KR20060110654A - A plasma display device - Google Patents

Abstract

A plasma display device is provided to radiate efficiently heat of intelligent modules by forming a multi-type heat-sink with an installation unit and two radiating plates. A plasma display panel is attached to one side of a chassis base. The chassis base is used for supporting the plasma display panel. A driving circuit board(9) is installed on the other side of the chassis base. A plurality of intelligent power modules(13) are mounted on the driving circuit board. A multi-type heat-sink(15) comes in contact with each of the intelligent power modules and the driving circuit board in order to be coupled with the chassis base.

Description

Plasma Display Device {A PLASMA DISPLAY DEVICE}

1 is an exploded perspective view of a plasma display device according to a first embodiment of the present invention.

FIG. 2 is an exploded perspective view of portion A of FIG. 1.

3 is a cross-sectional view taken along line B-B of FIG. 1.

4 is an exploded perspective view of a plasma display device according to a second embodiment of the present invention.

5 is an exploded perspective view of a portion C of FIG. 4.

6 is a cross-sectional view taken along the line D-D of FIG. 4.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display device, and more particularly, to a plasma display device that effectively radiates a plurality of intelligent power modules (hereinafter, referred to as 'IPM') disposed on a driving circuit board.

As is well known, a plasma display panel (hereinafter referred to as a 'PDP') is a display panel that displays an image by exciting phosphors by vacuum ultraviolet rays caused by gas discharge occurring in a discharge cell. It has excellent performance in contrast, viewing angle and the like.

The plasma display device surrounds the PDP that implements an image, a chassis base that supports the PDP, driving circuit boards installed on the chassis base opposite to the PDP, and surrounds the PDP, the chassis base, and the driving circuit board. It is composed of a case forming a.

This case consists of a front cover located in front of the PDP and a back cover located behind the chassis base. In this case, the front cover and the back cover generally form a coupling structure that is decomposable to each other.

The driving circuit boards mounted on the chassis base are composed of a power supply board, an image processing board, a logic board, an address buffer board, an X board, and a Y board, and a plurality of elements are mounted on each board. IPM is configured on the and Y boards.

Among the driving circuit boards, the X board and the Y board are provided with two IPMs for controlling the X electrode and the Y electrode of the PDP, which generate high heat because the IPM generates the sustain pulse at a high frequency.

Thus, to smoothly drive the PDP, the IPM controlling the X electrode and the Y electrode is used by attaching a single heat sink to each to maintain a temperature level suitable for driving.

However, since the heat dissipation operation of the IPM by the conventional heat sink is limited to the heat dissipation area of the heat sink to the upper surface of the IPM, the heat dissipation efficiency is reduced, and each of the heat dissipation operations is performed independently. When arranged up and down, there is a problem that a large temperature difference occurs between the IPMs due to heat radiation by air convection.

In addition, in order to attach a heat sink to the IPM, a separate heat dissipation pad should be used, and the assembly workability is also degraded, such as ground reinforcement between two IPMs for stable operation of the IPM.

The present invention has been invented to solve the problems as described above, the object is to improve the heat dissipation performance for a plurality of IPM provided in the driving circuit board, maintaining the appropriate temperature level of the IPM, and the temperature difference between the IPM It is to provide a plasma display device that can be minimized.

In addition, another object of the present invention is to assemble the heat sink directly to the driving circuit board to expand the heat dissipation area, to provide a plasma display device to form the ground through the set screw for assembly, and at the same time improve the workability of the assembly. It is.

The plasma display device according to the present invention includes a plasma display panel, a chassis base to which the plasma display panel is attached and supported, a driving circuit board provided on an opposite side of the plasma display panel of the chassis base, and a plurality of intelligent mounted on the driving circuit board. A multi-type heat sink which is assembled with the power module in contact with each one side thereof, and one side is in surface contact with the driving circuit board, and penetrates the driving circuit board from one side of the multi-type heat sink on the chassis base. A screw fastened to the boss.

The multi-type heat sink is formed of a mounting portion that forms a screw hole through which the screw penetrates at the same time as the center of the heat sink, and the heat sink includes a plurality of heat dissipation fins on both sides of the mounting portion. Because it is formed symmetrically, heat generated by the intelligent power module and transferred to the multi-type heat sink is transferred to the driving circuit board through the mounting portion. The mounting portion is formed in a state in which both ends of the both ends of the heat sink is bent downward, both ends are integrally formed with a horizontal portion, and in the central one side of the horizontal portion to form a screw hole in contact with the driving circuit board by the screw do.

The heat dissipation fins may be formed on both heat sinks in the same direction, respectively, and the heat dissipation fins may be formed parallel to the length direction in which both heat sinks are connected to each other, or perpendicular to the length direction in which both heat sinks are interconnected. Correspondingly to the convective direction of air for heat dissipation of heat generated by

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted for simplicity of explanation, and like reference numerals designate like elements throughout the specification.

1 is an exploded perspective view of a plasma display device according to a first embodiment of the present invention.

Referring to the plasma display device according to the first embodiment with reference to the drawings, the plasma display device of the present invention is substantially a PDP (3) for implementing an image, and one surface of the PDP (3), that is, the image is implemented A front cover (not shown) disposed on the opposite side and coupled to the PDP 3 and disposed on the front side of the PDP 3 and a back cover disposed on the rear side of the chassis base 5. It further includes (not shown).

Here, between the PDP 3 and the chassis base 5, a heat dissipation sheet 7 for transferring heat generated from the PDP 3 to the chassis base 5 side is disposed, and the electromagnetic wave radiated from the PDP 3 is disposed at the front cover. A filter (not shown) for shielding the is mounted.

In the above, the PDP 3 is typically formed in the shape of a rectangle (a rectangle whose length in the x-axis direction is longer than the length in the y-axis direction in the drawing), and the chassis base 5 has a shape corresponding to the shape of the PDP 3. It may be formed of a material such as aluminum (Al) having excellent thermal conductivity.

The PDP 3 is attached to and supported on one side of the chassis base 5, and a plurality of driving circuit boards 9 required for driving the PDP 3 are mounted on the opposite side thereof. The drive circuit board 9 is mounted to the boss 17 (see FIG. 3) provided on the rear surface of the chassis base 5 by the set screw 11.

The driving circuit board 9 mounted on the rear side of the chassis base 5 includes an X board 9a, a Y board 9b, an image processing board 9c, and a switching mode power supply board. 9d) and address buffer board 9e.

The X board 9a and the Y board 9b generally control the generation of sustain pulses applied to the X electrode (not shown) and the Y electrode (not shown) provided in the PDP 3 and the control of the X electrode and the Y electrode. To this end, it comprises an intelligent power module (IPM) 13 which integrates a plurality of elements to form an independent small circuit. The IPM 13 generates a high heat as mentioned above because a large number of elements are concentrated in a narrow space. The heat dissipation structure for dissipating the IPM 13 may be implemented in various ways.

2 is an exploded perspective view of portion A of FIG. 1, and FIG. 3 is a cross-sectional view taken along line B-B of FIG. 2.

The heat dissipation structure of the IPM 13 will be described with reference to these drawings. The X board 9a and the Y board 9b are generally provided with two IPMs 13, respectively. Hereinafter, the driving boards 9 will be collectively described without distinguishing each board. .

The drive circuit board 9 is fixedly mounted to the boss 17 provided in the chassis base 5 with a set screw 19. The drive circuit board 9 mounts various circuit elements (not shown) including the above-described IPM 13 to form a drive circuit.

In the present embodiment, the two IPMs 13 are mounted adjacent to each other on the driving circuit board 9 in the up and down direction, and generate a lot of heat when the PDP 3 is driven, so that the heat dissipation can be continuously performed for a long time. To maintain an appropriate temperature level. To this end, a multi-type heat sink 15 is used to dissipate heat generated in the IPM 13.

The multi-type heat sink 15 is in contact with two IPMs 13 mounted on the drive circuit board 9 in the up-down direction in parallel with each other on one side thereof, and the two IPMs ( 13) is assembled to the driving circuit board 9 so that heat transfer is possible with one side thereof in surface contact.

The multi-type heat sink 15 penetrates through the driving circuit board 9 from one side in contact with the driving circuit board 9 and is fastened to the boss 17 on the chassis base 5 through a set screw 19. .

The specific configuration of the multi-type heat sink 15 according to the first embodiment of the present invention is formed with a mounting portion 21 in the center thereof in direct contact with the driving circuit board 9. The mounting portion 21 forms a screw hole 23 through which the set screw 19 passes. On both sides of the mounting portion 21, the heat dissipation plate 27 including a plurality of heat dissipation fins 25 is formed symmetrically with each other to be integrally formed.

That is, the mounting portion 21 is formed by forming the horizontal portion 29 at both ends integrally from the bottom in the state where the corresponding one end of the both side heat sink 27 is bent downward, the lower surface of the horizontal portion 29 This drive circuit board 9 is in contact. In the central side of the horizontal portion 29, the screw hole 23 for assembling the set screw 19 is formed.

Here, the mounting portion 21 is preferably formed of a 'c' shape in which one surface is in surface contact with the driving circuit board 9 by integrally connecting both heat sinks 27, but is not limited thereto. As long as it is the structure which forms the contact surface with respect to the board | substrate 9, the design change is possible.

The heat dissipation fins 25 are formed on both side heat sinks 27 in the same direction to correspond to the convective direction of air. In the present embodiment, the heat dissipation fins 25 are connected in the longitudinal direction (y direction). A plurality of heat dissipation fins 25 are formed in parallel with each other.

That is, the multi-type heat sink 15 formed by symmetrically forming two heat sinks 27 contacting the two IPMs 13 with the mounting portion 21 in contact with the driving circuit board 9 at the center has an IPM ( The heat dissipation path of 13) is diversified to improve the heat dissipation efficiency of the two IPMs 13.

In more detail, the high heat generated by the two IPM 13 is a heat dissipation operation by the convection phenomenon that occurs at each of the heat sink 27 and the heat radiation fin (25). In addition, the high heat transmitted from the two IPMs 13 to the respective heat sinks 27 is also conducted to the drive circuit board 9 through the mounting portion 21 and radiated through the drive circuit board 9.

As described above, the multi-type heat sink 15 according to the present embodiment expands the heat dissipation area by the heat dissipation plate 27, the heat dissipation fin 25, and the mounting portion 21 to increase the heat dissipation efficiency of the IPM 13. Maintaining a proper temperature level, considering the heat conduction phenomenon, a certain area of the drive circuit board 9 is also included in the heat dissipation area, the expansion effect of the heat dissipation area is further increased.

In addition, the heat absorbed by both heat sinks 27 is effectively dispersed by the conduction phenomenon to achieve a preliminary thermal balance of the multi-type heat sink 15, due to the thermal balance of the multi-type heat sink 15, two IPM ( 13) There is almost no temperature difference between them.

In addition, the multi-type heat sink 15 is simply fastened to the boss 17 on the chassis base 5 through the set screw 19 while being in contact with the driving circuit board 9 through a separate mounting portion 21. The workability of the assembly is improved, and the heat sink 27 can maintain the contact state with respect to the wide surface of the IPM 13 even without a separate heat dissipation pad, thereby further improving the efficiency of heat conduction between the IPM 13 and the heat sink 27. You can also increase it.

In addition, the set screw 19 has a direct connection structure with the boss 17, and can simultaneously perform a ground function for stable driving of the IPM 13, thereby providing a separate ground reinforcement work to the IPM 13. There is no need to do it.

Here, the multi-type heat sink 15 of the present embodiment is applied only when two IPMs 13 adjacent to the driving circuit board 9 are provided up and down.

4 to 6 are second embodiments of the present invention, and their overall configuration and operation are similar to or the same as those of the first embodiment, and thus different parts from the first embodiment will be described.

In the first embodiment, the two heat dissipation plates 27 are disposed so that the heat dissipation fins 25 may correspond to the convection direction of air in response to the two IPMs 13 being mounted adjacent to each other in the vertical direction on the driving circuit board 9. ) Are formed parallel to each other in the longitudinal direction (y direction). The second embodiment is perpendicular to the longitudinal direction (x direction) in which both heat sinks 27 are interconnected in response to the case where two IPMs 13 are mounted adjacent to each other in the left and right directions on the driving circuit board 9. The heat dissipation fins 25 are formed so that the heat dissipation fins 25 can correspond appropriately to the convection direction of the air, thereby maintaining the heat dissipation performance of the IPM 15.

Therefore, the first embodiment can be applied to a structure in which two IPMs 13 on the driving circuit board 9 are mounted in a neighboring direction up and down, and the second embodiment is applied to two IPMs 13 on the driving circuit board 13. ) Can be applied to the structure mounted next to each other.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. In addition, it is natural that it belongs to the scope of the present invention.

As described above, according to the plasma display device of the present invention, a multi-type heat sink is formed by symmetrically forming two heat sinks respectively contacting two IPMs, with a mounting part in direct contact with a driving circuit board having two IPMs. By diversifying the heat dissipation path of the IPM, the heat dissipation efficiency of the IPM can be improved.

In addition, the heat absorbed by the heat sinks on both sides of the multi-type heat sink is effectively dispersed by the conduction phenomenon, thereby achieving a preliminary thermal balance, thereby minimizing the temperature difference between the two IPMs.

In addition, the multi-type heat sink is assembled directly to the boss by using a set screw in a state in which the heat sink is in contact with the driving circuit board without the heat radiating pad, thereby expanding the heat dissipation area and forming a ground through the set screw. It can exclude and also has the effect of improving the assembly workability.

Claims (9)

Plasma display panel, A chassis base for attaching and supporting the plasma display panel; A driving circuit board on the chassis base opposite to the plasma display panel; And a multi-type heat sink having one side contacting each side of the plurality of intelligent power modules mounted on the driving circuit board and the other side contacting the driving circuit board to be fastened to the chassis base. The method of claim 1, And the multi-type heat sink is mounted through a screw which penetrates the driving circuit board from one side thereof and is fastened to a boss on the chassis base. The method of claim 1, The multi-type heat sink is formed of a mounting portion that forms a screw hole through which a screw penetrates at the same time as the center of the heat sink, and heat sinks including a plurality of heat sink fins are symmetrical on both sides of the mounting portion. A plasma display device that is formed as an enemy. The method of claim 3, wherein The mounting unit is a plasma display device in which both ends of the both sides of the heat sink are bent downwardly to form a horizontal portion at both ends integrally. The method of claim 4, wherein And a screw hole formed at a central side of the horizontal portion. The method of claim 3, wherein The mounting portion is a plasma display device having a '-' shape in which one surface is in surface contact with the driving circuit board by connecting the both sides of the heat sink integrally. The method of claim 3, wherein The heat dissipation fins are formed on both heat sinks in the same direction. The method of claim 3, wherein The heat dissipation fins are formed in parallel to the longitudinal direction in which both heat sinks are interconnected. The method of claim 3, wherein The heat dissipation fins are formed in a vertical direction with respect to the longitudinal direction in which both heat sinks are interconnected.

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