KR20050109258A - Magnetic driven shutter - Google Patents
Magnetic driven shutter Download PDFInfo
- Publication number
- KR20050109258A KR20050109258A KR1020040034331A KR20040034331A KR20050109258A KR 20050109258 A KR20050109258 A KR 20050109258A KR 1020040034331 A KR1020040034331 A KR 1020040034331A KR 20040034331 A KR20040034331 A KR 20040034331A KR 20050109258 A KR20050109258 A KR 20050109258A
- Authority
- KR
- South Korea
- Prior art keywords
- magnet
- shutter
- chamber
- drive
- driven
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K3/00—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
- F16K3/02—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor
- F16K3/16—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with special arrangements for separating the sealing faces or for pressing them together
- F16K3/18—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with special arrangements for separating the sealing faces or for pressing them together by movement of the closure members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
본 발명은 마그네틱 구동을 이용한 셔터 어셈블리에 관한 것으로, 챔버의 기판 출입구를 개방 및 폐쇄시키는 회전식 셔터; 상기 셔터에 회전력을 부여하는 축; 상기 축의 일단부에 마련된 피동 자석; 상기 챔버를 둘러싸는 바디를 사이에 두고 상기 피동 자석과 대면하는 구동 자석; 및 상기 구동 자석에 회전력을 전달하는 구동원을 포함하는 것을 특징으로 한다. 이에 의하면, 바디에 홀을 형성할 필요가 없으므로 바디 내의 환경 기밀성이 보장되어 누출 현상이 없어진다.The present invention relates to a shutter assembly using magnetic drive, comprising: a rotary shutter for opening and closing a substrate entrance of a chamber; An axis to impart rotational force to the shutter; A driven magnet provided at one end of the shaft; A drive magnet facing the driven magnet with a body surrounding the chamber therebetween; And a drive source for transmitting rotational force to the drive magnet. This eliminates the need to form holes in the body, thereby ensuring environmental airtightness in the body and eliminating leakage.
Description
본 발명은 셔터 어셈블리에 관한 것으로, 보다 상세하게는 마그네틱을 이용하여 개폐 구동을 구현하는 셔터 어셈블리에 관한 것이다.The present invention relates to a shutter assembly, and more particularly to a shutter assembly for implementing the opening and closing drive using a magnetic.
반도체 메모리 소자의 기판으로 사용되는 웨이퍼(wafer), 액정디스플레이 또는 플라즈마 디스플레이 패널로 사용되는 평판 기판 등의 위에는 소정의 박막과 금속막 등 여러 공정을 거쳐 메모리 소자나 디스플레이 소자로 제조된다. 이러한 각 공정은 외부와는 격리된 환경을 제공하는 챔버(chamber)라는 장비내에서 진행된다. 따라서, 챔버에는 기판의 출입을 허용하는 도어(door)를 개폐할 수 있는 셔터(shutter)가 마련되는 것이 종래이다.On a wafer used as a substrate of a semiconductor memory device, a flat substrate used as a liquid crystal display or a plasma display panel, and the like, a semiconductor device is manufactured as a memory device or a display device through various processes such as a predetermined thin film and a metal film. Each of these processes is carried out in equipment called chambers that provide an environment that is isolated from the outside. Therefore, the chamber is conventionally provided with a shutter that can open and close the door (allowing the entrance and exit of the substrate).
이러한 셔터의 개폐 동작을 구현하기 위해선 모터나 실린더와 같은 구동 장치가 필수적이다. 그런데, 셔터의 구동 장치는 챔버를 둘러싸는 바디 외부에 설치되는 것이 일반적이다. 그런데, 종래의 셔터는 축의 회전에 의해서 동작하므로 축이 설치될 수 있게끔 바디에는 홀이 가공되어야 한다. 이렇게 바디에 홀이 가공되어 있으면 홀을 통해 공정에 사용되는 화학약품이 외부로 누출될 수 있거나, 또는 외부로부터 바디 내부로 특정 물질이 들어가게 되어 바디 내부의 환경이 오염될 수 있는 문제점이 있다.In order to implement the opening and closing operation of the shutter, a driving device such as a motor or a cylinder is essential. By the way, the driving device of the shutter is generally installed outside the body surrounding the chamber. However, since the conventional shutter operates by the rotation of the shaft, a hole must be processed in the body so that the shaft can be installed. Thus, when the hole is processed in the body, chemicals used in the process may leak to the outside through the hole, or a specific material may enter the body from the outside to contaminate the environment inside the body.
이에 본 발명은 상기한 종래 기술상의 문제점을 해결하기 위하여 안출된 것으로, 본 발명의 목적은 바디 내의 기밀성이 담보될 수 있는 셔터 어셈블리를 제공함에 있다.Accordingly, the present invention has been made to solve the above-described problems in the prior art, an object of the present invention to provide a shutter assembly that can be ensured airtightness in the body.
상기한 목적을 달성하기 위한 본 발명에 따른 셔터 어셈블리는 마그네틱을 이용하여 개폐 구동이 가능한 것을 특징으로 한다.Shutter assembly according to the present invention for achieving the above object is characterized in that the opening and closing drive using the magnetic.
상기 특징을 구현할 수 있는 본 발명에 따른 셔터 어셈블리는 챔버의 기판 출입구를 개방 및 폐쇄시키는 회전식 셔터; 상기 셔터에 회전력을 부여하는 축; 상기 축의 일단부에 마련된 피동 자석; 상기 챔버를 둘러싸는 바디를 사이에 두고 상기 피동 자석과 대면하는 구동 자석; 및 상기 구동 자석에 회전력을 전달하는 구동원을 포함하는 것을 특징으로 한다.Shutter assembly according to the present invention that can implement the above features a rotary shutter for opening and closing the substrate entrance of the chamber; An axis to impart rotational force to the shutter; A driven magnet provided at one end of the shaft; A drive magnet facing the driven magnet with a body surrounding the chamber therebetween; And a drive source for transmitting rotational force to the drive magnet.
이 실시예에 의하면, 상기 피동 자석과 상기 구동 자석은 원반 형태인 것을 특징으로 한다. 상기 피동 자석은 상기 구동 자석의 회전력을 자력에 의해 전달받아 상기 구동 자석이 회전될 때 동시에 회전되는 것을 특징으로 한다. 상기 셔터의 일부분에 제1자석이 더 포함하고, 상기 챔버에는 상기 제1자석과는 다른 극성을 가진 제2자석이 더 포함하는 것을 특징으로 한다. 상기 제1자석과 상기 제2자석의 자력 세기는 상기 피동 자석 및 상기 구동 자석의 자력 세기에 비해 상대적으로 작은 것을 특징으로 한다.According to this embodiment, the driven magnet and the drive magnet are characterized in that the disk shape. The driven magnet may be rotated at the same time when the driving magnet is rotated by receiving the rotational force of the driving magnet by the magnetic force. A first magnet is further included in a portion of the shutter, and the chamber further comprises a second magnet having a polarity different from that of the first magnet. The magnetic strength of the first magnet and the second magnet is relatively small compared to the magnetic strength of the driven magnet and the driving magnet.
본 발명에 따른 마그네틱을 이용한 셔터 어셈블리에 의하면 바디에 홀을 형성할 필요가 없으므로 바디 내의 환경 기밀성이 보장되어 누출 현상이 없어진다.According to the shutter assembly using the magnetic according to the present invention, there is no need to form a hole in the body, thereby ensuring environmental airtightness in the body, thereby eliminating a leak phenomenon.
본 발명에 따른 마그네틱을 이용한 셔터 어셈블리를 첨부한 도면을 참조하여 상세히 설명한다.With reference to the accompanying drawings, a shutter assembly using a magnetic according to the present invention will be described in detail.
본 발명과 종래 기술과 비교한 이점은 첨부된 도면을 참조한 상세한 설명과 특허청구범위를 통하여 명백하게 될 것이다. 특히, 본 발명에 따른 반도체 소자의 제조 장치는 특허청구범위에서 잘 지적되고 명백하게 청구된다. 그러나, 본 발명에 따른 반도체 소자의 제조 장치는 첨부된 도면과 관련해서 다음의 상세한 설명을 참조함으로써 가장 잘 이해될 수 있다. 도면에 있어서 동일한 참조부호는 다양한 도면을 통해서 동일한 구성요소를 나타낸다.Advantages over the present invention and prior art will become apparent through the description and claims with reference to the accompanying drawings. In particular, a device for manufacturing a semiconductor device according to the present invention is well pointed out and claimed in the claims. However, the apparatus for manufacturing a semiconductor device according to the present invention can be best understood by referring to the following detailed description with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements throughout the various drawings.
(실시예)(Example)
도 1을 참조하면, 본 발명에 따른 마그네틱 구동을 이용한 셔터 어셈블리는 셔터(100)를 회전시키는 축(120)과는 소정의 연결 부재(110)와 연결된다. 여기서, 셔터(100)는 특정 공정이 진행되는 챔버(90) 일부분에 형성된 기판 출입구(80)를 선택적으로 개방시키거나 이를 폐쇄시키는 장치이다.Referring to FIG. 1, a shutter assembly using magnetic driving according to the present invention is connected to a predetermined connecting member 110 and an axis 120 for rotating the shutter 100. Here, the shutter 100 is a device for selectively opening or closing the substrate entrance 80 formed in a portion of the chamber 90 in which a specific process is performed.
셔터(100)와 출입구(80)와 직접 맞닿는 셔터 일부분(102)에는 직접적인 마찰로 인해 발생되는 셔터(100)의 부분적 마모를 방지하여 챔버 내의 기밀성을 확보하기에 적합한 부재로 이루어지는 것이 바람직하다. 예를 들어, 기밀 부재(102)는 탄력성이 있으며 내마모성이 있는 수지 등으로 이루어질 수 있다.The shutter portion 102 which is in direct contact with the shutter 100 and the entrance and exit 80 is preferably made of a member suitable for securing airtightness in the chamber by preventing partial wear of the shutter 100 caused by direct friction. For example, the airtight member 102 may be made of a resin having elasticity and wear resistance.
후술하는 바와 같이, 축(120)의 회전에 의해 셔터(100)는 화살표 방향(A)으로 회전하여 출입구(80)를 폐쇄시킨다. 이때, 셔터(100)가 열리지 아니하고 출입구(80)를 폐쇄하는 상태를 계속적으로 확보하기 위해 셔터의 일부분(104a)과 챔버(90)의 일부분(104b)에 각각 접촉 부재, 예를 들어, 자석을 내장하는 것이 바람직하다. 예를 들어, 셔터(100)의 자석(104a) 극성은 N극이고, 챔버(90)의 자석(104b)은 S극일 수 있다. 이에 따라, N극과 S극의 인력 작용에 의해 셔터(100)는 챔버(90)의 벽에 계속적으로 접촉하게 출입구(80)의 폐쇄를 온전히 유지할 수 있게 된다.As will be described later, the shutter 100 rotates in the arrow direction A by the rotation of the shaft 120 to close the doorway 80. In this case, the contact member, for example, a magnet may be attached to each of the part 104a of the shutter and the part 104b of the chamber 90 to continuously secure the state in which the shutter 100 is not opened and the doorway 80 is closed. It is preferable to incorporate. For example, the polarity of the magnet 104a of the shutter 100 may be N pole, and the magnet 104b of the chamber 90 may be S pole. Accordingly, due to the attractive force of the north pole and the south pole, the shutter 100 can maintain the closing of the entrance and exit 80 in full contact with the wall of the chamber 90.
도 2를 참조하면, 축(120)의 회전은 마그네틱 구동을 이용한다. 즉, 챔버(90)를 둘러싸는 바디(300)쪽을 향하는 축(120)의 일단부에는 자석(220;이하, 피동 자석)이 달려있다. 그리고, 바디(300)를 사이에 두고 축(120)과 연결된 자석(220) 너머에는 또 다른 자석(200;이하, 구동 자석)이 모터(210)의 구동축(230) 일단부에 달려있다. 피동 자석(220)과 달리 구동 자석(200)은 구동원인 모터(210)의 회전력을 전달받아 회전할 수 있다. 자석(220,200)을 이용함으로써 종래와 같이 바디(300)에 축(120) 설치를 위한 홀을 형성할 필요가 없다.Referring to FIG. 2, the rotation of the shaft 120 uses magnetic drive. That is, a magnet 220 (hereinafter referred to as a driven magnet) is attached to one end of the shaft 120 facing toward the body 300 surrounding the chamber 90. Further, another magnet 200 (hereinafter, referred to as a driving magnet) may be positioned at one end of the driving shaft 230 of the motor 210 beyond the magnet 220 connected to the shaft 120 with the body 300 interposed therebetween. Unlike the driven magnet 220, the driving magnet 200 may rotate by receiving the rotational force of the motor 210 as the driving source. By using the magnets 220 and 200, there is no need to form a hole for installing the shaft 120 in the body 300 as in the related art.
피동 자석(220)과 구동 자석(200)은 구동 자석(200)이 모터(210)에 의해 회전될 때 자력(Magnetic force)에 의해 피동 자석(220)도 같은 속도로 회전될 수 있을만큼의 자력 세기를 가져야 할 것이다. 그리고, 양 자석(200,220)간의 간격도 마찬가지일 것이다. 한편, 도 1에 도시된 바와 같이, 셔터(100)와 챔버(90)의 일부분에도 각각 자석(104a,104b)이 있는 바, 이 자석(104a,104b)의 자력 세기는 피동 및 구동 자석(220,200)의 자력에 비해 상대적으로 작아야 할 것이다. 그래야만, 구동 자석(200)의 회전이 피동 자석(220)의 회전을 유발하고, 결과적으로 셔터(100)가 개방 또는 폐쇄 방향으로 움직여야 하기 때문이다. 한편, 피동 자석(220)과 구동 자석(200)의 형태는 큰 원반 형태인 것이 회전에 도움이 될 것이다. The driving magnet 220 and the driving magnet 200 are magnetic force enough to allow the driving magnet 220 to be rotated at the same speed by the magnetic force when the driving magnet 200 is rotated by the motor 210. It should have a century. The same may be true between the magnets 200 and 220. Meanwhile, as shown in FIG. 1, the magnets 104a and 104b are also present in the shutter 100 and the part of the chamber 90, respectively, and the magnetic strengths of the magnets 104a and 104b are driven and driven magnets 220 and 200. It should be relatively small compared to the magnetic force of). This is because the rotation of the drive magnet 200 causes the rotation of the driven magnet 220, and consequently the shutter 100 must move in the open or closed direction. On the other hand, the shape of the driven magnet 220 and the drive magnet 200 is a large disk shape will help the rotation.
상기와 같이 구성된 마그네틱을 이용한 셔터 어셈블리는 다음과 같이 동작한다.The shutter assembly using the magnetic structure configured as described above operates as follows.
도 1 및 도 2를 다시 참조하면, 소정의 공정을 진행되어야 할 기판(70)이 출입구(80)를 통해 챔버(90) 내부로 들어오게 되면, 챔버(90) 내부 환경을 외부와 격리시키기 위해 셔터(100)가 회전하여 출입구(80)를 폐쇄한다. 셔터(100)의 구동 자석(200)과 피동 자석(220) 사이의 자력에 의한다. 일단 모터(210)가 구동하면 모터 구동축(230) 끝부분에 달린 구동 자석(200)이 회전하게 된다. 일단 구동 자석(200)이 회전하게 되면 바디(300) 너머에 있는 피동 자석(220)은 같은 방향과 같은 속도로 회전된다. 피동 자석(220)이 회전하게 되면 축(120)도 같이 회전하게 되어 셔터(100)가 회전되어 출입구(80)를 폐쇄한다. 한편, 셔터(100)와 챔버(90)는 접촉 부재, 즉 약한 자력을 갖는 자석(104a,104b)에 의해 폐쇄 상태를 온전히 유지한다. 챔버(90)내의 기판(70)에 대한 소정의 공정이 완료되면 상기와 같은 작용으로 출입구(80)는 개방된다.Referring again to FIGS. 1 and 2, when the substrate 70 to be subjected to a predetermined process enters the chamber 90 through the doorway 80, to isolate the environment inside the chamber 90 from the outside. The shutter 100 rotates to close the doorway 80. By the magnetic force between the driving magnet 200 and the driven magnet 220 of the shutter 100. Once the motor 210 is driven, the drive magnet 200 attached to the end of the motor drive shaft 230 is rotated. Once the driving magnet 200 is rotated, the driven magnet 220 over the body 300 is rotated at the same speed and the same direction. When the driven magnet 220 is rotated, the shaft 120 is also rotated so that the shutter 100 is rotated to close the doorway 80. On the other hand, the shutter 100 and the chamber 90 are kept intact by the contact members, that is, magnets 104a and 104b having weak magnetic force. When the predetermined process for the substrate 70 in the chamber 90 is completed, the doorway 80 is opened by the above operation.
이상의 상세한 설명은 본 발명을 예시하는 것이다. 또한 전술한 내용은 본 발명의 바람직한 실시 형태를 나타내고 설명하는 것에 불과하며, 본 발명은 다양한 다른 조합, 변경 및 환경에서 사용할 수 있다. 그리고, 본 명세서에 개시된 발명의 개념의 범위, 저술한 개시 내용과 균등한 범위 및/또는 당업계의 기술 또는 지식의 범위 내에서 변경 또는 수정이 가능하다. 전술한 실시예들은 본 발명을 실시하는데 있어 최선의 상태를 설명하기 위한 것이며, 본 발명과 같은 다른 발명을 이용하는데 당업계에 알려진 다른 상태로의 실시, 그리고 발명의 구체적인 적용 분야 및 용도에서 요구되는 다양한 변경도 가능하다. 따라서, 이상의 발명의 상세한 설명은 개시된 실시 상태로 본 발명을 제한하려는 의도가 아니다. 또한 첨부된 청구범위는 다른 실시 상태도 포함하는 것으로 해석되어야 한다.The foregoing detailed description illustrates the present invention. In addition, the foregoing description merely shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. And, it is possible to change or modify within the scope of the concept of the invention disclosed in this specification, the scope equivalent to the written description, and / or the skill or knowledge in the art. The above-described embodiments are for explaining the best state in carrying out the present invention, the use of other inventions such as the present invention in other state known in the art, and the specific fields of application and uses of the present invention. Various changes are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.
이상에서 상세히 설명한 바와 같이, 본 발명에 따른 마그네틱을 이용한 셔터 어셈블리에 의하면, 바디에 홀을 형성할 필요가 없으므로 바디 내의 환경 기밀성이 보장되어 누출 현상이 없어진다.As described in detail above, according to the shutter assembly using the magnetic according to the present invention, since it is not necessary to form a hole in the body, the environmental airtightness in the body is ensured and the leakage phenomenon is eliminated.
도 1은 본 발명에 따른 마그네틱 구동을 이용한 셔터 어셈블리를 도시한 측면도.1 is a side view showing a shutter assembly using a magnetic drive according to the present invention.
도 2는 본 발명에 따른 마그네틱 구동을 이용한 셔터 어셈블리를 도시한 정면도.Figure 2 is a front view showing a shutter assembly using a magnetic drive according to the present invention.
< 도면의 주요부분에 대한 부호의 설명 ><Description of Symbols for Major Parts of Drawings>
80; 웨이퍼 출입구 90; 챔버80; Wafer entrance 90; chamber
100; 셔터 102; 기밀 부재100; Shutter 102; Airtight absence
104a, 104b; 접촉 부재 110; 연결 부재104a, 104b; Contact member 110; Connecting member
120; 축 200; 구동 자석120; Axis 200; Driving magnet
210; 모터 220; 피동 자석210; Motor 220; Driven magnet
300; 바디300; body
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020040034331A KR100625313B1 (en) | 2004-05-14 | 2004-05-14 | Magnetic driven shutter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020040034331A KR100625313B1 (en) | 2004-05-14 | 2004-05-14 | Magnetic driven shutter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20050109258A true KR20050109258A (en) | 2005-11-17 |
| KR100625313B1 KR100625313B1 (en) | 2006-09-20 |
Family
ID=37285204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020040034331A KR100625313B1 (en) | 2004-05-14 | 2004-05-14 | Magnetic driven shutter |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100625313B1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100837320B1 (en) * | 2007-05-04 | 2008-06-11 | 주식회사 디엠에스 | An apparatus for processing glass substrate |
| KR20150113946A (en) * | 2015-09-22 | 2015-10-08 | 위순임 | Gate valve assembly for wafer processing system |
| US9627236B2 (en) | 2014-04-11 | 2017-04-18 | Semes Co., Ltd. | Substrate treating apparatus |
| KR20180054946A (en) * | 2016-11-14 | 2018-05-25 | 세메스 주식회사 | Apparatus and Method for treating substrate |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020013265A (en) * | 2000-08-14 | 2002-02-20 | 윤종용 | Magnetic slit door |
| KR20040021840A (en) * | 2002-09-05 | 2004-03-11 | 삼성전자주식회사 | door closing apparatus of semiconductor device fabricating equipment |
-
2004
- 2004-05-14 KR KR1020040034331A patent/KR100625313B1/en not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100837320B1 (en) * | 2007-05-04 | 2008-06-11 | 주식회사 디엠에스 | An apparatus for processing glass substrate |
| US9627236B2 (en) | 2014-04-11 | 2017-04-18 | Semes Co., Ltd. | Substrate treating apparatus |
| KR20150113946A (en) * | 2015-09-22 | 2015-10-08 | 위순임 | Gate valve assembly for wafer processing system |
| KR20180054946A (en) * | 2016-11-14 | 2018-05-25 | 세메스 주식회사 | Apparatus and Method for treating substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100625313B1 (en) | 2006-09-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4293137A (en) | Magnetic liquid shaft sealing | |
| WO2007004690A1 (en) | Magnetic fluid sealing device | |
| US7284571B2 (en) | Valve device | |
| US6340029B1 (en) | Apparatus for opening/closing a valve and method thereof | |
| KR100625313B1 (en) | Magnetic driven shutter | |
| JP5038895B2 (en) | Gate device | |
| JP2006286691A (en) | Apparatus and method of processing substrate | |
| TW202142797A (en) | Pendulum valve | |
| JPH11230386A (en) | Four-way changeover valve | |
| US5057952A (en) | Magnetic fluid sealing apparatus for a magnetic disk drive | |
| JPH0570947A (en) | Vacuum vapor deposition device | |
| KR100855733B1 (en) | Apparatus for processing glass substrate | |
| US6323575B1 (en) | High-efficiency rotating coil torque motor | |
| JP3564038B2 (en) | Shaft sealing device | |
| JP2005180535A (en) | Valve, valve for vacuum and vacuum vessel | |
| KR100828423B1 (en) | Apparatus for processing glass substrate | |
| JP2018162681A (en) | Magnet gear pump and its manufacturing method | |
| JP2018162681A5 (en) | ||
| JPH04347070A (en) | Multistage magnetic fluid sealing device for vacuum | |
| KR20020013265A (en) | Magnetic slit door | |
| JP2557576B2 (en) | Valveless valve | |
| JPH0949505A (en) | Rotary actuator | |
| CN111101110B (en) | Gas inlet integrated structure, process chamber and semiconductor processing equipment | |
| KR102061465B1 (en) | the indicator housing for preventing dew condensation | |
| JPH11158604A (en) | Rotating mechanism of physical vapor deposition apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| FPAY | Annual fee payment |
Payment date: 20090820 Year of fee payment: 4 |
|
| LAPS | Lapse due to unpaid annual fee |