high-temperature oxide and the by-product gas through the cooling unit 410 by spraying the cooling water multiplex And a third cooling unit 430 for purifying.

4 is a cross-sectional view illustrating the first cooling unit 410 of FIG. 2.

As shown in FIG. 4, in the structure of the first cooling unit 410, a nozzle 401 for introducing coolant from the outside is formed on the outer wall, and the coolant introduced from the nozzle 401 is a circulation passage 412 on the outer wall. By repeating the process introduced into the interior through the inlet 413 of the first cooling unit 410, the material of the first cooling unit 410 due to the thermal spray formed at a high temperature of the combustion reaction unit 300 It prevents damage and cools the incoming hot by-product gas. In addition, the cooling water is continuously circulated to flow into the inner wall of the first cooling unit 410, thereby preventing the oxide from being fixed to the inner wall.

The structure of the first cooling unit 410 is also installed at the connection of the reaction unit and the combustion reaction unit 300 and the connection of the combustion reaction unit 300 and the first cooling unit 410, the plurality of burners 100 This is to prevent the connection part from being damaged due to the high temperature flame. Cooling water flowing into the first cooling unit 410 fastened to the connection portion should be continuously supplied to fill the flow path formed, it is preferably supplied at a high pressure.

In addition, the first cooling unit 410 and the wet reaction unit 400 connected to the first cooling unit 410 and the first cooling unit 410 for wet cooling the thermally oxidized secondary product gas connected to the combustion reaction unit 300 are introduced. Cooling water is preferably supplied to the distilled water in order to prevent unnecessary chemical reactions with the by-product gas.

5 is a cross-sectional view illustrating the second cooling unit 420 of FIG. 2.

As shown in FIG. 5, the second cooling unit 420 is connected to the first cooling unit 410 by a pipe fitting 402, and the injection nozzle 421 mounted at one side thereof is the first cooling unit 410. Cooling water is injected into the by-product gas and the oxide which has passed through, thereby recooling the by-product and the oxide of the high-temperature by-product and the oxide produced by the combustion reaction unit 300 by wet purifying the water-soluble gas in the by-product. It is a structure that is introduced into the tubular passage formed at the lower end of the second cooling unit 420 is collected in the water storage chamber (500).

6 is a cross-sectional view illustrating the third cooling unit 430 of FIG. 2.

As illustrated in FIG. 6, the third cooling unit 430 is connected to the second cooling unit 420, and a plurality of third cooling units 420 may be used to re-wet the non-wet purified secondary product gas in the second cooling unit 420. Injection nozzle 421, and a neutralizer 432 for removing the powder contained in the by-product gas.

In addition, in order to increase the degree of purification of the secondary product gas, it is preferable that the U-shaped pipe 434 is provided with a convenient wet treatment and neutralization operation. A plurality of such U-shaped pipes 434 are arranged, it is possible to build an improved purification facility. The plurality of neutralizers 432 disposed on the tubular passage of the pipe preferably uses a fluorine-based neutralizer 432 for neutralizing the fluorine-based gas.

Injection nozzles 421 for injecting distilled water are respectively disposed in each of the portions in which the plurality of neutralizing agents 432 are disposed in the tubular passages, thereby further improving the function of purifying the by-product gas by the neutralizing agent 432.

In addition, the tubular passage toward the lower end of the third cooling unit 430 is connected to the reservoir chamber 500 in which the by-products generated during the purification process are collected. The water storage chamber 500 is provided with a level sensor 510 for adjusting the water level in the chamber, the level sensor 510 is preferably provided with any one of a sensor, a proximity sensor and a photo sensor using buoyancy.

Due to this configuration, the waste gas after the semiconductor process is combusted, and the gas which has been purged of the thermal oxidatively decomposed gas is discharged to the outside through the exhaust port 700.

Although described above with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and changed within the scope of the invention without departing from the spirit and scope of the invention described in the claims below. I can understand that you can.

Therefore, in the present invention, waste gas flows into the ignition zone due to the flame formed in the combustion reaction chamber at high density, and thermally decomposes various kinds of waste gases introduced into the ignition zone, and then passes through various paths of purification facilities. It has the advantage of improving the purification of the gas discharged to the atmosphere and combustion treatment of waste gas of high efficiency within a short time.

Claims (14)

A plurality of burners for combusting the waste gas to oxidatively decompose and produce a flame insensitive to external pressure; A burner part having a flame generating end of the plurality of burners connected to a combustion reaction chamber and having a waste gas inlet formed at one side thereof; A combustion reaction unit in which the burner unit communicates with the combustion reaction chamber and is coupled to the burner unit, and a gas layer is provided on a side wall of the combustion reaction chamber; A wet reaction part for multi-purifying the gas thermally oxidized in the combustion reaction part; And Multiple waste gas treatment apparatus, characterized in that it comprises a water storage chamber for collecting the cooling water and the dust collection is used installed below the wet reactor. The multiple waste gas treatment apparatus according to claim 1, wherein the plurality of burners are installed such that one stable flame is formed to radiate a high density flame. The burner part of claim 1, wherein a flame generating end of the plurality of burners is coupled to the inner part of the burner part, and nitrogen is injected for rapidly flowing the waste gas flowing through the waste gas inlet to the combustion reaction chamber. Multiple waste gas treatment apparatus, characterized in that the ball is formed around the plurality of burners. The method of claim 1, wherein the combustion reaction unit, the porous cylinder forming a side wall of the combustion reaction chamber; And Multiple waste gas treatment apparatus characterized in that it is spaced apart from the porous cylinder by a predetermined interval to form an empty space and the gas inlet at a predetermined position, the case forming the outside of the combustion reaction unit. The multiple waste gas treatment apparatus according to claim 4, wherein the porous cylinder is made of a ceramic material. The apparatus of claim 4, wherein the case is made of stainless steel. The multiple waste gas treating apparatus of claim 4, wherein the gas inlet is provided with a predetermined gas for concentrating the waste gas flowing into the combustion reaction chamber into an ignition zone formed by the flame of the plurality of burners. The multiple waste gas treatment apparatus according to claim 7, wherein the predetermined gas is any one of nitrogen, oxygen, and nitrogen and oxygen. The apparatus of claim 1, wherein the wet reaction unit comprises: a first cooling unit configured to wet-cool the outer wall and the inflow gas while the coolant flowing into the outer wall is circulated; A second cooling unit having a spray nozzle for wet cooling the high temperature oxide and the by-product gas passing through the first cooling unit; And The multi-waste gas, characterized in that the neutralizing agent for removing the by-product of the water-soluble gas through the second cooling unit is disposed on the tubular passage, and the third cooling unit is provided with a spray nozzle for re-cooling the water-soluble gas. Processing unit. 10. The apparatus of claim 9, wherein the inlet cooling water of the first cooling unit is a cooling water supplied at a high pressure. The multiple waste gas treatment apparatus according to claim 9, wherein the third cooling unit is formed of a U-shaped pipe in which a plurality of neutralizing agents are disposed in order to repeatedly purify the incoming secondary gas. The multiple waste gas treating apparatus according to claim 9 or 11, wherein the neutralizing agent is a fluorine-based neutralizing agent for neutralizing the fluorine-based gas. 10. The apparatus of claim 9, wherein the second cooling unit and the third cooling unit are supplied with distilled water in order to prevent unnecessary chemical reactions. The multiple waste gas treatment apparatus of claim 1, wherein the water storage chamber is provided with a level sensor for adjusting the water level in the chamber.

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