KR20050053790A - Film carrier tape for mounting electronic component - Google Patents

Abstract

A film carrier tape for mounting electronic components having a large number of wiring patterns of a conductive metal formed on the surface of a long insulating film, characterized in that each wiring pattern is covered independently with a solder resist layer except for the part of connecting terminal, and the solder resist layer formed on the surface of each wiring pattern is divided into a plurality of sections. Warp can be reduced in the film carrier tape for mounting a large number of electronic components cut in the widthwise direction as with the case of CSP, COF, BGA, or the like.

Description

Film carrier tape for mounting electronic component

TECHNICAL FIELD This invention relates to the film carrier tape for electronic component mounting with which curvature distortion was reduced. More specifically, the present invention is a tape made of a long insulating film, which is almost the same as an electronic component in which the size of a film carrier is mounted, such as a chip on film (COF), a chip size package (CSP), and a ball grid array (BGA). The film carrier tape for electronic component mounting in which two or more film carriers are manufactured side by side in the width direction of this invention, It is related with the film carrier tape for electronic component mounting in which the bending deformation in each film carrier was remarkably reduced.

In order to mount electronic components, such as an integrated circuit, in an electronic device, the film carrier tape for mounting electronic components is used. The film carrier tape for mounting electronic components forms a wiring pattern made of a conductive metal on the surface of the long insulating film, and many of these film carrier tapes for mounting electronic components leave a terminal portion on the surface of the wiring pattern. It is manufactured by forming a soldering resist layer. Thermosetting resins, such as an epoxy resin, are used as resin which forms a soldering resist layer in such a film carrier tape for electronic component mounting.

In the film carrier tape for mounting electronic components that do not form a solder resist layer, large warpage deformation is not found, but the thermosetting resin forming the solder resist layer has a property of being extremely cured when cured by heating. By cured shrinkage of the thermosetting resin which forms the same soldering resist layer, the bending deformation generate | occur | produces in the width direction and the longitudinal direction in the film carrier tape for electronic component mounting.

The warpage deformation generated in the width direction and the longitudinal direction of such a long film carrier tape is, for example, a method of passing the film carrier between a plurality of rolls under heating, while bending the film carrier tape in the opposite direction to the warpage generated. Correction can be performed by a method of heating or the like while imparting warping. Such a warpage removal method is particularly effective as a warpage removal method of a film carrier tape in which one wiring pattern is formed in the width direction of a tape made of an insulating film.

However, in recent years, in the mounting technology of electronic components, a film carrier having almost the same area as an electronic component and a film carrier, such as a chip on film (COF), a chip size package (CSP) or a ball grid array (BGA), is used. There are many cases. Since such a film carrier has little occupied area, a plurality (for example, two or four) can be manufactured side by side in the width direction of the tape which consists of an insulating film. In such CSP, COF, BGA, etc., since a solder resist layer is formed in each film carrier, each film carrier in which the solder resist layer was formed is bent, and the opposite bending is given to the tape in which the plurality of film carriers are formed in the width direction. Also, the tape is bent at the boundary portions of the film carriers adjacent in the width direction, so that the opposite bending cannot be effectively applied to the curved and deformed film carrier portions, respectively. Therefore, in the film carrier tape for electronic component mounting which forms several film carriers in the width direction of a tape like CSP and BGA, there exists no effective warpage removal method which corrects the bending distortion which generate | occur | produced in each film carrier.

Patent Document 1 Japanese Patent Application No. 2001-249499

1: is a top view which shows an example of the film carrier tape for electronic component mounting of this invention.

FIG. 2 is a cross-sectional view along the line A-A 'in FIG. 1. FIG.

3 is an explanatory diagram for selecting and explaining one film carrier for forming the film carrier tape for mounting an electronic component of the present invention.

It is a figure which shows the method of measuring the bending deformation of the film carrier tape in this invention.

FIG. 5 is a diagram illustrating an example of a film carrier tape for mounting electronic components in which a soldering resist layer is formed on 20% or more of the wiring pattern except for the terminal portion.

6 is a diagram illustrating an example of a cross section of a partition of the solder resist layer.

An object of this invention is to provide the film carrier tape for electronic component mounting which reduced the bending deformation of each film carrier in the film carrier tape for electronic component mounting in which the some film carrier was formed in the width direction of a tape.

The film carrier tape for mounting electronic components of the present invention is a film carrier tape for mounting electronic components, in which a plurality of wiring patterns made of a conductive metal are formed on the surface of the long insulating film.

Each of the wiring patterns is independently covered by a solder resist layer except for the connection terminal portion, and a plurality of solder resist layers formed on the surface of each wiring pattern are divided and / or divided into a plurality of pieces. I am doing it.

Moreover, in the film carrier tape for mounting an electronic component of the present invention, a plurality of wiring patterns made of a conductive metal are formed on the surface of the long insulating film, and at least two of the wiring patterns are provided in the width direction of the long insulating film. In the film carrier tape for mounting electronic components,

Each of the wiring patterns is separately covered with a solder resist layer except for the connection terminal portion, and a plurality of solder resist layers formed on the surface of each wiring pattern are divided and / or divided into a plurality. It features.

In the film carrier tape for electronic component mounting of this invention, a soldering resist is divided and apply | coated, and since the stress by hardening shrinkage in each divided soldering resist layer is small, the deformation in this film carrier can be made small. Can be.

Next, the film carrier tape for mounting an electronic component of the present invention will be specifically described with reference to the drawings.

1: is a top view which shows an example of the film carrier tape for electronic component mounting of this invention, and FIG. 2 is A-A 'sectional drawing in FIG.

As shown in FIG. 1 and FIG. 2, in the film carrier tape 10 for mounting electronic components of the present invention, a plurality of film carriers 12 are formed on the surface of the long insulating film 11.

Since this long insulating film 11 contacts acid etc. at the time of an etching, it has chemical resistance which does not penetrate into such a chemical | medical agent, and heat resistance which does not change even by the heating at the time of bonding. As an example of the raw material which forms this insulating film 11, polyester, a polyamide, a polyimide, etc. are mentioned. Especially in this invention, it is preferable to use the film which consists of polyimides. Such polyimide has excellent heat resistance and excellent chemical resistance compared with other resins.

As an example of this polyimide resin, the wholly aromatic polyimide synthesize | combined from a pyromellitic dianhydride and aromatic diamine, the wholly aromatic polyimide which has a biphenyl skeleton synthesize | combined from biphenyl tetracarboxylic dianhydride and an aromatic diamine is mentioned. Especially in this invention, the wholly aromatic polyimide which has a biphenyl skeleton (for example, brand name: Eupyrex S and the product made by Ubeheung Co., Ltd.) is used preferably. The wholly aromatic polyimide having a biphenyl skeleton has a lower water absorption than other wholly aromatic polyimides. Although there is no restriction | limiting in particular in the thickness of the insulation film which can be used by this invention, Since the insulation film whose thickness is 75 micrometers or less has low self-shape holding force, and a deformation | transformation tends to occur, in this invention, the thickness (average thickness) of an insulation film is 75 micrometers or less Preferably, when manufacturing a thin film carrier using the insulating film in the range of 50-12.5 micrometers, high usefulness.

The sprocket hole 14 for conveying and insulating this insulating film 11 is formed in the edge of the width direction of such a long insulating film 11, and performs positioning. In addition, the insulating film 11 may further include a positioning hole, a device hole, a solder ball hole for arranging a solder hole serving as an external terminal, a slit for securing a connection with an electronic component, and the like. These can be formed by a punching step and a drilling step using a laser beam.

In this way, the wiring pattern 15 is formed in the insulating film in which required holes are formed. This wiring pattern 15 arrange | positions electroconductive metal foil on the surface of the insulating film 11 as mentioned above, apply | coats photosensitive resin on the surface of this conductive metal foil, and a desired pattern to the photosensitive resin layer formed in this way. It can be formed by exposing and forming a pattern made of photosensitive resin, and selectively etching the conductive metal foil using this pattern as a masking material. Aluminum foil and copper foil are mentioned as an example of the conductive metal used here. As such conductive metal foil, it is possible to use the metal foil normally in the range of 3-35 micrometers, Preferably it is 9-25 micrometers. In addition, a nucleus of the conductive metal may be provided on the surface of the insulating film to deposit the conductive metal on the nucleus.

As the conductive metal foil used in the present invention, it is preferable to use copper foil. Examples of the copper foil usable here include electrolytic copper foil and rolled copper foil, but electrolytic copper foil is preferable in consideration of etching characteristics, operability, and the like.

In the film carrier tape for mounting electronic components of the present invention, a plurality of film carriers 12 formed by a wiring pattern formed from the conductive metal are formed in a width direction of a tape made of an insulating film. The aspect in which two (12) coexisted in the width direction of the tape is shown.

In the film carrier tape for mounting an electronic component of the present invention, the film carrier 12 as described above is formed in plural in the width direction of the tape, respectively. For example, in the insulating film 11 having an effective width of 35 mm, two film carriers having one side, for example, 14 mm can be formed side by side in the width direction, and in the insulating film 11 having an effective width of 70 mm, 1 Four film carriers whose sides are 14 mm for example can be formed side by side in the width direction.

In the case where the film carrier formed on the film carrier tape 10 for mounting electronic components is CSP or BGA, the surface on which the wiring pattern 15 of the insulating film 11 is formed is used to ensure connection with the electronic parts. The solder resist layer 20 is formed by applying solder resist ink on the surface of the formed wiring pattern leaving the terminal portion 16. The resin which forms the soldering resist layer 20 apply | coated here is a coating liquid which melt | dissolved or disperse | distributed the thermosetting resin to the organic solvent normally, and after apply | coating such soldering resist ink, it heats a soldering resist layer 20 by To form. When the solder resist ink is cured to form the solder resist layer 20, the resin forming the solder resist layer is slightly cured, so that the solder resist layer 20 is applied to the inside where the solder resist ink is applied. As a result, bending deformation occurs.

On the other hand, there is also a film carrier tape for mounting electronic components of a type in which the formation of the solder resist layer 20 is unnecessary.

As described above, when a plurality of film carriers 12 are formed side by side in the width direction of the tape, even if the tape is bent opposite to the tape, the film carriers 12 are only folded and bent between the film carriers 12, and the warp deformation occurs. In the part of), the opposite bending hardly takes place. Therefore, when looking at the individual film carriers 12, the bending deformation is hardly corrected.

Therefore, when forming the some film carrier 12 side by side in the width direction of the above-mentioned tape, it is efficient to prevent a bending deformation in each film carrier 12 itself.

The cause of the bending deformation is the difference in the expansion coefficient of the material such as the insulating film, the conductive metal or the like, as described above, the hardening shrinkage of the solder resist, and the internal stress generated by the hardening shrinkage is the self-holding property of the insulating film. When it becomes higher constantly, the stress inherent in a soldering resist layer appears as a bending deformation of a film carrier. Then, when the formation area of the solder resist layer 20 becomes large, the internal stress in the large area of the solder resist layer 20 is mutually connected, and a large internal stress tends to be large. However, even in the solder resist layer 2 in which such a large internal stress is generated, the internal stress is not so large in part.

Therefore, in the present invention, the solder resist layer 20, which is conventionally applied and formed integrally and integrally integrated, is divided or divided into several parts to form a coating, and the stress in each load or divided section is made as small as possible. The amount of antagonism of the insulating film 11 in the portion of the partitioned solder resist layer 20 is suppressed to the extent that it is antagonistic and the bending deformation in the partitioned solder resist layer 20 formation portion is minimized. I'm doing it.

That is, in the film carrier tape 10 for mounting electronic components of the present invention, as shown in Figs. 1 to 3, the solder resist layer 20 is divided into A compartment 20a, B compartment 20b, and C compartment ( 20c), it divides into several divisions like D compartment 20d, and apply | coats and forms a soldering resist ink.

Resin which forms the soldering resist layer 20 in this invention is curable resin, For example, thermosetting resins, such as an epoxy resin, a urethane modified epoxy resin, a phenol resin, and a polyimide resin precursor, are used preferably. Such a thermosetting resin is melt | dissolved or disperse | distributed in a solvent, and is usually 10-40 Pa.s, Preferably it is the viscosity within the range of 20-30 Pa.s so that application | coating by a squeegee using a screen mask is possible. It is adjusted.

1 to 3, the region for forming the solder resist layer 20 is a region in which the A compartment 20a, the B compartment 20b, the C compartment 20c, and the D compartment 20d are combined. These regions were integrally coated with a solder resist. However, when a solder resist is apply | coated and hardened | cured extensively in this way, when resin hardens | cures, it hardens | contracts and curvature which made the soldering resist layer 20 inward in the individual film carrier 12 as shown in FIG. Deformation occurs.

In the film carrier tape for electronic component mounting of this invention, the area | region which should apply the above-mentioned solder resist is divided into several, and a soldering resist is apply | coated. That is, in FIGS. 1 and 3, the region to which the solder resist is to be applied is a region in which the A section 20a, the B section 20b, the C section 20c, and the D section 20d are combined. In the example shown in Fig. 3, this region is divided into four sections, each of the sections is separated from the adjacent sections, and the solder resist is applied and cured to form the solder resist layer 20 divided into four sections. On the other hand, in the case where the length and width of the film carrier are less than 5 mm, the warp deformation that is a problem often does not occur. Therefore, in the present invention, the solder in the film carrier whose length and width size of the film carrier is 5 mm or more is soldered. It is preferable to form resist separately.

By dividing the solder resist layer in this manner, the stress due to hardening shrinkage of the solder resist is generated in each section, but the stress is small, and the stress is antagonized with the stress inherent in the insulating film and the wiring pattern formed thereon. Strain in a film carrier can be suppressed to the minimum.

Such an effect is similarly exhibited even when one film carrier 12 is formed in the width direction.

Such a solder resist layer 20 also depends on the physical properties of the film carrier, the insulating film, the solder resist, and other materials, but is preferably divided into 2 to 16, particularly preferably 2 to 8. By dividing the solder resist layer 20 in this manner, the shrinkage stress due to the hardening of the solder resist in each section is reduced, and the deformation of the entire film carrier is also reduced. In addition, since the physical property values of an insulation film, a soldering resist, etc. are intricately intertwined with the size of the soldering resist after a division | segmentation, it is not necessary to make one side size less than 5 mm.

In the film carrier tape 10 for mounting an electronic component of the present invention, there is no particular limitation on the shape and relative size of each section for dividing and / or dividing the solder resist layer 20, but the area where the solder resist is to be applied is as long as possible. It is desirable to be equally divisible. By equalizing the stresses generated in the respective sections, the deformation of the entire film carrier becomes smaller. That is, it is preferable to make the area of each compartment equal and to make the form of each compartment substantially the same. In the film carrier tape for electronic component mounting of this invention, it is preferable to make the length of one side of each division of the partitioned soldering resist about 2-10 mm, Preferably it is 2.5-7.5 mm.

In the film carrier tape for mounting electronic components of the present invention, the film carrier formed by dividing and / or dividing the solder resist layer is not limited to the CSP or BGA as described above, and can be applied to a general TAB tape. For example, as shown in FIG. 5A and FIG. 5B, it can apply to the film carrier tape for electronic component mounting which forms a soldering resist layer in 30% or more of area | regions (except the terminal part) which were formed. FIG. 5A shows an example in which a solder resist layer is divided into 12 to form a wiring pattern 15 formed on the surface of the insulating film 11 having device holes. In addition, the wiring pattern of FIG. 5A is an example, and does not limit the wiring pattern in this invention. 5B shows an example in which the solder resist layer 20 is divided into two. In FIG. 5B, the wiring pattern is formed on the surface of the insulating film 11, but the wiring pattern is omitted in FIG. 5B. For example, as shown to FIG. 5A and FIG. 5B, it is useful in the film carrier tape for electronic component mounting which forms a soldering resist layer in 30% or more of wiring pattern area | region except a connection terminal part.

6A and 6B, the distance W between the partitions divided as described above can be appropriately set so that the stress generated in the adjacent partitions is not transmitted. Usually, 20 µm to 50 mm Preferably, it sets to the value within the range of 20 micrometers-3 mm. By setting the distance between the partitions as described above, the stresses in the respective compartments are not transmitted to the adjacent compartments, and there is no particular problem in the protection of the wiring pattern between the compartments. Moreover, it is preferable to form each division so that the shape may be similar. The similar shape of the compartments makes the internal stress generated in each compartment uniform, so that the deformation of the entire film carrier is reduced.

The thickness h ₀ of the solder resist layer divided or fractionated as described above is the same as that of the conventional solder resist layer, and the average thickness after curing is usually 3 to 50 μm, preferably on the upper surface of the wiring pattern. It exists in the range of 5-40 micrometers. In the film carrier tape for mounting electronic components of the present invention, the solder resist layer 20 is divided or divided as shown in Fig. 6A, and the solder resist layer as described above is disposed between adjacent sections. It is necessary to have a portion which is not formed, but internal stress generated in each compartment does not have to be transmitted to an adjacent compartment. For example, as shown in FIG. 6B, the partitioned solder resist layer 20 is at least partially adjacent to the solder. It may be fractionated in connection with the partition of the resist layer. In this case, the thickness h ₁ of the solder resist layer between the compartments may be 1/2 or less of the normal thickness h ₀ of the solder resist layer, and h ₁ may be zero.

In order to form the partitioned solder resist layer 20, a mask may be formed on a conventional screen so as to correspond to the partition, and resin may be applied. In addition, in the case of the adhesive type soldering resist which is currently employ | adopted, what is necessary is just to form a clearance and to stick a soldering resist. In addition, in the case of the soldering resist using photosensitive resin, after apply | coating resin, what is necessary is just to expose and develop so that a soldering resist layer may divide and / or fractionate. In addition, the solder resist layer fractionated so that at least one part may be connected between divisions can be formed by adjusting the line width of the screen mask used when apply | coating a soldering resist coating liquid.

After forming a soldering resist layer as mentioned above, the surface of the terminal part (lead, bonding pad, etc.) 16 exposed from the soldering resist layer 20 is plated. The plating treatment includes tin plating, nickel plating, nickel-gold multilayer plating, nickel-palladium-gold multilayer plating, solder plating, tin-bismuth plating, and the like. In addition, the plating layer described above is formed on the surface of the wiring pattern between the divided solder resist layers.

In addition, you may perform this plating process before forming a soldering resist layer.

The film carrier tape for electronic component mounting of this invention manufactured as mentioned above can be used by a conventional method. For example, an electronic component (not shown) is disposed on the solder resist layer formed by using an adhesive or the like, and an electrical connection is formed between the bump electrode formed on the electronic component and the connection terminal 16. The parts can be mounted. For the formation of this electrical connection, for example, a conductive metal wire such as a gold wire can be used. On the other hand, in the film carrier tape for mounting an electronic component of the present invention, the mounted electronic component and the carrier tape have almost the same occupied area, but the present invention is not limited to such a film carrier tape.

The connecting terminal 16 formed in the film carrier tape for mounting electronic components of the present invention is connected to the solder ball via the wiring pattern 15.

As mentioned above, since the solder resist sheet layer is divided | segmented or divided into the film carrier tape for electronic component mounting of this invention, the curvature distortion of the film carrier resulting from hardening shrinkage at the time of hardening of a soldering resist can be reduced.

The deformation | transformation of the film carrier in the film carrier tape for electronic component mounting of this invention is measured as follows. As shown in Fig. 4 (a), one film carrier in a film carrier tape manufactured by using the sprocket hole of the film carrier tape to be moved using the sprocket hole as a reference point is formed. Measure the height with respect to the reference point of measuring points ① to ⑤ shown in 3. In consideration of the fact that this film carrier tape is deformed as shown in Fig. 4 from the obtained values, ① '(⑤'), ② '(④') of the film carrier (unit) to be measured by calculation. Get the value of). Find ① '= ⑤' = (① + ⑤) / 2 and similarly find ② '= ④' = (② + ④) / 2.

In addition, the larger one of the value of (1) '-③ or (2)'-③ of the unit curvature in this invention is the bending deformation in this invention.

By dividing or dividing a soldering resist layer as mentioned above, the curvature distortion of a film carrier becomes 50% or less of the curvature distortion of the film carrier which has a soldering resist layer which is not divided or fractionated.

As mentioned above, in the film carrier tape for electronic component mounting of this invention, by dividing or dividing a soldering resist layer, the curvature distortion of a film carrier is reduced and a reliable film carrier tape for electronic component mounting can be obtained.

Although the Example is shown below about the film carrier tape for electronic component mounting of this invention, it demonstrates, comparing with the case where a soldering resist is formed in the whole wiring pattern surface other than a connection terminal which is easy to bend, but it demonstrates The invention is not limited by this.

Example 1

A solder ball hole for arranging the sprocket hole and the solder ball in a polyimide film (manufactured by Ubeheung Sangyo Co., Ltd., brand name: Yupyrex S) having an average thickness of 50 µm and a width of 48 mm was punched out by punching. In this polyimide film, as shown in FIG. 1, the solder ball hole was perforated so that two rows of 17 mm-side film carriers could be formed.

Subsequently, an electrolytic copper foil of 25 micrometers in average thickness was stuck to this polyimide film, the photosensitive resin was apply | coated on this electrolytic copper foil, and it exposed and developed. The wiring pattern made of copper was formed by selectively etching the electrolytic copper foil using the pattern made of the developed photosensitive resin as a masking material.

Solder resist layer (average thickness after hardening: 10 micrometers) was formed by apply | coating and heat-curing a soldering resist ink on the surface of the wiring pattern thus formed. The solder resist layer formed here is divided | segmented into 4 as shown in FIG. 1 by forming a mask on a screen, and the part (compartment part) in which the solder resist is not apply | coated with the width of 200 micrometers between each division. This exists.

Thus, after forming the four-part soldering resist layer, the connection part which is not coat | covered with the soldering resist layer, and the division part of a soldering resist layer are gold-plated after nickel plating, and also the film carrier tape whole in a conventional method. Therefore, the warpage was removed.

The film carriers formed in the portion near the central portion in the longitudinal direction of the obtained film carrier tape for electronic component mounting were randomly selected from 12 consecutive six rows, and the bending deformation was measured for these film carriers.

The results are shown in Table 1. In addition, the reason described in the upper end and the lower end in Table 1 is for distinguishing the film carrier which becomes an upper side and the film carrier which becomes a lower side, when this film carrier tape is arrange | positioned as shown in FIG. The direction of the tape in the manufacturing process of the film carrier tape for electronic component mounting is irrelevant.

1st piece 2nd piece 3rd piece 4th piece 5th piece 6th piece medium Top 0.35 mm -0.005 mm 0.015 mm 0.023 mm 0.150 mm 0.071 mm 0.035 mm lower 0.012 mm 0.051 mm -0.019 mm -0.016 mm 0.017 mm 0.180 mm

Comparative Example 1

In Example 1, the film carrier tape for mounting electronic components was produced similarly except not dividing a soldering resist layer.

In the obtained film carrier tape for electronic component mounting, it carried out similarly to the Example, and randomly selected 6 continuous 12-row film carriers, and the bending deformation of these film carriers was measured.

The results are shown in Table 2.

1st piece 2nd piece 3rd piece 4th piece 5th piece 6th piece medium Top 0.112 mm 0.050 mm 0.074 mm 0.078 mm 0.084 mm 0.061 mm 0.085 mm lower 0.098 mm 0.074 mm 0.093 mm 0.092 mm 0.072 mm 0.089 mm

As can be seen by comparing Tables 1 and 2 above, by dividing the solder resist layer into four, the amount of warpage deformation of the film carrier can be reduced to an average of half or less.

In the film carrier tape for mounting an electronic component of the present invention, since the solder resist layer is divided or divided into a plurality, the stress accompanying the shrinkage when the solder resist ink is cured is dispersed. Therefore, in the film carrier tape for electronic component mounting of this invention, the curvature distortion of the film carrier by hardening shrinkage of a soldering resist layer is remarkably reduced, and the mounting precision of an electronic component is also improved reliably.

In particular, the film carrier tape for mounting an electronic component of the present invention is particularly useful as CSP, COF, BGA, or the like.

Claims (9)

In the film carrier tape for electronic component mounting in which the wiring pattern which consists of a conductive metal is formed in the surface of a long insulating film, Each of the wiring patterns is separately covered with a solder resist layer except for the connection terminal portion, and a plurality of solder resist layers formed on the surface of each wiring pattern are divided and / or divided into a plurality. A film carrier tape for mounting electronic components. In the film carrier tape for mounting electronic components in which a plurality of wiring patterns made of a conductive metal are formed on the surface of the long insulating film, and at least two of the wiring patterns are arranged in parallel in the width direction of the long insulating film. Each of the wiring patterns is separately covered with a solder resist layer except for the connection terminal portion, and a plurality of solder resist layers formed on the surface of each wiring pattern are divided and / or divided into a plurality. A film carrier tape for mounting electronic components. The method according to claim 1 or 2, A solder carrier layer is formed by dividing and / or dividing into 2-16 the said wiring pattern surface, The film carrier tape for electronic component mounting characterized by the above-mentioned. The method according to claim 1 or 2, In each of the film carriers, a gap between the divided or fractionated solder resist layer and the partition of the solder resist layer adjacent to the partition of the divided or fractionated solder resist layer is within a range of 20 µm to 50 mm. Film carrier tape for mounting electronic components. The method according to claim 1 or 2, The thickness of the said long insulation film is 75 micrometers or less, The film carrier tape for electronic component mounting. The method according to claim 1 or 2, An area occupied by one film carrier and an area of an electronic component mounted on the film carrier tape are substantially the same. The method according to claim 1 or 2, The insulating film surface opposite to the insulating film surface side on which the wiring pattern for mounting the electronic components of the film carrier is formed is formed so that metal balls for electrically contacting with the outside of the film carrier can be arranged. Film carrier tape for mounting electronic components. The method according to claim 1 or 2, An average thickness other than the partition part on the wiring pattern after hardening of the soldering resist layer apply | coated to the surface of the said wiring pattern exists in the range of 3-50 micrometers, The film carrier tape for electronic component mounting. The method according to claim 1 or 2, The said soldering resist layer is formed in 20% or more of wiring pattern area | region except a connection terminal part, The film carrier tape for electronic component mounting.