KR20050104600A - Plasma display device - Google Patents

Abstract

The present invention is to provide a plasma display device for improving the heat dissipation performance of the device provided on the driving circuit board by inclining the installation angle of the heat sink or the heat radiation fin angle of the heat sink.

Plasma display device according to the invention, the plasma display panel; A chassis base to attach and support the plasma display panel; Driving circuit boards on opposite sides of the chassis base of the plasma display panel; And heat sinks provided on the elements to dissipate elements mounted in parallel with the driving circuit board, and parallel to the plasma display panel and forming natural convection in oblique directions to the long side and the short side thereof.

Description

Plasma Display Device {PLASMA DISPLAY DEVICE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display apparatus, and more particularly, to a plasma display apparatus for improving the heat dissipation performance of elements included in a driving circuit board by inclining an installation angle of a heat sink or a heat radiation fin angle thereof.

As is well known, a plasma display panel (PDP, hereinafter referred to as 'PDP' for convenience) is a display panel that displays an image by exciting phosphors by vacuum ultraviolet rays caused by gas discharge occurring in a discharge cell. Excellent performance in brightness, contrast, viewing angle, etc., and the large screen is thin and lightweight.

The plasma display device using the PDP includes a PDP for realizing an image, a chassis base for supporting the PDP, a drive board installed on the chassis base facing the PDP, a PDP, a chassis base, and a drive board to surround the PDP. It consists of a case forming an appearance.

This case consists of a front cover located in front of the PDP and a back cover located behind the PDP. In this case, the front cover and the back cover generally form a coupling structure that is decomposable to each other.

The driving circuit boards mounted on the chassis base are composed of a power supply board, an image processing board, a logic board, an address buffer board, an X board, a Y board, and the like, and a plurality of circuit elements are mounted on each board.

However, the circuit elements installed in the driving circuit board generate heat as much as the high voltage current is handled, and if the heat is not sufficiently radiated to the outside, the circuit element may malfunction.

Plasma display device having an example for solving the heat dissipation problem of the driving circuit board is provided with a blowing means such as a fan to seal the space between the back cover and the driving circuit board and forced convection into the space However, such a structure is advantageous for heat dissipation, but makes consumers feel uncomfortable due to noise generated from the fan.

On the other hand, the plasma display device having another example is implemented to exclude the fan as described above and to adopt a plurality of heat sinks to release the heat generated from the driving circuit board by natural convection.

However, this plasma display device arranges and forms the installation angle of the heat sink and the angle of the heat sink heat dissipation fin in parallel with the flow direction of the convective air. As a result, the plasma display device is pivoted to have a long side or a short side of the PDP. If iii) is located below the device, the direction of the heat sink becomes orthogonal to the direction of the airflow, making the effective use of natural convection phenomena.

Accordingly, an object of the present invention is to solve the above problems, and an object thereof is to provide a plasma display apparatus for improving heat dissipation performance of elements provided in a driving circuit board by inclining an installation angle of a heat sink or a heat dissipation fin angle thereof.

In order to achieve this object, the plasma display device according to the present invention,

A plasma display panel;

A chassis base to attach and support the plasma display panel;

Driving circuit boards on opposite sides of the chassis base of the plasma display panel; And

And heat sinks provided on the elements to dissipate the elements mounted in parallel with the driving circuit board and forming natural convection in parallel to the long side and the short side thereof while being parallel to the plasma display panel.

The heat sinks form an air flow passage in the oblique direction by a plurality of heat dissipation fins extending in the longitudinal direction.

The heat sinks are parallel to the plasma display panel and arranged in the same diagonal direction.

The heat sinks form an air flow passage in the oblique direction by a plurality of heat dissipation fins parallel to the plasma display panel and diagonally formed with respect to the length direction and the width direction of the heat sink.

The heat sinks form a plurality of heat dissipation fins parallel to the plasma display panel in a diagonal direction with respect to the length direction and the width direction of the heat sink in the same diagonal direction.

Among the heat sinks, the heat radiation fins of the heat sinks disposed adjacent to the long side or the short side of the plasma display panel are formed by cutting a portion of the adjacent side portion at the long side end or the short side end as compared with other heat sinks.

A front cover is disposed in front of the plasma display panel, a back cover is disposed behind the chassis base, the front cover and the back cover are assembled to the chassis base, and air convection is provided at two long side ends of the back cover. An intake port and an exhaust port are provided to enable the device.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

1 is an exploded perspective view of a plasma display device according to the present invention.

Referring to the plasma display device with reference to the drawings, the plasma display device of the present invention is disposed on the PDP (3) for substantially implementing the image, and one side of the PDP (3), that is, the opposite side on which the image is implemented, the PDP And a chassis base (5) coupled to (3), further comprising a front cover (7) disposed on the front side of the PDP (3) and a back cover (9) disposed on the rear side of the chassis base (7). .

Here, a heat dissipation sheet (not shown) for transferring heat generated from the PDP 3 to the chassis base 5 is disposed between the PDP 3 and the chassis base 5, and the PDP 3 is disposed at the front cover 7. The filter 11 for shielding the electromagnetic wave radiated from the () is mounted.

In the above, the PDP 3 is generally formed in a substantially rectangular shape (a rectangle in which the length in the X-axis direction is longer than the length in the Y-axis direction in the drawing), and the chassis base 5 corresponds to the shape of the PDP 3. It has a shape and is formed of a material such as aluminum having excellent thermal conductivity.

The PDP 3 is attached to one side of the chassis base 5, and a plurality of driving circuit boards 13 required for driving the PDP 3 are mounted on the opposite side thereof. These drive circuit boards 13 are mounted to bosses (not shown) which are provided on the rear of the chassis base 5 by a set screw (not shown).

The driving circuit board 13 mounted on the rear of the chassis base 5 includes an X, Y board, an image processing board, a switching mode power supply (SMPS) board, and the like. As is well known, various elements 15 such as FETs (Field Effect Transistors, not shown) are mounted on a printed circuit board through lead wires.

2 is a perspective view of a first embodiment of a heat sink;

Referring to the figure, the heat sink 17 will be described. The heat sink 17 includes elements 15 that form a circuit in the driving circuit board 13 and heat generated in the driving circuit board 13. It is configured to radiate heat and is installed in large numbers. The heat sink 17 is usually fixed to the drive circuit board 13 by soldering a plurality of lugs.

In the present embodiment, the heat sink 17 is attached to the driving circuit board 13 and the elements 15 so as to effectively dissipate the elements 15 mounted in the direction parallel to the driving circuit board 13 (X-Y plane). And this heat sink 17 is parallel to the plane direction (XY plane) of the PDP 3, and the natural convection (a) of diagonal direction with respect to the long side (X-axis direction) and short side (Y-axis direction) of the PDP 3 is carried out (a). Are constructed and arranged to form. Due to this arrangement, the natural convection a in the diagonal direction is formed even if the long side or the short side of the PDP 3 is turned down by turning the PDP device. Of course, as shown in FIGS. 3 and 4, the direction a forms a symmetrical structure.

3 and 4 illustrate that the natural convection a in the diagonal direction is formed by the arrangement of the heat sinks 17.

FIG. 3 is a partial front view of the driving circuit board with the long side of the plasma display panel positioned downward in the plasma display device to which the heat sink of FIG. 2 is applied, and FIG. 4 is a plasma display to which the heat sink of FIG. 2 is applied. A partial front view of the driving circuit board with the short side of the plasma display panel positioned below the device.

That is, FIG. 3 shows a state where the long side of the PDP 3 is downward and FIG. 4 is a state where the short side of the PDP 3 is downward as described above. These heat sinks 17 are arranged parallel to the PDP 3 on the drive circuit board 13 (XY plane) and in an oblique direction with respect to the long side (X-axis direction) and short side (Y-axis direction) of the PDP 3. And an air flow passage in the oblique direction a. A plurality of heat dissipation fins 17a forming this air flow passage are elongated in the longitudinal direction of the heat sink 17. The heat dissipation fins 17a formed on the heat sink 17 are preferably formed in the same diagonal direction a while being parallel to the heat dissipation fins 17a formed on the other heat sinks 17 so as to form natural convection smoothly. .

5 is a perspective view of a second embodiment of the heat sink.

Referring to this figure, the heat sink 27 will be described. Unlike the first embodiment in which the heat sink 27 is inclined, the heat sink 27 is parallel to the PDP 3 (XY plane) while being in parallel with the PDP 3 (XY plane). And a plurality of heat dissipation fins 27a formed diagonally with respect to the long side (X-axis direction) and the short side (Y-axis direction) of (3), and the air flow path by these heat dissipation fins 27a is described above. Similarly, it forms in diagonal direction (a). Therefore, although the heat sink 27 is arranged in parallel with the long side (X-axis direction) of the PDP 3, the air flow path is formed in the diagonal direction a by the heat radiation fins 27a. Therefore, these heat dissipation fins 27a are formed shorter than those located at both ends of the heat sink 27 in the middle portion. In addition, the plurality of heat dissipation fins 27a formed in the heat sink 27 are formed in the same diagonal direction a as the plurality of heat dissipation fins 27a formed in the other heat sinks 17 so as to smoothly form natural convection. It is preferable. By this configuration of the heat dissipation fins 27a, the natural convection a in the diagonal direction turns the PDP device so that the state is maintained even if the long side or the short side of the PDP 3 is located below. Of course, it can be seen that the diagonal direction (a) is formed symmetrically when comparing FIG.

6 and 7 correspond to the first embodiment of FIGS. 3 and 4, in which the heat sink 17 is inclined to form an air flow passage in an oblique direction a, In the second embodiment, there is a difference in that the heat dissipation fin 27a of the heat sink 27 is inclined in the diagonal direction a to form the air flow passage in the diagonal direction a.

8 is a perspective view of a third embodiment of the heat sink.

Referring to this figure, the heat sink 37 will be described. As compared with the heat sink 27 of the second embodiment, the heat sink 37 further includes a cutout 37b in which a part of the heat dissipation fins 37a is cut out. Equipped.

This cutout 37b is formed in the heat dissipation fin 27a of the heat sink 37 disposed adjacent to the long side (X-axis direction) or short side (Y-axis direction) of the PDP 3. More specifically, the cutout 37b is formed by cutting the adjacent portion of the long side (X-axis direction) end or the short side (Y-axis direction) end of the PDP 3 from the heat generating fin 27a. This cutout 37b turns the PDP device to facilitate the inflow of air through the bottom of the heat sink 37 located at the bottom.

The chassis base 5 having the drive circuit board 13 is combined with the PDP 3 to form a module, which is disposed in the front cover 7 and the back cover 9, and mutually coupled thereto. This constitutes one plasma display device.

When the plasma display device is driven, the driving circuit board 13 and the elements 15 mounted thereon generate heat.

Accordingly, the plasma display device maximizes the natural convection effect of air generated in the space between the back cover 9 and the driving circuit board 13 and the arrangement of the heat sinks 17, 27, and 37 formed as described above. The heat generated from the driving circuit board 13 and the elements 15 provided therein is more actively radiated.

At this time, the air passing through the driving circuit board 13 and the heat sinks 17, 27, and 37 provided therein is inlet port 9a and exhaust port respectively provided on both sides of the long side (X-axis direction) end of the back cover 9. It forms a flow passage that is sucked through and discharged through 9b).

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the scope of the invention.

As described above, according to the present invention, the natural heat convection of the heat sinks provided on the elements mounted in the parallel direction on the driving circuit board in the diagonal direction with respect to the long side and the short side in the parallel direction of the PDP is rotated, thereby turning the PDP. Even if the long side or the short side of is located below, there is an effect of improving the heat dissipation performance of the elements.

1 is an exploded perspective view of a plasma display device according to the present invention.

2 is a perspective view of a first embodiment of a heat sink;

3 is a partial front view of a driving circuit board in which the long side of the plasma display panel is positioned below the plasma display apparatus to which the heat sink of FIG. 2 is applied.

FIG. 4 is a partial front view of the driving circuit board in which the short side of the plasma display panel is positioned below the plasma display apparatus to which the heat sink of FIG. 2 is applied.

5 is a perspective view of a second embodiment of a heat sink.

FIG. 6 is a partial front view of the driving circuit board with the long side of the plasma display panel positioned downward in the plasma display apparatus to which the heat sink of FIG. 5 is applied.

FIG. 7 is a partial front view of the driving circuit board in which the short side of the plasma display panel is positioned downward in the plasma display apparatus to which the heat sink of FIG. 5 is applied.

8 is a perspective view of a third embodiment of a heat sink.

Claims (7)

A plasma display panel; A chassis base to attach and support the plasma display panel; Driving circuit boards on opposite sides of the chassis base of the plasma display panel; And And heat sinks disposed on the elements mounted in parallel with the driving circuit board, the heat sinks being parallel to the plasma display panel and forming natural convection in diagonal directions with respect to the long side and the short side thereof. The method of claim 1, And the heat sinks form an air flow passage by the plurality of heat dissipation fins extending in a length direction in the diagonal direction. The method of claim 1, And the heat sinks are arranged parallel to the plasma display panel in the same diagonal direction. The method of claim 1, And the heat sinks parallel to the plasma display panel and form air flow passages formed by the plurality of heat dissipation fins in the diagonal direction with respect to the length direction and the width direction of the heat sink in the diagonal direction. The method of claim 1, And the heat sinks parallel to the plasma display panel and form a plurality of heat dissipation fins formed in an oblique direction with respect to the length direction and the width direction of the heat sink in the same diagonal direction. The method of claim 1, The heat dissipation fin of the heat sink disposed adjacent to the long side or the short side of the plasma display panel among the heat sinks is formed by cutting a portion of the adjacent side portion of the long side end or the short side end compared to other heat sinks. The method of claim 1, A front cover is disposed in front of the plasma display panel, a back cover is disposed behind the chassis base, the front cover and the back cover are assembled to the chassis base, and air convection is provided at two long side ends of the back cover. A plasma display panel is provided with an inlet and an exhaust port for enabling.