KR20050073371A - 반도체 장치의 금속배선 형성 방법 - Google Patents
반도체 장치의 금속배선 형성 방법 Download PDFInfo
- Publication number
- KR20050073371A KR20050073371A KR1020040001743A KR20040001743A KR20050073371A KR 20050073371 A KR20050073371 A KR 20050073371A KR 1020040001743 A KR1020040001743 A KR 1020040001743A KR 20040001743 A KR20040001743 A KR 20040001743A KR 20050073371 A KR20050073371 A KR 20050073371A
- Authority
- KR
- South Korea
- Prior art keywords
- forming
- pad
- metal
- film
- nickel
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/03—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (2)
- 금속패드가 형성된 반도체 기판 상에 패시베이션막을 형성하는 단계;상기 패시베이션막을 패터닝하여 상기 금속패드를 개방하는 패드홀을 형성하는 단계;상기 패드홀 하부의 상기 금속패드 상에 핵생성자리 형태의 금속박막을 형성하는 단계; 및상기 패드홀을 니켈막으로 매립하여 니켈 범프를 형성하는 단계를 포함하는 반도체 장치의 금속배선 형성 방법.
- 제 1 항에 있어서, 상기 핵생성자리 형태의 금속박막은,LPCVD 반응기에서 200 내지 400℃의 온도와 0.01 내지 300Torr의 압력과 50 내지 1000W의 플라즈마 파워를 인가하여 H2 플라즈마 전처리 또는 NF3 전처리를 실시하는 단계; 및상기 LPCVD 반응기에서 200 내지 400℃의 온도와, 0.01 내지 300Torr의 압력과 50 내지 1000W의 플라즈마 파워를 인가한 상태에서, 10 내지 100sccm의 WF6가스, 100 내지 2000sccm의 H2가스와 소량의 SiH4가스를 주입하여 20 내지 100㎚ 두께의 양자 점 형태의 텅스텐막을 형성하는 반도체 장치의 금속배선 형성 방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040001743A KR101050943B1 (ko) | 2004-01-09 | 2004-01-09 | 반도체 장치의 금속배선 형성 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040001743A KR101050943B1 (ko) | 2004-01-09 | 2004-01-09 | 반도체 장치의 금속배선 형성 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050073371A true KR20050073371A (ko) | 2005-07-13 |
KR101050943B1 KR101050943B1 (ko) | 2011-07-20 |
Family
ID=37262490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020040001743A KR101050943B1 (ko) | 2004-01-09 | 2004-01-09 | 반도체 장치의 금속배선 형성 방법 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101050943B1 (ko) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19914338A1 (de) * | 1999-03-30 | 2000-10-05 | Pac Tech Gmbh | Kontakthöcker mit Trägermetallisierung sowie Verfahren zur Herstellung der Trägermetallisierung |
KR100382725B1 (ko) * | 2000-11-24 | 2003-05-09 | 삼성전자주식회사 | 클러스터화된 플라즈마 장치에서의 반도체소자의 제조방법 |
KR100479598B1 (ko) * | 2000-12-26 | 2005-04-06 | 주식회사 하이닉스반도체 | 텅스텐 범프를 갖는 캐패시터 및 그 제조 방법 |
-
2004
- 2004-01-09 KR KR1020040001743A patent/KR101050943B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR101050943B1 (ko) | 2011-07-20 |
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