KR20060015891A - Chemical exhaust equipment of semiconductor product device - Google Patents

Abstract

The present invention relates to a chemical discharge device of a semiconductor manufacturing equipment that prevents chemicals from flowing back from a buffer tank when a drain pipe is clogged with a foreign material at a bent portion of a pipe when discharging a chemical solution that has completed its life in a wet station facility.

The chemical discharge apparatus of the semiconductor manufacturing equipment for this purpose, the chemical solution and the time water is supplied is cooled down by dilution of the two solutions; A buffer tank for fresh water mixed with the chemical solution from the aspirator; An acid drain line forming a passage for discharging the chemical solution fresh water in the buffer tank; First and second drain lines branching from the acid drain lines; First and second drain valves disposed on the first and second drain lines, respectively, for regulating the discharge passage of the chemicals stored in the buffer tank; chemical solutions installed in the buffer tank and desalted in the buffer tank; A reverse flow sensor for detecting a reverse flow state of the; A controller for generating a valve switching control signal and outputting an alarm generation control signal when the level detected by the reverse flow detection sensor exceeds a set level; And an alarm generating unit for generating an alarm sound by the alarm generating control signal generated from the controller.

In the present invention, when discharging the chemical solution that has reached the end of its life, the drain line connected to the buffer tank is doubled so that one side is blocked so that it is discharged to the other side to prevent clogging of the drain line. It prevents deterioration due to chemical reactions and prevents safety accidents.

Semiconductor Process Bath, Cleaning Bath, Chemical Discharge, Wet Station, Wet Clean

Description

Chemical discharge device of semiconductor manufacturing equipment {CHEMICAL EXHAUST EQUIPMENT OF SEMICONDUCTOR PRODUCT DEVICE}             

1 is a structural diagram of a conventional chemical discharge system

2 is a block diagram of a chemical discharge device of the semiconductor manufacturing equipment according to an embodiment of the present invention

       Explanation of symbols on the main parts of the drawings

1: standby 2: wet station bath

3, 4: drain valve 5: aspirator

6: buffer tank 7: in-line heater

8: Regulation filter 9: Circulation pump

10: Chemical Inflow Hall 11: Sisu

12: auxiliary tank 13: acid drain line

14, 16, 17: discharge pipe 202, 22, 24: first to third elbow

22: Recovery Bath 24: Reaction Bath

26, 28: first and second drain valve 30: controller

32: reverse flow sensor 34, 36: first and second drain lines                 

38: alarm generator

The present invention relates to a chemical discharge device of a semiconductor manufacturing equipment, and in particular, when discharging a chemical solution that has reached the end of its life, a semiconductor manufacturing equipment that prevents chemicals from flowing back from a buffer tank when a drain pipe is blocked by a foreign material at a bent portion of a pipe. It relates to a chemical discharge device of the.

In general, in a semiconductor manufacturing process, a wafer is repeatedly fabricated through photographic, ion diffusion, etching, chemical vapor deposition, and metal deposition, and then manufactured into a semiconductor device chip.

Among various processes, semiconductor devices include etching processes and processes to remove certain components attached to the surface of the wafer by immersing the wafer in a certain chemical, and such a process is performed in wet station equipment. This wet station equipment typically consists of several semiconductor manufacturing process baths.

The wet station includes a loader for transporting a wafer carrier on which a plurality of wafers are mounted to a work position, a solution bath for etching or cleaning, a spin dryer for drying the wafer, and an unloader for transporting the finished wafer carrier. . In particular, the solution tank is equipped with a chemical tank, a washing tank, and a final washing tank according to the nature of the work.                         

On the other hand, if the chemicals in the solution tank is processed for a certain time, the chemicals in the solution tank do not function properly, so the chemicals in the solution tank should be replaced periodically. In general, semiconductor manufacturing equipment is equipped with a system for discharging the expiration of expired chemicals from the solution tank.

1 is a structural diagram of a conventional chemical discharge system.

 Referring to Figure 1, the standby tank (1) is fresh water and the chemical flowing through the chemical inlet pipe 10 and heated to a certain temperature. The wet station bath 2 heats the chemical supplied from the standby tank 1 through the pipeline 15 to a predetermined temperature to perform an etching process or a cleaning process. The auxiliary tank 12 drains the chemicals overflowing from the wet station bath 2 and discharges through the outlet to circulate the fresh chemicals. The chemical contained in the auxiliary tank 12 is heated in the inline heater 7 through the circulation pump 9 and the circulation filter 8 through the discharge pipe 16 installed in the lower portion to the wet station bath 2. Circulated. And the chemical contained in the wet station bath (2) is applied to the aspirator (5) through the discharge pipe (17). The aspirator 5 has two inlets and one outlet. The aspirator 5 is supplied with a chemical solution from the discharge pipe 17 of the two inlets, and the other inlet is supplied with the city water 11 through another pipe, and the two solutions are combined and discharged. . The pipe connected to the outlet of the drawer (5) is connected to the buffer tank (6). The buffer tank 6 is connected to the pipe to which the water is supplied and to the circulator filter 8 in addition to the pipe connected to the aspirator 5 to connect the pipe for discharging the solution therein.                         

After the etching process or the cleaning process is performed in the wet station bath (2), the high temperature chemical solution is discharged through the discharge pipe (17) to the aspirator (5), and is diluted with CITY WATER in the aspirator (5). Is cooled. The chemical solution discharged through the outlet of the aspirator (5) is fresh water in the buffer tank (6), the chemical solution fresh water in the buffer tank (6) is discharged through the acid drain line (13). The first and second drain valves 3 and 4, which are not described herein, are valves for controlling the discharge of the chemical solution discharged through the discharge pipe 17 to the aspirator 5.

As shown in FIG. 1, the conventional chemicals discharging system is used and the remaining chemical solution is mixed with the water in the buffer tank 6 and then discharged through the acid drain line 13, wherein the acid drain line (13) is bent several times in a narrow plenium space, and if the impurity (e.g., chemical coagulation mass and fume) generated in the facility is not discharged and the acid drain line 13 is clogged, the chemical solution is blocked. Backflow. When the chemical flows back, the countercurrent chemical reacts with the chemicals that are not mixed with the time water to generate heat, and the acid drain line 13 is bent and deteriorated by the heat, thereby causing a safety accident. there was.

Accordingly, an object of the present invention is to discharge the chemicals of the semiconductor manufacturing equipment that can prevent the safety accidents caused by the backflow phenomenon by the chemicals discharged through the acid drain line in order to solve the above problems In providing a device.

Chemical discharge apparatus of the semiconductor manufacturing equipment for achieving the above object, the chemical solution and the time is supplied with the aspirator for cooling by dilution of the two solutions; A buffer tank for fresh water mixed with the chemical solution from the aspirator; An acid drain line forming a passage for discharging the chemical solution fresh water in the buffer tank; First and second drain lines branching from the acid drain lines; First and second drain valves disposed on the first and second drain lines, respectively, for regulating the discharge passage of the chemicals stored in the buffer tank; chemical solutions installed in the buffer tank and desalted in the buffer tank; A reverse flow sensor for detecting a reverse flow state of the; A controller for generating a valve switching control signal and outputting an alarm generation control signal when the level detected by the reverse flow detection sensor exceeds a set level; And an alarm generator for generating an alarm sound by the alarm generation control signal generated from the controller.

The controller may close the first drain valve and open the second drain valve when a reverse flow state is detected from the reverse flow sensor while the chemical is discharged to the first drain line.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

2 is a block diagram of a chemical discharge device of the semiconductor manufacturing equipment according to an embodiment of the present invention.

Standby tank (1) for desalination of chemicals flowing through the chemical inlet pipe (10) and heating to a predetermined temperature, and chemicals supplied from the standby tank (1) through the pipeline (15) to a set temperature Wet station bath (2) which is heated and performs etching process or cleaning process, and auxiliary tank which drains chemicals overflowing from the wet station bath (2) and discharges them through the outlet to circulate the fresh water chemicals. (12), a circulation pump (9) for pumping the discharge pipe (16) installed in the lower portion of the auxiliary tank 12 to discharge the chemical contained in the auxiliary tank 12, and the circulation pump (9) Circulation filter (8) for removing impurities by filtering the chemical solution pumped through, and in-line heating the chemical solution from which impurities are removed from the circulation filter (8) to a set temperature (7) and two inlets and one outlet, the chemical solution is supplied from the discharge pipe 17 of the two inlets, and the other inlet is supplied by the CITY WATER 11 through the other pipe. The aspirator 5, which is supplied and discharged by combining the two solutions, is connected to a pipe for supplying water and a circulator filter 8, and a pipe for discharging an internal solution is connected to the aspirator 5. Buffer tank (6) for fresh water mixed with the chemical solution from the side, and the acid drain line (13) which is connected to the buffer tank (6) to form a passage for discharging the chemical solution fresh water in the buffer tank (6) And a first elbow (20) installed on the acid drain line (13) and branching from an acid drain line (13) connected to the first elbow (20) for bending the discharge pipe. First and second drain lines 34 and 36, and the first and second drain lines 34 and 36. The third and second drain valves 26 and 28 installed on the first and second drain lines 34 and 36 to control the discharge passage of the chemicals stored in the buffer tank 6 respectively. Second and third elbows 22 and 24 respectively installed to bend the discharge pipe, and a counter current flow sensor installed in the buffer tank 6 to detect a level of a chemical solution that is fresh in the buffer tank 6 ( 32), a controller 30 for generating a valve switching control signal and outputting an alarm generation control signal when the water level detected by the backflow detection sensor 32 exceeds a set water level or more, and the controller; An alarm generation unit 38 is configured to generate an alarm sound by the alarm generation control signal generated from 30.

Referring to Figure 2 described above will be described in detail the operation of recycling the chemical supply of the preferred embodiment of the present invention.

Standby tank (1) is a fresh water flowing through the chemical inlet pipe 10 and heated to a certain temperature. The wet station bath 2 heats the chemical supplied from the standby tank 1 through the pipeline 15 to a predetermined temperature to perform an etching process or a cleaning process. The auxiliary tank 12 drains the chemicals overflowing from the wet station bath 2 and discharges through the outlet to circulate the fresh chemicals. The chemical contained in the auxiliary tank 12 is heated in the inline heater 7 through the circulation pump 9 and the circulation filter 8 through the discharge pipe 16 installed in the lower portion of the auxiliary tank 12 and wetted. Circulated to the station bath (2).                     

After the etching process or the cleaning process is performed in the wet station bath (2), the high temperature chemical solution is discharged to the aspirator (5) through the discharge pipe (17), and is diluted with CITY WATER in the aspirator (5). By cooling. The chemical solution discharged through the outlet of the aspirator (5) is fresh water in the buffer tank (6), the chemical solution fresh water in the buffer tank (6) is discharged through the acid drain line (13). The first and second drain valves 3 and 4, which are not described herein, are valves for controlling the discharge of the chemical solution discharged through the discharge pipe 17 to the aspirator 5. The acid drain line 13 is branched into first and second drain lines 34 and 36. The third drain valve 26 is opened by the control of the controller 30 and the fourth drain valve 28 is closed. Then, the chemical solution discharged through the acid drain line 13 is discharged through the third drain valve 26 and the first drain line 34. However, when the first drain line 34 is blocked, the chemical solution discharged through the acid drain line 13 is flowed back so that the water level of the buffer tank 6 is increased. In this case, the backflow detection sensor 32 is a buffer tank. (6) detects the water level and provides it to the controller (30). When the level of water detected by the counter flow sensor 32 is higher than the set water level, the controller 30 closes the third drain valve 26 and opens the fourth drain valve 28 when the water level is higher than the set water level. The chemical solution discharged through the drain line 13 is discharged to the second drain line 36.

In addition, when the second drain line 36 is blocked, the controller 30 detects the reverse flow state when the water level detected by the reverse flow detection sensor 32 is higher than the set water level and opens the third drain valve 26. The fourth drain valve 28 is closed to discharge the chemical solution discharged through the acid drain inline 13 to the first drain line 34.

The first to third elbows 20, 22, and 24, which are not described herein, are used to fold the drain line, and the pipes are cleaned at the time of facility process management (PM) by simplifying disassembly and assembly by bolting to the connection part. Can respond quickly in case of leak.

As described above, in the present invention, when discharging the chemical solution which has reached the end of its life, the drain line connected to the buffer tank is doubled so that one side is blocked so as to be discharged to the other to prevent clogging of the drain line, thereby preventing the backflow of the chemical. Due to this there is an advantage to prevent degradation due to the reaction of the chemical in the pipe and also to prevent safety accidents.

In addition, when discharging chemical solution, it is possible to double the drain line connected to the buffer tank so that if one side is blocked, it is discharged to the other side and the mixed drain line can be operated without downtime of the equipment, thereby increasing productivity. .

Claims (4)

In the chemical discharge device of the semiconductor manufacturing equipment, An aspirator supplied with a chemical solution and time water to be cooled and discharged by dilution of the two solutions; A buffer tank for freshening the chemical solution mixed from the aspirator; An acid drain line forming a passage for discharging the chemical solution fresh water in the buffer tank; First and second drain lines branching from the acid drain lines; First and second drain valves disposed on the first and second drain lines, respectively, for regulating the discharge passage of chemicals desalted in the buffer tank; A reverse flow sensor installed in the buffer tank and detecting a reverse flow state of the chemical solution freshwater in the buffer tank; A controller for generating a valve switching control signal and outputting an alarm generation control signal when the level detected by the reverse flow detection sensor exceeds a set level; Chemical discharge apparatus of the semiconductor manufacturing equipment comprising a. The method of claim 1, The reverse flow sensor is a chemical discharge device of the semiconductor manufacturing equipment, characterized in that the water level sensor for detecting the water level of the buffer tank. The method of claim 2, The chemical discharge device of the semiconductor manufacturing equipment, characterized in that it further comprises an alarm generating an alarm sound by the alarm generation control signal generated from the controller. The method of claim 3, Wherein the controller closes the first drain valve and opens the second drain valve when a reverse flow condition is detected from the reverse flow sensor while the chemical is discharged to the first drain line. Chemical discharge device in the installation.

Images