KR20060064412A - Manufacturing method of plasma display panel - Google Patents

Abstract

The present invention relates to a method of manufacturing a plasma display panel.

Such a method of manufacturing a plasma display panel according to the present invention includes a plurality of addresses in a direction intersecting a front panel and a plurality of sustain electrode pairs in which a plurality of sustain electrode pairs are formed by pairing a scan electrode and a sustain electrode on a front glass. Electrodes are bonded to the rear panel arranged on the rear glass at a predetermined interval, and forming the rear panel includes forming an address electrode on the rear glass, and then forming a white back on the address including the rear glass. And forming a partition on the white bag, and dipping the partition into the black coating solution for a predetermined time to form a black layer on the partition.

Plasma Display Panel, Bulkhead, Black Layer, Coating Liquid, Dipping

Description

Manufacturing Method of Plasma Display Panel {MANUFACTURING METHOD OF PLASMA DISPLAY PANEL}

1 is a structural diagram of a typical plasma display panel;

2A through 2E are process diagrams illustrating a black layer forming process of a plasma display panel according to the related art;

3 is a flowchart sequentially illustrating a method of manufacturing a plasma display panel according to the present invention;

4A to 4E are process charts illustrating a black layer forming process of a plasma display panel according to the present invention.

The present invention relates to a plasma display panel, and more particularly, to a method of manufacturing a plasma display panel which can reduce the number of processes and manufacturing cost by changing a method of manufacturing a rear panel of the plasma display panel.

In general, a plasma display panel is a partition wall formed between a front substrate and a rear substrate to form a unit cell, and each cell includes neon (Ne), helium (He), or a mixture of neon and helium (Ne + He) and An inert gas containing the same main discharge gas and a small amount of xenon is filled. When discharged by a high frequency voltage, the inert gas generates vacuum ultraviolet rays and emits phosphors formed between the partition walls to realize an image. Such a plasma display panel has a spotlight as a next generation display device because of its thin and light configuration.

1 illustrates a structure of a general plasma display panel.

As shown in FIG. 1, a plasma display panel includes a front substrate in which a plurality of sustain electrode pairs formed by pairing a scan electrode 102 and a sustain electrode 103 are formed on a front glass 101, which is a display surface on which an image is displayed. The rear substrate 110 having the plurality of address electrodes 113 arranged to intersect the plurality of sustain electrode pairs on the back glass 111 forming the back surface 100 and the rear surface is coupled in parallel with a predetermined distance therebetween. .

The front substrate 100 is made of a scan electrode 102 and a sustain electrode 103, that is, a transparent electrode (a) formed of a transparent ITO material and a metal material to mutually discharge and maintain light emission of the cells in one discharge cell. The scan electrode 102 and the sustain electrode 103 provided as the bus electrode b are included in pairs. The scan electrode 102 and the sustain electrode 103 are covered by one or more upper dielectric layers 104 that limit the discharge current and insulate the electrode pairs, and to facilitate the discharge conditions on the upper dielectric layer 104 top surface. A protective layer 105 on which magnesium oxide (MgO) is deposited is formed.

The rear substrate 110 is arranged in such a manner that a plurality of discharge spaces, that is, barrier ribs 112 of a stripe type (or well type) for forming discharge cells are maintained in parallel. In addition, a plurality of address electrodes 113 for performing address discharge to generate vacuum ultraviolet rays are disposed in parallel with the partition wall 112. On the upper side of the rear substrate 110, R, G, and B phosphors 114 which emit visible light for image display during address discharge are coated. A lower dielectric layer 115 is formed between the address electrode 113 and the phosphor 114 to protect the address electrode 113.

Here, the above-described partition 112, the upper surface of the front glass 101 absorbs the external light generated from the outside to reduce reflection and improve the color purity (purity) and contrast of the front glass 101, etc. The black layer 116 functioning as an array is configured.

As such, the plasma display panel having the structure uses micro discharges to generate visible light in the cells in which the discharges are generated. Barrier ribs are formed between the cells to separate neighboring cells. In addition, a black layer is formed on the partition wall to prevent unnecessary light from being discharged during discharge, thereby reducing the contrast characteristics of the plasma display panel.

2A to 2E illustrate a process of forming a black layer of a plasma display panel according to the related art.

First, referring to FIG. 2A, a lower dielectric 21 is formed on a lower substrate 20 on which an address electrode (not shown) is mounted, and a partition paste 22 having a predetermined thickness is formed on the lower dielectric 21. ) Is formed, and a black layer paste 23 is formed on the partition paste 22. At this time, the partition paste 22 and the black layer paste 23 are formed by any one of a printing method and a coating method using a black material in order to reduce the reflectance caused by external light. Thereafter, a dry film resin (hereinafter referred to as DFR) 24 is formed on the black layer paste 23 through a laminating process.

Referring to FIG. 2B, the photomask 25 is aligned on the DFR 24 to irradiate light, and after the exposure process of the DFR 24, a developing process is performed.

Referring to FIG. 2C, the DFR 24 of the region exposed to light by the developing process (hereinafter referred to as 'exposure region') remains on the black layer paste 23, while the region not exposed to light ( The DFR 24 of the 'unexposed area' is etched away.

Referring to FIG. 2D, the sand blasting apparatus 50 is positioned and driven on the partition paste 22, the black layer paste 22, and the DFR 24 that have undergone the above-described development process, thereby driving sand particles to the black layer paste 23. ) And the partition paste 22. At this time, the black layer paste 23 and the partition wall paste 22 are scraped due to the sputtering of the sand particles, whereas the paste 22 corresponding to the partition wall and the black layer paste 23 formed on the partition wall have a DFR ( 24) It is protected by a pattern.

Referring to FIG. 2E, when the black layer and the partition wall formed by being protected by the DFR 24 appear after the sand blasting process, the formed black layer and the partition wall are peeled off to remove the DFR 24. Next, the black layer paste 23 and the partition wall paste 22 are fired. As a result, the black layer on the partition and the upper part of the partition is completed, and a discharge space is formed between the partitions.                         

However, in the method of manufacturing the plasma display panel as described above, the method of forming a black layer on the top of the rear panel partition layer as shown in FIG. 2 is sand blasted together with the partition layer by applying a black layer paste on the entire upper surface of the partition layer. By doing so, there is a problem in that it takes a lot of material cost and processing time.

Accordingly, the present invention is to solve the above-mentioned conventional problems, an object of the present invention is to reduce the material cost of the black layer formed on the partition wall of the lower panel, and to reduce the process time of the plasma panel manufacturing method To provide.

A method of manufacturing a plasma display panel according to the present invention for achieving the above object is to cross a front panel and a plurality of sustain electrode pairs arranged with a plurality of sustain electrode pairs formed by pairing a scan electrode and a sustain electrode on the front glass. A plurality of address electrodes are bonded to the rear panel arranged in the rear glass at a predetermined interval, and the forming of the rear panel includes forming an address electrode on the rear glass, and then including the rear glass. Forming a white bag, forming a barrier on top of the white bag (generally referred to as a dielectric layer; hereinafter referred to as a dielectric layer), and dipping the barrier into a black coating solution for a predetermined time to form a top of the barrier. Forming a black layer.

In this case, the black coating liquid dipped over the partition wall is preferably a non-conductive material and an aqueous solution of at least one or more of iron (Fe), copper (Cu), and manganese (Mn), and the length of the partition wall dipped into the black coating liquid is total. It is characterized by being 1/8 or more and 1/10 or less with respect to the length of a partition.

Hereinafter, the accompanying drawings for the manufacturing method of the display panel according to an embodiment of the present invention will be described in detail.

3 is a view sequentially illustrating a method of manufacturing a plasma display panel according to the present invention.

As shown in FIG. 3, the method of manufacturing a plasma display panel according to the present invention includes an assembly process including a front panel manufacturing process listed on the right side of FIG. 3, a rear panel manufacturing process listed on the left side, and a sealing process listed below. This includes.

First, the manufacturing process of the front panel listed on the right side of FIG. 3 is as follows.

The front panel first prepares a front glass as a substrate (30), and then a plurality of sustain electrode pairs are formed on the front glass (31). Then, an upper dielectric layer is formed 32 on the sustain electrode pair, and a protective layer made of Mgo for protecting the sustain electrode pair is formed 33 on the upper dielectric layer.

Next, the rear panel manufacturing process listed on the left side of FIG. 3 will be described.

Like the front panel, the rear panel prepares a rear glass which is a substrate (30), and a plurality of address electrodes are formed on the rear glass so as to face each other by crossing the sustain electrode pair formed on the front panel (35). Then, a lower dielectric layer is formed on the upper surface of the address electrode (36), and a fluorescent layer is formed on the upper surface of the lower dielectric layer (37).                     

The front panel and the rear panel thus manufactured are sealed 38 to form a plasma display panel 39.

In the plasma display panel according to the present invention formed through such a manufacturing process, the manufacturing process of the rear panel will be described in more detail with reference to FIG. 4.

4A to 4E are process diagrams illustrating a process of forming a black layer on the partition wall of the plasma display panel according to the present invention.

First, referring to FIG. 4A, a dielectric material 41 is formed on a lower substrate 40 on which an address electrode (not shown) is mounted, and a partition paste 42 having a predetermined thickness is formed on the dielectric material 41. Is formed. At this time, the partition paste 42 is formed by any one of a printing method and a coating method using a black material in order to reduce the reflectance caused by external light. Thereafter, a dry film resin (hereinafter referred to as DFR) 43 is formed on the partition paste 42 through a laminating process, and the photo mask 45 is aligned on the DFR 43 so that light This is investigated.

Referring to FIG. 4B, after the DFR 43 exposure process, a development process is performed. The DFR 43 of the region exposed to light by this developing process (hereinafter referred to as 'exposure region') remains on the partition paste 42, while the region not exposed to light (hereinafter referred to as 'unexposed region'). DFR 43 is etched away.

Referring to FIG. 4C, sand particles are sprayed onto the partition face 42 by driving the sand blasting device 60 on the partition paste 42 and the DFR 43 that have undergone the above-described development process. At this time, the partition paste 42 is scraped due to the sputtering of the sand particles, while the paste 42 corresponding to the partition is protected by the DFR 43 pattern.

Referring to FIG. 4D, when the barrier rib formed to be protected by the DFR 43 appears after the sand blasting process, the barrier rib formed is peeled off to form the DFR 43. Next, the partition paste 42 is fired. As a result, the partition is completed, and a discharge space is formed between the partitions.

Referring to FIG. 4E, when the partition paste 42 is fired, the upper part of the partition formed by firing is dipped for a predetermined time so as to be immersed in the non-conductive black coating liquid 70 for about 1/8 to 1/10 of the entire length of the partition. The black layer is formed on the partition wall.

Here, the reason for limiting the length of the partition to be dipped in the black coating liquid when forming the black layer on the upper part of the partition wall is that the longer the length of the partition to be dipped in the black coating liquid, the higher the probability that the black layer becomes conductive, and the portion to which the fluorescent layer is applied This is because when the black layer is formed on the phosphor, the color characteristic of the phosphor may be lowered, thereby reducing color purity.

In addition, the black coating liquid dipped over the partition wall is a non-conductive material, and preferably contains at least one of iron (Fe), copper (Cu), and manganese (Mn).

As such, when the black layer is formed by using the black coating solution on the partition wall, the manufacturing process time of the rear panel may be shortened by forming the black layer by dipping without sandblasting.

Although the above has been shown and described with respect to the preferred embodiments of the present invention, the present invention is not limited to the above-described embodiment, it is usually in the field of the present invention without departing from the gist of the invention claimed in the claims. Those skilled in the art can make various modifications, as well as such changes are within the scope of the claims.

According to the present invention as described above, by forming a panel by dipping the upper part of the partition formed on the rear glass of the plasma display panel to the black coating liquid, the manufacturing process time can be shortened, and at the same time the material cost used to form the black layer can be reduced.

Claims (4)

The front panel includes a plurality of sustain electrode pairs formed by pairing a scan electrode and a sustain electrode on the front glass, and a plurality of address electrodes are arranged at a predetermined interval in a direction crossing the plurality of sustain electrode pairs. In the manufacturing method of the plasma display panel bonded together Forming the rear panel is (a) forming an address electrode on the rear glass and then forming a white back on the address including the rear glass; (b) forming a partition on the white bag; And (c) forming a black layer on the partition by dipping the partition into the black coating solution for a predetermined time; Method of manufacturing a plasma display panel comprising a. The method of claim 1, The black coating solution is a plasma display panel manufacturing method, characterized in that at least one or more aqueous solution of iron (Fe), copper (Cu), manganese (Mn). The method according to claim 1 or 2, The black coating liquid is a non-conductive plasma manufacturing method of the panel. The method of claim 1, And a length of the partition wall dipped into the black coating liquid is 1/8 or more and 1/10 or less with respect to the length of the entire partition wall.

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