KR20060080502A - Etching apparatus for using plasma display panel - Google Patents

Abstract

The present invention relates to an apparatus for removing a DFR pattern of a plasma display panel.

The present invention provides a peeling container containing a peeling solution for peeling the DFR (Dry Film Photo Resist) remaining on the partition wall of the plasma display panel, and disposed inside or outside of the peeling container, the peeling solution contained in the peeling container Vibration means for vibrating.

Therefore, after the electrode or the partition wall is formed using the DFR pattern, the DFR pattern remaining on the electrode or the partition wall is peeled off and cleaned by a single process.

DFR pattern removal device, bulkhead paste, vibration means, peeling solution

Description

Deferral pattern removing apparatus of plasma display panel {Etching apparatus for using Plasma Display Panel}

1 is a perspective view illustrating main parts of a general plasma display panel;

2A to 2C are exemplary views illustrating a process of fabricating a partition wall of a general plasma display panel to which the present invention is applied.

Figure 3 is a cross-sectional configuration of the DFR pattern removal apparatus applied in the present invention

<Explanation of symbols for the main parts of the drawings>

31 partition paste 40 rear substrate

42: DFR 200: DFR pattern removal device

210: container 220: peeling solution

230: vibration means

The present invention relates to a plasma display panel, and more particularly, after forming an electrode or a partition by a laminating process using a DFR pattern, the DFR pattern remaining on the upper side of the electrode or the partition is removed and cleaned by a single process. It relates to a DFR pattern removing device of the plasma display panel.

In general, a plasma display panel is a partition wall formed between a front substrate and a rear substrate to form a unit cell, and each cell includes neon (Ne), helium (He), or a mixture of neon and helium (Ne + He) and An inert gas containing the same main discharge gas and a small amount of xenon is filled. When discharged by a high frequency voltage, the inert gas generates vacuum ultraviolet rays and emits phosphors formed between the partition walls to realize an image.

Such a plasma display panel has a spotlight as a next generation display device because of its thin and light configuration.

1 illustrates a structure of a general plasma display panel.

As shown in FIG. 1, a plasma display panel includes a front substrate on which a plurality of sustain electrode pairs formed by pairing a scan electrode 102 and a sustain electrode 103 are formed on the front glass 101, which is a display surface on which an image is displayed. The back substrate 110 on which the plurality of address electrodes 113 are arranged so as to intersect the plurality of sustain electrode pairs on the back glass 111 forming the back surface 100 and the back surface is coupled in parallel with a predetermined distance therebetween.

The front substrate 100 is made of a scan electrode 102 and a sustain electrode 103, that is, a transparent electrode (a) formed of a transparent ITO material and a metal material to mutually discharge each other in one discharge cell and maintain light emission of the cell. The scan electrode 102 and the sustain electrode 103 provided as the bus electrode b are included in pairs.

The scan electrode 102 and the sustain electrode 103 are overlaid by one or more upper and lower dielectric layers 104 that limit the discharge current and insulate the electrode pairs, and the upper and lower dielectric layers 104 top surface. In order to facilitate the discharge conditions, a protective layer 105 on which magnesium oxide (MgO) is deposited is formed.

The rear substrate 110 is arranged in such a manner that a plurality of discharge spaces, that is, barrier ribs 112 of a stripe type (or well type) for forming discharge cells are maintained in parallel.

In addition, a plurality of address electrodes 113 which perform address discharge to generate vacuum ultraviolet rays are arranged in parallel with the partition wall 112.

In addition, R, G, and B phosphors 114 are coated on the upper surface of the rear substrate 110 to emit visible light for image display during address discharge.

A lower dielectric layer 115 is formed between the address electrode 113 and the phosphor 114 to protect the address electrode 113.

The plasma display panel having such a structure displays an image using micro discharge.

Such discharge occurs in a predetermined discharge cell, and visible light is generated in the discharge cell to display an image.

On the other hand, if the space of the discharge cells in which the discharge occurs is not partitioned separately, the discharge cells are discharged from the discharge cells that should not be discharged, or the light emitted by the discharge spreads. The problem that occurs occurs.

In order to solve the above problems, barrier ribs are formed to partition the discharge cells of the plasma display panel, and there are various methods of manufacturing such barriers, and a widely used method is chemically using an etching solution. There is a chemical etching method of etching by means of etching and a sandblast method of physically etching using a predetermined abrasive.

2A to 2C are diagrams for describing an etching process which is an example of a manufacturing process of a conventional plasma display panel.

In other words, the plasma display panel is formed by a plurality of processes. In order to form a partition wall or an electrode on either the front substrate or the rear substrate, a photoresist film, that is, a dry film, is formed to form a partition paste or an electrode paste. As an example of a laminating process using a resin (Dry Film Resin (hereinafter referred to as DFR)), only a process of manufacturing a partition paste is described.

First, referring to FIG. 2A, a lower dielectric layer 41 is formed on a rear substrate 40 on which an address electrode (not shown) is formed, and a partition paste having a predetermined thickness is formed on an upper surface of the lower dielectric layer 41. 31) is formed.

On the upper surface of the barrier paste 31, a predetermined photoresist film, for example, dry film resin (hereinafter referred to as DFR) 42, is formed through a laminating process or the like.

On the upper side of the DFR 42, photomasks without the drawing representations are aligned and subjected to an exposure process by a photomask, followed by a developing process.

The DFR 42 of the region (hereinafter referred to as 'non-exposure region') not exposed to light by this developing process remains on the partition paste 31, while the region exposed to light (hereinafter referred to as 'exposure region'). DFR 42 is etched and removed to form a shape as shown in FIG. 2B.

Subsequently, the etching apparatus 44 injects the etching liquid onto the partition paste 31 and the DFR 42 which have undergone the above-described development process.

At this time, as shown in FIG. 2B, the paste 31 corresponding to the partition wall is protected by the DFR 42 pattern, and the partition paste without the DFR 42 pattern formed is scraped off by the etching liquid.

When the partition paste 31 is etched by the etching solution after the above process, a discharge space is formed between the partition walls, and the DFR 42 pattern is removed by a separate peeling process, and is formed as shown in FIG. 2C.

That is, the peeling process is removed by a sand blasting method or an etching process, and when the peeling process is completed, another cleaning process, an ultrasonic cleaning process, is performed.

Of course, this process is not limited to the process for forming the partition paste 31, and the same applies to all processes using the DFR 42 pattern, such as a process for forming an electrode.

On the other hand, the following problems occurred during the above series of processes.

That is, after forming the electrode or the partition using the DFR pattern, a peeling process for removing the DFR pattern remaining on the electrode or the upper side of the partition by the sand blasting or etching method is peeled and removed again by ultrasonic Since the cleaning process has to go through, there is a problem in that the productivity by a large number of processes is lowered.

In addition, there was a problem in that the economic loss that must be provided with a separate facility because it has to go through a peeling process and an ultrasonic cleaning process.

Accordingly, an object of the present invention, namely, an object of the present invention, occurs during a process of using a photoresist using a DFR pattern to form an electrode or barrier paste on one of a front substrate and a rear substrate of a plasma display panel. In order to solve the problem, the DFR pattern of the plasma display panel which peels and cleans the DFR pattern remaining on the electrode or the upper side of the electrode or the partition by a single process after forming the electrode or the partition using the DFR pattern. The purpose is to provide a removal device.

Another object of the present invention is to provide a plasma display panel DFR pattern removal apparatus that reduces the number of processes by removing and cleaning the DFR pattern of the plasma display panel by a single process, thereby improving productivity and thus preventing economic loss. It is.

In order to achieve the above object, an embodiment of the present invention, a peeling vessel containing a peeling solution for peeling the DFR (Dry Film Photo Resist) remaining on the partition wall of the plasma display panel, and the inside or the outside of the peeling vessel It is disposed on, and provides a DFR pattern removal apparatus of the plasma display panel including a vibration means for vibrating the peeling solution contained in the peeling container.

Here, it is effective that the concentration of sodium carbonate (Na 2 Co 3) in the stripping solution is 5% or more and 10% or less.

In addition, the vibration means is effectively an ultrasonic vibrator.

Hereinafter, a preferred embodiment of the present invention for effectively implementing the above object will be described in detail.

Figure 3 is a cross-sectional view showing an embodiment of the DFR pattern removal apparatus applied in the present invention.

For convenience of description, the process until the peeling process for removing the DFR to which the present invention is applied is the same as described in detail in the related art, and thus a separate description thereof will be omitted and the construction of the DFR removing apparatus applied in the present invention will be omitted. Only its operation will be described.

As shown in the drawing, the present invention is directed to a laminating process using DFR (Dry Film Resin) on the paste to form an electrode paste or a barrier paste formed on any one of the front substrate and the rear substrate of the plasma display panel. This forms an electrode paste or a partition paste.                     

When the paste is formed by the above process, the DFR attached to the upper side of the paste is formed to form the paste, and the remaining DFR is subjected to a separate peeling and washing process of the DFR.

At this time, the DFR pattern removal apparatus 200 applied in the present invention is a vibration means for causing vibration with respect to the peeling solution 220 contained in the container on one side of the container 210, the inside of the container 210 containing the peeling solution 220 230 is provided.

It is effective that 100% of the stripping solution has a concentration of 5% or more and 10% or less of sodium carbonate (Na2Co3).

In addition, the vibration means 230 for effectively implementing the object of the present invention is effectively an ultrasonic vibrator.

The operation of the present invention configured as described above will be described.

That is, in order to form a partition on the back substrate 40 after all processes using the DFR 42 pattern using the photoresist, the paste is protected by the DFR pattern in the same manner as the conventional art, and the DFR pattern is not formed. The bulkhead paste is scraped off by the etching liquid.

In addition, when the partition wall 31 is formed by the etching solution after the above process, a discharge space is formed between the partition walls 31, and the DFR pattern is removed by a separate peeling process.

However, a feature of the present invention is that it is removed by a single process without peeling and cleaning the DFR pattern.

That is, when the front substrate or the rear substrate 110 is deposited on the container 210 containing the peeling solution 220 according to the present invention and then operating the vibration means 230, an ultrasonic vibrator which is an example of the vibration means 230 The substrate is cleaned by vibrating the peeling solution 220 and thereby peeling off the DFR pattern formed on the upper side of the partition wall 31.

Therefore, since the DFR pattern is peeled and cleaned by a single operation, the productivity is reduced by reducing the number of processes.

In addition, since the DFR pattern is peeled and cleaned by a single operation, the economic loss is reduced by preventing unnecessary equipment investment.

As such, those skilled in the art will appreciate that the present invention can be implemented in other specific forms without changing the technical spirit or essential features thereof. Therefore, the embodiments described above are to be understood as illustrative and not restrictive in all aspects.

The scope of the present invention is shown by the following claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.

As described in detail above, according to the present invention, after forming the electrode or the partition using the DFR pattern, the effect of reducing the number of processes by peeling and cleaning the DFR pattern remaining on the upper side of the electrode or the partition by a single process is effective. have.

In addition, the present invention also has the effect of reducing the number of processes by reducing the number of processes by peeling and cleaning the DFR pattern of the plasma display panel by a single process, thereby preventing economic losses.

Claims (3)

A peeling container containing a peeling solution for peeling the dry film photo resist (DFR) remaining on the upper part of the partition wall of the plasma display panel, Is disposed inside or outside of the peeling vessel, DFR pattern removal apparatus of the plasma display panel including a vibration means for vibrating the peeling solution contained in the peeling vessel. The method of claim 1, The concentration of sodium carbonate (Na 2 Co 3) in the stripping solution is 5% or more 10% or less DFR pattern removal apparatus of the plasma display panel. The method of claim 1, The vibration means is a DFR pattern removal apparatus of the plasma display panel, characterized in that the ultrasonic vibrator.

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